TWI607098B - Copper alloy plate and stamped product with copper alloy plate - Google Patents

Copper alloy plate and stamped product with copper alloy plate Download PDF

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Publication number
TWI607098B
TWI607098B TW105110108A TW105110108A TWI607098B TW I607098 B TWI607098 B TW I607098B TW 105110108 A TW105110108 A TW 105110108A TW 105110108 A TW105110108 A TW 105110108A TW I607098 B TWI607098 B TW I607098B
Authority
TW
Taiwan
Prior art keywords
copper alloy
alloy sheet
rolling direction
thickness
copper
Prior art date
Application number
TW105110108A
Other languages
English (en)
Chinese (zh)
Other versions
TW201702394A (zh
Inventor
Akihiro Kakitani
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201702394A publication Critical patent/TW201702394A/zh
Application granted granted Critical
Publication of TWI607098B publication Critical patent/TWI607098B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW105110108A 2015-03-30 2016-03-30 Copper alloy plate and stamped product with copper alloy plate TWI607098B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015070162A JP6085633B2 (ja) 2015-03-30 2015-03-30 銅合金板および、それを備えるプレス成形品

Publications (2)

Publication Number Publication Date
TW201702394A TW201702394A (zh) 2017-01-16
TWI607098B true TWI607098B (zh) 2017-12-01

Family

ID=57081955

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105110108A TWI607098B (zh) 2015-03-30 2016-03-30 Copper alloy plate and stamped product with copper alloy plate

Country Status (4)

Country Link
JP (1) JP6085633B2 (ja)
KR (1) KR101822740B1 (ja)
CN (1) CN106011523B (ja)
TW (1) TWI607098B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7505857B2 (ja) 2018-08-02 2024-06-25 トヨタ自動車株式会社 分断装置および分断方法
JP6790153B2 (ja) * 2019-03-04 2020-11-25 Ｊｘ金属株式会社 二次電池負極集電体用圧延銅箔、それを用いた二次電池負極集電体及び二次電池並びに二次電池負極集電体用圧延銅箔の製造方法
JP7034112B2 (ja) * 2019-03-26 2022-03-11 Ｊｘ金属株式会社 銅合金材料、電気電子部品、電子機器、及び銅合金材料の製造方法
JP7351171B2 (ja) * 2019-09-27 2023-09-27 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104334759A (zh) * 2013-03-25 2015-02-04 Jx日矿日石金属株式会社 导电性及挠曲系数优异的铜合金板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0813066A (ja) 1994-06-23 1996-01-16 Mitsubishi Shindoh Co Ltd スタンピング性に優れた銅合金または銅合金薄板
JP2003055722A (ja) * 2001-08-10 2003-02-26 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
JP3871064B2 (ja) * 2005-06-08 2007-01-24 株式会社神戸製鋼所 電気接続部品用銅合金板
JP4247922B2 (ja) 2006-09-12 2009-04-02 古河電気工業株式会社 電気・電子機器用銅合金板材およびその製造方法
JP4157898B2 (ja) 2006-10-02 2008-10-01 株式会社神戸製鋼所 プレス打ち抜き性に優れた電気電子部品用銅合金板
CN101709402B (zh) * 2009-12-11 2011-05-18 九星控股集团有限公司 汽车水箱散热器用超薄Cu-Sn-Te-P合金带
JP4601085B1 (ja) * 2010-06-03 2010-12-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品
JP2012224922A (ja) 2011-04-20 2012-11-15 Jx Nippon Mining & Metals Corp 銅合金および銅合金の製造方法
JP6128976B2 (ja) * 2012-09-20 2017-05-17 Ｊｘ金属株式会社 銅合金および高電流用コネクタ端子材
JP6246502B2 (ja) * 2013-06-13 2017-12-13 Ｊｘ金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6081513B2 (ja) 2015-03-30 2017-02-15 株式会社神戸製鋼所 放熱部品用銅合金板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104334759A (zh) * 2013-03-25 2015-02-04 Jx日矿日石金属株式会社 导电性及挠曲系数优异的铜合金板

Also Published As

Publication number Publication date
JP2016191088A (ja) 2016-11-10
CN106011523B (zh) 2018-06-08
KR101822740B1 (ko) 2018-01-26
KR20160117242A (ko) 2016-10-10
JP6085633B2 (ja) 2017-02-22
TW201702394A (zh) 2017-01-16
CN106011523A (zh) 2016-10-12

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