TWI607050B - 保護膜形成用薄膜、以及附保護膜的晶片及其製造方法 - Google Patents

保護膜形成用薄膜、以及附保護膜的晶片及其製造方法 Download PDF

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Publication number
TWI607050B
TWI607050B TW103110225A TW103110225A TWI607050B TW I607050 B TWI607050 B TW I607050B TW 103110225 A TW103110225 A TW 103110225A TW 103110225 A TW103110225 A TW 103110225A TW I607050 B TWI607050 B TW I607050B
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TW
Taiwan
Prior art keywords
protective film
film
forming
resin layer
acrylic polymer
Prior art date
Application number
TW103110225A
Other languages
English (en)
Chinese (zh)
Other versions
TW201439177A (zh
Inventor
Daisuke Yamamoto
Ken Takano
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW201439177A publication Critical patent/TW201439177A/zh
Application granted granted Critical
Publication of TWI607050B publication Critical patent/TWI607050B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/062—Copolymers with monomers not covered by C09D133/06
    • C09D133/066—Copolymers with monomers not covered by C09D133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/406—Bright, glossy, shiny surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2571/00—Protective equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Epoxy Resins (AREA)
TW103110225A 2013-03-19 2014-03-19 保護膜形成用薄膜、以及附保護膜的晶片及其製造方法 TWI607050B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013056825 2013-03-19

Publications (2)

Publication Number Publication Date
TW201439177A TW201439177A (zh) 2014-10-16
TWI607050B true TWI607050B (zh) 2017-12-01

Family

ID=51580173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103110225A TWI607050B (zh) 2013-03-19 2014-03-19 保護膜形成用薄膜、以及附保護膜的晶片及其製造方法

Country Status (5)

Country Link
JP (1) JP6357147B2 (ja)
KR (1) KR102177881B1 (ja)
CN (1) CN105009277B (ja)
TW (1) TWI607050B (ja)
WO (1) WO2014148496A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6519077B2 (ja) * 2015-05-25 2019-05-29 リンテック株式会社 半導体装置の製造方法
CN117656639A (zh) * 2016-03-04 2024-03-08 琳得科株式会社 保护膜形成用复合片
KR102448152B1 (ko) * 2017-10-27 2022-09-27 린텍 가부시키가이샤 보호막 형성용 필름, 보호막 형성용 복합 시트 및 반도체 칩의 제조 방법
WO2019131850A1 (ja) * 2017-12-28 2019-07-04 日東電工株式会社 半導体背面密着フィルム
TWI795503B (zh) * 2017-12-28 2023-03-11 日商日東電工股份有限公司 半導體背面密接膜
JP2020102553A (ja) * 2018-12-21 2020-07-02 日東電工株式会社 半導体背面密着フィルム
JP7139153B2 (ja) * 2018-05-29 2022-09-20 日東電工株式会社 背面密着フィルムおよびダイシングテープ一体型背面密着フィルム
JPWO2021171898A1 (ja) * 2020-02-27 2021-09-02
JP2022147663A (ja) 2021-03-23 2022-10-06 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214288A (ja) * 2002-12-27 2004-07-29 Lintec Corp チップ用保護膜形成用シート
JP2007250970A (ja) * 2006-03-17 2007-09-27 Hitachi Chem Co Ltd 半導体素子裏面保護用フィルム及びそれを用いた半導体装置とその製造法
JP2009130233A (ja) * 2007-11-27 2009-06-11 Furukawa Electric Co Ltd:The チップ保護用フィルム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3544362B2 (ja) 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
CN100468165C (zh) * 2004-04-08 2009-03-11 鸿富锦精密工业（深圳）有限公司 发光二极管及采用该发光二极管的背光模组
JP4682796B2 (ja) 2005-04-19 2011-05-11 日立化成工業株式会社 封止用シート
CN1978529A (zh) * 2005-12-06 2007-06-13 北京波米科技有限公司 光敏性聚酰亚胺树脂和组合物与制备方法
JP5456642B2 (ja) 2009-12-24 2014-04-02 日東電工株式会社 フリップチップ型半導体裏面用フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214288A (ja) * 2002-12-27 2004-07-29 Lintec Corp チップ用保護膜形成用シート
JP2007250970A (ja) * 2006-03-17 2007-09-27 Hitachi Chem Co Ltd 半導体素子裏面保護用フィルム及びそれを用いた半導体装置とその製造法
JP2009130233A (ja) * 2007-11-27 2009-06-11 Furukawa Electric Co Ltd:The チップ保護用フィルム

Also Published As

Publication number Publication date
JPWO2014148496A1 (ja) 2017-02-16
KR20150133171A (ko) 2015-11-27
JP6357147B2 (ja) 2018-07-11
TW201439177A (zh) 2014-10-16
WO2014148496A1 (ja) 2014-09-25
CN105009277A (zh) 2015-10-28
KR102177881B1 (ko) 2020-11-12
CN105009277B (zh) 2017-10-27

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