TWI603984B - 光固化型組成物、包含該組成物之障壁層及包含該組成物之封裝裝置 - Google Patents
光固化型組成物、包含該組成物之障壁層及包含該組成物之封裝裝置 Download PDFInfo
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- TWI603984B TWI603984B TW102119932A TW102119932A TWI603984B TW I603984 B TWI603984 B TW I603984B TW 102119932 A TW102119932 A TW 102119932A TW 102119932 A TW102119932 A TW 102119932A TW I603984 B TWI603984 B TW I603984B
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000000592 heterocycloalkyl group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- GRXOWOKLKIZFNP-UHFFFAOYSA-N undecane-1,1-diol Chemical compound CCCCCCCCCCC(O)O GRXOWOKLKIZFNP-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
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Description
本發明係有關於一光固化型組成物,包含此組成物之一障壁層,及包含此組成物之一封裝裝置。
有機發光二極體(OLED)係指其中一官能性有機材料層係插置於一陽極與一陰極間之一結構,其中,具有高能量之一激子可藉由使注射至陰極內之一電洞與注射至陽極內之一電子重組產生。產生之激子可移至一基態,藉此,發射於一特別波長帶內之光。有機發光二極體具有各種優點,諸如,自發光、快速回應、廣視角、超薄、高清析度,及耐久性。
但是,有機發光二極體具有問題,儘管封裝,由於自外部流動之水氣或氧氣或發光二極體內部或外部產生之排氣,有機材料及/或電極材料會被氧化,造成其性能及壽命惡化。為克服此等問題,某些方法已被提出,諸如,以一光固化型封裝劑塗覆,附接一透明或不透明之吸濕
劑,對其上形成一有機發光部之一基材提供玻璃料。
例如,韓國公開第2005-0021054A號案揭示一種有機發光二極體及其製備方法。
於本發明之一實施例,一光固化型組成物包含:(A)一光固化型單體,及(B)一以化學式表示之單體:
其中,Y係化學式2至4之一,
其中,R1、R2、R3、R4、X1、X2、X3、X4、X5、X6、m,及n具有於下詳細說明中所示之意義。
於本發明之另一實施例,一封裝裝置包含一裝置元件,及一障壁堆疊,其係形成於此裝置元件上且包含一無機障壁層及一有機障壁層,,其中,有機障壁層具有約2000ppm或更少之排氣產生量。
於本發明之另一實施例,一封裝裝置包含一裝置元件,及一障壁堆疊,其係形成於此裝置元件上且包含一無機障壁層及一有機障壁層,其中,於37.8℃及100%相對濕度(RH)持續24小時測量時,於厚度方向之5μm之層厚度,此有機障壁層具有約4.0克/公尺2.24小時或更少之水蒸氣傳輸率。
100‧‧‧封裝裝置
31‧‧‧無機障壁層
200‧‧‧封裝裝置
32‧‧‧有機障壁層
10‧‧‧基材
40‧‧‧內空間
20‧‧‧元件
30‧‧‧障壁堆疊
圖1係依據本發明一實施例之一封裝裝置之截面圖。
圖2係依據本發明另一實施例之一封裝裝置之截面圖。
除非其它表示外,術語“取代”於此處使用時係意指本發明之官能基團中之一氫原子係一鹵素(F、Cl、Br或I)、一羥基基團、一硝基基團、一氰基基團、一亞胺基基團(=NH、=NR,其中,R係一C1-C10烷基基團)、一胺基基團
[-NH2,-NH(R')、-N(R")(R"'),其中,R'、R"及R"'每一者獨立地係一C1-C10烷基基團]、一脒基基團、一聯氨或一腙基團、一羧基基團、一經取代或未經取代之C1-C20烷基基團、一經取代或未經取代之C6-C30芳基基團、一經取代或未經取代之C3-C30環烷基基團、一經取代或未經取代之C3-C30雜芳基基團,或一經取代或未經取代之C2-C30雜環烷基基團取代。
術語“雜”於此處使用時係意指一碳原子係以選自由N、O、S及P組成之組群之一原子取代。
於本發明,‘*’係一元素之一結合位置。
本發明之一方面係有關於一種光固化型組成物,包含(A)一光固化型單體,及(B)一以下列化學式1表示之單體或其寡聚物。
(A)光固化型單體
光固化型單體係指不含有雜環之一非雜環狀單體,或不含有環氧基團之一非環氧單體。
於一實施例,光固化型單體可包含不含有環氧乙烷基團之一非環氧乙烷型單體、不含有環氧丁烷之一非環氧丁烷型單體,或不含有環氧環烷基基團之一非環氧環烷基型單體。
光固化型單體係指除以化學式1表示之一單體外之任何單體。
光固化型單體可包含一單官能性單體、一多官能性單體,及其等之混合物,其係含有一不飽和基團。於一
實施例,此光固化型單體可包含具有約1至30,較佳係約1至20,更佳係約1至6個光固化型官能性基團之單體。此光固化型官能性基團可包含經取代或未經取代之乙烯基基團、經取代或未經取代之丙烯酸酯基團,或經取代或未經取代之甲基丙烯酸酯基團。
此光固化型單體可包含一單官能性單體及一多官能性單體之混合物。於此混合物,單官能性單體:多官能性單體可以從約1:0.1至約1:4,較佳係約1:1至約1:4,更佳係約1:2至約1:4之重量比率存在。
光固化型單體之例子包含具有一經取代或未經取代之 乙烯基基團之一C6-C20芳香族烴化合物;具有一C1-C20烷基基團、一C3-C20環烷基基團、一C6-C20芳香族基團,或一羥基基團及一C1-C20烷基基團之一不飽和酯;具有一C1-C20胺基烷基基團之一不飽和酯;一C1-C20飽和或不飽和羧酸之一乙烯酯;一乙烯基氰化合;一不飽和醯胺化合物;一單官或一多羥基醇之一單官能性或多官能性之(甲基)丙烯酸酯等。'多羥基醇'係指具有約2至約20,較佳係約2至約10,更佳係約2至約6個羥基基團之一醇。
光固化型單體之例子包含具有包含一乙烯基基團之一烯基基團之一C6-C20芳香族烴化合物,諸如,苯乙烯、α-甲基苯乙烯、乙烯基甲苯、乙烯基苯甲基醚、乙烯基苯甲基甲基醚等;一不飽和酯,諸如,(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸己酯、(甲
基)丙烯酸辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸十一烷酯、(甲基)丙烯酸十二烷酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苯甲酯、(甲基)丙烯酸苯酯等;一不飽和胺基烷基酯,諸如,(甲基)丙烯酸2-胺基乙酯、(甲基)丙烯酸2-二甲基胺基乙酯等;一飽和或不飽和之乙烯酯,諸如,乙酸乙烯酯、苯甲酸乙烯酯等;一乙烯基氰化合物,諸如,(甲基)丙烯腈等;一不飽和醯胺化合物,諸如,(甲基)丙烯醯胺等;一單醇或多羥基醇之一單官能性或多官能性之(甲基)丙烯酸酯,諸如,乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、三甲醇丙烷三(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、辛二醇二(甲基)丙烯酸酯、壬二醇二(甲基)丙烯酸酯、癸二醇二(甲基)丙烯酸酯、十一烷二醇二(甲基)丙烯酸酯、十二烷二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、新戊四醇二(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇二(甲基)丙烯酸酯、二新戊四醇三(甲基)丙烯酸酯、二新戊四醇四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、雙酚A二(甲基)丙烯酸酯、酚醛環氧(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三(丙二醇)二(甲基)丙烯酸酯、聚(丙二醇)二(甲基)丙烯酸酯等,且不限於此。'多羥基醇'係指具有二或更多,約2至約20,較佳係約2至約10,更佳係約2至約6個羥基基團之一醇。
較佳地,光固化型單體包含具有一C1-C20烷基
基團之一(甲基)丙烯酸酯、一C2-C20二醇之一二(甲基)丙烯酸酯、一C3-C20三醇之一三(甲基)丙烯酸酯,及一C4-C20四醇之一四(甲基)丙烯酸酯之至少一者。
以固體含量而言,以光固化型組成物中之100重量份之(A)+(B)為基準,光固化型單體可以約1重量份至約99重量份,較佳係約50重量份至約90重量份之量存在。於此範圍內,光固化型組成物可展現高光固化效果,此確保低排氣產生及低水蒸氣傳輸率。
(B)具化學式1之單體或其寡聚物
以化學式1表示之單體或其寡聚物可指含有一光固化型官能性基團之單體或寡聚物。光固化型官能性基團可包含一經取代或未經取代之乙烯基基團、一經取代或未經取代之丙烯酸酯基團,或一經取代或未經取代之甲基丙烯酸酯基團。
於一實施例,具化學式1之單體可以化學式1表示:
其中,R3係氫,或一經取代或未經取代之C1-C30烷基基團,且Y係化學式2至4之一:
(其中,*係化學式1中之-O-之一結合位置,X1及X2係相同或不同,且係O、S、N-R(其中,R係氫,或一經取代或未經取代之C1-C5烷基基團),或一經取代或未經取代之(R')C(R")(其中,R'及R"係氫,或一經取代或未經取代之C1-C5烷基基團),
X1及X2之一係O、S,或N-R,且R1係一經取代或未經取代之C1-C30亞烷基基團、一經取代或未經取代之C1-C30烷基醚基團、一經取代或未經取代之C1-C30亞烷氧基基團、一經取代或未經取代之C1-C30烷基胺基團、一經取代或未經取代之C1-C30烷硫基基團、一經取代或未經取代之C6-C30亞芳基基團、一經取代或未經取代之C7-C30亞芳基烷基基團,或一經取代或未經取代之C1-C20亞烷氧基基團);
(其中,*係化學式1中之-O-之一結合位置,X3、X4,及X5係相同或不同,且係O、S、N-R(其中,
R係氫,或一經取代或未經取代之C1-C5烷基基團),或一經取代或未經取代之(R')C(R")(其中,R'及R"係氫,或一經取代或未經取代之C1-C5烷基基團),X3、X4,及X5之至少一者係O、S,或N-R,R1具有如上所示之意義,且R2係氫、一經取代或未經取代之C1-C30烷基基團、一經取代或未經取代之C1-C30烷基醚基團、一經取代或未經取代之C1-C30烷基胺基團或二烷基胺基團、一經取代或未經取代之C1-C30烷硫基基團、一經取代或未經取代之C6-C30芳基基團、一經取代或未經取代之C7-C30芳基烷基基團、一經取代或未經取代之C1-C20烷氧基基團);及
(其中,*係化學式1中之-O-之一結合位置,X6係O、S,或N-R(其中,R係氫,或一經取代或未經取代之C1-C5烷基基團),R1具有如上所示之意義,R4係一經取代或未經取代之C1-C30烷基基團、一經取代或未經取代之C1-C30烷基醚基團、一經取代或未經取代之C1-C30烷基胺基團或二烷基胺基團、一經取代或未經取代之C1-C30烷硫基基團、一經取代或未經取代之C6-C30芳基基團、一經取代或未經取代之C7-C30芳基烷基基團、一
經取代或未經取代之C1-C20烷氧基基團,n係從1至5之整數,且m係從0至n+1之整數)。
較佳地,X1係O,且X2係-CH2-。
較佳地,X4係O,且X3及X5個別係-CH2-。
較佳地,R1係一C1-C10亞烷基基團,更佳係一C1-C6亞烷基基團。
較佳地,R2係氫、一C1-C10烷基基團,更佳係一C1-C6烷基基團。
較佳地,n係1至2之整數。
於一實施例,具化學式1之單體可包含(甲基)丙烯酸環氧丙酯、(甲基)丙烯酸(3-乙基-3-環氧丁基)甲酯、(甲基)丙烯酸3,4-環氧環己基甲酯之至少一者。
包含於光固化型組成物內化學式1之單體或其寡聚物與光固化型單體可實現一層,其水蒸氣傳輸率及排氣產生量於固化後顯著降低,且可增加固化度。此外,具化學式1之單體使由於用於無機障壁層沉積之電漿造成之裝置損害達最小。
以固體含量而言,以組成物內之100重量份之(A)+(B)為基準,具化學式1之單體或其寡聚物可以約1重量份至約99重量份,較佳係約10重量份至約50重量份之量存在。於此範圍內,光固化型組成物可展現高光固化效果,此確保低排氣產生及低水蒸氣傳輸率。
組成物可進一步包含一起始劑。
(C)起始劑
起始劑可包含選自一光聚合反應起始劑及一光酸產生劑之至少一者。
作為光聚合反應起始劑,任何傳統之光聚合反應起始劑可不受限地使用,只要起始劑容許光固化型反應。例如,光聚合反應起始劑可包含三、苯乙酮、二苯基酮、9-氧硫、安息香、磷光質、肟起始劑,及其等之混合物。
三起始劑之例子可包含2,4,6-三氯-s-三、2-苯基-4,6-雙(三氯甲基)-s-三、2-(3',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-s-三、2-(4'-甲氧基萘基)-4,6-雙(三氯甲基)-s-三、2-(對-甲氧基苯基)-4,6-雙(三氯甲基)-s-三、2-(對-甲苯基)-4,6-雙(三氯甲基)-s-三、2-聯苯基-4,6-雙(三氯甲基)-s-三、雙(三氯甲基)-6-苯乙烯基-s-三、2-(萘-1-基)-4,6-雙(三氯甲基)-s-三、2-(4-甲氧基萘-1-基)-4,6-雙(三氯甲基)-s-三、2,4-三氯甲基(3,4-亞甲二氧苄基)-6-三、2,4-(三氯甲基(4'-甲氧基苯乙烯基)-6-三,及其等之混合物。
苯乙酮起始劑之例子可包含2,2'-二乙氧基苯乙酮、2,2'-二丁氧基苯乙酮、2-羥基-2-甲基丙醯苯,對-第三丁基三氯苯乙酮、對-第三丁基二氯苯乙酮、4-氯苯乙酮、2,2'-二氯-4-苯氧基苯乙酮、2-甲基-1-(4-(甲硫基)苯基)-2-嗎啉基丙-1-酮、2-苯甲基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁-1-酮,及其等之混合物。
二苯基酮起始劑之例子可包含二苯基酮、苯甲醯基苯甲酸、苯甲醯基苯甲酸甲基、4-苯基二苯基酮、羥基二苯基酮、丙烯酸酯化之二苯基酮、4,4'-雙(二甲基胺基)二苯基酮、4,4'-二氯二苯基酮、3,3'-二甲基-2-甲氧基二苯基酮,及其等之混合物。
9-氧硫起始劑之例子可包含9-氧硫、2-甲基9-氧硫、異丙基9-氧硫、2,4-二乙基9-氧硫 、2,4-二異丙基9-氧硫、2-氯9-氧硫,及其等之混合物。
安息香起始劑之例子可包含安息香、安息香甲基醚、安息香乙基醚、安息香異丙基醚、安息香異丁基醚、苯甲基二甲基縮酮,及其等之混合物。
磷光質起始劑之例子可包含雙苯甲醯基苯基氧化膦、苯甲醯基二苯基氧化膦,及其等之混合物。
肟起始劑之例子可包含2-(鄰-苯甲醯基肟)-1-[4-(苯硫基)苯基]-1,2-辛二酮、1-(鄰-乙醯基肟)-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙酮,及其等之混合物。
以固體含量而言,以此組成物中之100重量份之(A)+(B)為基準,光聚合反應起始劑可以約0.1重量份至約20重量份,較佳係約1重量份至約10重量份,更佳係約2重量份至約8重量份,更佳係約2重量份至約5重量份之量存在。於此範圍內,由於可避免在光聚合反應後留下未反應起始劑,光聚合反應可於曝光時充份實施,且降低傳輸。
光酸產生劑與藉由光聚合反應起始劑之基聚合反應同時地產生酸,且固化環氧基團,因此,增強光固化效果。
光酸產生劑可不受限地包含任何典型光酸產生劑。光酸產生劑之例子可包含咔唑型、二酮型、鋶型、碘鎓型、重氮型、非咪唑型之光酸產生劑,及其等之混合物。
以固體含量而言,以此組成物中之100重量份之(A)+(B)為基準,光酸產生劑可以約0.001重量份至約10重量份,較佳係約0.01重量份至約5重量份,更佳係約0.1重量份至約2重量份之量存在。於此範圍內,由於可避免在光聚合反應後留下未反應起始劑,光聚合反應可於曝光時充份實施,且降低傳輸。
以固體含量而言,以此組成物中之100重量份之(A)+(B)為基準,起始劑可以約0.1重量份至約20重量份,較佳係約0.5重量份至約10重量分之量存在。於此範圍內,由於可避免在光聚合反應後留下未反應起始劑,光聚合反應可於曝光時充份實施,且降低傳輸。
光固化型組成物可藉由混合光固化型單體及具化學式1之單體或其寡聚物,或進一步之起始劑而製造。較佳地,光固化型組成物係以一無溶劑之組成物製造。
光固化型組成物可展現約90%或更多,較佳係約90%至約99%,例如,約92.5%至約98.5%之固化度。於此範圍內,固化後之固化收縮應力低,因此,實現不產生任何位移,能用於裝置封裝應用之層。
一裝置之一元件,特別是一顯示裝置之一元件,會因周圍環境之氣體或液體,例如,大氣之氧及/或濕氣及/或蒸氣及受用於處理電子產品之化學材料滲透而遭受品質上之降解或惡化。為避免此問題,顯示裝置需被密封或封裝。
用於一裝置之此等元件可包含有機發光二極體(OLED)裝置、照明裝置、可撓性有機發光二極體裝置、金屬感應器墊、微碟雷射、電致變色裝置、光致變色裝置、微電機械系統、太陽能電池、積體電路、電荷耦合裝置、發光聚合物、發光二極體等,但不限於此等。
本發明之光固化型組成物可形成一有機障壁層,其可用於密封或封裝一裝置(特別是有機發光二極體裝置或可撓性有機發光二極體裝置)之元件。
依據另一方面,本發明提供一障壁層,其係一有機障壁層,且於37.8℃及100%相對濕度(RH)持續24小時於厚度方向5μm之層厚度測量時,具有約4.0克/公尺2.24小時之水蒸氣傳輸率。於此範圍內,有機障壁層可用於封裝裝置之元件。例如,有機障壁層可具有約1.0克/公尺2.24小時至4.0克/公尺2.24小時,例如,約1.2克/公尺2.24小時至3.6克/公尺2.24小時之水蒸氣傳輸率。
依據本發明之另一方面,本發明提供一障壁層,其係一有機障壁層,且具有約2000ppm或更少之排氣產生量。於此範圍內,當塗敷於裝置之元件時,有機障壁層具有微小作用,且確保此裝置之此元件之極長壽命。例如,
排氣產生量可為約10ppm至約1000ppm。
障壁層可包含此光固化型組成物之一固化產物。
於一實施例,障壁層可藉由使光固化型組成物光固化而形成。光固化型組成物可塗覆達約0.1μm至約20μm,較佳係約1μm至約10μm之厚度,然後,藉由以約10mW/cm2至約500mW/cm2照射約1秒至約50秒而固化。
障壁層具有前述之水蒸氣傳輸率及排氣產生量,因此,可與無機障壁層一起用以形成一障壁堆疊,其可用於裝置之封裝。
依據另一方面,本發明提供一障壁堆疊,其包含一有機障壁層及一無機障壁層。
無機障壁層係與有機障壁層不同,且可增強有機障壁層之效果。
無機障壁層不受特別限制,只要障壁層展現良好透光度及良好濕氣及/或氧障壁性質。
例如,無機障壁層可由金屬、介金屬化合物或合金、金屬或混合金屬之氧化物、金屬或混合金屬之氟化物、金屬或混合金屬之氮化物、金屬碳化物、金屬或混合金屬之氧氮化物、金屬或混合金屬之硼化物、金屬或混合金屬之氧硼化物、金屬或混合金屬之矽化物,及其等之混合物所組成。
於一實施例,金屬可包含矽(Si)、鋁(Al)、硒(Se)、鋅(Zn)、銻(Sb)、銦(In)、鍺(Ge)、錫(Sn)、鉍(Bi),或一過渡金屬、一鑭系金屬等,但不限於此等。
特別地,無機障壁層可為一包含氧化矽、氮化矽、氧氮化矽、ZnSe、ZnO、Sb2O3、Al2O3、In2O3、SnO2等之層。
有機障壁層具有前述水蒸氣傳輸率及排氣產生量。因此,當有機障壁層與無機障壁層交替沉積時,可確保無機障壁層之平滑性質。此外,有機障壁層能避免無機障壁層蔓延至其它無機障壁層之缺陷。
有機障壁層可包含此光固化型組成物之一固化產物。
障壁堆疊可包含有機障壁層及無機障壁層。此處,障壁堆疊之有機障壁層及無機障壁之數量不受特別限制。障壁堆疊之有機障壁層及無機障壁之組合可依對氧及/或濕氣及/或水蒸氣及/或化學材料滲透之抵抗度而修改。
於障壁堆疊,有機障壁層及無機障壁層可交替地沉積。此係因為由於組成物之物理性質,此沉積對有機障壁層提供有利效果。因此,有機障壁層及無機障壁層可補充或強化此裝置之封裝效果。
較佳地,有機障壁層及無機障壁層可交替沉積,且有機障壁層及無機障壁層可以總數10層或更少(例如,約2至10層),更佳係7層或更少(例如,約2至7層)而沉積。
於障壁堆疊,每一有機障壁層可具有約0.1μm至約20μm,較佳係約1μm至約10μm之厚度。於障壁堆疊,每一無機障壁層可具有約5nm至約500nm,較佳係約5nm至約50nm之厚度。
障壁堆疊係一薄膜封裝材料,且具有約5μm或更少,較佳係約1.5μm至約5μm之厚度。
無機障壁層可藉由真空方法形成,例如,藉由噴濺、化學蒸氣沉積、電漿化學蒸氣沉積、蒸發、昇華、電子迴旋共振-電漿蒸氣沉積,或此等之組合。
有機障壁層可以與無機障壁層相同方式藉由沉積,或藉由塗覆及固化光固化型組成物而形成。
依據另一方面,本發明提供一封裝裝置,其包含此裝置之一元件,及一障壁堆疊,其係形成於此裝置之此元件上,且包含一無機障壁層及一有機障壁層。
於一實施例,於厚度方向,於5μm層厚度,於37.8℃及100%相對濕度(RH)持續24小時而測量時,有機障壁層具有約4.0克/公尺2.24小時或更少之水蒸氣傳輸率。
於另一實施例,有機障壁層具有約2000ppm或更少之排氣產生量。
有機障壁層可包含光固化型組成物之一固化產物。
有機障壁層可指用於保護包含有機發光二極體、有機太陽能電池等之裝置之一封裝層。有機障壁層可避免此裝置之元件遭受因諸如濕氣、氧等之外部環境條件而降解或氧化。此外,有機障壁層於高濕氣條件或高溫及高濕氣條件下展現極少之排氣產生,因此,使此裝置之元件的排氣達最小,此轉而避免此裝置之元件之性能降低及壽命減短。
有機障壁層可於無機障壁層之上或下部形成。
無機障壁層可指用於保護包含一有機發光二極體、有機太陽能電池等之裝置的元件之一密封層。無機障壁層可藉由使無機障壁層與此裝置之元件接觸,或藉由使置放此裝置之元件的內部空間密封而未與此裝置之元件接觸而密封。無機障壁層可阻絕此裝置與外部氧或濕氣接觸,因此,避免此裝置之元件降解或受損。
無機障壁層可於此裝置之元件之一上部,或有機障壁層之上或下部形成。
封裝裝置具有其中裝置係以具有不同性質之無機障壁層及有機障壁層密封之一結構。無機障壁層及有機障壁層之至少一者係與一基材耦合,以密封此裝置之元件。
無機障壁層及有機障壁層可以多數次,例如,二次或更多,包含於此裝置內。於一實施例,無機障壁層及有機障壁層係交替地沉積,諸如,以無機障壁層/有機障壁層/無機障壁層/有機障壁層之順序。較佳地,無機/有機障壁層較佳係以總數約10層或更少(例如,總數約2至10層),更佳係總數約7層或更少(例如,總數約2至7層)沉積。
有機障壁層及無機障壁層之細節係如上所述。
依此裝置之元件的種類而定,可包含一基材。
基材不受特別限制,只要能使裝置之元件堆疊在上面。基材之例子可包含透明玻璃、塑膠片、聚矽氧,或金屬基材等。
圖1係依據本發明一實施例之一封裝裝置之截面
圖。
依據圖1,一封裝裝置100包含一基材10;此裝置之一元件20,其係於基材10上;及一障壁堆疊30,其係於此裝置之元件20上形成,且包含一無機障壁層31及一有機障壁層32,其中,無機障壁層31與此裝置之元件20接觸。
圖2係依據本發明另一實施例之一封裝裝置之截面圖。
參考圖2,一封裝裝置200包含一基材10;此裝置之一元件20,其係於基材10上形成;及一障壁堆疊30,其係於此裝置之元件20上形成,且包含一無機障壁層31及一有機障壁層32,其中,無機障壁層31可密封容納此裝置之件之一內空間40。
雖然無機障壁層及有機障壁層之每一者於圖1及2中係以單一層形成而例示,但無機障壁層及有機障壁層可以多數層沉積。此裝置可進一步包含一密封劑及/或一基材(未於圖1及2中顯示),其係於包含無機障壁層及有機障壁層之複合障壁層之一側面及/或一上側。
裝置可藉由任何典型方法製造。裝置係沉積於一基材上,然後,一無機障壁層於其上形成。光固化型組成物係藉由旋塗、狹縫式塗覆等塗覆至約1μm至5μm之厚度,且對其照射光形成一有機障壁層。形成無機障壁層及有機障壁層之程序可重複(較佳係10次或更少)。
於一實施例,封裝裝置之例子可包含一有機發光裝置(包含一有機發光二極體)、一液晶顯示器、一太陽能電
池等,但不限於此等。
其次,本發明將參考一些範例作更詳細解釋。此等範例僅提供作為例示說明,且不以任何方式作為限制本發明而闡釋。
用於範例及比較例之組份的細節係如下:
(A)光固化型單體:(A1)丙烯酸己酯,(A2)己二醇二丙烯酸酯,(A3)新戊四醇四丙烯酸酯,(皆可得自Aldrich)
(B)具化學式1之單體:(B1)甲基丙烯酸環氧丙酯(Aldrich,具包含化學式2之化學式1之單體),(B2)丙烯酸(3-乙基-3-環氧丁基)甲酯,OXE-10(Osaka Yuki,具包含化學式3之化學式1之單體),(B3)甲基丙烯酸7-噁二環[4,1,0]庚-3-基甲基酯,Cyclomer M100(Daicel,具包含化學式4之化學式1之單體)
(C)起始劑:(C1)光聚合反應起始劑:Darocur TPO(BASF),(C2)光酸產生劑:Irgacure PAG 121(BASF)
範例1至6及比較例1
(A)光固化型單體、(B)具化學式1之單體,及(C)起始劑係以表2所列示之量(單位:重量份)置於一125毫升棕色聚丙烯瓶內,其後使土一搖動器摻合3小時製備組成物。
範例及比較例製造之組成物係對物理性質作評估。結果顯示於表1。
物理性質評估
1.水蒸氣傳輸率:使用一水蒸氣傳輸率測試器
(PERMATRAN-W 3/33,由MOCON製造)。光固化型組成物係旋塗於一Al樣品固定器,且接受藉由以100mW/cm2之UV照射10秒之UV固化,製得一經固化之樣本,其具有一5μm厚之層。水蒸氣傳輸率係使用水蒸氣傳輸率測試器(PERMATRAN-W 3/33,由MOCON製造),於5μm層厚度,於37.8℃及100% RH持續24小時而測量。
2.有機障壁層之排氣產生量:光固化型組成物旋塗於一玻璃基材上,且接受於100mW/cm2之UV照射10秒之UV固化,製造一有機障壁層樣本,其具有20cm x 20cm x 3μm(寬度x長度x厚度)之尺寸。一GC/MS測試器(Perkin Elmer Clarus 600)被用於測量排氣產生。GC/MS使用一DB-5MS管柱(之度:30m,直徑:0.25mm,固定相厚度:0.25μm)作為一管柱,及使用氦氣(流速:1.0mL/分鐘,平均速度=32cm/s)作為一移動相。再者,分流比係20:1,且溫度條件係設定為使得溫度係於40℃維持3分鐘,以10℃/分鐘之速率加熱,然後,於320℃維持6分鐘。排氣係於20cm x 20cm之一玻璃尺寸下收集,收集容器係一Tedlar袋,收集溫度係90℃,收集時間係30分鐘,N2吹掃係以300mL/分鐘之流速進行,且吸附劑係Tenax GR(5%苯基甲基聚矽氧烷)。校正曲線係使用150ppm、400ppm及800ppm濃度之於正己烷內之甲苯溶液作為標準溶液而繪製,其中,R2值係以0.9987獲得。上述條件可綜述於表1。
3.固化度:光固化型組成物之吸收峰強度係使用FT-IR(NICOLET 4700,Thermo)於1635cm-1(C=C)及1720cm-1(C=O)測量。首先,光固化型組成物係旋塗於一玻璃基材上,然後,接受以100mW/cm2之UV照射10秒之UV固化,產生一樣本,其具有20cm x 20cm x 3μm(寬度x長度x厚度)之尺寸。固化膜切成樣本,其轉而用於使用FT-IR(NICOLET 4700,Thermo)測量接近1635cm-1(C=C)及1720cm-1(C=O)之吸收峰強度。光固化度係依據方程式1計算:固化度(%)=|1-(A/B)| x 100,其中,A係固化膜上之接近1635cm-1之吸收峰強度對接近1720cm-1之吸收峰強度之比率,且B係光固化型組成物之
於1635cm-1之吸收峰強度對於1720cm-1之吸收峰強度之比率。
如表2所示,自本發明範例之光固化型組成物製造之層證實低水蒸氣傳輸率、明顯降低之排氣,及顯著增
加之固化度。
同時,與本發明範例相比,自不含有具化學式1之單體之比較例1之光固化型組成物製造之層證實顯著較高之水蒸氣傳輸率及高排氣率,及較低固化度。
熟習此項技藝者需瞭解本發明不限於前述實施例及圖式,且各種修改、改變,及變化可於未偏離本發明之精神及範圍下為之。因此,此等實施例僅係提供作為例示說明,且不以任何方式作為限制本發明而闡釋。
10‧‧‧基材
20‧‧‧元件
30‧‧‧障壁堆疊
31‧‧‧無機障壁層
32‧‧‧有機障壁層
100‧‧‧封裝裝置
Claims (19)
- 一種光固化型組成物,包含:(A)一光固化型單體,及(B)一以化學式1表示之單體,或一其寡聚物:
- 如申請專利範圍第1項之光固化型組成物,其中,該(B)具化學式1之單體包含(甲基)丙烯酸環氧丙酯、(甲基)丙烯酸(3-乙基-3-環氧丁基)甲酯,或(甲基)丙烯酸3,4-環氧環己基甲酯。
- 如申請專利範圍第1項之光固化型組成物,其中,該光固化型單體包含具有約1至30個經取代或未經取代之乙烯基基團、經取代或未經取代之丙烯酸酯基團,或經取代或未經取代之甲基丙烯酸酯基團之一單體。
- 如申請專利範圍第1項之光固化型組成物,其中,該(A)光固化型單體係具有一C1-C20烷基基團之一(甲基)丙烯酸酯、一C2-C20二醇之一二(甲基)丙烯酸酯、一C3-C20三醇之一三(甲基)丙烯酸酯,及一C4-C20四醇之一四(甲基)丙烯酸酯之至少一者。
- 如申請專利範圍第1項之光固化型組成物,以固化含量而言,以100重量份之(A)+(B)為基準,包含:約1重量份至約99重量份之該(A)光固化型單體,及約1重量份至約99重量份之該(B)單體。
- 如申請專利範圍第1項之光固化型組成物,進一步包含:(C)一起始劑。
- 如申請專利範圍第6項之光固化型組成物,其中,該(C)起始劑包含選自一光聚合反應起始劑及一光酸產生劑之至少一者。
- 如申請專利範圍第6項之光固化型組成物,包含:以固 體含量而言,以100重量份之(A)+(B)為基準,約1重量份至約99重量份之該(A)光固化型單體,及約1重量份至約99重量份之該(B)單體;及以固體含量而言,以100重量份之(A)+(B)為基準,約0.1重量份至約20重量份之該(C)起始劑。
- 如申請專利範圍第7項之光固化型組成物,其中,以該組成物中之100重量份之(A)+(B)為基準,該光聚合反應起始劑係以約0.05重量份至約19重量份之量存在。
- 如申請專利範圍第7項之光固化型組成物,其中,以該組成物中之100重量份之(A)+(B)為基準,該光酸產生劑係以約0.001重量份至約10重量份之量存在。
- 一種裝置封裝元件,其具有如申請專利範圍第1至10項中任一項之光固化型組成物。
- 一種封裝裝置,包含如申請專利範圍第11項之裝置封裝元件,及一障壁堆疊,其係於該裝置之該元件上形成,且包含一無機障壁層及一有機障壁層,其中,該有機障壁層係由如申請專利範圍第1至10項中任一項之光固化型組成物所形成且具有約2000ppm或更少之一排氣產生量。
- 一種封裝裝置,包含如申請專利範圍第11項之裝置封裝元件,及一障壁堆疊,其係於該裝置之該元件上形成,該障壁堆疊包含一無機障壁層及一有機障壁層,其中,該有機障壁層係由如申請專利範圍第1至10項中任一項之光固化型組成物所形成且於一厚度方向,於一5μm 層厚度,於37.8℃及100% RH持續24小時測量時,具有約4.0克/公尺2.24小時或更少之水蒸氣傳輸率。
- 如申請專利範圍第12或13項之封裝裝置,該無機障壁層包含一金屬、金屬氧化物、金屬氮化物、金屬碳化物、金屬氧氮化物,或其等之混合物,且其中,該金屬包含矽(Si)、鋁(Al)、硒(Se)、鋅(Zn)、銻(Sb)、銦(In)、鍺(Ge)、錫(Sn)、鉍(Bi)、一過渡金屬,或一鑭系金屬之至少一者。
- 如申請專利範圍第12或13項之封裝裝置,其中該有機障壁層及該無機障壁層於障壁堆疊中係交替沉積。
- 如申請專利範圍第12或13項之封裝裝置,其中該有機障壁層及該無機障壁層係以總量約10層或更少於該障壁堆疊中沉積。
- 如申請專利範圍第12或13項之封裝裝置,其中,該有機障壁層具有約0.1μm至約20μm之厚度,且該無機障壁層具有約5nm至約500nm之厚度。
- 如申請專利範圍第12或13項之封裝裝置,其中,該裝置之該元件包含發光裝置、金屬感應器墊、微碟雷射、電致變色裝置、光致變色裝置、微電機械系統、太陽能電池、積體電路、電荷耦合裝置,或發光聚合物。
- 如申請專利範圍第12或13項之封裝裝置,其中,該有機障壁層包含如申請專利範圍第1項之光固化型組成物之一固化產物。
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US7781495B2 (en) | 2004-03-26 | 2010-08-24 | Kaneka Corporation | Composition curable by radical photo curing and cationic photo curing in combination |
JP2012082261A (ja) | 2010-10-07 | 2012-04-26 | Kaneka Corp | 光硬化性組成物およびその硬化物 |
-
2013
- 2013-01-14 KR KR1020130004178A patent/KR101574840B1/ko active IP Right Grant
- 2013-06-05 TW TW102119932A patent/TWI603984B/zh active
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KR101574840B1 (ko) | 2015-12-07 |
KR20140035228A (ko) | 2014-03-21 |
TW201410717A (zh) | 2014-03-16 |
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