TWI606225B - Vapor chamber having telescopic capillary structure - Google Patents
Vapor chamber having telescopic capillary structure Download PDFInfo
- Publication number
- TWI606225B TWI606225B TW104120129A TW104120129A TWI606225B TW I606225 B TWI606225 B TW I606225B TW 104120129 A TW104120129 A TW 104120129A TW 104120129 A TW104120129 A TW 104120129A TW I606225 B TWI606225 B TW I606225B
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- capillary
- retractable
- tube
- telescopic
- Prior art date
Links
Description
本發明係與一種板式熱交換器有關,尤指一種具可伸縮毛細組織之均溫板結構。The present invention relates to a plate heat exchanger, and more particularly to a temperature equalizing plate structure having a retractable capillary structure.
按,由於電腦產業的快速發展,許多應用於電腦上的電子發熱元件,如電腦的CPU、或顯示卡的GPU晶片等發熱元件,其因處理效能的提升而相對產生過熱問題,已成為現今散熱技術中,一再需要加以克服的課題。According to the rapid development of the computer industry, many electronic heating components used in computers, such as CPUs of computers, or GPU chips of display cards, have become relatively hot due to the improvement of processing efficiency. In technology, there are many issues that need to be overcome.
而除此之外,在為滿足散熱或熱傳等需求下,同時提供多發熱源進行散熱或熱傳的設計,也是不可或缺的重要技術之一,尤其在於多發熱元件的高低位置不同,各散熱或熱傳元件所提供用於接觸的受熱面,也需要配合不同的高度位置作調整。而以往在解決此問題時,一般係採用量身訂作的方式,也就是單一規格的散熱或熱傳元件,僅能適用其所對應的電子產品,一旦電子產品內的任一發熱元件在高度位置上作出改變或調整,該規格的散熱或熱傳元件即無法適用,必須重新量身訂作才行。更進一步地,僅管能提供多發熱元件進行散熱或熱傳等熱交換工作,但或有因為適用場合的多樣化而無法確保內部的工作流體進行回流,因此容易造成乾燒等問題而影響均溫板的熱傳效率或工作的穩定性,甚至失去熱傳作用。In addition, in order to meet the needs of heat dissipation or heat transfer, it is also an indispensable important technology to provide multiple heat sources for heat dissipation or heat transfer, especially in the high and low positions of multiple heating elements. The heat-receiving surface provided by the heat-dissipating or heat-transfer element for contact also needs to be adjusted with different height positions. In the past, when solving this problem, it is generally tailor-made, that is, a single-size heat-dissipating or heat-transfer component, which can only be applied to the corresponding electronic products, once any heating element in the electronic product is at a height. Changes or adjustments made to the location, the heat or heat transfer components of this specification are not applicable and must be re-tailored. Furthermore, although it is possible to provide a heat-dissipating operation such as heat dissipation or heat transfer by a plurality of heat-generating elements, it is not possible to ensure that the internal working fluid is reflowed due to diversification of the application, and thus it is easy to cause problems such as dry burning and the like. The heat transfer efficiency of the warm plate or the stability of the work even loses the heat transfer effect.
有鑑於此,本發明人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。In view of the above, the present inventors have made an effort to improve and solve the above-mentioned shortcomings, and have devoted themselves to research and cooperate with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.
本發明之主要目的,在於可提供一種具可伸縮毛細組織之均溫板結構,其係可視位於不同高度位置的發熱元件,來調整與各發熱元件的接觸時之受熱面,並確保均溫板內部的工作流體能有效回流,以避免發生乾燒等影響均溫板熱傳之情事。The main object of the present invention is to provide a temperature equalizing plate structure with a retractable capillary structure, which can be used to adjust the heating surface when contacting the heating elements, and to ensure the temperature equalizing plate. The internal working fluid can be effectively recirculated to avoid the occurrence of dry burning and other effects that affect the heat transfer of the isothermal plate.
為了達成上述之目的,本發明係提供一種具可伸縮毛細組織之均溫板結構,包括一板狀殼體、一伸縮受熱部件、以及一多節毛細構件;其中,板狀殼體內部呈中空而形成一腔室,且板狀殼體具有一底部,於底部上設有一與腔室相通的通孔,伸縮受熱部件內部呈中空並相對位於板狀殼體之底部外,且與板狀殼體之通孔密封連接而與腔室相連通,多節毛細構件則包含複數毛細節管相互活動銜接而成,並依序銜接於伸縮受熱部件與板狀殼體內部之間。In order to achieve the above object, the present invention provides a temperature equalizing plate structure having a retractable capillary structure, comprising a plate-shaped casing, a telescopic heat-receiving member, and a multi-section capillary member; wherein the plate-shaped casing is hollow inside Forming a chamber, and the plate-shaped housing has a bottom, and a through hole communicating with the chamber is disposed on the bottom portion, and the inside of the telescopic heat-receiving member is hollow and opposite to the bottom of the plate-shaped housing, and the plate-shaped shell The through hole of the body is sealed and connected to the chamber, and the multi-section capillary member comprises a plurality of capillary detail tubes which are connected to each other and sequentially connected between the telescopic heat-receiving member and the interior of the plate-shaped housing.
<本發明><present invention>
1‧‧‧板狀殼體1‧‧‧plate shell
10‧‧‧下板10‧‧‧ Lower board
100‧‧‧底部100‧‧‧ bottom
101‧‧‧通孔101‧‧‧through hole
11‧‧‧上板11‧‧‧Upper board
12‧‧‧腔室12‧‧‧ chamber
120‧‧‧毛細層120‧‧‧bred layer
2‧‧‧伸縮受熱部件2‧‧‧Flexible heat-receiving parts
20‧‧‧受熱板20‧‧‧heated plate
200‧‧‧毛細層200‧‧‧bred layer
21‧‧‧伸縮管21‧‧‧ telescopic tube
210‧‧‧變形管部210‧‧‧Deformation Tube Department
211‧‧‧第一端口211‧‧‧ first port
212‧‧‧第二端口212‧‧‧Second port
22‧‧‧彈性元件22‧‧‧Flexible components
3‧‧‧多節毛細構件3‧‧‧Multi-section capillary
30‧‧‧毛細節管30‧‧‧Mao detail tube
300‧‧‧銜接孔300‧‧‧Connecting holes
31‧‧‧毛細節管31‧‧‧Mao detail tube
4、4’、4”‧‧‧發熱元件4, 4', 4" ‧ ‧ heating elements
圖1係本發明外觀之立體示意圖。Figure 1 is a perspective view of the appearance of the present invention.
圖2係本發明內部構造之局部剖面示意圖。Figure 2 is a partial cross-sectional view showing the internal structure of the present invention.
圖3係圖2之A部分放大詳圖。Figure 3 is an enlarged detail of a portion A of Figure 2.
圖4係本發明於豎立狀態使用下之內部剖面示意圖。Figure 4 is a schematic illustration of the internal cross-section of the present invention in use in an upright position.
圖5係圖4之B部分放大詳圖。Figure 5 is an enlarged detail view of part B of Figure 4.
圖6係本發明另一實施例之局部放大詳圖。Figure 6 is a partially enlarged detail view of another embodiment of the present invention.
為了使 貴審查委員能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。The detailed description of the present invention and the accompanying drawings are to be understood by the accompanying claims .
請參閱圖1及圖2,係分別為本發明外觀之立體示意圖、以及其內部構造之局部剖面示意圖。本發明係提供一種具可伸縮毛細組織之均溫板結構,其係用於幫助如電腦的CPU、或顯示卡的GPU晶片等發熱元件4(即如圖4所示)提供熱交換作用,並可適用於如複數發熱元件4分別處於高、低不同接觸表面的場合上,或是單一發熱元件4但受限於其周邊電子元件的高度而不易與其接觸的場合上,並可確保其內部的工作流體能有效回流,以避免發生乾燒等影響均溫板熱傳之情事。該均溫板結構包括一板狀殼體1、一伸縮受熱部件2、以及一多節毛細構件3;其中:Please refer to FIG. 1 and FIG. 2 , which are respectively a perspective view of the appearance of the present invention and a partial cross-sectional view of the internal structure thereof. The present invention provides a temperature equalizing plate structure having a retractable capillary structure for helping a heat exchange element such as a CPU of a computer or a GPU chip of a display card (i.e., as shown in FIG. 4) to provide heat exchange, and It can be applied to the case where the plurality of heating elements 4 are respectively at different high and low contact surfaces, or the single heating element 4 is limited by the height of the peripheral electronic components and is not easily contacted therewith, and the inside thereof can be ensured. The working fluid can be effectively refluxed to avoid the occurrence of dry burning and other effects that affect the heat transfer of the uniform temperature plate. The temperature equalizing plate structure comprises a plate-shaped casing 1, a telescopic heat-receiving member 2, and a multi-section capillary member 3; wherein:
請一併參閱圖3所示,該板狀殼體1內部中空並呈密封狀。而在本發明所舉之實施例中,該板狀殼體1可由一下板10與一上板11相蓋合後構成,並於該板狀殼體1內部形成一介於下板10與上板11之間的腔室12,用以供適量的工作流體(圖略)填充後並予以密封,並可於該腔室12內壁上披覆設置毛細層120,所述毛細層120可為金屬網或燒結粉末。Referring to FIG. 3 together, the plate-shaped casing 1 is hollow and sealed inside. In the embodiment of the present invention, the plate-shaped housing 1 can be formed by the lower plate 10 and an upper plate 11 being closed, and a lower plate 10 and an upper plate are formed inside the plate-shaped housing 1 . The chamber 12 between the 11 is filled with a suitable amount of working fluid (not shown) and sealed, and a capillary layer 120 may be disposed on the inner wall of the chamber 12, and the capillary layer 120 may be metal. Mesh or sintered powder.
請一併參閱圖4及圖5所示,本發明於均溫板上,除了提供可配合發熱元件4高度位置而作撓性變形的伸縮受熱部件2外,還進一步以上述多節毛細構件3來確保均溫板內部的工作流體可有效回流,例如在如圖4所示的豎立狀態使用下。且該伸縮受熱部件2可視實際需對應的發熱元件4的位置來設置、以及數量增設為複數,但數量至少以一者為限,而該多節毛細構件3則對應配置於該伸縮受熱部件2內,尤其係指該伸縮受熱部件2與板狀殼體1內部之間。Referring to FIG. 4 and FIG. 5 together, the present invention further includes the above-mentioned multi-section capillary member 3 in addition to the expansion-contracting heat-receiving member 2 which can flexibly deform the height position of the heating element 4 on the temperature equalizing plate. To ensure that the working fluid inside the temperature equalizing plate can be effectively recirculated, for example, in an upright state as shown in FIG. The telescopic heat-receiving member 2 can be disposed according to the position of the corresponding heat-generating component 4, and the number is increased to a plurality, but the number is at least one, and the multi-section capillary member 3 is correspondingly disposed on the telescopic heat-receiving member 2 In particular, it means between the telescopic heat receiving member 2 and the inside of the plate-like casing 1.
承上所述,該伸縮受熱部件2內部中空並密封連接於上述板狀殼體1之底部100外,以與該板狀殼體1之腔室12相連通。在本發明所舉之實施例中,該伸縮受熱部件2可包含一受熱板20、以及一內部呈中空的伸縮管21,該受熱板20外表面係用於接觸於發熱元件4上表面,較佳的方式是於受熱板20與發熱元件4之間塗佈有適量的導熱介質,如導熱膏等。此外,該受熱板20內表面則亦可披覆設置毛細層200,所述毛細層200仍可為金屬網或燒結粉末。該伸縮管21可為一撓性或彈性的周圍封閉管狀體,所指撓性的管體可如蛇腹管、所指彈性的管體可如彈簧管等。該伸縮管21係具有一可經伸縮而改變長度(變長或變短)的變形管部210、以及分別形成於該變形管部210二端處的一第一端口211與一第二端口212,其中所述第一端口211係供伸縮受熱部件2的受熱板20設於其上,以使受熱板20密封連接於所述第一端口211而封閉之;另,該板狀殼體1於下板10底部100上設有與腔室12相通的通孔101,所述第二端口212則與該通孔101密封連接,該通孔101的數量亦視伸縮受熱部件2的數量而作一對一的對應設置。As described above, the telescopic heat-receiving member 2 is hollow and sealingly connected to the outside of the bottom portion 100 of the plate-shaped casing 1 to communicate with the chamber 12 of the plate-shaped casing 1. In the embodiment of the present invention, the telescopic heat receiving member 2 may include a heat receiving plate 20 and an inner hollow tube 21, and the outer surface of the heat receiving plate 20 is for contacting the upper surface of the heat generating component 4, A preferred method is to apply an appropriate amount of a heat transfer medium, such as a thermal paste, between the heat receiving plate 20 and the heat generating component 4. In addition, the inner surface of the heat receiving plate 20 may also be covered with a capillary layer 200, and the capillary layer 200 may still be a metal mesh or a sintered powder. The telescopic tube 21 can be a flexible or elastic surrounding closed tubular body, and the flexible tube body can be, for example, a bellows tube, and the elastic tube body can be a spring tube or the like. The telescopic tube 21 has a deformed tube portion 210 that can be lengthened (lengthened or shortened) by telescopic expansion, and a first port 211 and a second port 212 respectively formed at two ends of the deformed tube portion 210. The first port 211 is provided on the heat receiving plate 20 of the expansion and contraction heat receiving member 2, so that the heat receiving plate 20 is sealed and connected to the first port 211 to be closed; The bottom portion 100 of the lower plate 10 is provided with a through hole 101 communicating with the cavity 12, and the second port 212 is sealingly connected with the through hole 101. The number of the through holes 101 is also determined by the number of the telescopic heat-receiving members 2. The corresponding setting for one.
該多節毛細構件3係由複數毛細節管30、31相互活動銜接而成,並依序銜接於上述伸縮受熱部件2與板狀殼體1內部之間,以隨著伸縮受熱部件2改變長度時,該多節毛細構件3亦可於伸縮受熱部件2內部因各毛細節管30、31的相互銜接作相對應的配合銜接位置。而在本發明所舉之實施例中,該等毛細節管30、31可分別為一第一毛細節管30與一第二毛細節管31,其中之第一毛細節管30內係具有一銜接孔300,所述銜接孔300可為一貫通第一毛細節管30的通孔、或是未貫通第一毛細節管30的盲孔,並供第二毛細節管31套入該銜接孔300內而使第一、二毛細節管30、31相互活動銜接。更進一步地,第一毛細節管30係設於伸縮受熱部件2之受熱板20內表面,並與受熱板20內表面的毛細層200相銜接,而第二毛細節管31則設於板狀殼體1之上板11內壁。The multi-section capillary member 3 is formed by the plurality of capillary detail tubes 30, 31 being movably coupled to each other, and sequentially connected between the telescopic heat-receiving member 2 and the interior of the plate-shaped casing 1 to change the length with the telescopic heat-receiving member 2. In this case, the multi-section capillary member 3 can also be engaged in the interior of the telescopic heat-receiving member 2 by the mutual engagement of the respective capillary detail tubes 30, 31. In the embodiment of the present invention, the capillary detail tubes 30, 31 can be a first capillary detail tube 30 and a second capillary detail tube 31, respectively, wherein the first capillary detail tube 30 has a The connecting hole 300 can be a through hole penetrating the first capillary detail tube 30 or a blind hole not penetrating the first capillary detail tube 30, and the second capillary detail tube 31 is inserted into the connection hole. The first and second hair detail tubes 30, 31 are engaged with each other within 300. Further, the first capillary detail tube 30 is disposed on the inner surface of the heat receiving plate 20 of the telescopic heat receiving member 2, and is coupled to the capillary layer 200 on the inner surface of the heat receiving plate 20, and the second capillary detail tube 31 is disposed on the plate shape. The inner wall of the plate 11 above the casing 1.
是以,藉由上述之構造組成,即可得到本發明具可伸縮毛細組織之均溫板結構。Therefore, by the above-described structural composition, the uniform temperature plate structure of the present invention having the retractable capillary structure can be obtained.
據此,如圖4及圖5所示,由於本發明之伸縮受熱部件2可藉由其伸縮管21的撓性或彈性而變形,以供各伸縮受熱部件2之受熱板20可適應不同高、低位置的發熱元件4、4’、4”而確實與之接觸,故單一均溫板仍可適用於提供複數發熱元件4、4’、4”進行熱交換。同時本發明主要係在均溫板如豎立等非水平使用狀態下,也能透過多節毛細構件3配合伸縮受熱部2,而確實銜接於該伸縮受熱部件2與該板狀殼體1內部之間,以確保均溫板內部的工作流體能有效回流至伸縮受熱部件2之受熱板20處的毛細層200,俾可避免工作流體因重力等外在因素而無法回流,進而防止均溫板內發生乾燒問題以維持其應有的熱傳效用。Accordingly, as shown in FIG. 4 and FIG. 5, the telescopic heat-receiving member 2 of the present invention can be deformed by the flexibility or elasticity of the telescopic tube 21, so that the heat-receiving plate 20 of each of the telescopic heat-receiving members 2 can be adapted to different heights. Since the low-position heating elements 4, 4', 4" are in contact with each other, the single temperature equalizing plate can be applied to provide heat exchange for the plurality of heating elements 4, 4', 4". At the same time, the present invention mainly engages the telescopic heat receiving portion 2 through the multi-section capillary member 3 in the non-horizontal use state of the temperature equalizing plate, such as erecting, and is surely engaged with the telescopic heat receiving member 2 and the inside of the plate-shaped housing 1 . In order to ensure that the working fluid inside the temperature equalizing plate can be effectively returned to the capillary layer 200 at the heat receiving plate 20 of the telescopic heat receiving member 2, the working fluid can be prevented from flowing back due to external factors such as gravity, thereby preventing the temperature in the uniform temperature plate. A dry burning problem occurs to maintain its proper heat transfer.
此外,如圖6所示,為進一步增加上述伸縮受熱部件2之受熱板20與發熱元件4表面的接觸更為確實,該伸縮受熱部件2內係設有一將受熱板20向外推抵的彈性元件22,該彈性元件22可為一壓縮彈簧,其一端推抵於受熱板20內表面或受熱板20的毛細層200上,另一端則可抵頂於板狀殼體1之腔體12內壁,如上板11內,以藉由該彈性元件22所提供的彈力,進一步增加受熱板20與發熱元件4表面間的接觸效果。Further, as shown in FIG. 6, in order to further increase the contact between the heat receiving plate 20 of the telescopic heat receiving member 2 and the surface of the heat generating component 4, the elastic heat insulating member 2 is provided with a elasticity for pushing the heat receiving plate 20 outward. The elastic member 22 can be a compression spring, one end of which is pushed against the inner surface of the heat receiving plate 20 or the capillary layer 200 of the heat receiving plate 20, and the other end can be abutted against the cavity 12 of the plate-shaped housing 1. The wall, as in the upper plate 11, further increases the contact effect between the heat receiving plate 20 and the surface of the heat generating element 4 by the elastic force provided by the elastic member 22.
綜上所述,本發明確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。In summary, the present invention can achieve the intended use purpose, and solve the lack of the conventional, and because of the novelty and progress, fully meet the requirements of the invention patent application, and apply according to the patent law, please check and The patent in this case is granted to protect the rights of the inventor.
惟以上所述僅為本發明之較佳可行實施例,非因此即拘限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術、手段等變化,均同理皆包含於本發明之範圍內,合予陳明。However, the above description is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, and the equivalent techniques and means, etc., which are used in the description of the present invention and the contents of the drawings, are the same. It is included in the scope of the present invention and is combined with Chen Ming.
1‧‧‧板狀殼體 1‧‧‧plate shell
10‧‧‧下板 10‧‧‧ Lower board
100‧‧‧底部 100‧‧‧ bottom
101‧‧‧通孔 101‧‧‧through hole
11‧‧‧上板 11‧‧‧Upper board
12‧‧‧腔室 12‧‧‧ chamber
120‧‧‧毛細層 120‧‧‧bred layer
2‧‧‧伸縮受熱部件 2‧‧‧Flexible heat-receiving parts
20‧‧‧受熱板 20‧‧‧heated plate
200‧‧‧毛細層 200‧‧‧bred layer
21‧‧‧伸縮管 21‧‧‧ telescopic tube
210‧‧‧變形管部 210‧‧‧Deformation Tube Department
211‧‧‧第一端口 211‧‧‧ first port
212‧‧‧第二端口 212‧‧‧Second port
3‧‧‧多節毛細構件 3‧‧‧Multi-section capillary
30‧‧‧毛細節管 30‧‧‧Mao detail tube
31‧‧‧毛細節管 31‧‧‧Mao detail tube
4‧‧‧發熱元件 4‧‧‧heating components
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104120129A TWI606225B (en) | 2015-06-23 | 2015-06-23 | Vapor chamber having telescopic capillary structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104120129A TWI606225B (en) | 2015-06-23 | 2015-06-23 | Vapor chamber having telescopic capillary structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201700940A TW201700940A (en) | 2017-01-01 |
TWI606225B true TWI606225B (en) | 2017-11-21 |
Family
ID=58400684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104120129A TWI606225B (en) | 2015-06-23 | 2015-06-23 | Vapor chamber having telescopic capillary structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI606225B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI671500B (en) * | 2018-06-13 | 2019-09-11 | 訊凱國際股份有限公司 | Liquid cooling device |
CN109712951B (en) * | 2019-01-09 | 2024-03-19 | 深圳兴奇宏科技有限公司 | Heat dissipation structure |
CN109673137B (en) * | 2019-01-09 | 2024-03-15 | 深圳兴奇宏科技有限公司 | Heat radiation unit |
-
2015
- 2015-06-23 TW TW104120129A patent/TWI606225B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201700940A (en) | 2017-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI606225B (en) | Vapor chamber having telescopic capillary structure | |
US10451355B2 (en) | Heat dissipation element | |
US20080253082A1 (en) | Cooling system with flexible heat transport element | |
TW201701112A (en) | Vapor chamber having telescopic heated element | |
CN107484386A (en) | The manufacture method of heat conducting device | |
CN103327792A (en) | Passive-driven micro-channel heat-sink cooling device | |
TWI675177B (en) | Complex temperature plate combined assembly | |
TWM502818U (en) | Heat sink with hidden isothermal plate | |
TWM556324U (en) | Heat dissipation device | |
CN108151565A (en) | Three-dimensional temperature equalization system | |
TWM560615U (en) | Heat dissipating device | |
CN203537724U (en) | Heat dissipating device | |
CN109699164A (en) | Plate-type heat-pipe radiating shell | |
CN206310966U (en) | A kind of structure thermal control integral heat dissipation device | |
TW202001177A (en) | Vapor chamber structure | |
CN109387106A (en) | Multiple temperature-uniforming plates combine assembly | |
TWI620910B (en) | A three dimensional vapor chamber device | |
CN207487473U (en) | Multiple temperature-uniforming plates combine assembly | |
TWI542276B (en) | Thermal module | |
TW201317532A (en) | Heat-dissipating device | |
CN108716869A (en) | Equalizing plate structure | |
TWM470497U (en) | Heat dissipation module | |
CN104661490A (en) | Uniform temperature plate structure | |
TWI611157B (en) | Heat pipe module and heat dissipating device using the same | |
TW201800713A (en) | Heat dissipation device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |