WO2006100825A1 - Photocurable resin composition for forming black matrix, photosensitive film using the same, method for forming black matrix, black matrix and plasma display panel having the black matrix - Google Patents
Photocurable resin composition for forming black matrix, photosensitive film using the same, method for forming black matrix, black matrix and plasma display panel having the black matrix Download PDFInfo
- Publication number
- WO2006100825A1 WO2006100825A1 PCT/JP2006/301149 JP2006301149W WO2006100825A1 WO 2006100825 A1 WO2006100825 A1 WO 2006100825A1 JP 2006301149 W JP2006301149 W JP 2006301149W WO 2006100825 A1 WO2006100825 A1 WO 2006100825A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- black matrix
- forming
- film
- resin composition
- photocurable resin
- Prior art date
Links
- 239000011159 matrix material Substances 0.000 title claims abstract description 60
- 239000011342 resin composition Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims description 30
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 28
- 239000000178 monomer Substances 0.000 claims abstract description 23
- 239000001913 cellulose Substances 0.000 claims abstract description 19
- 229920002678 cellulose Polymers 0.000 claims abstract description 19
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 19
- 230000003647 oxidation Effects 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 17
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 14
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000003999 initiator Substances 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 26
- 238000011161 development Methods 0.000 claims description 24
- 230000018109 developmental process Effects 0.000 claims description 24
- 230000001681 protective effect Effects 0.000 claims description 5
- 230000007261 regionalization Effects 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 11
- 238000000059 patterning Methods 0.000 abstract description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052742 iron Inorganic materials 0.000 abstract description 5
- 229910017052 cobalt Inorganic materials 0.000 abstract description 4
- 239000010941 cobalt Substances 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract description 4
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- -1 fumaric acid ester Chemical class 0.000 description 46
- 239000000203 mixture Substances 0.000 description 20
- 239000011521 glass Substances 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 238000010304 firing Methods 0.000 description 15
- 239000002245 particle Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 12
- 239000004698 Polyethylene Substances 0.000 description 10
- 229920000573 polyethylene Polymers 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000007921 spray Substances 0.000 description 7
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 244000028419 Styrax benzoin Species 0.000 description 4
- 235000000126 Styrax benzoin Nutrition 0.000 description 4
- 235000008411 Sumatra benzointree Nutrition 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- 210000004027 cell Anatomy 0.000 description 4
- 235000019382 gum benzoic Nutrition 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- XTKDAFGWCDAMPY-UHFFFAOYSA-N azaperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCN(C=2N=CC=CC=2)CC1 XTKDAFGWCDAMPY-UHFFFAOYSA-N 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- MWGATWIBSKHFMR-UHFFFAOYSA-N 2-anilinoethanol Chemical compound OCCNC1=CC=CC=C1 MWGATWIBSKHFMR-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 2
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 2
- YDIYEOMDOWUDTJ-UHFFFAOYSA-N 4-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=C(C(O)=O)C=C1 YDIYEOMDOWUDTJ-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- OCVCTOIYGNHYRL-UHFFFAOYSA-N C(C=1C(C(=O)OCC(C)O)=CC=CC1)(=O)OC=1C(OC1)C(C(=C)C)=O Chemical compound C(C=1C(C(=O)OCC(C)O)=CC=CC1)(=O)OC=1C(OC1)C(C(=C)C)=O OCVCTOIYGNHYRL-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical class C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Natural products OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- QMMFVYPAHWMCMS-UHFFFAOYSA-N dimethyl monosulfide Natural products CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 2
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- FKIRSCKRJJUCNI-UHFFFAOYSA-N ethyl 7-bromo-1h-indole-2-carboxylate Chemical compound C1=CC(Br)=C2NC(C(=O)OCC)=CC2=C1 FKIRSCKRJJUCNI-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- KOSXTEKMNXZLDK-UHFFFAOYSA-N (3-methoxy-2-methylbutyl) acetate Chemical compound COC(C)C(C)COC(C)=O KOSXTEKMNXZLDK-UHFFFAOYSA-N 0.000 description 1
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- YKYIFUROKBDHCY-ONEGZZNKSA-N (e)-4-ethoxy-1,1,1-trifluorobut-3-en-2-one Chemical group CCO\C=C\C(=O)C(F)(F)F YKYIFUROKBDHCY-ONEGZZNKSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- JWTSVUUPJIIXTO-UHFFFAOYSA-N 1,5-bis[4-(dimethylamino)phenyl]penta-1,4-dien-3-one Chemical compound C1=CC(N(C)C)=CC=C1C=CC(=O)C=CC1=CC=C(N(C)C)C=C1 JWTSVUUPJIIXTO-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- IMDHDEPPVWETOI-UHFFFAOYSA-N 1-(4-tert-butylphenyl)-2,2,2-trichloroethanone Chemical compound CC(C)(C)C1=CC=C(C(=O)C(Cl)(Cl)Cl)C=C1 IMDHDEPPVWETOI-UHFFFAOYSA-N 0.000 description 1
- VMCRQYHCDSXNLW-UHFFFAOYSA-N 1-(4-tert-butylphenyl)-2,2-dichloroethanone Chemical compound CC(C)(C)C1=CC=C(C(=O)C(Cl)Cl)C=C1 VMCRQYHCDSXNLW-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- GOVVHAHLSILYMB-UHFFFAOYSA-N 1-propoxythioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2OCCC GOVVHAHLSILYMB-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical compound CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- YZTUIKZEIMOMGF-UHFFFAOYSA-N 2-[3-[4-(dimethylamino)phenyl]prop-2-enylidene]-3h-inden-1-one Chemical compound C1=CC(N(C)C)=CC=C1C=CC=C1C(=O)C2=CC=CC=C2C1 YZTUIKZEIMOMGF-UHFFFAOYSA-N 0.000 description 1
- YWWIHHSFVKZDAO-UHFFFAOYSA-N 2-[[4-(dimethylamino)phenyl]methylidene]-1-cyclohexanone Chemical compound C1=CC(N(C)C)=CC=C1C=C1C(=O)CCCC1 YWWIHHSFVKZDAO-UHFFFAOYSA-N 0.000 description 1
- LWAFETVQZHKDIS-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)-2-methylanilino]ethanol Chemical compound CC1=CC=CC=C1N(CCO)CCO LWAFETVQZHKDIS-UHFFFAOYSA-N 0.000 description 1
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical class NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 1
- KSJSQGSNADDXSC-UHFFFAOYSA-N 2-benzylidene-3-(dimethylamino)-3h-inden-1-one Chemical compound O=C1C2=CC=CC=C2C(N(C)C)C1=CC1=CC=CC=C1 KSJSQGSNADDXSC-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- PNJNLCNHYSWUPT-UHFFFAOYSA-N 2-methylpentane-1,4-diol Chemical compound CC(O)CC(C)CO PNJNLCNHYSWUPT-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- JRCGLALFKDKSAN-UHFFFAOYSA-N 3-hydroxybutyl prop-2-enoate Chemical compound CC(O)CCOC(=O)C=C JRCGLALFKDKSAN-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- BMVWCPGVLSILMU-UHFFFAOYSA-N 5,6-dihydrodibenzo[2,1-b:2',1'-f][7]annulen-11-one Chemical compound C1CC2=CC=CC=C2C(=O)C2=CC=CC=C21 BMVWCPGVLSILMU-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 235000009113 Betula papyrifera Nutrition 0.000 description 1
- 244000274847 Betula papyrifera Species 0.000 description 1
- 235000009109 Betula pendula Nutrition 0.000 description 1
- 235000010928 Betula populifolia Nutrition 0.000 description 1
- 235000002992 Betula pubescens Nutrition 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- DQFBYFPFKXHELB-UHFFFAOYSA-N Chalcone Natural products C=1C=CC=CC=1C(=O)C=CC1=CC=CC=C1 DQFBYFPFKXHELB-UHFFFAOYSA-N 0.000 description 1
- VOWAEIGWURALJQ-UHFFFAOYSA-N Dicyclohexyl phthalate Chemical compound C=1C=CC=C(C(=O)OC2CCCCC2)C=1C(=O)OC1CCCCC1 VOWAEIGWURALJQ-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- AIJULSRZWUXGPQ-UHFFFAOYSA-N Methylglyoxal Chemical compound CC(=O)C=O AIJULSRZWUXGPQ-UHFFFAOYSA-N 0.000 description 1
- UBUCNCOMADRQHX-UHFFFAOYSA-N N-Nitrosodiphenylamine Chemical compound C=1C=CC=CC=1N(N=O)C1=CC=CC=C1 UBUCNCOMADRQHX-UHFFFAOYSA-N 0.000 description 1
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 description 1
- NWSOKOJWKWNSAF-UHFFFAOYSA-N O=C(Sc1nnn[nH]1)c1ccccc1 Chemical compound O=C(Sc1nnn[nH]1)c1ccccc1 NWSOKOJWKWNSAF-UHFFFAOYSA-N 0.000 description 1
- VJFCXDHFYISGTE-UHFFFAOYSA-N O=[Co](=O)=O Chemical compound O=[Co](=O)=O VJFCXDHFYISGTE-UHFFFAOYSA-N 0.000 description 1
- AZAUMEDROKKWQS-UHFFFAOYSA-N OOO.CC(=C)C(O)=O Chemical class OOO.CC(=C)C(O)=O AZAUMEDROKKWQS-UHFFFAOYSA-N 0.000 description 1
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 description 1
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229930182558 Sterol Natural products 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- SWHLOXLFJPTYTL-UHFFFAOYSA-N [2-methyl-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(COC(=O)C(C)=C)COC(=O)C(C)=C SWHLOXLFJPTYTL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000005513 chalcones Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- PCYQQSKDZQTOQG-NXEZZACHSA-N dibutyl (2r,3r)-2,3-dihydroxybutanedioate Chemical compound CCCCOC(=O)[C@H](O)[C@@H](O)C(=O)OCCCC PCYQQSKDZQTOQG-NXEZZACHSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- AGYZIJHFFCQMEL-UHFFFAOYSA-N ethyl 2H-tetrazol-5-ylsulfanylformate Chemical compound C(C)OC(=O)SC1=NN=NN1 AGYZIJHFFCQMEL-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- UACSZOWTRIJIFU-UHFFFAOYSA-N hydroxymethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCO UACSZOWTRIJIFU-UHFFFAOYSA-N 0.000 description 1
- GJIDOLBZYSCZRX-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound OCOC(=O)C=C GJIDOLBZYSCZRX-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000003702 sterols Nutrition 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UGNWTBMOAKPKBL-UHFFFAOYSA-N tetrachloro-1,4-benzoquinone Chemical compound ClC1=C(Cl)C(=O)C(Cl)=C(Cl)C1=O UGNWTBMOAKPKBL-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical compound C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
Definitions
- the present invention relates to a photocurable resin composition for forming a black matrix.
- the present invention also relates to a photosensitive film using the composition, a method for forming a black matrix, a black matrix, and a plasma display panel having the black matrix.
- flat panel displays include liquid crystal displays, electroluminescence, light emitting diodes (LEDs), fluorescent display tubes (VFD), plasma displays (PDP), field emission displays (FED), and digital micromirror devices (DMD). ) Etc. are known.
- a color display obtained by colorizing these displays produces three primary colors of red, blue, and green light for each pixel and expresses a change in color by controlling the brightness of each pixel.
- a black matrix is formed to prevent a decrease in contrast and color purity.
- this black matrix is required to have excellent light shielding properties.
- PDPs have attracted a great deal of attention because they are relatively simple in structure and easy to increase in size, are self-luminous, have high display quality, and are capable of color display. Therefore, many proposals have been made.
- Such PDPs are generally divided into a large number of display cells by providing partition walls made of an insulating material on the surface of a substrate arranged oppositely, and a phosphor layer is formed in the cells so as to surround each cell. Is provided with a pattern electrode.
- the screen display is realized by generating plasma discharge by applying a voltage to the pattern electrode, and causing each of the light emitting layers to emit light by the action of ultraviolet rays by the plasma discharge.
- electrodes, resistors, dielectrics, etc. for generating plasma are provided in the substrate or cell.
- the partition walls, electrodes, resistors, dielectrics, phosphors, color filters, and black matrix that make up these components must be made with high precision.
- a photosensitive paste that is not intended for forming a black matrix, but that contains a low-melting glass and changes to black after firing has also been disclosed (for example, (See Patent Document 2).
- Patent Document 1 Japanese Patent Laid-Open No. 9 160243
- Patent Document 2 JP 2000-347394
- Patent Document 2 the property of changing to black is achieved by using a compound that is converted into a black oxide by firing, such as an organometallic compound nickel acetyl cintonate, which is expensive and cheaper. Was demanded.
- a compound that is converted into a black oxide by firing such as an organometallic compound nickel acetyl cintonate, which is expensive and cheaper.
- these bivalent or higher metals such as copper, iron and cobalt are used as metal powder, they will gel with a polymer having a carboxyl group in the side chain, so that coating patterning is not possible. I got it.
- the inventors examined a photosensitive resin having a characteristic that it does not gel even when a metal powder having an ionic valence of 2 or more is used, and further development with water is possible. We also examined the characteristic of being. As a result, the inventors have found that the above problem can be solved by combining a powder of a metal having an ionic valence of 2 or more, which is blackened by oxidation, and a specific resin component.
- the photocurable resin composition of the present invention is a photocurable resin composition used for forming a black matrix, and comprises (A) oxidation. (B) (i) a water-soluble cellulose derivative, (ii) a photopolymerizable monomer, and (iii) an acrylic resin having a hydroxy group And (iv) a photocurable resin composition for forming a black matrix, which comprises an organic component comprising a photopolymerization initiator.
- the photosensitive film of the present invention comprises a photosensitive paste film obtained by forming the photo-curable resin composition into a film, and a protective film for protecting the photosensitive paste film.
- the black matrix of the present invention has an optical density (OD) of 3.0 or more obtained by curing the photosensitive paste film by baking after patterning.
- the black matrix forming method of the present invention includes a photosensitive paste film forming step of forming a photosensitive paste film on a substrate using the photocurable resin composition, and exposing the photosensitive paste film. Then, a development process is performed with water to form a predetermined pattern on the substrate, and the pattern obtained in the pattern formation process is baked at a temperature of 1000 ° C. or less in the presence of oxygen.
- a black matrix forming method having a pattern baking and blackening step of curing and oxidizing to blacken [0015]
- the plasma display of the present invention has a black matrix formed by using the above black matrix forming method.
- a photocurable resin composition for forming a black matrix capable of forming a fine black pattern that can be developed with water and capable of forming a black matrix at low cost is provided. can do.
- the photocurable resin composition of the present invention is a photocurable resin composition used for forming a black matrix, and (A) a powder of a metal having an ionic valence of 2 or more that is blackened by oxidation; B) (i) a water-soluble cellulose derivative, (ii) a photopolymerizable monomer, (iii) an acrylic resin having a hydroxy group, and (iv) an organic component comprising a photopolymerization initiator .
- the metal having an ionic valence of 2 or more that is blackened by oxidation used in the present invention is not particularly limited as long as it is blackened by oxidation by baking treatment after pattern formation.
- iron and cobalt copper is more preferable.
- copper oxide obtained by oxidation is more preferable because it is insulative.
- copper is preferable because it is inexpensive and easy to purchase.
- the shape of the metal powder include forces such as a granular shape, a spherical shape, and a flake shape.
- the shape is not particularly limited to these, and other shapes may be used.
- a metal powder having a single shape may be used, or a mixture of two or more types of metal powder may be used.
- the average particle size of the metal powder is in the range of 0.01 to 100 ⁇ , preferably in the range of 0.0 :! to 30 zm, more preferably in the range of 0.5 to 10 to 111. If the average particle size exceeds 100 111, it becomes difficult to form a fine and highly accurate pattern, and if the average particle size is less than 0.01 ⁇ m, the light is irregularly reflected and the pattern light cannot be transmitted.
- the organic component used in the present invention includes (i) a water-soluble cellulose derivative, (ii) a photopolymerizable monomer, (iii) an acrylic resin having a hydroxy group, and (iv) initiation of photopolymerization. It consists of an agent.
- a water-soluble cellulose derivative known ones can be used, and are not particularly limited, and examples thereof include carboxymethyl cellulose, hydroxyethyl cellulose, hydroxy chineno metheno resenorelose, and hydroxypropino rescenole.
- Examples thereof include rosin, ethinorehydroxyethinorenorose, canoleboxymethinoreethinoresenorelose, hydroxypropinoremethinoresenorelose and the like. These may be used alone or in admixture of two or more.
- the above (ii) photopolymerizable monomer may be a known photopolymerizable monomer, and is not particularly limited.
- the acrylic resin having a hydroxy group is obtained by polymerizing a monomer having a hydroxyl group as a main copolymerizable monomer and further copolymerizing with other monomers as necessary. And copolymers.
- the monomer having a hydroxyl group is preferably a monoester product of acrylic acid or methacrylic acid and a monoalcohol having 1 to 20 carbon atoms, such as hydroxymethyl acrylate, hydroxymethyl methacrylate, 2 —Hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, 2-hydroxy Butyl acrylate, 2-hydroxybutyl methacrylate, 3-hydroxybutyl acrylate, 3-hydroxybutyl Examples include chinoremethacrylate, 4-hydroxybutynoleatelate, 4-hydroxybutinoacrylate, and monoesterol
- Glycerololeatalylate Glycellonoremetatalylate, Dipentaerythritolol monoatalylate, Dipentaerythritololmonometatalylate, ⁇ — Force Pro Lataton Modified Hydroxyethyl Atylate, ⁇ — Force Prolatatone
- epoxy ester compounds such as modified hydroxyl ether methacrylate and 2-hydroxy-3phenoxypropyl acrylate.
- Other monomers copolymerizable with the monomer having a hydroxyl group include, for example, methyl acrylate, ethyl acetate, ⁇ -propyl acrylate, isopropyl acrylate, ⁇ butyl acrylate, isobutyl acrylate, sec Butyl Atylate, Cyclohexyl Atylate, 2-Ethylhexyl Atylate, Stearyl Atylate, Methyl Metatalylate, Ethyl Metatalylate, n-Propyl Metatalylate, Isopropyl Metatalylate, sec Propyl Metatalyl , N-butyl methacrylate, sec-butyl methacrylate, sec butyl methacrylate, cyclohexyl methacrylate, 2-ethyl hexyl methacrylate, sterol methacrylate, 2, 2, 2-trifanolate romethinolate , 2
- acrylonitrile, methacrylonitrile, attalinoleamide, methacrylolamide, vinyl acetate, glycidyl acrylate, glycidyl methacrylate, and the like can also be used. These may be used alone or in combination of two or more.
- the photocurable resin composition of the present invention contains the above (iii) acrylic resin having a hydroxyl group, whereby the development resistance is improved and a highly accurate image can be formed.
- the ratio of (i) the water-soluble cellulose derivative and (ii) the photopolymerizable monomer in the photocurable resin composition of the present invention is as follows: 10 to 50 parts by weight of the cellulose derivative, (ii) 90 to 50 parts by weight of the photopolymerizable monomer, preferably (i) 20 to 40 parts by weight of the water-soluble cellulose derivative, (ii) the photopolymerizable monomer It is preferable that the monomer is 80 to 60 parts by mass, more preferably (i) 25 to 35 parts by mass of the water-soluble cellulose derivative, and (ii) 75 to 65 parts by mass of the photopolymerizable monomer. Necessary pattern formation precision by each component being within the above range.
- the photopolymerizable monomer is 50 parts by mass or more, the photopolymerization necessary for development can be obtained, and practically sufficient image forming ability can be obtained. Further, when the photopolymerizable monomer is 90 parts by mass or less, resolution of a fine image is improved.
- the ratio of (i) the water-soluble cellulose derivative and (iii) the hydroxyl group-containing acrylic resin is such that (i) the water-soluble cellulose derivative is 30 to 90 parts by mass with respect to 100 parts by mass of the total of the two components.
- photoinitiators As the photopolymerization initiator, generally known photoinitiators can be used. For example, benzophenones, benzoins, benzoin alkyl ethers, acetophenones, aminoacetophenones, benzyl Benzoin alkyl ethers, benzylalkylketals, anthraquinones, ketals, thixanthones and the like.
- the above (iv) photopolymerization initiator comprises (i) a water-soluble cellulose derivative and (iv) a total of 100 parts by mass of the photopolymerizable monomer. A range of 0.2 to 5 parts by mass is preferably used.
- the photopolymerization initiator is 0.1 part by mass or more, sufficient curability for practical use can be obtained.
- the photopolymerization initiator is 10 parts by mass or less, poor bottom curing due to excessive absorption of the initiator can be prevented.
- the photo-curable resin composition of the present invention does not have an oligomer or a polymer having a carboxyl group in the side chain. Therefore, even if a metal powder having an ionic valence of 2 or more is used, gelation does not occur. In addition, because it can be developed with water, it has little impact on the environment. Furthermore, it is excellent in storage stability as compared with an alkali development type photocurable resin composition. This is probably because the acid component contained in the composition is small.
- the photocurable resin composition of the present invention may contain an ultraviolet absorber, a sensitizer, a sensitizer, a polymerization inhibitor, a plasticizer, a thickener, an organic solvent, if necessary. , Dispersant, antifoaming agent, yes Or additive components such as inorganic precipitation inhibitors can be added.
- the above sensitizer is a force added to improve the sensitivity.
- Specific examples thereof include 2, 4 -jetylthioxanthone, isopropyl thixanthone, 2,3_bis (4-jetylamino benzal) cyclopenta
- a polymerization inhibitor is added to improve thermal stability during storage.
- a polymerization inhibitor includes hydroquinone, monoester of hydroquinone, N-nitrosodiphenylamine, phenothiazine, p_t-butyl.
- Catechol N-phenylnaphthylamine, 2,6-di_t_butyl_p_methylphenol, chloranil, pyrogallol and the like.
- plasticizers for improving the followability to the substrate specifically, dibutyl phthalate (HDBP), dioctyl phthalate (DOP), dicyclohexyl phthalate, polyethylene glycol, glycerin, dibutyl tartrate Etc.
- HDBP dibutyl phthalate
- DOP dioctyl phthalate
- dicyclohexyl phthalate polyethylene glycol
- glycerin dibutyl tartrate Etc.
- antifoaming agent examples include alkylene glycol-based, silicone-based and higher alcohol-based antifoaming agents such as polyethylene glycol (molecular weight 400 to 800), and bubbles in the paste or film It is possible to reduce vacancies after firing.
- the photocurable resin composition of the present invention contains (C) glass powder as a binder. Moyore.
- the glass powder is not particularly limited as long as it satisfies the transparency required for the exposure light source.
- Specific examples of the glass powder include PbO_SiO, PbO
- glass powders such as O—SiO-based lead borosilicate glass, zinc borosilicate glass, and bismuth borosilicate glass.
- a force average particle size of 0.5 to 10 x m, preferably 1 to 8 z m is suitably used depending on the shape of the pattern to be produced. If the average particle size exceeds 10 ⁇ m, surface irregularities occur when forming a highly accurate pattern, and if the average particle size is less than 1 ⁇ m, fine cavities are formed during firing, which may cause insulation failure.
- Examples of the shape of the (C) glass powder include a spherical shape, a block shape, a flake shape, a dendrite shape, and the like, and these can be used alone or in combination of two or more.
- the ratio of (A) a metal powder having an ionic valence of 2 or more, which is blackened by oxidation, and (B) the organic component is the ratio of the photocurable resin composition.
- the organic component is 10 parts by mass or more, a practically sufficient photopolymerizability can be obtained, and a sufficient image can be formed.
- the organic component (B) is 40 parts by mass or less, the occurrence of pattern peeling after firing can be suppressed, which is preferable.
- the photocurable resin composition of the present invention is prepared by dissolving or dispersing in a solvent.
- a solvent As the solvent to be used, (A) Affinity with a metal powder having an ionic valence of 2 or more, which is blackened by oxidation, and (B) Solubility of organic components are good. There is no particular limitation as long as it can impart an appropriate viscosity and can be easily evaporated and removed by drying.
- ketones such as jetyl ketone, methyl butyl ketone, dipropyl ketone, and cyclohexanone
- alcohols such as n-pentanol, 4-methylol 2-pentanol, cyclohexanol, and diacetone alcohol.
- Ethylene glycol monomethino ethenore ethylene glycol mono methino ree noate, ethylene glycol mono chineno ethenore, propylene glyco no mono mono chineno ethenore, propylene glycol mono methino eno enoenore, diethylene Ether-based alcohols such as glyconolemonomethinoreethenole, diethyleneglycolenomonotinoreatenore, diethyleneglycolenoresinetinoreethenole, diethyleneglycol-l-deethylether; acetic acid _ n-butyl, amyl acetate Saturated aliphatic monocarboxylic acid alkyl esters such as lactic acid ethyl ester, lactic acid _n_butyl lactic acid esters, etc .; methyl cetyl sorb acetate, ethyl cetyl sorb acetate,
- the content of the solvent is as follows: (A) a metal powder having an ionic valence of 2 or more that is blackened by oxidation and (B) an organic component More preferably, 300 parts by mass or less is more preferable, with 10 to 70 parts by mass and 25 to 35 parts by mass being most preferable with respect to 100 parts by mass.
- the photosensitive film of the present invention is produced as follows.
- a photosensitive paste film is prepared by forming (applying and drying) the photocurable resin composition on a support film so as to have a dry film thickness of 10 to 50 ⁇ m.
- the supporting film to be used include a flexible film made of a synthetic resin film such as polyethylene terephthalate, polyethylene, polypropylene, polycarbonate, and polychlorinated butyl having a film thickness of 15 to 125 zm. If necessary, this support film may be subjected to a release treatment so that transfer is easy.
- the roll coater has excellent film thickness uniformity, and a thick film is effective. Since it can form efficiently, it is preferable.
- a protective film is attached to obtain a photosensitive film.
- this protective film for example, a polyethylene terephthalate film, a polypropylene film, a polyethylene film having a thickness of about 15 to 125 zm coated or baked with silicone is suitable.
- the curable resin composition layer formed on the substrate by coating or transfer is exposed to an image by irradiating an active ray such as ultraviolet ray, excimer laser, ⁇ ray, electron beam through a mask.
- an active ray such as ultraviolet ray, excimer laser, ⁇ ray, electron beam through a mask.
- development processing is performed using water, and unirradiated portions are dissolved and removed to form a pattern on the substrate, followed by baking.
- the entire surface is exposed without a mask and a pattern is formed without developing, and it is baked and blackened in the presence of oxygen to form a black matrix.
- the above-mentioned photosensitive film is used. First, the protective film is removed from the photosensitive film, the photosensitive paste film is transferred to the substrate, and image exposure or overall exposure is performed. Remove the support film. Next, in the case of the photosensitive paste film subjected to image exposure, it is subjected to a development process to form a pattern. In the case of a photosensitive paste film that has been exposed to the entire surface, a cured film is formed without developing, and is fired in the presence of oxygen.
- the substrate examples include a glass substrate, a substrate in which an electrode such as a bus electrode is provided on the glass substrate, and a ceramic substrate.
- the photosensitive paste film is superposed on the substrate surface and thermocompression bonded with a hot roll laminator or the like. Thermocompression bonding is preferably performed at a substrate surface temperature of 80 to 140 ° C, roll pressure:! To 5 kg / cm 2 , and moving speed of 0.1 to 10 OmZ. .
- the substrate may be preheated.
- As the preheating temperature for example, a range of 40 to 100 ° C. is selected.
- a radiation irradiation apparatus used for exposure an ultraviolet irradiation apparatus generally used in a photolithography method, an exposure apparatus used when manufacturing semiconductors and liquid crystal display devices, and the like are used. be able to.
- the development processing is carried out with water because (i) it has a water-soluble cellulose derivative component.
- the water temperature is preferably 10-50 ° C force S, more preferably 20-40 ° C force S. If it is out of this range, developability deteriorates and a development residue is generated.
- development time, development temperature, development method eg, dipping method, rocking method, shower method, spray method, paddle method, etc.
- development A device or the like can be selected as appropriate.
- the photocurable resin composition of the present invention can be easily developed with water, and can form a black matrix having sufficient blackness without causing environmental problems or adverse effects on the human body due to organic solvents or aqueous alkali solutions.
- the temperature used for the baking is a temperature at which (A) a metal powder having an ionic valence of 2 or more that is blackened by oxidation is sufficiently blackened, and (B) is a temperature at which the organic component is burned off. That ’s ⁇ mayyo.
- Specific white birch ko (boiled, 400 ⁇ : 1000 o C, preferably ryoma 500 ⁇ 1000 o C, more preferably ryah 500 ⁇ 600 ° C. If less than 400 ° C, (B) organic component) This is because some metals (for example, copper, etc.) change the color of the black metal to a different color when the temperature exceeds 1000 ° C. From 10 to 120 minutes when heated at a heating rate of 10 ° C / min and calcined at 500 to 600 ° C.
- the black matrix of the present invention obtained by the above method has an optical density (OD value) of 3.
- the black matrix of the present invention can be suitably used for a power used as a material for producing various displays such as a plasma display panel, an organic EL, an inorganic EL, and a field emission display, particularly for a PDP.
- the PDP of the present invention includes a black matrix obtained by the method for forming a black matrix comprising the photocurable resin composition.
- the PDP of the present invention is manufactured by a normal PDP manufacturing method. Specifically, a constituent element selected from a partition, an electrode, a resistor, a dielectric layer, a phosphor, and a color filter is formed on a substrate such as a glass substrate by a known method, and the black matrix is the photocurable resin composition.
- the PDP is manufactured by forming the black matrix using the method.
- the photocurable resin composition prepared in (2) above was applied onto a support film made of polyethylene terephthalate using a lip coater, and the coating film was dried at 100 ° C for 6 minutes to completely remove the solvent.
- a photosensitive paste film having a thickness of 16 ⁇ was formed on a support film.
- a 25 ⁇ m thick polyethylene film was laminated on the photosensitive paste film to produce a photosensitive film.
- a firing process was performed by heating at a heating rate of 1.0 ° C / min and holding at 580 ° C for 30 minutes. As a result, a black matrix having a good rectangular pattern shape and sufficient blackness with a D value of 3.5 was formed.
- a photosensitive film was produced in the same manner as in Example 1 except that the copper powder was changed to iron powder (average particle size 1 ⁇ m). While peeling off the polyethylene film of the produced photosensitive film, it was laminated at 105 ° C. with a hot roll laminator on a glass substrate that had been heated to 80 ° C. in advance. The air pressure was 3 kg / cm 2 and the laminating speed was 1 ⁇ Om / min.
- a firing process was performed by heating at a heating rate of 1.0 ° C / min and holding at 580 ° C for 30 minutes. As a result, a black matrix having a good rectangular pattern shape and sufficient blackness with a D value of 3.5 was formed.
- a photosensitive film was produced in the same manner as in Example 1 except that the copper powder was changed to cobalt powder (average particle size 1 ⁇ m). While peeling off the polyethylene film of the produced photosensitive film, it was laminated at 105 ° C. with a hot roll laminator on a glass substrate that had been heated to 80 ° C. in advance. The air pressure was 3 kg / cm 2 and the laminating speed was 1. Om / min. Subsequently, the polyethylene terephthalate as a support film was peeled off, and the photosensitive paste film was exposed to ultraviolet rays at an irradiation dose of 500 mj / cm 2 with a super high pressure mercury lamp through a test angle pattern mask.
- a firing process was performed by heating at a heating rate of 1.0 ° C / min and holding at 580 ° C for 30 minutes. As a result, a black matrix having a good rectangular pattern shape and sufficient blackness with a D value of 3.5 was formed.
- the support film polyethylene terephthalate
- the photosensitive paste film was exposed to ultraviolet light at a dose of 500 mj / cm 2 with a super high pressure mercury lamp through a test angle pattern mask.
- a pattern was formed by spray development for 30 seconds at a spraying pressure of 3 kg / cm 2 using water at a liquid temperature of 30 ° C.
- the minimum remaining line width was 30 / m.
- the pattern shape was observed by SEM, a trapezoidal pattern shape was obtained.
- the film was heated at a heating rate of 1.0 ° C / min. A baking treatment was performed for 30 minutes at ° C. As a result, a black matrix having a good rectangular pattern shape and sufficient blackness with a D value of 3.5 was formed.
- a photosensitive film was produced in the same manner as in Example 1 except that the photocurable resin composition was adjusted by kneading. While peeling off the polyethylene film of the manufactured photosensitive film, preheat it to 80 ° C. It was laminated at 105 ° C. with a hot roll laminator on a heated glass substrate. The air pressure was 3 kg / cm 2 and the laminating speed was 1. Om / min.
- the polyethylene terephthalate as a support film was peeled off, and the photosensitive paste film was exposed to ultraviolet rays at a dose of 500 mj / cm 2 with an ultrahigh pressure mercury lamp through a test angle pattern mask.
- spray development was performed at a spraying pressure of 3 kg / cm 2 for 30 seconds to form a pattern.
- the adhesion was evaluated, the remaining minimum line width was 30 zm.
- the pattern shape was observed with SEM, a trapezoidal pattern shape was obtained.
- a firing process was performed by heating at a heating rate of 1.0 ° C / min and holding at 580 ° C for 30 minutes. As a result, a black matrix having a good rectangular pattern shape and sufficient blackness with a D value of 3 and 5 is formed.
- the photosensitive black paste composition prepared in (2) above was applied onto a support film made of polyethylene terephthalate using a lip coater, and the coating film was dried at 100 ° C for 6 minutes to completely remove the solvent. 16 ⁇ m thick photosensitive black paste film on support film Formed. Next, a 25 ⁇ m thick polyethylene film was laminated on the photosensitive black paste film to produce a photosensitive film.
- the polyethylene terephthalate as a supporting film was peeled off, and the photosensitive black matrix film was exposed to ultraviolet rays at an irradiation dose of 500 mj / cm 2 with a super high pressure mercury lamp through a test angle pattern mask.
- a pattern was formed by spray development for 30 seconds at a spraying pressure of 3 kg / cm 2 using water at a liquid temperature of 30 ° C.
- the minimum remaining line width was 200 / im.
- an inverted trapezoidal pattern shape with an under force was obtained.
- the photosensitive black paste composition was prepared by kneading 50 parts by mass of the resist composition (solid content 50./o) prepared in (1) above and 75 parts by mass of copper powder (average particle size 1 ⁇ m).
- the adjusted force S, paste yarn and composition were gelled and could not be applied.
- Industrial applicability As described above, the photocurable resin composition of the present invention can be developed with water, can form a fine pattern, and can form a black matrix having a sufficient black color. Therefore, it can be used for various displays. it can. It is particularly useful for black matrix for PDP.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005078444A JP4197177B2 (en) | 2005-03-18 | 2005-03-18 | Photo-curable resin composition for forming black matrix, photosensitive film using the same, method for forming black matrix, black matrix and plasma display panel having the black matrix |
JP2005-078444 | 2005-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006100825A1 true WO2006100825A1 (en) | 2006-09-28 |
Family
ID=37023514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/301149 WO2006100825A1 (en) | 2005-03-18 | 2006-01-25 | Photocurable resin composition for forming black matrix, photosensitive film using the same, method for forming black matrix, black matrix and plasma display panel having the black matrix |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4197177B2 (en) |
KR (1) | KR20070095425A (en) |
CN (1) | CN101142526A (en) |
WO (1) | WO2006100825A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5449688B2 (en) * | 2008-03-26 | 2014-03-19 | 太陽ホールディングス株式会社 | Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them |
KR102024736B1 (en) | 2012-09-20 | 2019-09-25 | 동우 화인켐 주식회사 | Touch screen panel and method of preparing the same |
CN115356873A (en) | 2018-07-05 | 2022-11-18 | 东丽株式会社 | Resin composition, light-shielding film, method for producing light-shielding film, and substrate with partition |
KR20220161259A (en) | 2020-03-30 | 2022-12-06 | 도레이 카부시키가이샤 | Resin composition, light shielding film, and substrate on which barrier ribs are formed |
JP7309651B2 (en) | 2020-03-31 | 2023-07-18 | 株式会社ノリタケカンパニーリミテド | Photosensitive composition and its use |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63265238A (en) * | 1987-04-23 | 1988-11-01 | Tokyo Ohka Kogyo Co Ltd | Water developable photosetting insulating paste composition |
JPH06348013A (en) * | 1993-06-02 | 1994-12-22 | Tokyo Ohka Kogyo Co Ltd | Photosensitive resin composition |
JPH09160243A (en) * | 1995-12-09 | 1997-06-20 | Tokyo Ohka Kogyo Co Ltd | Photosensitive resin composition for forming light shielding film, black matrix using the same and its production |
JPH1114819A (en) * | 1997-06-23 | 1999-01-22 | Toppan Printing Co Ltd | Colored photosensitive resin composition |
JP2000347394A (en) * | 1999-06-07 | 2000-12-15 | Toray Ind Inc | Photosensitive paste, member for display and display |
JP2002328470A (en) * | 2001-05-01 | 2002-11-15 | Tokyo Ohka Kogyo Co Ltd | Photosensitive insulating paste composition and photosensitive film using the same |
-
2005
- 2005-03-18 JP JP2005078444A patent/JP4197177B2/en not_active Expired - Fee Related
-
2006
- 2006-01-25 KR KR1020077018879A patent/KR20070095425A/en not_active Application Discontinuation
- 2006-01-25 CN CNA2006800081394A patent/CN101142526A/en active Pending
- 2006-01-25 WO PCT/JP2006/301149 patent/WO2006100825A1/en not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63265238A (en) * | 1987-04-23 | 1988-11-01 | Tokyo Ohka Kogyo Co Ltd | Water developable photosetting insulating paste composition |
JPH06348013A (en) * | 1993-06-02 | 1994-12-22 | Tokyo Ohka Kogyo Co Ltd | Photosensitive resin composition |
JPH09160243A (en) * | 1995-12-09 | 1997-06-20 | Tokyo Ohka Kogyo Co Ltd | Photosensitive resin composition for forming light shielding film, black matrix using the same and its production |
JPH1114819A (en) * | 1997-06-23 | 1999-01-22 | Toppan Printing Co Ltd | Colored photosensitive resin composition |
JP2000347394A (en) * | 1999-06-07 | 2000-12-15 | Toray Ind Inc | Photosensitive paste, member for display and display |
JP2002328470A (en) * | 2001-05-01 | 2002-11-15 | Tokyo Ohka Kogyo Co Ltd | Photosensitive insulating paste composition and photosensitive film using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2006259421A (en) | 2006-09-28 |
JP4197177B2 (en) | 2008-12-17 |
KR20070095425A (en) | 2007-09-28 |
CN101142526A (en) | 2008-03-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5056757B2 (en) | Photosensitive resin composition, photosensitive film and pattern forming method | |
KR20070104259A (en) | Photo-sensitive resin composition containing inorganic particle, photo-sensitive film, and process of forming inorganic pattern | |
WO2006100825A1 (en) | Photocurable resin composition for forming black matrix, photosensitive film using the same, method for forming black matrix, black matrix and plasma display panel having the black matrix | |
JP4640971B2 (en) | Photosensitive resin composition for light shielding pattern formation of plasma display | |
TWI311688B (en) | Photosensitive insulative paste composition and photosensitive film using the same | |
WO1996042035A1 (en) | Photosensitive paste, plasma display, and process for the production thereof | |
WO2008035785A1 (en) | Inorganic-particle-containing resin composition, transfer film, and process for producing member for display panel | |
JP3520647B2 (en) | Photosensitive paste | |
JP3239759B2 (en) | Photosensitive paste | |
KR101404459B1 (en) | Photosensitive paste composition for plasma display panel barrier rib and method for forming plasma display panel barrier rib | |
TW200303338A (en) | Photo curing composition and plasma display using the same in forming black pattern | |
TW200535564A (en) | Photosensitive inorganic paste composition, sheet-shaped unbaked body, and method of producing plasma display front plate | |
JP2008170953A (en) | Inorganic particle-containing photosensitive resin composition, photosensitive film, pattern forming method, and method for manufacturing flat panel display | |
JP2007246568A (en) | Resin composition containing inorganic particle, transfer film and method for producing member for displaying panel | |
JP3873407B2 (en) | Photosensitive glass paste | |
JP3520663B2 (en) | Photosensitive paste | |
JP4337535B2 (en) | Patterned glass layer forming glass paste, patterned glass layer forming photosensitive film, and method for producing display panel member using the same | |
JP2010276703A (en) | Photosensitive paste composition and pattern forming method | |
JPH10275564A (en) | Plasma display panel and its manufacture | |
JP2011007864A (en) | Photosensitive paste composition and pattern forming method | |
JP2010009777A (en) | Photosensitive conductive paste and manufacturing method of electrode pattern using the same | |
JP4159002B2 (en) | Plasma display substrate and method of manufacturing plasma display | |
JPH10125220A (en) | Manufacture of plasma display | |
JP2000319476A (en) | Photosensitive paste and production of member for plasma display | |
JP2006332067A (en) | Buffer layer forming paste for plasma display panel, and the plasma display panel manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020077018879 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200680008139.4 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
NENP | Non-entry into the national phase |
Ref country code: RU |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: RU |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 06712344 Country of ref document: EP Kind code of ref document: A1 |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 6712344 Country of ref document: EP |