CN109712951B - Heat dissipation structure - Google Patents
Heat dissipation structure Download PDFInfo
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- CN109712951B CN109712951B CN201910020802.1A CN201910020802A CN109712951B CN 109712951 B CN109712951 B CN 109712951B CN 201910020802 A CN201910020802 A CN 201910020802A CN 109712951 B CN109712951 B CN 109712951B
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- lower plate
- upper plate
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- capillary structure
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- 230000017525 heat dissipation Effects 0.000 title abstract description 21
- 239000012530 fluid Substances 0.000 claims abstract description 7
- 239000011247 coating layer Substances 0.000 claims description 19
- 238000001704 evaporation Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 238000009833 condensation Methods 0.000 claims description 12
- 230000005494 condensation Effects 0.000 claims description 12
- 230000008020 evaporation Effects 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 229920005570 flexible polymer Polymers 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000008602 contraction Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 1
- WCERXPKXJMFQNQ-UHFFFAOYSA-N [Ti].[Ni].[Cu] Chemical compound [Ti].[Ni].[Cu] WCERXPKXJMFQNQ-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Bedding Items (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation structure, which comprises a body, wherein the body is provided with an upper plate, a lower plate, a telescopic part and a cavity, the upper plate, the telescopic part and the lower plate jointly define the cavity, the telescopic part is arranged between the upper plate and the lower plate, a body capillary structure is arranged in the cavity, the body capillary structure is arranged on an inner wall of the cavity, and the cavity is filled with a working fluid.
Description
Technical Field
The present invention relates to a heat dissipating structure, and more particularly, to a heat dissipating structure with a body that can be extended and retracted to change its length (or height) and bend.
Background
With the progress of semiconductor technology, the volume of integrated circuits is also gradually reduced, and in order to enable the integrated circuits to process more data, the integrated circuits with the same volume can accommodate more than several times more computing elements than before, when the number of computing elements in the integrated circuits is increased, the execution efficiency is increased, so that the heat energy generated by the computing elements during operation is also increased, taking a common central processing unit as an example, at the time of high-full workload, the heat emitted by the central processing unit is enough to cause the whole central processing unit to burn out, and therefore, the heat dissipation structure of the integrated circuits becomes an important subject.
The central processing unit and the chip or other electronic components in the electronic equipment are heat sources in the electronic equipment, and when the electronic equipment operates, the heat sources generate heat, so that the heat dissipation structures such as heat pipes, temperature equalizing plates, flat heat pipes and the like which are commonly used in the prior art have good heat dissipation and heat conduction effects to conduct heat conduction or temperature equalization, wherein the heat pipes are mainly used as far-end heat conduction; one end of the heat pipe absorbs heat, the internal working fluid is converted from liquid state to vapor state for evaporation, the heat is transferred to the other end of the heat pipe, and the purpose of heat conduction is achieved.
Because the finished products manufactured by the existing heat pipes or temperature equalizing plates are all fixed in size (such as length), the heat generating source of each electronic device is different in setting position and height, so that the heat pipes or temperature equalizing plates arranged in each electronic device can be used only by selecting the corresponding size, and the heat pipes or temperature equalizing plates in each electronic device cannot be mutually used in common (or along) mode, and further the use is quite inconvenient.
Disclosure of Invention
It is an object of the present invention to provide a heat dissipating structure with a body that can be extended and retracted to change its length (or height) and bent or modified.
Another objective of the present invention is to provide a heat dissipation structure that can achieve multiple uses by means of a body with a telescopic portion, so as to be suitable for different electronic devices and achieve an interoperability effect.
Another object of the present invention is to provide a heat dissipation structure with good convenience.
In order to achieve the above objective, the present invention provides a heat dissipation structure, which comprises a body, wherein the body is provided with an upper plate, a lower plate, a telescopic part and a chamber, the upper plate, the telescopic part and the lower plate together define the chamber, the telescopic part is arranged between the upper plate and the lower plate, a body capillary structure is arranged in the chamber, the body capillary structure is arranged on an inner wall of the chamber, and the chamber is filled with a working fluid.
The heat radiation structure, wherein: the chamber is internally provided with a coating layer which is arranged in the chamber corresponding to the telescopic part and is in contact connection with the capillary structure of the body in the chamber.
The heat radiation structure, wherein: the body is provided with an evaporation part and a condensation part, the condensation part and the evaporation part are respectively positioned on the upper plate and the lower plate, the expansion part is provided with a plurality of expansion joints, the expansion joints are provided with a concave ring body and a convex ring body, the concave ring body and the convex ring body are one section, and the concave ring body and the convex ring body of the expansion joints are mutually connected to form the expansion part in a mutually-spaced manner, so that the expansion joint can be stretched or compressed.
The heat radiation structure, wherein: the cover layer is formed on the inner wall of the chamber corresponding to the telescopic part and is positioned between the upper plate and the lower plate, one end of the cover layer is contacted with the body capillary structure connected with the inner wall of the chamber adjacent to the upper plate, and the other end of the cover layer is contacted with the body capillary structure connected with the inner wall of the chamber adjacent to the lower plate.
The heat radiation structure, wherein: the telescopic part is made of a flexible and elastic metal material or nonmetal material.
The heat radiation structure, wherein: the body capillary structure is a woven mesh, a fiber body, a metal sintering powder body, a groove or any combination of the above, and the coating layer is a capillary structure.
The heat radiation structure, wherein: the coating layer is flexible polymer material structure, flexible paper structure, flexible cloth structure or memory alloy structure.
The heat radiation structure, wherein: the body is a temperature equalizing plate or a hot plate.
The heat radiation structure, wherein: the upper plate and the lower plate are made of metal materials, and the metal materials are copper materials, gold materials or aluminum materials.
The heat radiation structure, wherein: the coating layer is a capillary structure, and the coating layer is selected from grooves, woven mesh, fiber bodies or any combination of the above and whisker.
Therefore, by the design of the heat dissipation structure, the length (or the height) and the bending or deformation of the heat dissipation structure can be effectively and telescopically changed, so that the use of the heat dissipation structure is changeable and the use convenience is good, and the heat dissipation structure can be also suitable for different electronic devices to effectively achieve the interoperability.
Drawings
Fig. 1 is a schematic diagram of a three-dimensional assembly according to an embodiment of the invention.
FIG. 2A is a schematic diagram of an embodiment of the present invention in partial cross section and compressed to a reduced height state.
FIG. 2B is a schematic diagram of a stretched height state with a partial cross section of an embodiment of the present invention.
FIG. 3A is a schematic view of a part of another embodiment of the present invention in a compressed lowered height state.
FIG. 3B is a schematic view of another embodiment of the present invention in partial cross section and in a stretched height state.
Reference numerals illustrate: a heat dissipation structure 1; a body 10; an upper plate 11; a lower plate 12; an evaporation unit 101; a condensing unit 102; a telescopic section 103; a telescopic joint 1031; female ring body 1032; a convex ring 1033; a chamber 105; a body capillary structure 31; cladding layer 32.
Detailed Description
The above objects of the present invention, as well as the structural and functional characteristics thereof, will be described in terms of the preferred embodiments of the present invention as illustrated in the accompanying drawings.
The invention relates to a heat dissipation structure, please refer to fig. 1 for a schematic diagram of a three-dimensional assembly according to an embodiment of the invention; FIG. 2A is a schematic diagram of an embodiment of the present invention in partial cross section and compressed lowered height; FIG. 2B is a schematic diagram of a stretched height state with a partial cross section of an embodiment of the present invention. The heat dissipation structure 1 includes a body 10, and the body 10 is shown as a temperature equalizing plate in the present embodiment, but is not limited thereto, and the body 10 may be a hot plate, a heat pipe or other two-phase flow heat dissipation structure in practical implementation. The main body 10 has an upper plate 11, a lower plate 12, an evaporating portion 101, a condensing portion 102, a telescopic portion 103 and a chamber 105, wherein the upper plate 11 and the lower plate 12 are made of a metal material, and the metal material is gold, silver, copper, iron, aluminum, stainless steel, titanium or alloy, and the upper plate 11, the telescopic portion 103 and the lower plate 12 together define the chamber 105, the evaporating portion 101 and the condensing portion 102 of the main body 10 are respectively located on the lower plate 12 and the upper plate 11, and the evaporating portion 101 is attached to a heating element (such as a central processing unit, a display processor, a north-south bridge chip or other heating source; not shown). The expansion part 103 is made of a flexible and flexible material, for example, a metal material, which is selected from copper material, gold material, aluminum material, or an alloy material thereof, and is disposed between the upper plate 11 and the lower plate 12 of the body 10 (i.e., between the evaporation part 101 and the condensation part 102 of the body 10), that is, the expansion part 103 is disposed between the upper plate 11 and the lower plate 12 along the peripheral side of the adjacent body 10, and the expansion part 103 is integrally connected to the inner side of the lower plate 12 from the inner side of the upper plate 11 facing the lower plate 12 on the peripheral side of the adjacent body 10, and in practical implementation, the connection manner between the expansion part 103 and the upper plate 11 and the lower plate 12 may be a welding manner (e.g., laser welding, micro arc welding, resistance welding, or spot welding) or diffusion bonding manner.
In one embodiment, the upper plate 11 and the lower plate 12 of the body 10 are made of metal (gold, silver, copper, iron, aluminum, stainless steel, titanium or alloy), the expansion part 103 is instead made of a non-metal (such as plastic or rubber with ductile flexible material or polymer), and the expansion part 103 and the upper plate 11 and the lower plate 12 may be integrally molded (or glued, sleeved, clamped or otherwise combined) to form the body 10.
The expansion part 103 is provided with a plurality of expansion joints 1031, the expansion joints 1031 are provided with a concave ring body 1032 and a convex ring body 1033, the concave ring body 1032 and the convex ring body 1033 are one joint, the expansion joint 1031 in the embodiment is shown as 3 expansion joints 1031, the concave ring body 1032 and the convex ring body 1033 of the expansion joint 1031 are mutually connected to form the expansion part 103, and can be axially stretched (including axially stretched (or height) and arbitrarily bent or deformed) or axially compressed (or height), and the inner diameters of the concave ring bodies 1032 are the same as each other and the inner diameters of the convex ring bodies 1033 are the same as each other. The number of the expansion joints 1031 according to the present invention is not limited to the above 3 expansion joints 1031, and in practical implementation, the number of expansion joints 1031 may be adjusted according to the length (or height) of the body 10 of the user and the heat dissipation requirement design, for example, the expansion joints 1031 are designed to be less than 3 (e.g., 2 expansion joints 1031) or more than 4 (e.g., 14 expansion joints 1031).
The evaporation portion 101, the expansion portion 103 and the condensation portion 102 together define the chamber 105, a working fluid (such as pure water or methanol or refrigerant) is filled in the chamber 105, a body capillary structure 31 and a coating layer 32 expanding and contracting with the expansion portion 103 are disposed in the chamber 105, the body capillary structure 31 may be a metal sintered powder, a woven mesh, a fiber, a groove or any combination thereof, and the body capillary structure 31 is disposed on an inner wall of the chamber 105, and in this embodiment, the body capillary structure 31 is a metal sintered powder formed on inner walls (i.e. inner sides of the upper and lower plates 11, 12) of the chamber 105 located in the evaporation portion 101 and the condensation portion 102. In the present embodiment, the expansion and contraction portion 103 is shown as 1 expansion and contraction portion 103 being provided between the upper plate 11 and the lower plate 12, but the present invention is not limited to the embodiment, and it is also possible to design 2 expansion and contraction portions 103 or more than 2 expansion and contraction portions 103 being provided between the upper plate 11 and the lower plate 12 at intervals to effectively achieve the effect of varying the usage.
The coating layer 32 is shown as a capillary structure in this embodiment, and the capillary structure is, for example, a woven mesh, a fiber body, or a groove, the coating layer 32 is disposed in the cavity 105 between the upper plate 11 and the lower plate 12, the coating layer 32 is disposed in the cavity 105 corresponding to the expansion portion 103, and the coating layer 32 is in contact with the body capillary structure 31 in the cavity 105, that is, the coating layer 32 is disposed on the inner wall of the cavity 105 corresponding to the expansion portion 103 (i.e., the coating layer 32 is formed on the inner side of the expansion portion 103 disposed in the cavity 105) and is disposed between the upper plate 11 and the lower plate 12, and one end of the coating layer 32 contacts the body capillary structure 31 connected to the inner wall of the cavity 105 adjacent to the upper plate 11, and the other end of the coating layer 32 contacts the body capillary structure 31 connected to the inner wall of the cavity 105 adjacent to the lower plate 12. In one embodiment, the coating 32 may be selected from a woven mesh or a fibrous body or any combination of the foregoing with whiskers.
In another embodiment, please refer to fig. 3A, which is a schematic diagram illustrating a partial cross section of another embodiment of the present invention in a compressed reduced height state; FIG. 3B is a schematic view of another embodiment of the present invention in partial cross section and in a stretched height state. As shown in the drawing, the coating 32 is changed to a non-above-mentioned capillary structure, that is, the coating 32 is changed to a flexible polymer structure (such as polyester fiber or nylon fiber) or a flexible paper structure (such as fiber paper) or a flexible cloth structure (such as non-woven cloth or cotton cloth) or a memory alloy (such as titanium nickel alloy, titanium palladium alloy or titanium nickel copper alloy) structure, the coating 32 is disposed in the chamber 105 adjacent to the expansion portion, that is, the coating 32 is coated on the inner side of the expansion portion 103 in the chamber 105, both ends of the coating 32 respectively contact with the body capillary structure 31 connecting the inner walls of the chamber 105 adjacent to the upper plate 11 and the lower plate 12, so that the coating 32 absorbs the condensed working fluid on the body capillary structure 31 of the inner wall of the chamber 105 of the upper plate through capillary action of the fiber on itself, and transmits the condensed working fluid to the body capillary structure 31 of the inner wall of the chamber 105 of the lower plate 12, and the expansion portion 103 can further increase the elasticity and the expansion portion 103.
Therefore, when the evaporation portion 101 of the main body 10 is attached to a heating element (such as a cpu) of an electronic device (such as a pen, a computer, a communication box, a server, or a smart mobile phone, a communication device, or an industrial device, or a transportation device; not shown), the height of the evaporation portion 101 can be axially extended (such as fig. 2B, the evaporation portion 103 is in an extended height state) through the expansion portion 103, so that the height of the condensation portion 102 of the main body 10 can be axially extended upwards to be extended to a far non-heat-source area in the electronic device for heat dissipation, and if other electronic components are blocked during the process of the condensation portion 102 being pulled up to the non-heat-source area, the expansion portion 103 can be arbitrarily bent to bypass other blocked electronic components due to the flexible and flexible material characteristics; if the height of the condensation portion 102 of the main body 10 is reduced to a region with less heat sources, the height of the condensation portion 102 of the main body 10 can be reduced by the expansion portion 103 being compressed in the axial direction (as shown in fig. 2A, the expansion portion 103 is in a compressed reduced height state), so that the height of the condensation portion 102 of the main body 10 is reduced in the axial direction to be drawn down to a region with less heat sources in the electronic device for dissipating heat, thereby effectively achieving the telescopic change of the height (or length) and bending, and effectively achieving the use variation and the use convenience.
In addition, when the body 10 is taken from an electronic device to another electronic device with different dimensions, the height (or length) of the body 10 can be arbitrarily bent by stretching and retracting the telescopic part 103 of the body 10, so that the body is effectively suitable for being used in the electronic devices with different dimensions, and the effect of interoperability is effectively achieved.
In summary, the above embodiments of the present invention can effectively and telescopically change the length and the bending of the heat dissipation structure 1 by the design of the heat dissipation structure, so as to effectively achieve multiple changes in use and good convenience in use, and can also be applied to different electronic devices to effectively achieve the effect of interoperability.
Claims (8)
1. The utility model provides a heat radiation structure, includes a body, its characterized in that: the body is provided with an upper plate, a lower plate, a telescopic part and a cavity, the upper plate, the telescopic part and the lower plate jointly define the cavity, the telescopic part is circumferentially arranged between the upper plate and the lower plate along the peripheral side of the adjacent body, a body capillary structure is arranged in the cavity, the body capillary structure is arranged on an inner wall of the cavity, and the cavity is filled with a working fluid;
the chamber is internally provided with a coating layer which is arranged in the chamber corresponding to the telescopic part and is in contact connection with the body capillary structure in the chamber; the cover layer is formed on the inner wall of the chamber corresponding to the telescopic part and is positioned between the upper plate and the lower plate, one end of the cover layer is contacted with the body capillary structure connected with the inner wall of the chamber adjacent to the upper plate, and the other end of the cover layer is contacted with the body capillary structure connected with the inner wall of the chamber adjacent to the lower plate.
2. The heat dissipating structure of claim 1, wherein: the body is provided with an evaporation part and a condensation part, the condensation part and the evaporation part are respectively positioned on the upper plate and the lower plate, the expansion part is provided with a plurality of expansion joints, the expansion joints are provided with a concave ring body and a convex ring body, the concave ring body and the convex ring body are one section, and the concave ring body and the convex ring body of the expansion joints are mutually connected to form the expansion part in a mutually-spaced manner, so that the expansion joint can be stretched or compressed.
3. The heat dissipating structure of claim 1, wherein: the telescopic part is made of a flexible and elastic metal material or nonmetal material.
4. The heat dissipating structure of claim 1, wherein: the body capillary structure is a woven mesh, a fiber body, a metal sintering powder body, a groove or any combination of the above, and the coating layer is a capillary structure.
5. The heat dissipating structure of claim 1, wherein: the coating layer is flexible polymer material structure, flexible paper structure, flexible cloth structure or memory alloy structure.
6. The heat dissipating structure of claim 1, wherein: the body is a temperature equalizing plate or a hot plate.
7. The heat dissipating structure of claim 1, wherein: the upper plate and the lower plate are made of metal materials, and the metal materials are copper materials, gold materials or aluminum materials.
8. The heat dissipating structure of claim 1, wherein: the coating layer is a capillary structure, and the coating layer is selected from grooves, woven mesh, fiber bodies or any combination of the above and whisker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910020802.1A CN109712951B (en) | 2019-01-09 | 2019-01-09 | Heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910020802.1A CN109712951B (en) | 2019-01-09 | 2019-01-09 | Heat dissipation structure |
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| Publication Number | Publication Date |
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| CN109712951A CN109712951A (en) | 2019-05-03 |
| CN109712951B true CN109712951B (en) | 2024-03-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910020802.1A Active CN109712951B (en) | 2019-01-09 | 2019-01-09 | Heat dissipation structure |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110322797B (en) * | 2019-07-15 | 2020-07-10 | 深圳市鸿天盛信息技术有限公司 | Security display device and control method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
| TW201423020A (en) * | 2012-12-07 | 2014-06-16 | Asia Vital Components Co Ltd | Vapor chamber structure and manufacturing method thereof |
| TW201700940A (en) * | 2015-06-23 | 2017-01-01 | 超眾科技股份有限公司 | Vapor chamber having telescopic capillary structure |
| TWI589831B (en) * | 2016-01-19 | 2017-07-01 | 超眾科技股份有限公司 | Heat transfer loop |
| CN209357712U (en) * | 2019-01-09 | 2019-09-06 | 深圳兴奇宏科技有限公司 | Radiator structure |
-
2019
- 2019-01-09 CN CN201910020802.1A patent/CN109712951B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
| TW201423020A (en) * | 2012-12-07 | 2014-06-16 | Asia Vital Components Co Ltd | Vapor chamber structure and manufacturing method thereof |
| TW201700940A (en) * | 2015-06-23 | 2017-01-01 | 超眾科技股份有限公司 | Vapor chamber having telescopic capillary structure |
| TWI589831B (en) * | 2016-01-19 | 2017-07-01 | 超眾科技股份有限公司 | Heat transfer loop |
| CN209357712U (en) * | 2019-01-09 | 2019-09-06 | 深圳兴奇宏科技有限公司 | Radiator structure |
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| CN109712951A (en) | 2019-05-03 |
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