CN109712951A - Radiator structure - Google Patents
Radiator structure Download PDFInfo
- Publication number
- CN109712951A CN109712951A CN201910020802.1A CN201910020802A CN109712951A CN 109712951 A CN109712951 A CN 109712951A CN 201910020802 A CN201910020802 A CN 201910020802A CN 109712951 A CN109712951 A CN 109712951A
- Authority
- CN
- China
- Prior art keywords
- ontology
- chamber
- coating layer
- pars contractilis
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims abstract description 5
- 239000011247 coating layer Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 16
- 238000009833 condensation Methods 0.000 claims description 14
- 230000005494 condensation Effects 0.000 claims description 14
- 230000008020 evaporation Effects 0.000 claims description 13
- 238000001704 evaporation Methods 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 239000000956 alloy Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910004337 Ti-Ni Inorganic materials 0.000 description 1
- 229910011209 Ti—Ni Inorganic materials 0.000 description 1
- WCERXPKXJMFQNQ-UHFFFAOYSA-N [Ti].[Ni].[Cu] Chemical compound [Ti].[Ni].[Cu] WCERXPKXJMFQNQ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The present invention provides a kind of radiator structure, including an ontology, the ontology is equipped with a upper plate, a lower plate, a pars contractilis and a chamber, the upper plate and the pars contractilis and the lower plate define aforementioned cavity jointly, the pars contractilis is set between the upper plate and lower plate, an ontology capillary structure is equipped in the chamber, which is set to an inner wall of the chamber, and a working fluid is filled in the chamber.
Description
Technical field
The present invention relates to a kind of radiator structure, it is espespecially a kind of have can by its length (or height) of an ontology telescopic variation and
Curved radiator structure.
Background technique
With the progress of semiconductor technology, the volume of integrated circuit is also gradually reduced, and in order to enable integrated circuit to handle
More data, the integrated circuit under same volume, it is already possible to accommodate than computing elements more than how upper several times in the past, work as product
Execution efficiency is higher and higher when computing element quantity in body circuit is more and more, therefore generated heat when computing element work
Can be also increasing, by taking common central processing unit as an example, in the fully loaded workload of height, heat that central processing unit gives out
Degree, it is sufficient to burn central processing unit entirely, therefore, the radiator structure of integrated circuit is turned into important project.
Central processing unit and chip or other electronic components in electronic equipment are the pyrotoxins in electronic equipment, when
When electronic equipment operates, which will generate heat, therefore existing be often used radiator structure such as heat pipe, temperature-uniforming plate, flat
There is heat pipe etc. good heat radiating and heat conduction efficiency to carry out thermally conductive or samming, and wherein heat pipe is mainly to make as distally thermally conductive
With；Internal process fluid is converted to steam state evaporation by liquid by one end absorption heat and transfers heat to the heat pipe other end by it,
And then achieve the purpose that heat transfer, and passing the biggish position system of area for heat can select temperature-uniforming plate as heat dissipation element, samming
Plate is mainly by the side Planar adsorbent heat contacted with heat source, then conducts heat to the other side and make heat dissipation condensation.
Since the finished product that existing heat pipe or temperature-uniforming plate produce is fixed size (such as length), because of each electronic device
Pyrotoxin set by seated position and height be all different, make the heat pipe installed in each electronic device or temperature-uniforming plate must selector
The size of conjunction could use, to cause heat pipe in each electronic device or temperature-uniforming plate to be unable to reach mutual general (or continuing to use),
And then suitable inconvenience is brought in use.
Summary of the invention
A purpose of the invention provide it is a kind of have can by its length (or height) of an ontology telescopic variation and bending or
The radiator structure of modification.
Another object of the present invention provide it is a kind of can reach by an ontology with pars contractilis using changeableization, with suitable
For different electronic devices, to reach the radiator structure of intercommunity effect.
Another object of the present invention a kind of can reach the good radiator structure of ease of use providing.
In order to achieve the above object, the present invention provides a kind of radiator structure, which includes an ontology, which is equipped with one
Upper plate, a lower plate, a pars contractilis and a chamber, the upper plate and the pars contractilis and the lower plate define aforementioned cavity jointly, this is flexible
Portion is set between the upper plate and lower plate, and an ontology capillary structure is equipped in the chamber, which is set to the chamber
One inner wall, and a working fluid is filled in the chamber.
The radiator structure a, in which: coating layer is equipped in the chamber, which is set to being somebody's turn to do for the corresponding pars contractilis
In chamber, which is in contact with the indoor ontology capillary structure of the chamber and connect.
The radiator structure, in which: the ontology has an evaporation part, a condensation part, and the condensation part and evaporation part are distinguished
Positioned at the upper plate and lower plate, which is equipped with plural telescopic joint, which is equipped with a concave ring body and a convex ring body, should
Concave ring body and the convex ring body are a section, and alternate connecting constitutes aforementioned stretch to concave ring body and convex ring body of the plural number telescopic joint each other
Portion, and can be stretched or be compressed.
The radiator structure, in which: the coating layer is formed on the inner wall for being set to the chamber of the corresponding pars contractilis, and position
Between the upper plate and lower plate, the end thereof contacts of the coating layer connect the ontology capillary structure of the chamber inner wall of the adjacent upper plate,
And the other end of the coating layer connects the ontology capillary structure of the chamber inner wall of the adjacent lower plate.
The radiator structure, in which: the pars contractilis is a flexible elastic and metal material flexible or non-metallic material
It is constituted.
The radiator structure, in which: the ontology capillary structure is mesh grid, corpus fibrosum, sintered metal powder body, groove
Or aforementioned any combination, the coating layer are a capillary structure.
The radiator structure, in which: the coating layer is the macromolecule material structure or flexible flexibility of flexible flexibility
Paper structure or flexible flexibility cloth structure or memory alloy structure.
The radiator structure, in which: the ontology is a temperature-uniforming plate or a hot plate.
The radiator structure, in which: the upper plate is made of with lower plate metal material, the metal material be copper material or
Golden material or aluminium material.
The radiator structure, in which: the coating layer be a capillary structure, the coating layer be selected as groove or mesh grid or
Corpus fibrosum aforementioned any is combined with whisker.
So the design of this radiator structure through the invention, so that its length (or height) of effectively scalable variation and bending
Or modification, effectively to reach good using changeableization and ease of use, and could be applicable on different electronic devices effectively to reach
To intercommunity.
Detailed description of the invention
Fig. 1 is the schematic diagram of the three-dimensional combination of one embodiment of the invention.
Fig. 2A is the part section of one embodiment of the invention and is in the schematic diagram for being reduced height condition by compression.
Fig. 2 B is the part section of one embodiment of the invention and in the schematic diagram of height condition of being stretched.
Fig. 3 A is the part section of the invention in another embodiment and is in the schematic diagram for being reduced height condition by compression.
Fig. 3 B is for the part section of the invention in another embodiment and in the schematic diagram for the height condition that is stretched.
Description of symbols: radiator structure 1；Ontology 10；Upper plate 11；Lower plate 12；Evaporation part 101；Condensation part 102；It is flexible
Portion 103；Telescopic joint 1031；Concave ring body 1032；Convex ring body 1033；Chamber 105；Ontology capillary structure 31；Coating layer 32.
Specific embodiment
Above-mentioned purpose and its structure of the invention and characteristic functionally, the preferred embodiment according to institute's accompanying drawings is given
Explanation.
The present invention is a kind of radiator structure, please refers to the schematic diagram for the three-dimensional combination that Fig. 1 is one embodiment of the invention；Figure
2A is the part section of one embodiment of the invention and is in the schematic diagram for being reduced height condition by compression；Fig. 2 B is of the invention one
The part section of embodiment and in the schematic diagram of height condition of being stretched.The radiator structure 1 include an ontology 10, the ontology 10 in
The present embodiment is expressed as a temperature-uniforming plate, but not limited to this, in when it is implemented, the ontology 10 may be selected to be a hot plate, heat pipe
Or other two-phase flow radiator structures.The ontology 10 has a upper plate 11, a lower plate 12, an evaporation part 101, a condensation part 102, one
Pars contractilis 103 and a chamber 105, wherein the upper plate 11 is made of with lower plate 12 metal material, the metal material be gold,
Silver, copper, iron, aluminium, stainless steel, titanium or alloy, and the upper plate 11 and pars contractilis 103 and lower plate 12 define aforementioned cavity jointly
105, the evaporation part 101 and condensation part 102 of the ontology 10 are located at the lower plate 12 and upper plate 11, the evaporation part 101 and a hair
Thermal element (such as central processing unit, video-stream processor or north and south bridge chip or other pyrotoxins；Do not show in figure) mutually it is sticked.And this is stretched
Contracting portion 103 is made of a flexible tool elasticity and material flexible, such as metal material, the metal material be selected as copper material or
Golden material or aluminium material or and combinations thereof alloy material, the pars contractilis be set to the ontology 10 upper plate 11 and lower plate 12 between
(i.e. between the evaporation part 101 and condensation part 102 of the ontology 10), that is to say, that the pars contractilis 103 is along the adjacent ontology 10
Side is around being located between the upper plate 11 and lower plate 12, and 103 system of pars contractilis is from the upper plate of the side of the adjacent ontology 10
Towards in face of 12 direction of lower plate, integrally extension is connected on the inside of the lower plate 12 on 11 inside, in when it is implemented, this is stretched
The connection type of contracting portion 103 and upper plate 11 and lower plate 12 be alternatively chosn to welding manner (such as laser welding or differential of the arc welding or
Resistance welding or spot welding) or diffusion bonding mode engage together.
In an embodiment, it is (gold, silver, copper, iron, aluminium, stainless that the upper plate 11 and lower plate 12 of the ontology 10 are that metal material is constituted
Steel, titanium or alloy), which, which changes, is designed as a non-metallic material and constitutes (the plastic cement or rubber that such as flexible flexible tool extends
Glue material matter or polymer), the pars contractilis 103 and upper plate 11 and lower plate 12 can be to coat injection molding (or gluing, set with one
Connect, be clamped or other modes combination) to constitute the ontology 10.
And the pars contractilis 103 is equipped with plural telescopic joint 1031, which is equipped with a concave ring body 1032 and one
Convex ring body 1033, the concave ring body 1032 and the convex ring body 1033 are a section, are expressed as 3 in the telescopic joint 1031 of the present embodiment and stretch
Casing coupling 1031 illustrates that alternate connecting constitutes aforementioned stretch to the concave ring body 1032 and convex ring body 1033 of the plural number telescopic joint 1031 each other
Portion 103, and can be pressed by axial tension length (including axial tension length (or height) and any bending or modification) or axially
Contracting length (or height), and mutually the same and described these convex ring bodies 1033 of internal diameter of these concave ring bodies 1032
Internal diameter is mutually the same.Wherein not limited to this above-mentioned 3 telescopic joints 1031 of telescopic joint 1031 of the invention, in when it is implemented,
The joint number amount of telescopic joint 1031 can be adjusted according to the length (or height) and radiating requirements design of the ontology 10 of user, such as
Telescopic joint 1031 is designed as 3 sections or less (such as 2 telescopic joints 1031) or 4 sections or more (such as 14 telescopic joints 1031).
And the chamber 105 is defined in the evaporation part 101 and pars contractilis 103 and condensation part 102 jointly, filling in the chamber 105
Have a working fluid (such as pure water or methanol or refrigerant), an ontology capillary structure 31 is equipped in the chamber 105 and is stretched with one with this
The flexible coating layer 32 in contracting portion 103, which can be a sintered metal powder body, mesh grid, corpus fibrosum, groove
Or aforementioned any plural number combination, and the ontology capillary structure 31 is set to an inner wall of the chamber 105, in the present embodiment this chaeta
Fine texture 31 is that sintered metal powder body is formed in the inner wall of the chamber 105 positioned at the evaporation part 101 Yu condensation part 102 (i.e.
The inside of the upper and lower plate 11,12).In addition, aforementioned pars contractilis 103 is expressed as 1 pars contractilis 103 set on upper plate in the present embodiment
Between 11 and lower plate 12, but be not limited to, in when it is implemented, can also design 2 pars contractilis 103 or 2 pars contractilis 103 with
On be arranged at intervals between the upper plate 11 and lower plate 12, effectively to reach using diverse effect.
And the coating layer 32 is expressed as a capillary structure in the present embodiment, and the capillary structure is such as mesh grid, fiber
Body, groove, the coating layer 32 are set in the chamber 105 between the upper plate 11 and lower plate 12, which is provided at corresponding be somebody's turn to do
In the chamber 105 of pars contractilis 103, and the coating layer 32 is in contact with the ontology capillary structure 31 in the chamber 105 and connect,
That is the coating layer 32 is located on the inner wall of the chamber 105 of the corresponding pars contractilis 103, (i.e. coating layer 32, which is formed, is arranged in chamber
On the inside of pars contractilis 103 in 105), and between the upper plate 11 and lower plate 12, and the end thereof contacts of the coating layer 32
The other end of the ontology capillary structure 31 and the coating layer 32 that connect 105 inner wall of chamber of the adjacent upper plate 11 connects phase
The ontology capillary structure 31 of 105 inner wall of chamber of the adjacent lower plate 12.In an embodiment, the coating layer 32 may be selected to be mesh grid or
Corpus fibrosum aforementioned any is combined with whisker.
In another embodiment, please refers to Fig. 3 A and be the part section of the invention in another embodiment and reduced in by compression
The schematic diagram of height condition；Fig. 3 B is for the part section of the invention in another embodiment and in the signal for the height condition that is stretched
Figure.In as shown, aforementioned coating layer 32 is changed to non-above-mentioned capillary structure, that is to say, that the coating layer 32 changes that be designed as one flexible
The macromolecule material structure (such as polyester fiber or nylon fiber) of flexibility or the paper structure (such as fibrous paper) of a flexible flexibility
Or one flexible flexibility cloth structure (such as nonwoven fabric or cotton) or a memorial alloy (such as Ti-Ni alloy, titanium palldium alloy or titanium nickel
Copper alloy) structure, which is set in the chamber 105 of the adjacent correspondence pars contractilis namely 32 coating of coating layer is affixed on
On the inside of the pars contractilis 103 in the chamber 105, the both ends of the coating layer 32 connect the adjacent upper plate 11 under respectively
The ontology capillary structure 31 of 105 inner wall of chamber of plate 12 enables coating layer 32 by the capillarity of the fiber with this (if do not knitted
The capillarity of measuring fiber) be absorbed into the upper plate 105 inner wall of chamber ontology capillary structure 31 on the condensed workflow of institute
It after body, and is transmitted on the ontology capillary structure 31 of 105 inner wall of chamber of the lower plate 12, and can also increase by the coating layer 32
Add the telescopic resilience of pars contractilis 103 and increases the effect of the strength and toughness of pars contractilis 103.
So the evaporation part 101 when the ontology 10 is sticked in an electronic device (such as pen electricity, computer, communication cabinet, servomechanism
Or on intelligent mobile phone or communication apparatus or commercial plant or transport device；Do not show in figure) heater element (such as centre
Manage device) when, it can be axially stretched by the pars contractilis 103 height (such as Fig. 2 B, pars contractilis 103 is in the height condition that is stretched), into
And it extends axially upward the height of the condensation part 102 of the ontology 10 and draws high farther away no heat source region in the electronic device
Upper heat dissipation, and if when encountering other electronic components during the condensation part 102 is drawn high to no heat source region and hindering, can be by should
Pars contractilis 103 is arbitrarily bent around other electric devices of obstruction with flexible elastic and material characteristic flexible；If at this point, thinking
When the shortening height of condensation part 102 of the ontology 10 is pulled to relatively nearly less heat source region, can axially it be pressed by the pars contractilis 103
Contracting reduces height (such as Fig. 2A, the pars contractilis 103 are in reduce height condition by compression), and then makes the condensation part 102 of the ontology 10
Height shorten radiate in drawing to less heat source region relatively close in electronic device axially downward so that effectively reaching and can stretch
Contracting changes its height (or length) and bending, and effectively reaches good using changeableization and ease of use.
In addition, can lead to when the ontology 10 is installed in another various sizes of electronic device by taking in an electronic device
Crossing 103 telescopic variation of pars contractilis of the ontology 10 its height (or length) can arbitrarily be bent, to be effectively useful in variant size
Electronic device in, effectively to achieve the effect that intercommunity.
In conclusion the design of the various embodiments described above this radiator structure 1 through the invention so that effectively scalable variation its
Length and bending effectively to reach good using changeableization and ease of use, and could be applicable on different electronic devices to have
Effect achievees the effect that intercommunity.
Claims (10)
1. a kind of radiator structure, including an ontology, it is characterised in that: the ontology is equipped with a upper plate, a lower plate, a pars contractilis and one
Chamber, the upper plate and the pars contractilis and the lower plate define aforementioned cavity jointly, which is set between the upper plate and lower plate, should
An ontology capillary structure is equipped in chamber, which is set to an inner wall of the chamber, and is filled in the chamber
One working fluid.
2. radiator structure according to claim 1, it is characterised in that: be equipped with a coating layer in the chamber, which sets
In in the chamber of the corresponding pars contractilis, which is in contact with the indoor ontology capillary structure of the chamber and connect.
3. radiator structure according to claim 1, it is characterised in that: the ontology has an evaporation part, a condensation part, this is cold
Solidifying portion and evaporation part are located at the upper plate and lower plate, which is equipped with plural telescopic joint, and it is recessed which is equipped with one
Ring body and a convex ring body, the concave ring body and the convex ring body are a section, the concave ring body of the plural number telescopic joint and convex ring body phase each other
Between connect and constitute aforementioned pars contractilis, and can be stretched or be compressed.
4. radiator structure according to claim 2, it is characterised in that: the coating layer, which is formed, is set to being somebody's turn to do for the corresponding pars contractilis
On the inner wall of chamber, and between the upper plate and lower plate, the end thereof contacts of the coating layer are connected in the chamber of the adjacent upper plate
The ontology capillary structure of wall and the other end of the coating layer connect the ontology capillary knot of the chamber inner wall of the adjacent lower plate
Structure.
5. radiator structure according to claim 1, it is characterised in that: the pars contractilis is a flexible elastic and metal flexible
Material or non-metallic material are constituted.
6. radiator structure according to claim 2, it is characterised in that: the ontology capillary structure is mesh grid, corpus fibrosum, gold
Belong to sintering body of powder, groove or aforementioned any combination, which is a capillary structure.
7. radiator structure according to claim 2, it is characterised in that: the coating layer is the macromolecule material of flexible flexibility
The cloth structure or memory alloy structure of the paper structure or flexible flexibility of structure or flexible flexibility.
8. radiator structure according to claim 1, it is characterised in that: the ontology is a temperature-uniforming plate or a hot plate.
9. radiator structure according to claim 1, it is characterised in that: the upper plate is made of with lower plate metal material, should
Metal material is copper material or golden material or aluminium material.
10. radiator structure according to claim 2, it is characterised in that: the coating layer is a capillary structure, the coating layer choosing
It is selected as groove or mesh grid or corpus fibrosum or aforementioned any is combined with whisker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910020802.1A CN109712951B (en) | 2019-01-09 | 2019-01-09 | Heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910020802.1A CN109712951B (en) | 2019-01-09 | 2019-01-09 | Heat dissipation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109712951A true CN109712951A (en) | 2019-05-03 |
| CN109712951B CN109712951B (en) | 2024-03-19 |
Family
ID=66260982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910020802.1A Active CN109712951B (en) | 2019-01-09 | 2019-01-09 | Heat dissipation structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN109712951B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110322797A (en) * | 2019-07-15 | 2019-10-11 | 深圳市鸿天盛信息技术有限公司 | A kind of security protection display device and its control method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
| TW201423020A (en) * | 2012-12-07 | 2014-06-16 | Asia Vital Components Co Ltd | Vapor chamber structure and manufacturing method thereof |
| TW201700940A (en) * | 2015-06-23 | 2017-01-01 | 超眾科技股份有限公司 | Vapor chamber having telescopic capillary structure |
| TWI589831B (en) * | 2016-01-19 | 2017-07-01 | 超眾科技股份有限公司 | Heat transfer loop |
| CN209357712U (en) * | 2019-01-09 | 2019-09-06 | 深圳兴奇宏科技有限公司 | Radiator structure |
-
2019
- 2019-01-09 CN CN201910020802.1A patent/CN109712951B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
| TW201423020A (en) * | 2012-12-07 | 2014-06-16 | Asia Vital Components Co Ltd | Vapor chamber structure and manufacturing method thereof |
| TW201700940A (en) * | 2015-06-23 | 2017-01-01 | 超眾科技股份有限公司 | Vapor chamber having telescopic capillary structure |
| TWI589831B (en) * | 2016-01-19 | 2017-07-01 | 超眾科技股份有限公司 | Heat transfer loop |
| CN209357712U (en) * | 2019-01-09 | 2019-09-06 | 深圳兴奇宏科技有限公司 | Radiator structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110322797A (en) * | 2019-07-15 | 2019-10-11 | 深圳市鸿天盛信息技术有限公司 | A kind of security protection display device and its control method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109712951B (en) | 2024-03-19 |
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