TWI603419B - Processor - Google Patents

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Publication number
TWI603419B
TWI603419B TW104126144A TW104126144A TWI603419B TW I603419 B TWI603419 B TW I603419B TW 104126144 A TW104126144 A TW 104126144A TW 104126144 A TW104126144 A TW 104126144A TW I603419 B TWI603419 B TW I603419B
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moving
moving mechanism
support portion
respect
support
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TW104126144A
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Chinese (zh)
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TW201543607A (en
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Nobuo Hasegawa
Masami Maeda
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Seiko Epson Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

處理器 processor

本發明係關於一種處理器及檢查裝置。 The present invention relates to a processor and an inspection device.

自先前以來,已知有一種檢查例如IC(Integrated Circuit,積體電路)元件等電子零件之電氣特性之檢查裝置。 Since the prior art, an inspection apparatus for inspecting electrical characteristics of electronic components such as IC (Integrated Circuit) components has been known.

此種檢查裝置係以將電子零件自供給托盤供給至檢查部,對供給至檢查部之電子零件之電氣特性進行檢查,於該檢查結束後,將電子零件自檢查部回收至回收托盤中之方式構成。又,收納於供給托盤中之電子零件臨時轉移至梭子上,再藉由梭子搬送至檢查部附近。於梭子上,設置有形成有凹穴(pocket)之托盤,於該凹穴中收納電子零件。 In such an inspection apparatus, the electronic component is supplied from the supply tray to the inspection unit, and the electrical characteristics of the electronic component supplied to the inspection unit are inspected, and after the inspection is completed, the electronic component is collected from the inspection unit to the recovery tray. Composition. Further, the electronic components housed in the supply tray are temporarily transferred to the shuttle and transported to the vicinity of the inspection unit by the shuttle. On the shuttle, a tray in which a pocket is formed is disposed, and the electronic component is housed in the recess.

自供給托盤向托盤之電子零件之搬送係藉由供給機器人而執行。供給機器人具有複數個吸附嘴,利用各吸附嘴吸附保持供給托盤之凹穴內之電子零件,於將所保持之電子零件轉移至托盤之凹穴中之後,釋放該電子零件,藉此自供給托盤向托盤搬送電子零件。作為此種供給機器人,已知有例如如專利文獻1中所記載之供給機器人。 The transfer of the electronic components from the supply tray to the tray is performed by supplying the robot. The supply robot has a plurality of adsorption nozzles, and the electronic components in the pockets of the supply tray are sucked and held by the adsorption nozzles, and after the electronic components are transferred to the pockets of the tray, the electronic components are released, thereby self-supplying the trays. Transfer electronic parts to the tray. As such a supply robot, for example, a supply robot described in Patent Document 1 is known.

然而,一般之供給機器人由於複數個吸附嘴之配設間距(相互之位置關係)固定,故而會產生如下之問題。即,設置於供給托盤上之複數個凹穴之配設間距與設置於托盤上之複數個凹穴之配設間距並不一定相等。於假如設置在供給托盤上之複數個凹穴之配設間距與設置在托盤上之複數個凹穴之配設間距不同之情形時,無法統一地將保持 於各吸附嘴上之電子零件向設置於托盤上之凹穴內釋放,從而必需針對各吸附嘴,逐個依序地進行相對於凹穴之位置對準、及向該凹穴內之電子零件之釋放。於此種方法中,會產生自供給托盤向托盤之電子零件之搬送需要過多時間,而無法進行順利之檢查之問題。 However, in general, the supply robot is fixed by the arrangement pitch (positional relationship of each other) of a plurality of suction nozzles, and thus the following problems occur. That is, the arrangement pitch of the plurality of pockets provided on the supply tray is not necessarily equal to the arrangement pitch of the plurality of pockets provided on the tray. If the arrangement pitch of the plurality of recesses provided on the supply tray is different from the arrangement pitch of the plurality of recesses provided on the tray, the joint cannot be uniformly maintained. The electronic components on the adsorption nozzles are released into the recesses provided on the tray, so that it is necessary to sequentially align the positions of the recesses with respect to the recesses and the electronic components in the recesses for each nozzle. freed. In this method, it takes a long time to transfer the electronic parts from the supply tray to the tray, and the problem of smooth inspection cannot be performed.

為了解決此種問題,亦已知有如專利文獻1之、可使吸附嘴之配設間距變化之機器人,但於此種構成中,存在如下問題:由於零件抓持部會旋轉,故而必需修正零件抓持部之旋轉之機構,一般而言零件個數會增加,有時會導致機器人之大型化。 In order to solve such a problem, there is also known a robot which can change the arrangement pitch of the nozzles as in Patent Document 1. However, in such a configuration, there is a problem in that the part gripping portion is rotated, so that it is necessary to correct the parts. The mechanism of the rotation of the gripping portion generally increases the number of parts, which sometimes leads to an increase in the size of the robot.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2006-17575號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-17575

本發明之目的在於提供一種可使零件保持部之配設間距變化之該處理器中零件個數較少之處理器及檢查裝置。 SUMMARY OF THE INVENTION An object of the present invention is to provide a processor and an inspection apparatus which have a small number of components in the processor which can change the arrangement pitch of the component holding portion.

本發明係為了解決上述課題之至少一部分而完成者,可作為以下之形態或應用例而實現。 The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

此種目的係藉由下述之本發明而達成。 Such an object is achieved by the present invention described below.

本發明之處理器之特徵在於:當將相互正交之3個方向設為第1方向、第2方向及第3方向時,該處理器包括:基部;第1支持部,其固定於上述基部上,且於動作時相對於上述基部之相對位置不變;第1零件保持部,其支持於上述第1支持部上,以可相對於上述第1支持部沿上述第3方向移動之方式設置,且保持零件; 第1移動部,其支持於上述第1支持部上,且可相對於上述第1支持部沿上述第2方向移動;第2零件保持部,其支持於上述第1移動部上,以相對於上述第1零件保持部而位於上述第2方向上、並且可相對於上述第1移動部沿上述第3方向移動之方式設置,且保持零件;第2支持部,其支持於上述基部上,相對於上述第1支持部而位於上述第1方向上,並且可相對於上述基部沿上述第1方向移動;第3零件保持部,其支持於上述第2支持部上,以可相對於上述第2支持部沿上述第3方向移動之方式設置,且保持零件;第2移動部,其支持於上述第2支持部上,且可相對於上述第2支持部沿上述第2方向移動;第4零件保持部,其支持於上述第2移動部上,以相對於上述第3零件保持部而位於上述第2方向上、並且可相對於上述第2移動部沿上述第3方向移動之方式設置,且保持零件;第1移動機構,其使上述第1移動部及上述第2移動部一體地向上述第2方向移動,使上述第1零件保持部與上述第2零件保持部之於上述第2方向之相隔距離及上述第3零件保持部與上述第4零件保持部之於上述第2方向之相隔距離一起變化;及第2移動機構,其使上述第2支持部沿上述第1方向移動,而使上述第1支持部與上述第2支持部之上述第1方向之相隔距離變化。 The processor of the present invention is characterized in that, when the three directions orthogonal to each other are the first direction, the second direction, and the third direction, the processor includes: a base; and a first support portion fixed to the base And the first component holding portion is supported by the first support portion so as to be movable in the third direction with respect to the first support portion. And keep the parts; The first moving portion is supported by the first support portion and movable in the second direction with respect to the first support portion, and the second component holding portion is supported by the first moving portion to The first component holding portion is located in the second direction and is movable in the third direction with respect to the first moving portion, and holds the component; the second support portion is supported by the base portion and opposed to The first support portion is located in the first direction and is movable in the first direction with respect to the base portion, and the third component holding portion is supported by the second support portion so as to be movable relative to the second The support portion is disposed to move in the third direction and holds the component; the second moving portion is supported by the second support portion and is movable in the second direction with respect to the second support portion; the fourth component a holding portion that is provided in the second moving portion and that is located in the second direction with respect to the third component holding portion and that is movable in the third direction with respect to the second moving portion, and Keep the part; a moving mechanism that integrally moves the first moving portion and the second moving portion in the second direction, and separates the first component holding portion from the second component holding portion in the second direction The third component holding portion changes in a distance from the fourth component holding portion in the second direction, and the second moving mechanism moves the second support portion in the first direction to cause the first The distance between the support portion and the first direction of the second support portion is changed.

藉由設定為此種構成,可形成零件個數較少之處理器。 By setting this configuration, it is possible to form a processor having a small number of parts.

於本發明之處理器中,較佳為上述第1移動機構之至少一部分被支持於上述基部上。 In the processor of the present invention, preferably at least a part of the first moving mechanism is supported on the base.

藉此,裝置之構成變得簡單。 Thereby, the configuration of the device becomes simple.

於本發明之處理器中,較佳為上述第1移動機構包括:第1移動機構用第1引導輪及第1移動機構用第2引導輪,該等於上述第2方向上 相隔;第1移動機構用第1環形驅動索,其架設於上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪之間;以及第1移動機構用驅動源,其使上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪之至少一者旋轉而使上述第1移動機構用第1環形驅動索旋轉;且至少上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪分別可旋轉地被支持於上述基部上。 In the processor of the present invention, preferably, the first moving mechanism includes: a first guiding mechanism for the first moving mechanism and a second guiding wheel for the first moving mechanism, which is equal to the second direction a first ring-shaped driving cable for the first moving mechanism, which is disposed between the first guiding mechanism first guiding wheel and the first moving mechanism second guiding wheel; and a first moving mechanism driving source; Rotating at least one of the first movement mechanism first guide wheel and the first movement mechanism second guide wheel to rotate the first movement mechanism by the first ring drive cable; and at least the first movement mechanism The first guide wheel and the first guide wheel for the first moving mechanism are rotatably supported by the base.

藉此,第1移動機構之構成變得簡單。又,可謀求第1移動機構之零件個數之減少,故而可謀求隨之實現之小型化。 Thereby, the configuration of the first moving mechanism is simplified. Moreover, since the number of components of the first moving mechanism can be reduced, it is possible to achieve miniaturization in accordance therewith.

於本發明之處理器中,較佳為上述第1移動部及上述第2移動部分別直接或間接地連結於上述第1移動機構用第1環形驅動索上,且隨著上述第1移動機構用第1環形驅動索之旋轉,上述第1移動部相對於上述第1支持部沿上述第2方向移動,並且上述第2移動部相對於上述第2支持部沿上述第2方向移動。 In the processor of the present invention, preferably, the first moving unit and the second moving unit are directly or indirectly connected to the first moving mechanism first first driving cable, and the first moving mechanism The first moving portion moves in the second direction with respect to the first supporting portion by the rotation of the first ring-shaped driving cable, and the second moving portion moves in the second direction with respect to the second supporting portion.

藉此,可簡單且確實地使固定於第1移動部上之第2零件保持部及固定於第2移動部上之第4零件保持部向第2方向移動。 Thereby, the second component holding portion fixed to the first moving portion and the fourth component holding portion fixed to the second moving portion can be moved in the second direction in a simple and reliable manner.

於本發明之處理器中,較佳為上述第1移動機構進而包括:第1移動機構用第3引導輪及第1移動機構用第4引導輪,該等可旋轉地固定於上述第1支持部上,且於上述第2方向上相隔;第1移動機構用第2環形驅動索,其架設於上述第1移動機構用第3引導輪及上述第1移動機構用第4引導輪之間;傳遞部,其將上述第1移動機構用第1引導輪與上述第1移動機構用第3引導輪連結,而將上述第1移動機構用第1引導輪之旋轉傳遞至上述第1移動機構用第3引導輪;以及連結部,其將上述第1移動機構用第1環形驅動索與上述第1移動機構用第2環形驅動索連結;且上述第1移動部及上述第2移動部分別連結於上述連結部。 In the processor of the present invention, preferably, the first moving mechanism further includes: a third guiding wheel for the first moving mechanism and a fourth guiding wheel for the first moving mechanism, wherein the first support is rotatably fixed to the first support a second ring-shaped driving cable for the first moving mechanism, which is disposed between the third guiding wheel for the first moving mechanism and the fourth guiding wheel for the first moving mechanism; The first moving mechanism first connecting wheel and the first moving mechanism third guiding wheel are connected to each other, and the first moving mechanism first guiding wheel is transmitted to the first moving mechanism. a third guide wheel; and a connecting portion that connects the first moving mechanism first ring driving cable to the first moving mechanism second ring driving cable; and the first moving portion and the second moving portion respectively connect In the above connecting portion.

藉此,可使第1移動部及第2移動部以良好平衡性沿第2方向移動。 Thereby, the first moving portion and the second moving portion can be moved in the second direction with good balance.

於本發明之處理器中,較佳為上述第1移動機構用驅動源被支持於上述基部上。 In the processor of the present invention, it is preferable that the first moving mechanism drive source is supported by the base.

藉此,裝置之構成變得簡單。 Thereby, the configuration of the device becomes simple.

於本發明之處理器中,較佳為上述第2移動機構之至少一部分被支持於上述基部上。 In the processor of the present invention, preferably at least a part of the second moving mechanism is supported on the base.

藉此,裝置之構成變得簡單。 Thereby, the configuration of the device becomes simple.

於本發明之處理器中,較佳為上述第2移動機構包括:第2移動機構用第1引導輪及第2移動機構用第2引導輪,該等於上述第1方向上相隔;第2移動機構用環形驅動索,其架設於上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪之間;以及第2移動機構用驅動源,其使上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪之至少一者旋轉而使上述第2移動機構用環形驅動索旋轉;且 至少上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪分別可旋轉地被支持於上述基部上。 In the processor of the present invention, preferably, the second moving mechanism includes: a first guiding wheel for the second moving mechanism and a second guiding wheel for the second moving mechanism, which are equal to each other in the first direction; and the second movement The mechanism uses a ring-shaped driving cable that is disposed between the second guiding mechanism first guiding wheel and the second moving mechanism second guiding wheel; and a second moving mechanism driving source for the second moving mechanism At least one of the first guide wheel and the second guide mechanism second guide wheel rotates to rotate the second moving mechanism by the ring drive cable; At least the second moving mechanism first guide wheel and the second moving mechanism second guide wheel are rotatably supported by the base.

藉此,第2移動機構之構成變得簡單。 Thereby, the configuration of the second moving mechanism is simplified.

於本發明之處理器中,較佳為上述第1支持部及上述第2支持部分別形成為於上述第2方向及上述第3方向兩方向上具有擴寬之板狀。 In the processor of the present invention, it is preferable that each of the first support portion and the second support portion has a plate shape that is widened in both the second direction and the third direction.

藉此,可謀求裝置之小型化。 Thereby, the size of the device can be reduced.

於本發明之處理器中,較佳為上述第1零件保持部、上述第2零件保持部、上述第3零件保持部及上述第4零件保持部分別具有藉由吸附而保持對象物之吸附嘴。 In the processor of the present invention, it is preferable that the first component holding portion, the second component holding portion, the third component holding portion, and the fourth component holding portion each have a suction nozzle for holding an object by suction. .

藉此,可以簡單之構成保持對象物。 Thereby, the object to be held can be simply configured.

本發明之處理器之特徵在於:當將相互正交之2個方向設為第1方向及第2方向時,該處理器包括: 第1零件保持部,其保持零件;第2零件保持部,其相對於上述第1零件保持部而位於上述第2方向上,且保持零件;第3零件保持部,其相對於上述第1零件保持部而位於上述第1方向上,且保持零件;第4零件保持部,其相對於上述第3零件保持部而位於上述第2方向上,且保持零件;並且上述第3零件保持部及上述第4零件保持部一體地相對於上述第1零件保持部及上述第2零件保持部沿上述第1方向移動,上述第2零件保持部及上述第4零件保持部一體地相對於上述第1零件保持部及上述第3零件保持部沿上述第2方向移動。 The processor of the present invention is characterized in that, when the two directions orthogonal to each other are set to the first direction and the second direction, the processor includes: a first component holding portion that holds the component, a second component holding portion that is located in the second direction with respect to the first component holding portion, and holds the component, and a third component holding portion that is opposed to the first component The holding portion is located in the first direction and holds the component; the fourth component holding portion is located in the second direction with respect to the third component holding portion, and holds the component; and the third component holding portion and the The fourth component holding portion is integrally moved in the first direction with respect to the first component holding portion and the second component holding portion, and the second component holding portion and the fourth component holding portion are integrally opposed to the first component The holding portion and the third component holding portion move in the second direction.

藉由設定為此種構成,可形成零件個數較少之處理器。 By setting this configuration, it is possible to form a processor having a small number of parts.

本發明之檢查裝置之特徵在於包括:本發明之處理器、及進行對象物之檢查之檢查部,且該檢查裝置係以藉由上述處理器將上述對象物搬送至上述檢查部之方式構成。 The inspection apparatus of the present invention includes the processor of the present invention and an inspection unit that performs inspection of the object, and the inspection apparatus is configured to convey the object to the inspection unit by the processor.

藉此,可獲得零件個數較少之檢查裝置。 Thereby, an inspection device with a small number of parts can be obtained.

本發明之檢查裝置之特徵在於:當將相互正交之3個方向設為第1方向、第2方向及第3方向時,該檢查裝置包括:基部;第1支持部,其固定於上述基部上,且於動作時相對於上述基部之相對位置不變;第1零件保持部,其支持於上述第1支持部上,以可相對於上述第1支持部沿上述第3方向移動之方式設置,且保持零件;第1移動部,其支持於上述第1支持部上,且可相對於上述第1支持部沿上述第2方向移動; 第2零件保持部,其支持於上述第1移動部上,以相對於上述第1零件保持部而位於上述第2方向上、並且可相對於上述第1移動部沿上述第3方向移動之方式設置,且保持零件;第2支持部,其支持於上述基部上,相對於上述第1支持部而位於上述第1方向上,並且可相對於上述基部沿上述第1方向移動;第3零件保持部,其支持於上述第2支持部上,以可相對於上述第2支持部沿上述第3方向移動之方式設置,且保持零件;第2移動部,其支持於上述第2支持部上,且可相對於上述第2支持部沿上述第2方向移動;第4零件保持部,其支持於上述第2移動部上,以相對於上述第3零件保持部而位於上述第2方向上、並且可相對於上述第2移動部沿上述第3方向移動之方式設置,且保持零件;第1移動機構,其使上述第1移動部及上述第2移動部一體地向上述第2方向移動,而使上述第1零件保持部與上述第2零件保持部之上述第2方向之相隔距離及上述第3零件保持部與上述第4零件保持部之上述第2方向之相隔距離一起變化;第2移動機構,其使上述第2支持部沿上述第1方向移動,使上述第1支持部與上述第2支持部之上述第1方向之相隔距離變化;及檢查部,其對保持於上述第1零件保持部、上述第2零件保持部、上述第3零件保持部及上述第4零件保持部上之各零件進行檢查。 In the inspection apparatus of the present invention, when the three directions orthogonal to each other are the first direction, the second direction, and the third direction, the inspection apparatus includes: a base portion; and a first support portion fixed to the base portion And the first component holding portion is supported by the first support portion so as to be movable in the third direction with respect to the first support portion. And holding the component; the first moving portion is supported by the first support portion and movable in the second direction with respect to the first support portion; The second component holding portion is supported by the first moving portion so as to be movable in the third direction with respect to the first component holding portion and in the third direction with respect to the first moving portion. Providing and holding the component; the second support portion is supported on the base portion, is located in the first direction with respect to the first support portion, and is movable in the first direction with respect to the base portion; and the third component is held The second support portion is supported by the second support portion so as to be movable in the third direction with respect to the second support portion, and the second movable portion is supported by the second support portion. And the second component holding portion is movable in the second direction, and the fourth component holding portion is supported by the second moving portion, and is located in the second direction with respect to the third component holding portion, and The second moving unit is movable in the third direction and holds the component, and the first moving mechanism integrally moves the first moving unit and the second moving unit in the second direction. Make the above a distance between the component holding portion and the second component holding portion in the second direction and a distance between the third component holding portion and the second component holding portion in the second direction; and a second moving mechanism; The second support portion is moved in the first direction, and the distance between the first support portion and the second support portion in the first direction is changed; and the inspection portion is held by the first component holding portion. Each of the components of the second component holding portion, the third component holding portion, and the fourth component holding portion is inspected.

藉此,可獲得零件個數較少之檢查裝置。 Thereby, an inspection device with a small number of parts can be obtained.

1‧‧‧檢查裝置 1‧‧‧Checking device

2‧‧‧供給托盤 2‧‧‧Supply tray

3‧‧‧回收托盤 3‧‧‧Recycling tray

4‧‧‧第1梭子 4‧‧‧1st shuttle

5‧‧‧第2梭子 5‧‧‧2nd shuttle

6‧‧‧檢查用插口 6‧‧‧Check socket

7‧‧‧供給機器人 7‧‧‧Supply robot

7a‧‧‧支持框 7a‧‧‧Support box

7b‧‧‧移動框 7b‧‧‧ moving box

7c‧‧‧手單元 7c‧‧‧Hand unit

8‧‧‧回收機器人 8‧‧‧Recycling robot

8a‧‧‧支持框 8a‧‧‧Support box

8b‧‧‧移動框 8b‧‧‧ moving box

8c‧‧‧手單元 8c‧‧‧Hand unit

9‧‧‧檢查用機器人 9‧‧‧Check robot

10‧‧‧控制裝置 10‧‧‧Control device

11‧‧‧基座 11‧‧‧Base

21‧‧‧凹穴 21‧‧‧ recess

23‧‧‧軌道 23‧‧‧ Track

31‧‧‧凹穴 31‧‧‧ recess

33‧‧‧軌道 33‧‧‧ Track

41‧‧‧基底構件 41‧‧‧Base member

42‧‧‧托盤 42‧‧‧Tray

43‧‧‧托盤 43‧‧‧Tray

44‧‧‧軌道 44‧‧‧ Track

51‧‧‧基底構件 51‧‧‧Base member

52‧‧‧托盤 52‧‧‧Tray

53‧‧‧托盤 53‧‧‧Tray

54‧‧‧軌道 54‧‧‧ Track

61‧‧‧檢查用個別插口 61‧‧‧Inspection with individual sockets

62‧‧‧探針 62‧‧‧Probe

71‧‧‧第1支持部 71‧‧‧1st Support Department

72‧‧‧第2支持部 72‧‧‧2nd Support Department

73‧‧‧第3支持部 73‧‧‧3rd Support Department

74‧‧‧第4支持部 74‧‧‧4th Support Department

75‧‧‧基部 75‧‧‧ base

76‧‧‧X方向移動機構 76‧‧‧X direction moving mechanism

77‧‧‧Y方向移動機構 77‧‧‧Y direction moving mechanism

77a‧‧‧第1單元 77a‧‧‧Unit 1

77b‧‧‧第2單元 77b‧‧‧Unit 2

92‧‧‧手單元 92‧‧‧Hand unit

93‧‧‧手單元 93‧‧‧Hand unit

94‧‧‧支持部 94‧‧‧Support Department

95‧‧‧第1移動部 95‧‧‧1st mobile department

96‧‧‧第2移動部 96‧‧‧2nd Moving Department

97‧‧‧旋轉部 97‧‧‧Rotating Department

98‧‧‧保持部 98‧‧‧ Keeping Department

100‧‧‧IC元件 100‧‧‧IC components

101‧‧‧檢查控制部 101‧‧‧Check Control Department

102‧‧‧驅動控制部 102‧‧‧Drive Control Department

200‧‧‧載置狀態檢測器件 200‧‧‧Loading state detection device

421‧‧‧凹穴 421‧‧‧ recess

431‧‧‧凹穴 431‧‧‧ recesses

500‧‧‧第2攝像機 500‧‧‧2nd camera

521‧‧‧凹穴 521‧‧‧ recess

531‧‧‧凹穴 531‧‧‧ recess

600‧‧‧第1攝像機 600‧‧‧1st camera

611‧‧‧側面 611‧‧‧ side

613‧‧‧底部 613‧‧‧ bottom

711‧‧‧第1零件保持機構 711‧‧‧1st part retention mechanism

712‧‧‧軸 712‧‧‧Axis

713‧‧‧吸附嘴 713‧‧‧Adsorption nozzle

714‧‧‧第1驅動機構 714‧‧‧1st drive mechanism

714a‧‧‧滑輪 714a‧‧‧ pulley

714b‧‧‧滑輪 714b‧‧‧ pulley

714c‧‧‧皮帶 714c‧‧‧Leather

714d‧‧‧馬達 714d‧‧‧Motor

714e‧‧‧固定部 714e‧‧‧Fixed Department

715‧‧‧第1移動部 715‧‧‧1st Mobile Department

716‧‧‧第2零件保持機構 716‧‧‧2nd part retention mechanism

717‧‧‧軸 717‧‧‧Axis

718‧‧‧吸附嘴 718‧‧‧Adsorption nozzle

719‧‧‧驅動機構 719‧‧‧ drive mechanism

719a‧‧‧滑輪 719a‧‧‧ pulley

719b‧‧‧滑輪 719b‧‧‧ pulley

719c‧‧‧皮帶 719c‧‧‧Leather

719d‧‧‧馬達 719d‧‧‧Motor

719e‧‧‧固定部 719e‧‧‧Fixed Department

721‧‧‧第3零件保持機構 721‧‧‧3rd part retention mechanism

722‧‧‧軸 722‧‧‧Axis

723‧‧‧吸附嘴 723‧‧‧Adsorption nozzle

724‧‧‧驅動機構 724‧‧‧ drive mechanism

724a‧‧‧滑輪 724a‧‧‧ pulley

724b‧‧‧滑輪 724b‧‧‧ pulley

724c‧‧‧皮帶 724c‧‧‧Leather

724d‧‧‧馬達 724d‧‧‧Motor

724e‧‧‧固定部 724e‧‧‧Fixed Department

725‧‧‧第2移動部 725‧‧‧2nd Moving Department

726‧‧‧第4零件保持機構 726‧‧‧4th part retention mechanism

727‧‧‧軸 727‧‧‧Axis

728‧‧‧吸附嘴 728‧‧‧Adsorption nozzle

729‧‧‧驅動機構 729‧‧‧ drive mechanism

729a‧‧‧滑輪 729a‧‧‧ pulley

729b‧‧‧滑輪 729b‧‧‧ pulley

729c‧‧‧皮帶 729c‧‧‧Leather

729d‧‧‧馬達 729d‧‧‧Motor

729e‧‧‧固定部 729e‧‧‧Fixed Department

731‧‧‧第5零件保持機構 731‧‧‧5th part retention mechanism

732‧‧‧軸 732‧‧‧Axis

733‧‧‧吸附嘴 733‧‧‧Adsorption nozzle

734‧‧‧驅動機構 734‧‧‧ drive mechanism

734a‧‧‧滑輪 734a‧‧‧ pulley

734b‧‧‧滑輪 734b‧‧‧ pulley

734c‧‧‧皮帶 734c‧‧‧Leather

734d‧‧‧馬達 734d‧‧‧Motor

734e‧‧‧固定部 734e‧‧‧Fixed Department

735‧‧‧第3移動部 735‧‧‧3rd Ministry of Movement

736‧‧‧第6零件保持機構 736‧‧‧6th part retention mechanism

737‧‧‧軸 737‧‧‧Axis

738‧‧‧吸附嘴 738‧‧‧Adsorption nozzle

739‧‧‧驅動機構 739‧‧‧Drive mechanism

739a‧‧‧滑輪 739a‧‧‧ pulley

739b‧‧‧滑輪 739b‧‧‧ pulley

739c‧‧‧皮帶 739c‧‧‧Leather

739d‧‧‧馬達 739d‧‧‧Motor

739e‧‧‧固定部 739e‧‧‧Fixed Department

741‧‧‧第7零件保持機構 741‧‧‧7th part retention mechanism

742‧‧‧軸 742‧‧‧Axis

743‧‧‧吸附嘴 743‧‧‧Adsorption nozzle

744‧‧‧驅動機構 744‧‧‧ drive mechanism

744a‧‧‧滑輪 744a‧‧‧ pulley

744b‧‧‧滑輪 744b‧‧‧ pulley

744c‧‧‧皮帶 744c‧‧‧Leather

744d‧‧‧馬達 744d‧‧‧Motor

744e‧‧‧固定部 744e‧‧‧Fixed Department

745‧‧‧第4移動部 745‧‧‧4th Mobile Department

746‧‧‧第8零件保持機構 746‧‧‧8th part retention mechanism

747‧‧‧軸 747‧‧‧Axis

748‧‧‧吸附嘴 748‧‧‧Adsorption nozzle

749‧‧‧驅動機構 749‧‧‧ drive mechanism

749a‧‧‧滑輪 749a‧‧‧ pulley

749b‧‧‧滑輪 749b‧‧‧ pulley

749c‧‧‧皮帶 749c‧‧‧Leather

749d‧‧‧馬達 749d‧‧‧Motor

749e‧‧‧固定部 749e‧‧‧Fixed Department

751‧‧‧第1基底 751‧‧‧1st base

752‧‧‧第2基底 752‧‧‧2nd base

753‧‧‧軌道 753‧‧‧ Track

754‧‧‧導引器 754‧‧‧ introducer

755‧‧‧導引器 755‧‧‧ introducer

756‧‧‧導引器 756‧‧‧ introducer

761‧‧‧二段滑輪 761‧‧Two-stage pulley

761a‧‧‧小徑滑輪 761a‧‧ ‧ small diameter pulley

761b‧‧‧大徑滑輪 761b‧‧‧ large diameter pulley

762‧‧‧二段滑輪 762‧‧‧Two-stage pulley

762a‧‧‧小徑滑輪 762a‧‧‧Small diameter pulley

762b‧‧‧大徑滑輪 762b‧‧‧ large diameter pulley

763‧‧‧皮帶 763‧‧‧Land

763a‧‧‧區域 763a‧‧‧Area

763b‧‧‧區域 763b‧‧‧Area

764‧‧‧皮帶 764‧‧‧Land

764a‧‧‧區域 764a‧‧‧Area

764b‧‧‧區域 764b‧‧‧Area

765‧‧‧馬達 765‧‧‧Motor

771‧‧‧滑輪 771‧‧‧ pulley

772‧‧‧滑輪 772‧‧‧ pulley

773‧‧‧皮帶 773‧‧‧Land

773a‧‧‧區域 773a‧‧‧Area

773b‧‧‧區域 773b‧‧‧Area

774‧‧‧滑輪 774‧‧‧ pulley

775‧‧‧滑輪 775‧‧‧ pulley

776‧‧‧皮帶 776‧‧‧Land

776a‧‧‧區域 776a‧‧‧Area

776b‧‧‧區域 776b‧‧‧Area

777‧‧‧馬達 777‧‧‧Motor

778‧‧‧傳遞軸 778‧‧‧Transfer axis

779‧‧‧連結軸 779‧‧‧Connected shaft

779b‧‧‧線性襯套 779b‧‧‧Linear bushing

779c‧‧‧線性襯套 779c‧‧‧Linear bushing

779d‧‧‧線性襯套 779d‧‧‧Linear bushing

911‧‧‧框 911‧‧‧ box

911a‧‧‧軌道 911a‧‧ Track

912‧‧‧框 912‧‧‧ box

912a‧‧‧軌道 912a‧‧ Track

912b‧‧‧軌道 912b‧‧‧ Track

913‧‧‧手單元支持部 913‧‧‧Hand Unit Support

914‧‧‧手單元支持部 914‧‧‧Hand Unit Support

941‧‧‧元件標記 941‧‧‧Component marking

1100‧‧‧第1支持部用單元 1100‧‧‧1st support unit

1101‧‧‧滑輪 1101‧‧‧ pulley

1102‧‧‧滑輪 1102‧‧‧ pulley

1103‧‧‧皮帶 1103‧‧‧Belt

1103a‧‧‧區域 1103a‧‧‧Area

1103b‧‧‧區域 1103b‧‧‧Area

1200‧‧‧第2支持部用單元 1200‧‧‧2nd support unit

1201‧‧‧滑輪 1201‧‧‧ pulley

1202‧‧‧滑輪 1202‧‧‧ pulley

1203‧‧‧皮帶 1203‧‧‧Land

1203a‧‧‧區域 1203a‧‧‧Area

1203b‧‧‧區域 1203b‧‧‧Area

1300‧‧‧第3支持部用單元 1300‧‧‧3rd support unit

1301‧‧‧滑輪 1301‧‧‧ pulley

1302‧‧‧滑輪 1302‧‧‧ pulley

1303‧‧‧皮帶 1303‧‧‧Leather

1303a‧‧‧區域 1303a‧‧‧Area

1303b‧‧‧區域 1303b‧‧‧Area

1400‧‧‧第4支持部用單元 1400‧‧‧4th support unit

1401‧‧‧滑輪 1401‧‧‧ pulley

1402‧‧‧滑輪 1402‧‧‧ pulley

1403‧‧‧皮帶 1403‧‧‧Leather

1403a‧‧‧區域 1403a‧‧‧Area

1403b‧‧‧區域 1403b‧‧‧Area

1500‧‧‧驅動機構 1500‧‧‧ drive mechanism

1501‧‧‧花鍵軸 1501‧‧‧ Splined shaft

1502‧‧‧花鍵螺帽 1502‧‧‧ spline nut

1503‧‧‧花鍵螺帽 1503‧‧‧ spline nut

1504‧‧‧花鍵螺帽 1504‧‧‧ spline nut

1505‧‧‧花鍵螺帽 1505‧‧‧ spline nut

1507‧‧‧馬達 1507‧‧ ‧ motor

1508‧‧‧滑輪 1508‧‧‧ pulley

1509‧‧‧滑輪 1509‧‧‧ pulley

1510‧‧‧皮帶 1510‧‧‧Leather

S‧‧‧區域 S‧‧‧ area

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

圖1係表示本發明之檢查裝置之第1實施形態之概略平面圖。 Fig. 1 is a schematic plan view showing a first embodiment of an inspection apparatus according to the present invention.

圖2係圖1所示之檢查用值所具有之供給機器人之手單元之立體圖。 Fig. 2 is a perspective view of the hand unit of the robot supplied to the inspection value shown in Fig. 1.

圖3係圖1所示之檢查用值所具有之供給機器人之手單元之平面 圖。 Figure 3 is a plan view of the hand unit of the robot provided in the inspection value shown in Figure 1. Figure.

圖4係圖2所示之手單元所具有之第1支持部之平面圖。 Fig. 4 is a plan view showing a first support portion of the hand unit shown in Fig. 2;

圖5係圖2所示之手單元所具有之第2支持部之平面圖。 Fig. 5 is a plan view showing a second support portion of the hand unit shown in Fig. 2;

圖6係圖2所示之手單元所具有之第3支持部之平面圖。 Fig. 6 is a plan view showing a third support portion of the hand unit shown in Fig. 2.

圖7係圖2所示之手單元所具有之第4支持部之平面圖。 Fig. 7 is a plan view showing a fourth support portion of the hand unit shown in Fig. 2.

圖8係表示圖2所示之手單元所具有之X方向移動機構之平面圖。 Fig. 8 is a plan view showing the X-direction moving mechanism of the hand unit shown in Fig. 2.

圖9表示係圖2所示之手單元所具有之Y方向移動機構之平面圖。 Fig. 9 is a plan view showing the Y-direction moving mechanism of the hand unit shown in Fig. 2.

圖10(a)、(b)係表示圖2所示之手單元所具有之Y方向移動機構之平面圖。 10(a) and 10(b) are plan views showing the Y-direction moving mechanism of the hand unit shown in Fig. 2.

圖11係圖1所示之檢查裝置所具有之檢查用機器人之手單元之立體圖。 Fig. 11 is a perspective view showing the hand unit of the inspection robot included in the inspection apparatus shown in Fig. 1.

圖12係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 Fig. 12 is a plan view showing an electronic component inspection sequence of the inspection apparatus shown in Fig. 1.

圖13係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 Fig. 13 is a plan view showing the electronic component inspection sequence of the inspection apparatus shown in Fig. 1.

圖14係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 Fig. 14 is a plan view showing an electronic component inspection sequence of the inspection apparatus shown in Fig. 1.

圖15係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 Fig. 15 is a plan view showing the electronic component inspection sequence of the inspection apparatus shown in Fig. 1.

圖16係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 Fig. 16 is a plan view showing an electronic component inspection sequence of the inspection apparatus shown in Fig. 1.

圖17係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 Fig. 17 is a plan view showing the electronic component inspection sequence of the inspection apparatus shown in Fig. 1.

圖18係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 Fig. 18 is a plan view for explaining an electronic component inspection sequence of the inspection apparatus shown in Fig. 1.

圖19係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平 面圖。 Figure 19 is a diagram for explaining the electronic component inspection sequence of the inspection apparatus shown in Figure 1. Surface map.

圖20係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 Fig. 20 is a plan view for explaining an electronic component inspection sequence of the inspection apparatus shown in Fig. 1.

圖21係表示本發明之第2實施形態之檢查裝置所具有之供給機器人之手單元之平面圖。 Fig. 21 is a plan view showing a hand unit for supplying a robot included in the inspection apparatus according to the second embodiment of the present invention.

圖22係圖21所示之手單元所具有之支持部之平面圖。 Figure 22 is a plan view showing a support portion of the hand unit shown in Figure 21.

以下,基於附圖所示之實施形態詳細地對應用本發明之處理器之檢查裝置(本發明之檢查裝置)進行說明。 Hereinafter, an inspection apparatus (inspection apparatus of the present invention) to which the processor of the present invention is applied will be described in detail based on the embodiment shown in the drawings.

<第1實施形態> <First embodiment>

圖1係表示本發明之檢查裝置之第1實施形態之概略平面圖,圖2係圖1所示之檢查用值所具有之供給機器人之手單元之立體圖,圖3係圖1所示之檢查用值所具有之供給機器人之手單元之平面圖,圖4係圖2所示之手單元所具有之第1支持部之平面圖,圖5係圖2所示之手單元所具有之第2支持部之平面圖,圖6係圖2所示之手單元所具有之第3支持部之平面圖,圖7係圖2所示之手單元所具有之第4支持部之平面圖,圖8係表示圖2所示之手單元所具有之X方向移動機構之平面圖,圖9及圖10表示係圖2所示之手單元所具有之Y方向移動機構之平面圖,圖11係圖1所示之檢查裝置所具有之檢查用機器人之手單元之立體圖,圖12至圖20係對圖1所示之檢查裝置之電子零件之檢查順序進行說明之平面圖。 Fig. 1 is a schematic plan view showing a first embodiment of an inspection apparatus according to the present invention, and Fig. 2 is a perspective view of a hand unit for supplying a robot included in the inspection value shown in Fig. 1, and Fig. 3 is a view for inspection shown in Fig. 1. FIG. 4 is a plan view of the first support portion of the hand unit shown in FIG. 2, and FIG. 5 is a second support portion of the hand unit shown in FIG. FIG. 6 is a plan view showing a third support portion of the hand unit shown in FIG. 2, FIG. 7 is a plan view showing a fourth support portion of the hand unit shown in FIG. 2, and FIG. 8 is a plan view showing FIG. FIG. 9 and FIG. 10 are plan views of the Y-direction moving mechanism of the hand unit shown in FIG. 2, and FIG. 11 is a plan view of the inspection apparatus shown in FIG. A perspective view of the hand unit of the inspection robot is used. Figs. 12 to 20 are plan views for explaining the inspection procedure of the electronic components of the inspection apparatus shown in Fig. 1.

再者,以下,為了便於說明,如圖1所示,將相互正交之3軸設為X軸(第1軸)、Y軸(第2軸)及Z軸(第3軸)。又,將平行於X軸之方向稱為「X方向(第1方向)」,將平行於Y軸之方向稱為「Y方向(第2方向)」,將平行於Z軸之方向稱為「Z方向」。又,於X方向、Y方向及Z方向各方向中,將箭頭前端側稱為「+」,將箭頭末端側稱為「-」。 In the following description, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis (first axis), a Y-axis (second axis), and a Z-axis (third axis). Further, the direction parallel to the X-axis is referred to as "X direction (first direction)", the direction parallel to the Y-axis is referred to as "Y direction (second direction)", and the direction parallel to the Z-axis is referred to as " Z direction". Further, in the X direction, the Y direction, and the Z direction, the front end side of the arrow is referred to as "+", and the end side of the arrow is referred to as "-".

圖1所示之檢查裝置1係用以對例如IC元件(IC晶片)、LCD(Liquid Crystal Disp1ay,液晶顯示器)、CIS(Contact Image Sensor,接觸式影像感測器)等試驗零件(電子零件)100之電氣特性進行檢查、試驗之裝置。再者,以下,為了便於說明,以使用IC元件作為試驗零件之情形為代表而進行說明。 The inspection apparatus 1 shown in FIG. 1 is used for test parts (electronic parts) such as an IC component (IC chip), an LCD (Liquid Crystal Disp1ay, liquid crystal display), a CIS (Contact Image Sensor), and the like. 100 electrical characteristics of the device for inspection and testing. In the following, for convenience of explanation, a case where an IC component is used as a test component will be described as a representative.

檢查裝置1包括供給托盤2、回收托盤3、第1梭子4、第2梭子5、檢查用插口(檢查部)6、供給機器人7、回收機器人8、檢查用機器人9、第1攝像機600、第2攝像機500、及進行該等各部之控制之控制裝置10。 The inspection device 1 includes a supply tray 2, a recovery tray 3, a first shuttle 4, a second shuttle 5, an inspection socket (inspection unit) 6, a supply robot 7, a collection robot 8, an inspection robot 9, a first camera 600, and a 2 Camera 500, and control device 10 for controlling the various parts.

於此種檢查裝置1中,形成除去該等各部之中之檢查用插口6之構成,即由供給托盤2、回收托盤3、第1梭子4、第2梭子5、供給機器人7、回收機器人8、檢查用機器人9、第1攝像機600、第2攝像機500、控制裝置10,構成執行IC元件100之搬送之處理器(本發明之處理器)。再者,處理器之構成並不限定於此,既可根據需要而省略該等各部之中之至少1個,亦可添加有其他構成(例如,熱板或腔室)。 In the inspection apparatus 1, the inspection socket 6 among the respective units is removed, that is, the supply tray 2, the recovery tray 3, the first shuttle 4, the second shuttle 5, the supply robot 7, and the recovery robot 8 are formed. The inspection robot 9, the first camera 600, the second camera 500, and the control device 10 constitute a processor (processor of the present invention) that performs the transfer of the IC device 100. Further, the configuration of the processor is not limited thereto, and at least one of the units may be omitted as needed, and another configuration (for example, a hot plate or a chamber) may be added.

又,檢查裝置1包括搭載上述各部之基座11、及以收納上述各部之方式覆蓋於基座11上之未圖示之安全罩,於該安全罩之內側(以下稱為「區域S」),配置有第1梭子4、第2梭子5、檢查用插口6、供給機器人7、回收機器人8、檢查用機器人9、第1攝像機600及第2攝像機500,並且以可向區域S之內外移動之方式,配置有供給托盤2及回收托盤3。 Further, the inspection apparatus 1 includes a susceptor 11 on which the respective units are mounted, and a safety cover (not shown) that covers the susceptor 11 so as to accommodate the respective portions, and is inside the safety cover (hereinafter referred to as "area S"). The first shuttle 4, the second shuttle 5, the inspection socket 6, the supply robot 7, the collection robot 8, the inspection robot 9, the first camera 600, and the second camera 500 are disposed, and are movable to the inside and outside of the region S. In this manner, the supply tray 2 and the recovery tray 3 are disposed.

以下,依序詳細地對該等各部進行說明。 Hereinafter, each part will be described in detail in order.

1.供給托盤 Supply tray

供給托盤2係用以將進行檢查之IC元件100自區域S外搬送至區域S內之托盤。如圖1所示,供給托盤2形成為板狀,且於其上表面,沿X方向及Y方向呈矩陣狀地形成有用以載置IC元件100之複數個凹穴 21。 The supply tray 2 is for transporting the inspected IC component 100 from the area S to the tray in the area S. As shown in FIG. 1, the supply tray 2 is formed in a plate shape, and a plurality of recesses for mounting the IC component 100 are formed in a matrix form in the X direction and the Y direction on the upper surface thereof. twenty one.

此種供給托盤2係以跨越區域S之內外之方式載置於在向Y方向延伸之軌道23上移動之未圖示之平台上。而且,供給托盤2藉由以例如線性馬達作為驅動源之未圖示之驅動器件使上述平台移動,由此可沿軌道23於±Y方向上往返移動。因此,可重複進行如下動作:將收納有IC元件100之供給托盤2載置於處在區域S外之平台上,使供給托盤2與平台一併向區域S內移動,自供給托盤2上卸除所有IC元件100,之後再次使供給托盤2與平台一併向區域S外移動。 The supply tray 2 is placed on a platform (not shown) that moves on the rail 23 extending in the Y direction so as to straddle the inside and outside of the region S. Further, the supply tray 2 moves the above-described stage by a driving means (not shown) such as a linear motor as a driving source, thereby being reciprocally movable in the ±Y direction along the track 23. Therefore, the operation of repeatedly loading the supply tray 2 in which the IC component 100 is housed on the platform outside the region S, and moving the supply tray 2 together with the platform into the region S, and unloading from the supply tray 2 can be repeated. In addition to all of the IC components 100, the supply tray 2 is again moved out of the region S together with the platform.

2.回收托盤 2. Recycling tray

回收托盤3係用以收納檢查結束之IC元件100並將其自區域S內搬送至區域S外之托盤。如圖1所示,回收托盤3形成為板狀,且於其上表面,沿X方向及Y方向呈矩陣狀地形成有用以載置IC元件100之複數個凹穴31。 The recovery tray 3 is for accommodating the IC element 100 that has been inspected and transporting it from the area S to the tray outside the area S. As shown in FIG. 1, the collection tray 3 is formed in a plate shape, and a plurality of pockets 31 for mounting the IC element 100 are formed in a matrix form in the X direction and the Y direction on the upper surface thereof.

此種回收托盤3係以跨越區域S之內外之方式載置於在向Y方向延伸之軌道33上移動之未圖示之平台上。而且,回收托盤3藉由以例如線性馬達作為驅動源之未圖示之驅動器件使上述平台移動,由此可沿軌道33於±Y方向上往返移動。因此,於區域S內,可重複進行如下動作:將檢查結束之IC元件100收納於回收托盤3中,使回收托盤3移動至區域S外,將平台上之回收托盤3更換成空托盤,之後再次使回收托盤3向區域S內移動。 Such a recovery tray 3 is placed on a platform (not shown) that moves on a rail 33 extending in the Y direction so as to span the inside and outside of the region S. Further, the recovery tray 3 moves the stage by a driving means (not shown) such as a linear motor as a driving source, thereby being reciprocally movable in the ±Y direction along the track 33. Therefore, in the region S, the IC device 100 in which the inspection is completed can be repeatedly stored in the recovery tray 3, the recovery tray 3 can be moved outside the region S, and the recovery tray 3 on the platform can be replaced with an empty tray. The recovery tray 3 is moved again into the area S.

此種回收托盤3係相對於上述供給托盤2於+X方向上相隔而設置,且於供給托盤2與回收托盤3之間,配置有第1梭子4、第2梭子5及檢查用插口6。 The collection tray 3 is provided in the +X direction with respect to the supply tray 2, and the first shuttle 4, the second shuttle 5, and the inspection socket 6 are disposed between the supply tray 2 and the collection tray 3.

3.第1梭子 3. The first shuttle

第1梭子4將藉由供給托盤2而搬送至區域S內之IC元件100進而搬送至檢查用插口6之附近,故而其進而係用以將利用檢查用插口6進行 過檢查之檢查結束之IC元件100搬送至回收托盤3之附近者。 The first shuttle 4 is transported to the IC device 100 in the region S by the supply tray 2 and then transported to the vicinity of the inspection socket 6, so that it is further used for the inspection socket 6 The IC device 100 that has passed the inspection of the inspection is transported to the vicinity of the recovery tray 3.

如圖1所示,第1梭子4包括基底構件41、及固定於基底構件41上之2個托盤42、43。該等2個托盤42、43係沿X方向排列而設置。又,於托盤42、43上,分別以沿X方向排列4個、沿Y方向排列2個之方式呈矩陣狀(matrix狀)地形成有用以載置IC元件100之8個凹穴421、431。 As shown in FIG. 1, the first shuttle 4 includes a base member 41 and two trays 42, 43 fixed to the base member 41. The two trays 42, 43 are arranged in the X direction. Further, in the trays 42 and 43, eight recesses 421 and 431 for mounting the IC component 100 are formed in a matrix shape in a matrix of four in the X direction and two in the Y direction. .

托盤42、43之中,位於供給托盤2側之托盤42係用以將收納於供給托盤2中之IC元件100轉移而收納之托盤,位於回收托盤3側之托盤43係用以收納已利用檢查用插口6完成電氣特性之檢查之IC元件100之托盤。即,托盤42係用以收納未檢查之IC元件100之托盤,托盤43係用以收納檢查結束之IC元件100之托盤。 Among the trays 42 and 43, the tray 42 on the side of the supply tray 2 is a tray for transferring and storing the IC component 100 accommodated in the supply tray 2, and the tray 43 on the side of the recovery tray 3 is used for storing the used inspection. The tray of the IC component 100 in which the electrical characteristics are inspected by the socket 6. That is, the tray 42 is for accommodating the tray of the unchecked IC device 100, and the tray 43 is for accommodating the tray of the IC component 100 that has been inspected.

此種第1梭子4係基底構件41支持於向X方向延伸之軌道44上,藉由以例如線性馬達作為驅動源之未圖示之驅動器件,可沿軌道44於±X方向上往返移動。而且,可形成如下兩種狀態:一是第1梭子4移動至-X方向側,托盤42相對於供給托盤2排列於+Y方向側,並且托盤43相對於檢查用插口6排列於+Y方向側之狀態;二是第1梭子4移動至+X方向側,托盤43相對於回收托盤3排列於+Y方向側,並且托盤42相對於檢查用插口6排列於+Y方向側之狀態。 The first shuttle 4 base member 41 is supported by a rail 44 extending in the X direction, and can be reciprocated in the ±X direction along the rail 44 by a driving device (not shown) using, for example, a linear motor as a drive source. Further, two states can be formed: first, the first shuttle 4 is moved to the -X direction side, the tray 42 is arranged on the +Y direction side with respect to the supply tray 2, and the tray 43 is arranged in the +Y direction with respect to the inspection socket 6. The second state is that the first shuttle 4 is moved to the +X direction side, the tray 43 is arranged on the +Y direction side with respect to the recovery tray 3, and the tray 42 is arranged on the +Y direction side with respect to the inspection socket 6.

4.第2梭子 4. The second shuttle

第2梭子5具有與上述第1梭子4相同之功能及構成。即,第2梭子5將藉由供給托盤2而搬送至區域S內之IC元件100進而搬送至檢查用插口6之附近,故而其進而係用以將藉由檢查用插口6進行過檢查之檢查結束之IC元件100搬送至回收托盤3之附近者。 The second shuttle 5 has the same function and configuration as the first shuttle 4 described above. In other words, the second shuttle 5 is transported to the vicinity of the inspection socket 6 by the supply tray 2 and transported to the IC device 100 in the region S. Therefore, the second shuttle 5 is further used for inspection by the inspection socket 6. The completed IC device 100 is transported to the vicinity of the recovery tray 3.

如圖1所示,第2梭子5包括基底構件51、及固定於基底構件51上之2個托盤52、53。該等2個托盤52、53係沿X方向排列而設置。又,於托盤52、53上,分別以沿X方向排列4個、沿Y方向排列2個之方式 呈矩陣狀地形成有用以載置IC元件100之8個凹穴521、531。 As shown in FIG. 1, the second shuttle 5 includes a base member 51 and two trays 52, 53 fixed to the base member 51. The two trays 52 and 53 are arranged in the X direction. Further, on the trays 52 and 53, four are arranged in the X direction and two in the Y direction. Eight recesses 521 and 531 for mounting the IC component 100 are formed in a matrix.

托盤52、53之中,位於供給托盤2側之托盤52係將收納於供給托盤2中之IC元件100轉移而收納之托盤,位於回收托盤3側之托盤43係用以收納已利用檢查用插口6完成電氣特性之檢查之IC元件100之托盤。即,托盤52係用以收納未檢查之IC元件100之托盤,托盤53係用以收納檢查結束之IC元件100之托盤。 Among the trays 52 and 53, the tray 52 on the supply tray 2 side is a tray in which the IC component 100 accommodated in the supply tray 2 is transferred and stored, and the tray 43 on the side of the collection tray 3 is used to store the used inspection socket. 6 The tray of the IC component 100 that completes the inspection of the electrical characteristics. That is, the tray 52 is for accommodating the tray of the unchecked IC device 100, and the tray 53 is for accommodating the tray of the IC component 100 that has been inspected.

此種第2梭子5係基底構件51支持於向X方向延伸之軌道54上,藉由以例如線性馬達作為驅動源之未圖示之驅動器件,可沿軌道54於±X方向上往返移動。藉此,可形成如下兩種狀態:一是第2梭子5移動至-X方向側,托盤52相對於供給托盤2排列於+Y方向側,並且托盤53相對於檢查用插口6排列於-Y方向側之狀態;二是第2梭子5移動至+X方向側,托盤53相對於回收托盤3排列於+Y方向側,並且托盤52相對於檢查用插口6排列於-Y方向側之狀態。 The second shuttle 5 base member 51 is supported by a rail 54 extending in the X direction, and is reciprocally movable in the ±X direction along the rail 54 by a driving device (not shown) using, for example, a linear motor as a drive source. Thereby, two states can be formed: one is that the second shuttle 5 is moved to the -X direction side, the tray 52 is arranged on the +Y direction side with respect to the supply tray 2, and the tray 53 is arranged at -Y with respect to the inspection socket 6. In the state of the direction side, the second shuttle 5 is moved to the +X direction side, the tray 53 is arranged on the +Y direction side with respect to the recovery tray 3, and the tray 52 is arranged on the -Y direction side with respect to the inspection socket 6.

再者,第2梭子5係相對於上述第1梭子4於-Y方向上相隔而設置,且於第1梭子4與第2梭子5之間,配置有檢查用插口6。 Further, the second shuttle 5 is provided in the -Y direction with respect to the first shuttle 4, and an inspection socket 6 is disposed between the first shuttle 4 and the second shuttle 5.

5.檢查用插口 5. Inspection socket

檢查用插口(檢查部)6係用以檢查IC元件100之電氣特性之插口。 The inspection socket (inspection portion) 6 is a socket for inspecting the electrical characteristics of the IC component 100.

此種檢查用插口6包括用以配置IC元件100之8個檢查用個別插口61,且8個檢查用個別插口61係以沿X方向排列4個、沿Y方向排列2個之方式設置。又,8個檢查用個別插口61之排列間距與形成於各托盤42、43、52、53上之8個凹穴之排列間距大致相等。藉此,可順利地進行托盤42、43、52、53與檢查用個別插口61之間之IC元件100之搬送。 The inspection socket 6 includes eight inspection individual sockets 61 for arranging the IC device 100, and eight inspection individual sockets 61 are provided so as to be arranged in four in the X direction and two in the Y direction. Further, the arrangement pitch of the eight inspection individual sockets 61 is substantially equal to the arrangement pitch of the eight pockets formed on the respective trays 42, 43, 52, 53. Thereby, the transfer of the IC component 100 between the trays 42, 43, 52, 53 and the individual inspection sockets 61 can be smoothly performed.

雖未圖示,但於各檢查用個別插口61中,設置有自其底部突出之複數個探針。該等複數個探針分別藉由彈簧等向上方賦能。若於檢查用個別插口61中配置IC元件100,則複數個探針與該IC元件100所具 有之外部端子接觸。藉此,形成IC元件100與控制裝置10(下述檢查控制部101)經由探針電性連接之狀態,即,可進行IC元件100之電氣特性之檢查(試驗)之狀態。 Although not shown, a plurality of probes protruding from the bottom thereof are provided in each of the individual inspection sockets 61. The plurality of probes are respectively energized upward by a spring or the like. If the IC component 100 is disposed in the individual socket 61 for inspection, the plurality of probes and the IC component 100 have There are external terminals in contact. Thereby, the state in which the IC device 100 and the control device 10 (the inspection control unit 101 described below) are electrically connected via the probe, that is, the state in which the electrical characteristics of the IC device 100 are inspected (tested) can be formed.

此種檢查用插口6裝卸自如地固定於基座11上。因此,可簡單地、與目標檢查(試驗)相應地改裝檢查用插口6、或者根據IC元件100之大小或形狀而改裝與其相符之檢查用插口6。 The inspection socket 6 is detachably fixed to the base 11. Therefore, the inspection socket 6 can be simply modified in accordance with the target inspection (test), or the inspection socket 6 conforming thereto can be modified in accordance with the size or shape of the IC component 100.

6.第1攝像機 6. The first camera

第1攝像機600係設置於第1梭子4與檢查用插口6之間。如下所述,此種第1攝像機600於保持有未檢查之IC元件100之第1手單元92通過上方時,對IC元件100及第1手單元92所具有之元件標記941進行攝影。 The first camera 600 is disposed between the first shuttle 4 and the inspection socket 6. As described below, when the first hand unit 92 holding the unchecked IC device 100 passes over, the first camera 600 captures the component marks 941 of the IC device 100 and the first hand unit 92.

7.第2攝像機 7. 2nd camera

第2攝像機500具有與上述第1攝像機600相同之功能。此種第2攝像機500設置於第2梭子5與檢查用插口6之間。如下所述,第2攝像機500於保持有未檢查之IC元件100之第2手單元93通過上方時,對IC元件100及第2手單元93所具有之元件標記進行攝影。 The second camera 500 has the same function as the first camera 600 described above. Such a second camera 500 is disposed between the second shuttle 5 and the inspection socket 6. As will be described later, when the second hand unit 93 holding the unchecked IC device 100 passes over, the second camera 500 photographs the component marks of the IC component 100 and the second hand unit 93.

8.供給機器人 8. Supply robot

供給機器人7係將收納於供給托盤2中之IC元件100搬送至托盤42、52上之機器人。 The supply robot 7 is a robot that transports the IC component 100 housed in the supply tray 2 to the trays 42 and 52.

如圖1所示,供給機器人7包括:支持框7a,其支持於基座11上;移動框7b,其支持於支持框7a上,且可相對於支持框7a於±Y方向上往返移動;及手單元7c,其支持於移動框7b上,且可相對於移動框7b於±X軸方向上往返移動。 As shown in FIG. 1, the supply robot 7 includes a support frame 7a supported on the base 11 and a moving frame 7b supported on the support frame 7a and movable back and forth in the ±Y direction with respect to the support frame 7a; The hand unit 7c is supported on the moving frame 7b and is reciprocally movable in the ±X-axis direction with respect to the moving frame 7b.

於支持框7a上,形成有沿Y方向延伸之軌道,移動框7b沿該軌道於Y方向上往返移動。又,於移動框7b上,形成有沿X方向延伸之軌道,手單元7c沿該軌道於X方向上往返移動。再者,移動框7b相對於 支持框7a之移動、手單元7c相對於移動框7b之移動係藉由以例如線性馬達作為驅動源之未圖示之驅動器件而進行。 On the support frame 7a, a track extending in the Y direction is formed, and the moving frame 7b reciprocates in the Y direction along the track. Further, on the moving frame 7b, a track extending in the X direction is formed, and the hand unit 7c reciprocates in the X direction along the track. Furthermore, moving frame 7b is relative to The movement of the support frame 7a and the movement of the hand unit 7c with respect to the moving frame 7b are performed by a driving device (not shown) using, for example, a linear motor as a driving source.

以下,基於圖2~圖10,詳細地對手單元7c進行說明。再者,於圖2~圖10各圖中,為了便於說明,省略構成之一部分圖示。 Hereinafter, the opponent unit 7c will be described in detail based on FIGS. 2 to 10. In addition, in each of FIGS. 2 to 10, for convenience of explanation, a part of the configuration is omitted.

如圖2及圖3所示,手單元7c具有基部75,且該基部75可相對於移動框7b沿X方向移動地得到支持。再者,所謂「基部」係指支持其他構件(例如下述第1~第4支持部71~74)而使其聚攏之部位,且係形成手單元7c之基礎之部分。 As shown in FIGS. 2 and 3, the hand unit 7c has a base portion 75, and the base portion 75 is supported to be movable in the X direction with respect to the moving frame 7b. In addition, the "base portion" refers to a portion that supports other members (for example, the first to fourth support portions 71 to 74 described below) and gathers them, and forms a basis of the hand unit 7c.

此種基部75包括:第1基底751,其形成為於XY平面上具有擴寬且於Z方向上具有厚度之板狀;及第2基底752,其自第1基底751之-X方向側之端部向下方(-Z方向)延出,於ZY平面上具有擴寬且於X方向上具有厚度。即,基部75形成為於途中彎曲之L字狀之外形。2個基底751、752之中,於第1基底751上,固定有構成下述X方向移動機構76之零件之至少一部分,於第2基底752上,固定有構成下述Y方向移動機構77之零件之至少一部分。 The base portion 75 includes a first base 751 formed in a plate shape having a width in the XY plane and having a thickness in the Z direction, and a second base 752 from the -X direction side of the first base 751. The end portion extends downward (in the -Z direction), has a widening in the ZY plane, and has a thickness in the X direction. That is, the base portion 75 is formed in an L-shaped outer shape that is curved in the middle. Among the two bases 751 and 752, at least a part of the components constituting the following X-direction moving mechanism 76 is fixed to the first base 751, and the Y-direction moving mechanism 77 is fixed to the second base 752. At least part of the part.

又,手單元7c包括支持於基部75上之4個支持部,具體而言,包括第1支持部71、第2支持部72、第3支持部73及第4支持部74。該等4個支持部係自-X方向側向+X方向,以第3支持部73、第2支持部72、第1支持部71、第4支持部74之順序排列而設置。再者,上述「支持」係指以防止自基部75落下之狀態連結。 Further, the hand unit 7c includes four support portions supported by the base portion 75, and specifically includes a first support portion 71, a second support portion 72, a third support portion 73, and a fourth support portion 74. The four support portions are arranged in the order of the third support portion 73, the second support portion 72, the first support portion 71, and the fourth support portion 74 from the -X direction side +X direction. In addition, the above-mentioned "support" means that the connection from the base portion 75 is prevented from falling.

又,4個支持部71~74之中之第1支持部71固定於第1基底751上。再者,上述「固定」係指於動作時上述第1支持部71相對於基部75之相對位置不變。 Further, the first support portion 71 of the four support portions 71 to 74 is fixed to the first base 751. In addition, the above-mentioned "fixed" means that the relative position of the first support portion 71 with respect to the base portion 75 does not change during the operation.

其他第2、第3、第4支持部72、73、74分別可相對於第1基底751沿X方向移動。本實施形態中,於第1基底751之下表面形成有沿X方向延伸之軌道753,且於該軌道753上配置有可於軌道753上移動之3個 導引器754、755、756。而且,於導引器754上固定有第2支持部72,於導引器755上固定有第3支持部73,於導引器756上固定有第4支持部74。藉由此種構成,第2、第3、第4支持部72、73、74可相對於基部75沿X方向移動。 The other second, third, and fourth support portions 72, 73, and 74 are movable in the X direction with respect to the first base 751, respectively. In the present embodiment, a rail 753 extending in the X direction is formed on the lower surface of the first base 751, and three rails 753 are movable on the rail 753. Introducers 754, 755, 756. Further, the second support portion 72 is fixed to the introducer 754, the third support portion 73 is fixed to the introducer 755, and the fourth support portion 74 is fixed to the introducer 756. With such a configuration, the second, third, and fourth support portions 72, 73, and 74 can move in the X direction with respect to the base portion 75.

又,第1、第2、第3、第4支持部71、72、73、74分別形成為於YZ平面上具有擴寬且於X方向上具有厚度之板狀。如此,藉由使各支持部71~74形成為於YZ平面上具有擴寬之板狀,可使支持部71~74以更窄之間距沿X方向並排設置。因此,可謀求手單元7c之小型化,並且可偏向X方向以較窄之間距配置下述複數個吸附嘴。 Further, each of the first, second, third, and fourth support portions 71, 72, 73, and 74 is formed in a plate shape having a width in the YZ plane and a thickness in the X direction. As described above, by forming the support portions 71 to 74 in a plate shape having a widened width on the YZ plane, the support portions 71 to 74 can be arranged side by side in the X direction at a narrower interval. Therefore, it is possible to reduce the size of the hand unit 7c, and it is possible to arrange the following plurality of suction nozzles in a narrow interval in the X direction.

以下,詳細地對第1、第2、第3、第4支持部71、72、73、74進行說明,各支持部71~74形成為彼此相同之構成。 Hereinafter, the first, second, third, and fourth support portions 71, 72, 73, and 74 will be described in detail, and the support portions 71 to 74 are formed to be identical to each other.

8-1.第1支持部 8-1. First Support Department

如圖4所示,於第1支持部71上設置有第1零件保持機構711。第1零件保持機構711具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 As shown in FIG. 4, the first component holding mechanism 711 is provided in the first support portion 71. The first component holding mechanism 711 has a function of holding the IC 100 that is transported from the supply tray 2 to the trays 42 and 52.

此種第1零件保持機構711包括:軸712,其支持於第1支持部71上並且可相對於第1支持部71於±Z方向上往返移動;吸附嘴(第1零件保持部)713,其設置於軸712之前端部(下端部);及驅動機構714,其經由軸712使吸附嘴713相對於第1支持部71沿±Z方向移動。此種構成之第1零件保持機構711藉由驅動機構714經由軸712使吸附嘴713下降,藉由吸附嘴713而吸附IC元件100,由此保持IC元件100。以此方式,藉由吸附而保持IC元件100,由此可抑制對IC元件100施加之應力,而防止IC元件100之破損。又,可以簡單之構成且確實地保持IC元件100。再者,上述「保持」係指以IC元件100不會落下之程度持續吸附IC100。 The first component holding mechanism 711 includes a shaft 712 that is supported by the first support portion 71 and reciprocally movable in the ±Z direction with respect to the first support portion 71. The suction nozzle (first component holding portion) 713, It is provided at the front end (lower end) of the shaft 712, and a drive mechanism 714 that moves the suction nozzle 713 in the ±Z direction with respect to the first support portion 71 via the shaft 712. The first component holding mechanism 711 having such a configuration lowers the suction nozzle 713 via the shaft 712 by the drive mechanism 714, and sucks the IC component 100 by the suction nozzle 713, thereby holding the IC component 100. In this way, the IC element 100 is held by adsorption, whereby the stress applied to the IC element 100 can be suppressed, and the IC element 100 can be prevented from being damaged. Moreover, the IC device 100 can be simply configured and surely held. In addition, the above-mentioned "holding" means that the IC 100 is continuously adsorbed so that the IC element 100 does not fall.

作為驅動機構714之構成,只要可使軸712相對於第1支持部71於 Z方向上往返移動,便不特別限定,於本實施形態中,其包括一對滑輪(引導輪)714a、714b、架設於一對滑輪714a、714b之間之皮帶(環形驅動索)714c、及使滑輪714a旋轉之馬達(驅動源)714d。 As the configuration of the drive mechanism 714, the shaft 712 can be made relative to the first support portion 71. The present invention is not particularly limited, and includes a pair of pulleys (guide wheels) 714a and 714b, a belt (ring drive cable) 714c spanned between the pair of pulleys 714a and 714b, and A motor (drive source) 714d that rotates the pulley 714a.

滑輪714a、714b可經由未圖示之軸旋轉地支持於第1支持部71之一主面上。又,滑輪714a、714b係於Z方向上相隔而設置。因此,皮帶714c具有沿Z軸方向延伸之區域,且於該區域內經由固定部714e固定有軸712。若藉由馬達714d使滑輪714a旋轉,則滑輪714b與皮帶714c隨之旋轉,固定於皮帶714c上之軸712(吸附嘴713)相對於第1支持部71沿Z軸方向移動。藉由選擇馬達714d之旋轉方向,可使吸附嘴713相對於第1支持部71上升、或下降。 The pulleys 714a and 714b are rotatably supported by one main surface of the first support portion 71 via a shaft (not shown). Further, the pulleys 714a and 714b are provided apart from each other in the Z direction. Therefore, the belt 714c has a region extending in the Z-axis direction, and the shaft 712 is fixed in the region via the fixing portion 714e. When the pulley 714a is rotated by the motor 714d, the pulley 714b and the belt 714c rotate accordingly, and the shaft 712 (the suction nozzle 713) fixed to the belt 714c moves in the Z-axis direction with respect to the first support portion 71. By selecting the rotation direction of the motor 714d, the suction nozzle 713 can be raised or lowered with respect to the first support portion 71.

再者,只要可實現如上所述之驅動,則對於引導輪、環形驅動索及驅動源之構成不特別限定。例如,亦可使用鏈輪取代滑輪714a、714b作為一對引導輪、使用鏈條取代皮帶714c作為環形驅動索。又,亦可使用壓電致動器取代馬達714d作為驅動源。 Further, the configuration of the guide wheel, the ring drive cable, and the drive source is not particularly limited as long as the drive as described above can be realized. For example, a sprocket may be used instead of the pulleys 714a, 714b as a pair of guide wheels, and a chain instead of the belt 714c may be used as the endless drive cable. Further, a piezoelectric actuator may be used instead of the motor 714d as a drive source.

又,於第1支持部71上,設置有可相對於第1支持部71於Y方向上往返移動之第1移動部715。於第1支持部71上,設置有沿Y方向延伸之軌道(引導部),且第1移動部715可沿該軌道移動。再者,只要可沿Y方向引導第1移動部715,則亦可以沿Y方向延伸之溝槽或長孔取代上述軌道。 Further, the first support portion 71 is provided with a first moving portion 715 that can reciprocate in the Y direction with respect to the first support portion 71. A rail (guide portion) extending in the Y direction is provided in the first support portion 71, and the first moving portion 715 is movable along the rail. Further, as long as the first moving portion 715 can be guided in the Y direction, the track or the elongated hole extending in the Y direction may be substituted for the track.

又,於第1支持部71上,設置有第2零件保持機構716。第2零件保持機構716與第1零件保持機構711同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 Further, a second component holding mechanism 716 is provided on the first support portion 71. Similarly to the first component holding mechanism 711, the second component holding mechanism 716 has a function of holding the IC 100 that is transported from the supply tray 2 to the trays 42 and 52.

此種第2零件保持機構716包括:軸717,其支持於第1移動部715上並且可相對於第1移動部715於Z方向上往返移動;吸附嘴(第2零件保持部)718,其設置於軸717之前端部;及驅動機構719,其經由軸717使吸附嘴718相對於第1移動部715沿Z方向移動。此種構成之第2零 件保持機構716藉由驅動機構719經由軸717使吸附嘴718下降,藉由吸附嘴718而吸附IC元件100,由此保持IC元件100。 The second component holding mechanism 716 includes a shaft 717 that is supported by the first moving portion 715 and reciprocally movable in the Z direction with respect to the first moving portion 715, and a suction nozzle (second component holding portion) 718. The end portion is provided at a front end of the shaft 717; and the drive mechanism 719 moves the suction nozzle 718 in the Z direction with respect to the first moving portion 715 via the shaft 717. The second zero of this composition The member holding mechanism 716 lowers the suction nozzle 718 via the shaft 717 by the drive mechanism 719, and sucks the IC element 100 by the suction nozzle 718, thereby holding the IC element 100.

作為驅動機構719之構成,只要可使軸717於±Z方向上往返移動即可,無特別限定,但於本實施形態中,其形成為與上述之驅動機構714相同之構成。即,驅動機構719包括一對滑輪719a、719b、架設於一對滑輪719a、719b之間之皮帶719c、及使滑輪719a旋轉之馬達719d。 The configuration of the drive mechanism 719 is not particularly limited as long as the shaft 717 can be reciprocated in the ±Z direction. However, in the present embodiment, the configuration is the same as that of the above-described drive mechanism 714. That is, the drive mechanism 719 includes a pair of pulleys 719a and 719b, a belt 719c spanned between the pair of pulleys 719a and 719b, and a motor 719d that rotates the pulley 719a.

滑輪719a、719b可經由未圖示之軸旋轉地支持於第1支持部71之一主面上。又,滑輪719a、719b係於Z方向上相隔而設置。因此,皮帶719c具有沿Z軸方向延伸之區域,且於該區域內經由固定部719e固定有軸717。若藉由馬達719d使滑輪719a旋轉,則滑輪719b與皮帶719c隨之旋轉,使得固定於皮帶719c上之軸717(吸附嘴718)相對於第1支持部71沿Z軸方向移動。藉由選擇馬達719d之旋轉方向,可使吸附嘴718相對於第1支持部71上升或下降。 The pulleys 719a and 719b are rotatably supported by one of the main surfaces of the first support portion 71 via a shaft (not shown). Further, the pulleys 719a and 719b are provided apart from each other in the Z direction. Therefore, the belt 719c has a region extending in the Z-axis direction, and a shaft 717 is fixed in the region via the fixing portion 719e. When the pulley 719a is rotated by the motor 719d, the pulley 719b and the belt 719c rotate together, so that the shaft 717 (the suction nozzle 718) fixed to the belt 719c moves in the Z-axis direction with respect to the first support portion 71. The suction nozzle 718 can be raised or lowered with respect to the first support portion 71 by selecting the rotation direction of the motor 719d.

再者,固定部719e於Y方向上伸縮自如,與第1移動部715相對於第1支持部71之Y方向之移動一併伸長或收縮。因此,不會阻礙第1移動部715相對於第1支持部71之Y方向之移動。又,構成驅動機構719之各部(一對滑輪719a、719b、皮帶719c、馬達719d)亦可設置於第1移動部715上。若為此種構成,則無需將固定部719e設為伸縮自如之構成。 Further, the fixing portion 719e is expandable and contractible in the Y direction, and is extended or contracted together with the movement of the first moving portion 715 with respect to the Y direction of the first support portion 71. Therefore, the movement of the first moving portion 715 with respect to the Y direction of the first support portion 71 is not hindered. Further, each of the components (the pair of pulleys 719a and 719b, the belt 719c, and the motor 719d) constituting the drive mechanism 719 may be provided on the first moving portion 715. According to this configuration, it is not necessary to configure the fixing portion 719e to be expandable and contractible.

8-2.第2支持部 8-2. 2nd Support Department

如圖5所示,於第2支持部72上設置有第3零件保持機構721。第3零件保持機構721與上述第1零件保持機構711同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 As shown in FIG. 5, the third component holding mechanism 721 is provided on the second support portion 72. Similarly to the first component holding mechanism 711, the third component holding mechanism 721 has a function of holding the IC 100 that is transported from the supply tray 2 to the trays 42 and 52.

此種第3零件保持機構721之構成與上述第1零件保持機構711相同。即,第3零件保持機構721包括:軸722,其支持於第2支持部72上 並且可相對於第2支持部72於Z方向上往返移動;吸附嘴(第3零件保持部)723,其設置於軸722之前端部;及驅動機構724,其經由軸722使吸附嘴723相對於第2支持部72沿±Z方向移動。此種構成之第3零件保持機構721藉由驅動機構724經由軸722使吸附嘴723下降,藉由吸附嘴723而吸附IC元件100,由此保持IC元件100。 The configuration of the third component holding mechanism 721 is the same as that of the first component holding mechanism 711 described above. That is, the third part holding mechanism 721 includes a shaft 722 that is supported by the second support portion 72. And moving back and forth in the Z direction with respect to the second support portion 72; a suction nozzle (third component holding portion) 723 provided at a front end portion of the shaft 722; and a drive mechanism 724 for opposing the suction nozzle 723 via the shaft 722 The second support unit 72 moves in the ±Z direction. The third component holding mechanism 721 having such a configuration lowers the suction nozzle 723 via the shaft 722 by the drive mechanism 724, and sucks the IC component 100 by the suction nozzle 723, thereby holding the IC component 100.

又,驅動機構724包括一對滑輪724a、724b、架設於一對滑輪724a、724b之間之皮帶724c、及使滑輪724a旋轉之馬達724d。滑輪724a、724b經由未圖示之軸可旋轉地支持於第2支持部72之一主面上。又,滑輪724a、724b係於Z方向上相隔而設置。因此,皮帶724c具有沿Z軸方向延伸之區域,且於該區域內經由固定部724e固定有軸722。若藉由馬達724d使滑輪724a旋轉,則固定於皮帶724c上之軸722(吸附嘴723)相對於第2支持部72沿Z軸方向移動。 Further, the drive mechanism 724 includes a pair of pulleys 724a and 724b, a belt 724c spanned between the pair of pulleys 724a and 724b, and a motor 724d for rotating the pulley 724a. The pulleys 724a and 724b are rotatably supported by one of the main surfaces of the second support portion 72 via a shaft (not shown). Further, the pulleys 724a and 724b are provided apart from each other in the Z direction. Therefore, the belt 724c has a region extending in the Z-axis direction, and the shaft 722 is fixed in the region via the fixing portion 724e. When the pulley 724a is rotated by the motor 724d, the shaft 722 (the suction nozzle 723) fixed to the belt 724c moves in the Z-axis direction with respect to the second support portion 72.

又,於第2支持部72上,設置有可相對於第2支持部72於Y方向上往返移動之第2移動部725。於第2支持部72上,設置有沿Y方向延伸之軌道,第2移動部725係可沿該軌道移動地設置。藉由此種構成,可簡單且確實地限制第2移動部725之Y方向以外之移動。 Further, the second support portion 72 is provided with a second moving portion 725 that can reciprocate in the Y direction with respect to the second support portion 72. The second support portion 72 is provided with a rail extending in the Y direction, and the second moving portion 725 is movable along the rail. With such a configuration, the movement of the second moving portion 725 other than the Y direction can be easily and surely restricted.

又,於第2支持部72上,設置有第4零件保持機構726。第4零件保持機構726與上述第2零件保持機構716同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 Further, a fourth component holding mechanism 726 is provided on the second support portion 72. Similarly to the second component holding mechanism 716 described above, the fourth component holding mechanism 726 has a function of holding the IC 100 that is transported from the supply tray 2 to the trays 42 and 52.

此種第4零件保持機構726之構成與上述第2零件保持機構716相同。即,第4零件保持機構726包括:軸727,其支持於第2移動部725上並且可相對於第2移動部725於±Z方向上往返移動;吸附嘴(第4零件保持部)728,其設置於軸727之前端部;及驅動機構729,其經由軸727使吸附嘴728相對於第2移動部725沿Z方向移動。此種構成之第4零件保持機構726藉由驅動機構729經由軸727使吸附嘴728下降,藉由吸附嘴728而吸附IC元件100,由此保持IC元件100。 The configuration of the fourth component holding mechanism 726 is the same as that of the second component holding mechanism 716 described above. That is, the fourth component holding mechanism 726 includes a shaft 727 that is supported by the second moving portion 725 and reciprocally movable in the ±Z direction with respect to the second moving portion 725; the suction nozzle (fourth component holding portion) 728, It is disposed at a front end of the shaft 727; and a drive mechanism 729 that moves the suction nozzle 728 in the Z direction with respect to the second moving portion 725 via the shaft 727. The fourth component holding mechanism 726 having such a configuration lowers the suction nozzle 728 via the shaft 727 by the drive mechanism 729, and sucks the IC component 100 by the suction nozzle 728, thereby holding the IC component 100.

又,驅動機構729包括一對滑輪729a、729b、架設於一對滑輪729a、729b之間之皮帶729c、及使滑輪729a旋轉之馬達729d。滑輪729a、729b可經由未圖示之軸旋轉地支持於第2支持部72之一主面上。又,滑輪729a、729b係於Z方向上相隔而設置。因此,皮帶729c具有沿Z軸方向延伸之區域,且於該區域內經由固定部729e固定有軸727。若藉由馬達729d使滑輪729a旋轉,則固定於皮帶729c上之軸727(吸附嘴728)相對於第2支持部72沿Z軸方向移動。 Further, the drive mechanism 729 includes a pair of pulleys 729a and 729b, a belt 729c spanned between the pair of pulleys 729a and 729b, and a motor 729d for rotating the pulley 729a. The pulleys 729a and 729b are rotatably supported by one main surface of the second support portion 72 via a shaft (not shown). Further, the pulleys 729a and 729b are provided apart from each other in the Z direction. Therefore, the belt 729c has a region extending in the Z-axis direction, and the shaft 727 is fixed in the region via the fixing portion 729e. When the pulley 729a is rotated by the motor 729d, the shaft 727 (the suction nozzle 728) fixed to the belt 729c moves in the Z-axis direction with respect to the second support portion 72.

再者,固定部729e於Y方向上伸縮自如,與第2移動部725相對於第2支持部72之Y方向之移動一併伸長或收縮。因此,不會阻礙第2移動部725相對於第2支持部72之Y方向之移動。 Further, the fixing portion 729e is expandable and contractible in the Y direction, and is extended or contracted together with the movement of the second moving portion 725 with respect to the Y direction of the second support portion 72. Therefore, the movement of the second moving portion 725 with respect to the Y direction of the second support portion 72 is not hindered.

8-3.第3支持部 8-3. Third Support Department

如圖6所示,於第3支持部73上設置有第5零件保持機構731。第5零件保持機構731與上述第1零件保持機構711同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 As shown in FIG. 6, the fifth component holding mechanism 731 is provided in the third support portion 73. Similarly to the first component holding mechanism 711, the fifth component holding mechanism 731 has a function of holding the IC 100 that is transported from the supply tray 2 to the trays 42 and 52.

此種第5零件保持機構731之構成與上述第1零件保持機構711相同。即,第5零件保持機構731包括:軸732,其支持於第3支持部73上並且可相對於第3支持部73於Z方向上往返移動;吸附嘴(第5零件保持部)733,其設置於軸732之前端部;及驅動機構734,其經由軸732使吸附嘴733相對於第3支持部73沿Z方向移動。此種構成之第5零件保持機構731藉由驅動機構734經由軸732使吸附嘴733下降,藉由吸附嘴733而吸附IC元件100,由此保持IC元件100。 The configuration of the fifth component holding mechanism 731 is the same as that of the first component holding mechanism 711 described above. In other words, the fifth component holding mechanism 731 includes a shaft 732 that is supported by the third support portion 73 and reciprocally movable in the Z direction with respect to the third support portion 73, and a suction nozzle (the fifth component holding portion) 733. The front end portion of the shaft 732 is disposed; and the drive mechanism 734 moves the suction nozzle 733 in the Z direction with respect to the third support portion 73 via the shaft 732. The fifth component holding mechanism 731 having such a configuration lowers the suction nozzle 733 via the shaft 732 by the drive mechanism 734, and sucks the IC component 100 by the suction nozzle 733, thereby holding the IC component 100.

又,驅動機構734包括一對滑輪734a、734b、架設於一對滑輪734a、734b之間之皮帶734c、及使滑輪734a旋轉之馬達734d。滑輪734a、734b可經由未圖示之軸旋轉地支持於第3支持部73之一主面上。又,滑輪734a、734b係於Z方向上相隔而設置。因此,皮帶734c具有沿Z軸方向延伸之區域,且於該區域內經由固定部734e固定有軸 732。若藉由馬達734d使滑輪734a旋轉,則固定於皮帶734c上之軸732(吸附嘴733)相對於第3支持部73沿Z軸方向移動。 Further, the drive mechanism 734 includes a pair of pulleys 734a and 734b, a belt 734c spanned between the pair of pulleys 734a and 734b, and a motor 734d for rotating the pulley 734a. The pulleys 734a and 734b are rotatably supported by one of the main surfaces of the third support portion 73 via a shaft (not shown). Further, the pulleys 734a and 734b are provided apart from each other in the Z direction. Therefore, the belt 734c has a region extending in the Z-axis direction, and the shaft is fixed in the region via the fixing portion 734e. 732. When the pulley 734a is rotated by the motor 734d, the shaft 732 (the suction nozzle 733) fixed to the belt 734c moves in the Z-axis direction with respect to the third support portion 73.

又,於第3支持部73上,設置有可相對於第3支持部73於Y方向上往返移動之第3移動部735。於第3支持部73上,設置有沿Y方向延伸之軌道,第3移動部735係可沿該軌道移動地設置。藉由形成為此種構成,可簡單且確實地限制第3移動部735之Y方向以外之移動。 Further, the third support portion 73 is provided with a third moving portion 735 that is reciprocally movable in the Y direction with respect to the third support portion 73. The third support portion 73 is provided with a rail extending in the Y direction, and the third moving portion 735 is movable along the rail. With such a configuration, the movement of the third moving portion 735 other than the Y direction can be easily and surely restricted.

又,於第3支持部73上,設置有第6零件保持機構736。第6零件保持機構736與上述第2零件保持機構716同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 Further, a sixth component holding mechanism 736 is provided on the third support portion 73. Similarly to the second component holding mechanism 716 described above, the sixth component holding mechanism 736 has a function of holding the IC 100 that is transported from the supply tray 2 to the trays 42 and 52.

此種第6零件保持機構736之構成與上述第2零件保持機構716相同。即,第6零件保持機構736包括:軸737,其支持於第3移動部735上並且可相對於第3移動部735於Z方向上往返移動;吸附嘴(第6零件保持部)738,其設置於軸737之前端部;及驅動機構739,其經由軸737使吸附嘴738相對於第3移動部735沿Z方向移動。此種構成之第6零件保持機構736藉由驅動機構739經由軸737使吸附嘴738下降,藉由吸附嘴738而吸附IC元件100,由此保持IC元件100。 The configuration of the sixth component holding mechanism 736 is the same as that of the second component holding mechanism 716 described above. That is, the sixth component holding mechanism 736 includes a shaft 737 that is supported by the third moving portion 735 and reciprocally movable in the Z direction with respect to the third moving portion 735, and a suction nozzle (sixth component holding portion) 738. A front end portion of the shaft 737 is disposed; and a drive mechanism 739 moves the suction nozzle 738 in the Z direction with respect to the third moving portion 735 via the shaft 737. The sixth component holding mechanism 736 having such a configuration lowers the suction nozzle 738 via the shaft 737 by the drive mechanism 739, and sucks the IC component 100 by the suction nozzle 738, thereby holding the IC component 100.

又,驅動機構739包括一對滑輪739a、739b、架設於一對滑輪739a、739b之間之皮帶739c、及使滑輪739a旋轉之馬達739d。滑輪739a、739b可經由未圖示之軸旋轉地支持於第3支持部73之一主面上。又,滑輪739a、739b係於Z方向上相隔而設置。因此,皮帶739c具有沿Z軸方向延伸之區域,且於該區域內經由固定部739e固定有軸737。若藉由馬達739d使滑輪739a旋轉,則固定於皮帶739c上之軸737(吸附嘴738)相對於第3支持部73沿Z軸方向移動。 Further, the drive mechanism 739 includes a pair of pulleys 739a and 739b, a belt 739c spanned between the pair of pulleys 739a and 739b, and a motor 739d for rotating the pulley 739a. The pulleys 739a and 739b are rotatably supported by one main surface of the third support portion 73 via a shaft (not shown). Further, the pulleys 739a and 739b are provided apart from each other in the Z direction. Therefore, the belt 739c has a region extending in the Z-axis direction, and the shaft 737 is fixed in the region via the fixing portion 739e. When the pulley 739a is rotated by the motor 739d, the shaft 737 (the suction nozzle 738) fixed to the belt 739c moves in the Z-axis direction with respect to the third support portion 73.

再者,固定部739e於Y方向上伸縮自如,與第3移動部735相對於第3支持部73之Y方向之移動一併伸長或收縮。因此,不會阻礙第3移動部735相對於第3支持部73之Y方向之移動。 Further, the fixing portion 739e is expandable and contractible in the Y direction, and is extended or contracted together with the movement of the third moving portion 735 with respect to the Y direction of the third support portion 73. Therefore, the movement of the third moving portion 735 with respect to the Y direction of the third support portion 73 is not hindered.

8-4.第4支持部 8-4. 4th Support Department

如圖7所示,於第4支持部74上設置有第7零件保持機構741。第7零件保持機構741與上述第1零件保持機構711同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 As shown in FIG. 7, the seventh component holding mechanism 741 is provided on the fourth support portion 74. Similarly to the first component holding mechanism 711 described above, the seventh component holding mechanism 741 has a function of holding the IC 100 that is transported from the supply tray 2 to the trays 42 and 52.

此種第7零件保持機構741之構成與上述第1零件保持機構711相同。即,第7零件保持機構741包括:軸742,其支持於第4支持部74上並且可相對於第4支持部74於Z方向上往返移動;吸附嘴(第7零件保持部)743,其設置於軸742之前端部;及驅動機構744,其經由軸742使吸附嘴743相對於第4支持部74沿Z方向移動。此種構成之第7零件保持機構741藉由驅動機構744經由軸742使吸附嘴743下降,藉由吸附嘴743而吸附IC元件100,由此保持IC元件100。 The configuration of the seventh component holding mechanism 741 is the same as that of the first component holding mechanism 711 described above. That is, the seventh component holding mechanism 741 includes a shaft 742 that is supported by the fourth support portion 74 and reciprocally movable in the Z direction with respect to the fourth support portion 74, and a suction nozzle (seventh component holding portion) 743. The front end portion of the shaft 742 is disposed; and the driving mechanism 744 moves the suction nozzle 743 in the Z direction with respect to the fourth support portion 74 via the shaft 742. The seventh component holding mechanism 741 having such a configuration lowers the suction nozzle 743 via the shaft 742 by the drive mechanism 744, and sucks the IC component 100 by the suction nozzle 743, thereby holding the IC component 100.

又,驅動機構744包括一對滑輪744a、744b、架設於一對滑輪744a、744b之間之皮帶744c、及使滑輪744a旋轉之馬達744d。滑輪744a、744b可經由未圖示之軸旋轉地支持於第4支持部74之一主面上。又,滑輪744a、744b係於Z方向上相隔而設置。因此,皮帶744c具有沿Z軸方向延伸之區域,且於該區域內經由固定部744e固定有軸742。若藉由馬達744d使滑輪744a旋轉,則固定於皮帶744c上之軸742(吸附嘴743)相對於第3支持部73沿Z軸方向移動。 Further, the drive mechanism 744 includes a pair of pulleys 744a and 744b, a belt 744c that is stretched between the pair of pulleys 744a and 744b, and a motor 744d that rotates the pulley 744a. The pulleys 744a and 744b are rotatably supported by one of the main surfaces of the fourth support portion 74 via a shaft (not shown). Further, the pulleys 744a and 744b are provided apart from each other in the Z direction. Therefore, the belt 744c has a region extending in the Z-axis direction, and the shaft 742 is fixed in the region via the fixing portion 744e. When the pulley 744a is rotated by the motor 744d, the shaft 742 (the suction nozzle 743) fixed to the belt 744c moves in the Z-axis direction with respect to the third support portion 73.

又,於第4支持部74上,設置有可相對於第4支持部74於Y方向上往返移動之第4移動部745。於第4支持部74上,設置有沿Y方向延伸之軌道,第4移動部745係可沿該軌道移動地設置。藉由形成為此種構成,可簡單且確實地限制第4移動部745之Y方向以外之移動。 Further, the fourth support portion 74 is provided with a fourth moving portion 745 that is reciprocally movable in the Y direction with respect to the fourth support portion 74. The fourth support portion 74 is provided with a rail extending in the Y direction, and the fourth moving portion 745 is movable along the rail. With such a configuration, the movement of the fourth moving portion 745 other than the Y direction can be easily and surely restricted.

又,於第4支持部74上,設置有第8零件保持機構746。第8零件保持機構746與上述第2零件保持機構716同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 Further, an eighth component holding mechanism 746 is provided on the fourth support portion 74. Similarly to the second component holding mechanism 716 described above, the eighth component holding mechanism 746 has a function of holding the IC 100 that is transported from the supply tray 2 to the trays 42 and 52.

此種第8零件保持機構746之構成與上述第2零件保持機構716相 同。即,第8零件保持機構746包括:軸747,其支持於第4移動部745上並且可相對於第4移動部745於Z方向上往返移動;吸附嘴(第8零件保持部)748,其設置於軸747之前端部;及驅動機構749,其經由軸747使吸附嘴748相對於第4移動部745沿Z方向移動。此種構成之第8零件保持機構746藉由驅動機構749經由軸747使吸附嘴748下降,藉由吸附嘴748而吸附IC元件100,由此保持IC元件100。 The configuration of the eighth component holding mechanism 746 is the same as that of the second component holding mechanism 716 described above. with. That is, the eighth component holding mechanism 746 includes a shaft 747 that is supported by the fourth moving portion 745 and reciprocally movable in the Z direction with respect to the fourth moving portion 745, and a suction nozzle (eighth part holding portion) 748. The front end of the shaft 747 is disposed; and the driving mechanism 749 moves the suction nozzle 748 in the Z direction with respect to the fourth moving portion 745 via the shaft 747. The eighth component holding mechanism 746 having such a configuration lowers the suction nozzle 748 via the shaft 747 by the drive mechanism 749, and sucks the IC component 100 by the suction nozzle 748, thereby holding the IC component 100.

又,驅動機構739包括一對滑輪749a、749b、架設於一對滑輪749a、749b之間之皮帶749c、及使滑輪749a旋轉之馬達749d。滑輪749a、749b可經由未圖示之軸旋轉地支持於第4支持部74之一主面上。又,滑輪749a、749b係於Z方向上相隔而設置。因此,皮帶749c具有沿Z軸方向延伸之區域,且於該區域內經由固定部749e固定有軸747。若藉由馬達749d使滑輪749a旋轉,則固定於皮帶749c上之軸747(吸附嘴748)相對於第4支持部74沿Z軸方向移動。 Further, the drive mechanism 739 includes a pair of pulleys 749a and 749b, a belt 749c spanned between the pair of pulleys 749a and 749b, and a motor 749d for rotating the pulley 749a. The pulleys 749a and 749b are rotatably supported by one of the main surfaces of the fourth support portion 74 via a shaft (not shown). Further, the pulleys 749a and 749b are provided apart from each other in the Z direction. Therefore, the belt 749c has a region extending in the Z-axis direction, and the shaft 747 is fixed in the region via the fixing portion 749e. When the pulley 749a is rotated by the motor 749d, the shaft 747 (the suction nozzle 748) fixed to the belt 749c moves in the Z-axis direction with respect to the fourth support portion 74.

再者,固定部749e於Y方向上伸縮自如,與第4移動部745相對於第4支持部74之Y方向之移動一併伸長或收縮。因此,不會阻礙第4移動部745相對於第4支持部74之Y方向之移動。 Further, the fixing portion 749e is expandable and contractible in the Y direction, and is extended or contracted together with the movement of the fourth moving portion 745 with respect to the Y direction of the fourth support portion 74. Therefore, the movement of the fourth moving portion 745 with respect to the Y direction of the fourth support portion 74 is not hindered.

以上,對各支持部71、72、73、74之構成詳細地進行了說明。 The configuration of each of the support units 71, 72, 73, and 74 has been described in detail above.

此處,吸附嘴733、723、713、743係依序沿X方向排列而設置,且係以相等之間距配置。即,吸附嘴733與吸附嘴723之相隔距離、吸附嘴723與吸附嘴713之相隔距離、吸附嘴713與吸附嘴743之相隔距離彼此大致相等。 Here, the adsorption nozzles 733, 723, 713, and 743 are sequentially arranged in the X direction, and are disposed at equal intervals. That is, the distance between the adsorption nozzle 733 and the adsorption nozzle 723, the distance between the adsorption nozzle 723 and the adsorption nozzle 713, and the distance between the adsorption nozzle 713 and the adsorption nozzle 743 are substantially equal to each other.

又,吸附嘴718係相對於吸附嘴713沿Y方向排列而設置,同樣地,吸附嘴728係相對於吸附嘴723沿Y方向排列而設置,吸附嘴738係相對於吸附嘴733沿Y方向排列而設置,吸附嘴748係相對於吸附嘴743沿Y方向排列而設置。又,吸附嘴718、713之相隔距離、吸附嘴728、723之相隔距離、吸附嘴738、733之相隔距離、吸附嘴748、743 之相隔距離彼此大致相等。即,吸附嘴738、728、718、748亦係依序沿X方向排列而設置,且係以相等之間距配置。 Further, the adsorption nozzles 718 are arranged in the Y direction with respect to the adsorption nozzles 713. Similarly, the adsorption nozzles 728 are arranged in the Y direction with respect to the adsorption nozzles 723, and the adsorption nozzles 738 are arranged in the Y direction with respect to the adsorption nozzles 733. Further, it is provided that the adsorption nozzles 748 are arranged in the Y direction with respect to the adsorption nozzles 743. Moreover, the distance between the adsorption nozzles 718 and 713, the distance between the adsorption nozzles 728 and 723, the distance between the adsorption nozzles 738 and 733, and the adsorption nozzles 748 and 743 The distances are substantially equal to each other. That is, the suction nozzles 738, 728, 718, and 748 are also arranged in the X direction in order, and are disposed at equal intervals.

手單元7c進而包括:X方向移動機構(第2移動機構)76,其使第2、第3、第4支持部72、73、74相對於基部75(第1支持部71)沿X方向移動;及Y方向移動機構(第1移動機構)77,其使各移動部715、725、735、745相對於基部75向Y方向移動。 The hand unit 7c further includes an X-direction moving mechanism (second moving mechanism) 76 that moves the second, third, and fourth support portions 72, 73, and 74 in the X direction with respect to the base portion 75 (first support portion 71). And a Y-direction moving mechanism (first moving mechanism) 77 that moves each of the moving portions 715, 725, 735, and 745 in the Y direction with respect to the base portion 75.

8-5.X方向移動機構 8-5. X direction moving mechanism

X方向移動機構76係以可一面藉由使第2、第3、第4支持部72、73、74相對於第1支持部71沿X方向移動,而將吸附嘴733(738)與吸附嘴723(728)之相隔距離、吸附嘴723(728)與吸附嘴713(718)之相隔距離、及吸附嘴713(718)與吸附嘴743(748)之相隔距離維持為彼此相等,一面變更該等相隔距離之方式構成。 The X-direction moving mechanism 76 can move the nozzle 733 (738) and the suction nozzle by moving the second, third, and fourth support portions 72, 73, and 74 in the X direction with respect to the first support portion 71. The distance between 723 (728), the distance between the nozzle 723 (728) and the nozzle 713 (718), and the distance between the nozzle 713 (718) and the nozzle 743 (748) are kept equal to each other. It is composed of equal distances.

如圖8所示,X方向移動機構76包括一對二段滑輪(第2移動機構用第1引導輪、第2移動機構用第2引導輪)761、762、架設於一對二段滑輪761、762之間之2根皮帶(第2移動機構用第1環形驅動索、第2移動機構用第2環形驅動索)763、764、及使二段滑輪761旋轉之馬達(第2移動機構用驅動源)765。該等之中,二段滑輪761、762及馬達765分別支持於第1基底751上。 As shown in FIG. 8, the X-direction moving mechanism 76 includes a pair of two-stage pulleys (a second guide wheel for a second moving mechanism, a second guide wheel for a second moving mechanism) 761 and 762, and a pair of two-segment pulleys 761. Two belts between 762 (the first ring-shaped driving cable for the second moving mechanism, the second ring-shaped driving cable for the second moving mechanism) 763 and 764, and the motor for rotating the two-stage pulley 761 (for the second moving mechanism) Drive source) 765. Among these, the two-stage pulleys 761 and 762 and the motor 765 are respectively supported by the first base 751.

二段滑輪761、762可於第1基底751之上表面繞沿Y方向延伸之軸旋轉。又,二段滑輪761、762係於X方向上相隔而設置。 The two-stage pulleys 761 and 762 are rotatable about an upper surface of the first base 751 about an axis extending in the Y direction. Further, the two-stage pulleys 761 and 762 are provided apart from each other in the X direction.

二段滑輪761包括:小徑滑輪761a,其外徑較小;及大徑滑輪761b,其具有小徑滑輪761a之大致2倍之外徑;該等係沿Y方向排列且形成為同心。同樣地,二段滑輪762包括:小徑滑輪762a,其外徑較小;及大徑滑輪762b,其具有小徑滑輪762a之大致2倍之外徑;該等係沿Y方向排列且形成為同心。再者,小徑滑輪761a、762a之外徑彼此相等,大徑滑輪761b、762b之外形亦彼此相等。 The two-stage pulley 761 includes a small-diameter pulley 761a having a small outer diameter, and a large-diameter pulley 761b having an outer diameter substantially twice that of the small-diameter pulley 761a; the lines are arranged in the Y direction and are formed concentrically. Similarly, the two-stage pulley 762 includes: a small-diameter pulley 762a having a small outer diameter; and a large-diameter pulley 762b having an outer diameter substantially twice that of the small-diameter pulley 762a; the lines are arranged in the Y direction and formed as concentric. Further, the outer diameters of the small diameter pulleys 761a and 762a are equal to each other, and the outer diameter pulleys 761b and 762b are also equal in shape.

於小徑滑輪761a、762a之間,架設有皮帶763。皮帶763於小徑滑輪761a、762a之間,具有沿X方向延伸之2個區域763a、763b。而且,於一區域763a內,固定有第2支持部72,於另一區域763b內,固定有第4支持部74。若二段滑輪761旋轉,則於區域763a內皮帶763向X方向一方側進給,於區域763b內皮帶763向X方向另一側進給,故而第2、第4支持部72、74相互向X方向相反側且以大致相等之距離移動。 A belt 763 is placed between the small diameter pulleys 761a and 762a. The belt 763 is between the small diameter pulleys 761a and 762a and has two regions 763a and 763b extending in the X direction. Further, in the one region 763a, the second support portion 72 is fixed, and in the other region 763b, the fourth support portion 74 is fixed. When the two-stage pulley 761 rotates, the belt 763 is fed to one side in the X direction in the region 763a, and the belt 763 is fed to the other side in the X direction in the region 763b. Therefore, the second and fourth support portions 72 and 74 are mutually oriented. The X direction is opposite to the side and moves at approximately equal distances.

另一方面,於大徑滑輪761b、762b之間,架設有皮帶764。皮帶764於大徑滑輪761b、762b之間,具有沿X方向延伸之2個區域764a、764b。該等2個區域764a、764b之中,於在二段滑輪761旋轉時向與皮帶763之區域763a相同之方向進給之區域764a內,固定有第3支持部73。若皮帶763旋轉,則於區域763a、764a內,皮帶763向X方向相同側進給,故而第2、第3支持部72、73相互向X方向相同側移動。再者,如上所述,大徑滑輪761b、762b具有小徑滑輪761a、762a之2倍之外徑,故而第3支持部73之移動距離成為第2支持部72之移動距離之大致2倍。 On the other hand, a belt 764 is placed between the large diameter pulleys 761b and 762b. The belt 764 is between the large diameter pulleys 761b and 762b and has two regions 764a and 764b extending in the X direction. Among the two regions 764a and 764b, the third support portion 73 is fixed to the region 764a that is fed in the same direction as the region 763a of the belt 763 when the two-stage pulley 761 rotates. When the belt 763 rotates, the belt 763 is fed to the same side in the X direction in the regions 763a and 764a, so that the second and third support portions 72 and 73 move toward the same side in the X direction. Further, as described above, the large diameter pulleys 761b and 762b have twice the outer diameter of the small diameter pulleys 761a and 762a. Therefore, the moving distance of the third support portion 73 is approximately twice the moving distance of the second support portion 72.

根據此種構成,若藉由馬達765使二段滑輪761旋轉,則第2、第4支持部72、74相互向X方向相反側移動大致相等之距離,並且第3支持部73向與第2支持部72相同之方向且以第2支持部72之2倍移動。從而,根據X方向移動機構76,如上所述,可一面將吸附嘴733(738)與吸附嘴723(728)之相隔距離、吸附嘴723(728)與吸附嘴713(718)之相隔距離、及吸附嘴713(718)與吸附嘴743(748)之相隔距離維持為彼此相等,一面使該等相隔距離變化。 According to this configuration, when the two-stage pulley 761 is rotated by the motor 765, the second and fourth support portions 72 and 74 move to substantially the same distance in the X direction, and the third support portion 73 is moved to the second position. The support portion 72 moves in the same direction and twice as much as the second support portion 72. Therefore, according to the X-direction moving mechanism 76, as described above, the distance between the suction nozzle 733 (738) and the suction nozzle 723 (728), the distance between the suction nozzle 723 (728) and the suction nozzle 713 (718), And the distance between the adsorption nozzle 713 (718) and the adsorption nozzle 743 (748) is maintained equal to each other, and the distances are changed.

藉由形成為如上所述之構成,可簡化X方向移動機構76之構成,亦可謀求隨之實現之小型化、輕量化。因此,有助於手單元7c之小型化、輕量化,而提昇手單元7c之操作性。又,藉由二段滑輪761之旋轉,可統一地控制第2、第3、第4支持部72、73、74之所有移動,故 而可更確實地發揮上述功能。 By forming the configuration as described above, the configuration of the X-direction moving mechanism 76 can be simplified, and the miniaturization and weight reduction can be achieved. Therefore, it contributes to downsizing and weight reduction of the hand unit 7c, and improves the operability of the hand unit 7c. Further, by the rotation of the two-stage pulley 761, all the movements of the second, third, and fourth support portions 72, 73, and 74 can be collectively controlled, so that And the above functions can be played more reliably.

再者,只要可實現如上所述之驅動,則對於引導輪、環形驅動索及驅動源之構成並無特別限定。例如,亦可使用鏈輪取代滑輪作為一對引導輪、使用鏈條(金屬鏈條、橡膠鏈條等)取代皮帶作為環形驅動索。又,亦可使用壓電致動器取代馬達作為驅動源。又,小徑滑輪761a(762a)與大徑滑輪761b(762b)亦可以分體形式形成,於該情形時,亦可分別地設置用以使小徑滑輪761a旋轉之馬達、及用以使大徑滑輪761b旋轉之馬達。 Further, the configuration of the guide wheel, the ring drive cable, and the drive source is not particularly limited as long as the drive as described above can be realized. For example, a sprocket may be used instead of a pulley as a pair of guide wheels, and a chain (metal chain, rubber chain, etc.) may be used instead of a belt as a ring drive cable. Further, a piezoelectric actuator may be used instead of the motor as a driving source. Further, the small-diameter pulley 761a (762a) and the large-diameter pulley 761b (762b) may be formed separately, and in this case, a motor for rotating the small-diameter pulley 761a may be separately provided, and The motor in which the diameter pulley 761b rotates.

8-6.Y方向移動機構 8-6. Y direction moving mechanism

Y方向移動機構77係以可一面藉由使第1、第2、第3、第4移動部715、725、735、745相對於第1、第2、第3、第4支持部71、72、73、74一體地(具體而言,同時且等距離地)沿Y方向移動,而將吸附嘴713、718之相隔距離、吸附嘴723、728之相隔距離、吸附嘴733、738之相隔距離、及吸附嘴743、748之相隔距離維持為彼此相等,一面變更該等相隔距離之方式構成。 The Y-direction moving mechanism 77 can move the first, second, third, and fourth moving portions 715, 725, 735, and 745 to the first, second, third, and fourth support portions 71 and 72, respectively. , 73, 74 integrally (specifically, simultaneously and equidistantly) move in the Y direction, and the distance between the adsorption nozzles 713, 718, the distance between the adsorption nozzles 723, 728, the distance between the adsorption nozzles 733, 738 And the distance between the suction nozzles 743 and 748 is maintained to be equal to each other, and the distance between the suction nozzles is changed.

如圖9及圖10所示,Y方向移動機構77包括:第1單元77a及馬達(第1移動機構用驅動源)777,其設置於基部75上;第2單元77b,其設置於第1支持部71上;傳遞軸(傳遞部)778及連結軸(連結部)779,其以將第1、第2單元77a、77b連結之方式設置。 As shown in FIGS. 9 and 10, the Y-direction moving mechanism 77 includes a first unit 77a and a motor (a driving source for the first moving mechanism) 777 which are provided on the base portion 75, and a second unit 77b which is provided in the first unit. The support portion 71 has a transmission shaft (transmission portion) 778 and a connection shaft (connection portion) 779 which are provided to connect the first and second units 77a and 77b.

第1單元77a包括一對滑輪(第1移動機構用第1引導輪、第1移動機構用第2引導輪)771、772、及架設於一對滑輪771、772之間之皮帶(第1移動機構用第1環形驅動索)773。滑輪771、772繞沿X方向延伸之軸旋轉自如地支持於第2基底752之一(圖中右側)主面上。又,滑輪771、772係於Y方向上相隔而設置。而且,於該等滑輪771、772之間架設有皮帶773。皮帶773於滑輪771、772之間具有沿Y方向延伸之2個區域773a、773b。 The first unit 77a includes a pair of pulleys (a first guide wheel for the first movement mechanism, a second guide wheel for the first movement mechanism) 771 and 772, and a belt that is stretched between the pair of pulleys 771 and 772 (the first movement) The mechanism uses a first ring drive cable 773. The pulleys 771 and 772 are rotatably supported on the main surface of one of the second bases 752 (on the right side in the drawing) around an axis extending in the X direction. Further, the pulleys 771 and 772 are provided apart from each other in the Y direction. Further, a belt 773 is placed between the pulleys 771 and 772. The belt 773 has two regions 773a, 773b extending in the Y direction between the pulleys 771, 772.

馬達777係用以使滑輪771旋轉之驅動源,設置於第2基底752之另一(圖中左側)主面上。 The motor 777 is a driving source for rotating the pulley 771, and is provided on the other main surface (left side in the drawing) of the second substrate 752.

第2單元77b包括一對滑輪(第1移動機構用第3引導輪、第1移動機構用第4引導輪)774、775、及架設於一對滑輪774、775之間之皮帶(第1移動機構用第2環形驅動索)776。滑輪774、775繞沿X方向延伸之軸旋轉自如地支持於第1支持部71之一(圖中右側)主面上。又,滑輪774、775係於Y方向上相隔而設置。而且,於該等滑輪774、775之間架設有皮帶776。皮帶776於滑輪774、775之間具有沿Y方向延伸之2個區域776a、776b。 The second unit 77b includes a pair of pulleys (a third guide wheel for the first moving mechanism, a fourth guide wheel for the first moving mechanism) 774 and 775, and a belt that is placed between the pair of pulleys 774 and 775 (the first movement) The mechanism uses a second ring drive cable 776. The pulleys 774 and 775 are rotatably supported on the main surface of one of the first support portions 71 (the right side in the drawing) around the axis extending in the X direction. Further, the pulleys 774 and 775 are provided apart from each other in the Y direction. Further, a belt 776 is placed between the pulleys 774, 775. The belt 776 has two regions 776a, 776b extending in the Y direction between the pulleys 774, 775.

如此,藉由將第2單元77b設置在相對於第2基底752之位置不變之第1支持部71上,可使Y方向移動機構77更穩定地驅動。 As described above, by providing the second unit 77b on the first support portion 71 that is constant with respect to the position of the second base 752, the Y-direction moving mechanism 77 can be driven more stably.

傳遞軸778係用以將馬達777之驅動力傳遞至第2單元77b之軸。此種傳遞軸778係沿X方向延伸而設置,將滑輪771、774之軸彼此連結。因此,馬達777之驅動力經由傳遞軸778被傳遞至第2單元77b,從而滑輪771、774一體地旋轉。 The transmission shaft 778 is for transmitting the driving force of the motor 777 to the shaft of the second unit 77b. Such a transmission shaft 778 is provided to extend in the X direction, and connects the shafts of the pulleys 771 and 774 to each other. Therefore, the driving force of the motor 777 is transmitted to the second unit 77b via the transmission shaft 778, so that the pulleys 771, 774 integrally rotate.

又,傳遞軸778係貫通位於第2基底752與第1支持部71之間之第2、第3支持部72、73而設置(參照圖5及圖6)。具體而言,傳遞軸778通過形成於第2、第3支持部72、73上之貫通孔內而將滑輪771、774連結。藉由將傳遞軸778設定為此種配置,可抑制傳遞軸778自支持部71~74之露出,從而可謀求手單元7c之小型化。又,傳遞軸778亦發揮作為第2、第3支持部72、73向X方向移動時之導引器之功能,故而可更確實且順利地進行第2、第3支持部72、73之移動。 Further, the transmission shaft 778 is provided to penetrate the second and third support portions 72 and 73 located between the second base 752 and the first support portion 71 (see FIGS. 5 and 6). Specifically, the transmission shaft 778 connects the pulleys 771 and 774 through the through holes formed in the second and third support portions 72 and 73. By setting the transmission shaft 778 to such an arrangement, it is possible to suppress the exposure of the transmission shaft 778 from the support portions 71 to 74, and it is possible to reduce the size of the hand unit 7c. Further, the transmission shaft 778 also functions as an introducer when the second and third support portions 72 and 73 move in the X direction, so that the movement of the second and third support portions 72 and 73 can be performed more reliably and smoothly. .

連結軸779形成為直線狀,且沿X方向延伸。又,連結軸779於其途中之2處,經由固定具固定有皮帶773之區域773a、及皮帶776之區域776a。若皮帶773、776旋轉,則於區域773a、776a內,皮帶773、776向Y方向相同側進給,故而隨之,連結軸779維持姿勢地直接向Y 方向移動。 The connecting shaft 779 is formed in a straight line and extends in the X direction. Further, the connecting shaft 779 is fixed at two places in the middle thereof, and a region 773a of the belt 773 and a region 776a of the belt 776 are fixed via a fixture. When the belts 773 and 776 are rotated, the belts 773 and 776 are fed in the same direction in the Y direction in the regions 773a and 776a. Therefore, the connecting shaft 779 is directly moved to the Y position. Move in direction.

於此種連結軸779之外周,沿其軸向設置有3個線性襯套779b、779c、779d。該等各線性襯套779b、779c、779d單獨(動作不受其他構件限制之狀態)地,相對於連結軸779沿軸向自如移動,且沿周向自如旋轉。 On the outer circumference of the connecting shaft 779, three linear bushings 779b, 779c, and 779d are disposed along the axial direction thereof. Each of the linear bushings 779b, 779c, and 779d is freely movable in the axial direction with respect to the connecting shaft 779 alone (in a state where the operation is not restricted by other members), and is freely rotatable in the circumferential direction.

該等線性襯套779b~779d之中,線性襯套779b固定於第2移動部725上,線性襯套779c固定於第3移動部735上,線性襯套779d固定於第4移動部745上。再者,第1移動部715支持在固定於第1基底751上之第1支持部71上,故而不會相對於連結軸779沿Y軸方向移動。因此,於第1移動部715上,與其他移動部725~745不同,不經由線性襯套便直接固定有連結軸779。如此,藉由將連結軸779固定於第1移動部715上,可防止連結軸779之軸向(Y方向)之非本意移位。 Among the linear bushings 779b to 779d, the linear bushing 779b is fixed to the second moving portion 725, the linear bushing 779c is fixed to the third moving portion 735, and the linear bushing 779d is fixed to the fourth moving portion 745. Further, since the first moving portion 715 is supported by the first support portion 71 fixed to the first base 751, it does not move in the Y-axis direction with respect to the connecting shaft 779. Therefore, unlike the other moving parts 725 to 745, the first moving portion 715 directly fixes the connecting shaft 779 without passing through the linear bushing. As described above, by fixing the connecting shaft 779 to the first moving portion 715, the unintentional displacement of the connecting shaft 779 in the axial direction (Y direction) can be prevented.

藉由形成此種構成,若連結軸779利用皮帶773、776之旋轉而沿Y方向移動,則各移動部715、725、735、745相對於各支持部71、72、73、74沿Y方向一體地且以相等之距離移動。從而,根據此種構成之Y方向移動機構77,可確實地一面將吸附嘴713、718之相隔距離、吸附嘴723、728之相隔距離、吸附嘴733、738之相隔距離、及吸附嘴743、748之相隔距離維持為彼此相等,一面變更該等相隔距離。 With such a configuration, when the connecting shaft 779 moves in the Y direction by the rotation of the belts 773 and 776, the moving portions 715, 725, 735, and 745 are in the Y direction with respect to the respective supporting portions 71, 72, 73, and 74. Move integrally and at equal distances. Therefore, according to the Y-direction moving mechanism 77 having such a configuration, the distance between the suction nozzles 713 and 718, the distance between the suction nozzles 723 and 728, the distance between the suction nozzles 733 and 738, and the suction nozzle 743 can be surely separated. The distances between the 748s are maintained equal to each other, and the distances are changed.

再者,如上所述,線性襯套779b~779d係相對於連結軸779沿其軸向(X方向)移動自如,故而Y方向移動機構77不會阻礙第2、第3、第4支持部72、73、74藉由X方向移動機構76向X方向之移動。 Further, as described above, the linear bushings 779b to 779d are movable in the axial direction (X direction) with respect to the connecting shaft 779, so that the Y-direction moving mechanism 77 does not obstruct the second, third, and fourth supporting portions 72. 73 and 74 are moved in the X direction by the X-direction moving mechanism 76.

又,於Y方向移動機構77中,在第2基底752上設置第1單元77a,並且在第1支持部71上設置第2單元77b,在於軸向上相隔之2處支持連結軸779,故而可使連結軸779更順利且確實地向Y方向移動特定距離。尤其是藉由使第2、第3支持部72、73位於第2基底752與第1支持部71之間,可充分地確保第2基底752與第1支持部71之相隔距離,從 而可更穩定地支持連結軸779。 Further, in the Y-direction moving mechanism 77, the first unit 77a is provided on the second base 752, and the second unit 77b is provided in the first support portion 71, and the connecting shaft 779 is supported at two places spaced apart in the axial direction. The connecting shaft 779 is moved more smoothly and surely in the Y direction by a certain distance. In particular, by positioning the second and third support portions 72 and 73 between the second base 752 and the first support portion 71, the distance between the second base 752 and the first support portion 71 can be sufficiently ensured. The connecting shaft 779 can be supported more stably.

再者,於本實施形態之Y方向移動機構77中,第1、第2、第3、第4移動部715、725、735、745經由連結軸779(即間接地)連結於皮帶773、776上,但並不限定於此,例如,亦可省略連結軸779,而使第1、第2、第3、第4移動部715、725、735、745分別直接連結於皮帶773、776上。 Further, in the Y-direction moving mechanism 77 of the present embodiment, the first, second, third, and fourth moving portions 715, 725, 735, and 745 are coupled to the belts 773, 776 via the connecting shaft 779 (ie, indirectly). However, the present invention is not limited thereto. For example, the connecting shaft 779 may be omitted, and the first, second, third, and fourth moving portions 715, 725, 735, and 745 may be directly coupled to the belts 773 and 776, respectively.

以上,對手單元7c之構成具體地進行了說明。根據此種手單元7c,藉由獨立地控制各馬達765、777之驅動(打開/關閉及旋轉方向),可自由地變更吸附嘴713、718、723、728、733、738、743、748之配設間距。因此,例如,即便於形成在供給托盤2上之複數個凹穴21之配設間距與形成在托盤42(52)上之複數個凹穴421(521)之配設間距不同之情形時,亦可如下所述,自供給托盤2向托盤42(52)順利地搬運IC元件100。 The configuration of the opponent unit 7c has been specifically described above. According to the hand unit 7c, the suction nozzles 713, 718, 723, 728, 733, 738, 743, and 748 can be freely changed by independently controlling the driving (opening/closing and rotating directions) of the motors 765 and 777. With spacing. Therefore, for example, even when the arrangement pitch of the plurality of pockets 21 formed on the supply tray 2 is different from the arrangement pitch of the plurality of pockets 421 (521) formed on the tray 42 (52), The IC component 100 can be smoothly transported from the supply tray 2 to the tray 42 (52) as described below.

再者,本實施形態之手單元7c具有8個吸附嘴,但吸附嘴之數量只要為4個以上即可,並無特別限定。例如,於吸附嘴為4個之情形時,只要使第3、第4支持部73、74分別省略吸附嘴733、738、743、748。又,例如,於吸附嘴為10個之情形時,例如,只要於第4支持部74之+X方向側,設置為與第4支持部74相同之構成且具有2個吸附嘴之第5支持部,進而,將第5支持部固定於皮帶764之區域764b內即可。如此,根據手單元7c,可簡單地進行吸附嘴之數量之變更(進而,添加、刪除)。關於手單元8c亦相同。 Further, the hand unit 7c of the present embodiment has eight suction nozzles, but the number of the suction nozzles is not particularly limited as long as it is four or more. For example, when there are four adsorption nozzles, the third and fourth support portions 73 and 74 are omitted, and the adsorption nozzles 733, 738, 743, and 748 are omitted. In the case where the number of the nozzles is 10, for example, the fifth support portion of the fourth support portion 74 is provided in the same manner as the fourth support portion 74 and has the fifth support of the two nozzles. Further, the fifth support portion may be fixed in the region 764b of the belt 764. In this way, according to the hand unit 7c, the number of the nozzles (and, in addition, the addition and deletion) can be easily changed. The same applies to the hand unit 8c.

其次,對供給機器人7之驅動進行說明。 Next, the drive of the supply robot 7 will be described.

首先,以手單元7c位於供給托盤2上之方式,使移動框7b相對於支持框7a沿Y方向移動,並且使基部75相對於移動框7b沿X方向移動。其次,使X方向移動機構76及Y方向移動機構77各自根據需要而驅動,使吸附嘴713、718、723、728、733、738、743、748之配設間 距與凹穴21之配設間距一致。再者,X方向移動機構76及Y方向移動機構77之驅動亦可於手單元7c正在移動之過程中進行。 First, the moving frame 7b is moved in the Y direction with respect to the support frame 7a so that the hand unit 7c is positioned on the supply tray 2, and the base 75 is moved in the X direction with respect to the moving frame 7b. Next, the X-direction moving mechanism 76 and the Y-direction moving mechanism 77 are driven as needed, so that the nozzles 713, 718, 723, 728, 733, 738, 743, and 748 are disposed. The distance from the arrangement of the recesses 21 is the same. Further, the driving of the X-direction moving mechanism 76 and the Y-direction moving mechanism 77 can also be performed while the hand unit 7c is moving.

其次,使各吸附嘴713、718、723、728、733、738、743、748下降,藉由各吸附嘴713、718、723、728、733、738、743、748而保持IC元件100。其後,使吸附嘴713、718、723、728、733、738、743、748上升,自凹穴21中取出8個IC元件100。 Next, each of the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, and 748 is lowered, and the IC element 100 is held by the respective suction nozzles 713, 718, 723, 728, 733, 738, 743, and 748. Thereafter, the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, and 748 are raised, and eight IC elements 100 are taken out from the recess 21.

其次,以手單元7c位於托盤42上之方式,使移動框7b相對於支持框7a沿Y方向移動,並且使基部75相對於移動框7b沿X方向移動。由於供給托盤2之凹穴21之配設間距與托盤42之凹穴421之配設間距於X方向及Y方向兩個方向上不同,故而接著使X方向移動機構76及Y方向移動機構77分別驅動,使吸附嘴713、718、723、728、733、738、743、748之配設間距與凹穴421之配設間距一致。再者,X方向移動機構76及Y方向移動機構77之驅動亦可於手單元7c正在移動之過程中進行。 Next, the moving frame 7b is moved in the Y direction with respect to the support frame 7a in such a manner that the hand unit 7c is positioned on the tray 42, and the base portion 75 is moved in the X direction with respect to the moving frame 7b. Since the arrangement pitch of the recesses 21 of the supply tray 2 and the arrangement pitch of the recesses 421 of the tray 42 are different in the X direction and the Y direction, the X-direction moving mechanism 76 and the Y-direction moving mechanism 77 are respectively respectively caused. The driving is such that the arrangement pitch of the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, 748 coincides with the arrangement pitch of the pockets 421. Further, the driving of the X-direction moving mechanism 76 and the Y-direction moving mechanism 77 can also be performed while the hand unit 7c is moving.

其次,使各吸附嘴713、718、723、728、733、738、743、748下降,將保持於各吸附嘴713、718、723、728、733、738、743、748上之IC元件100載置於凹穴421中。然後,於解除IC元件100之吸附狀態之後,使吸附嘴713、718、723、728、733、738、743、748上升,將各IC元件100保留於凹穴421上。 Next, each of the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, and 748 is lowered to hold the IC component 100 held on each of the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, and 748. Placed in the pocket 421. Then, after the adsorption state of the IC device 100 is released, the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, and 748 are raised, and the IC elements 100 are left on the pockets 421.

再者,於上述形態中,供給托盤2之凹穴21之配設間距與托盤42之凹穴421之配設間距於X方向及Y方向兩個方向上不同,但並不限定於此,亦可為僅X方向上之配設間距不同。於該情形時,只要姑且藉由Y方向移動機構77,調整吸附嘴713、718、723、728、733、738、743、748之Y方向之配設間距,其後,僅驅動X方向移動機構76,使吸附嘴713、718、723、728、733、738、743、748之X方向之配設間距變化即可。 Further, in the above aspect, the arrangement pitch of the recesses 21 of the supply tray 2 and the arrangement pitch of the recesses 421 of the tray 42 are different in the two directions of the X direction and the Y direction, but the present invention is not limited thereto. The spacing can be set only in the X direction. In this case, as long as the Y-direction moving mechanism 77 is used, the arrangement pitch of the suction nozzles 713, 718, 723, 728, 733, 738, 743, and 748 in the Y direction is adjusted, and thereafter, only the X-direction moving mechanism is driven. 76. The arrangement pitch of the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, and 748 in the X direction may be changed.

相反地,亦可為僅Y方向上之配設間距不同。於該情形時,只要姑且藉由X方向移動機構76,調整吸附嘴713、718、723、728、733、738、743、748之X方向之配設間距,其後,僅驅動Y方向移動機構77,使吸附嘴713、718、723、728、733、738、743、748之Y方向之配設間距變化即可。 Conversely, it is also possible to arrange the pitch in only the Y direction. In this case, as long as the X-direction moving mechanism 76 is used, the arrangement pitch of the suction nozzles 713, 718, 723, 728, 733, 738, 743, and 748 in the X direction is adjusted, and thereafter, only the Y-direction moving mechanism is driven. 77. The arrangement pitch of the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, and 748 in the Y direction may be changed.

又,配設間距亦可為於X方向及Y方向兩個方向上相等。於該情形時,只要姑且藉由Y方向移動機構77,調整吸附嘴713、718、723、728、733、738、743、748之Y方向之配設間距,藉由X方向移動機構76,調整吸附嘴713、718、723、728、733、738、743、748之X方向之配設間距,其後不使該等配設間距變更,而進行上述IC元件100之搬送即可。 Further, the arrangement pitch may be equal in both the X direction and the Y direction. In this case, as long as the Y-direction moving mechanism 77 is used, the arrangement pitch of the suction nozzles 713, 718, 723, 728, 733, 738, 743, and 748 in the Y direction is adjusted, and the X-direction moving mechanism 76 is adjusted. The arrangement pitch of the adsorption nozzles 713, 718, 723, 728, 733, 738, 743, and 748 in the X direction may be performed after the IC element 100 is transported without changing the arrangement pitch.

自供給托盤2向托盤52之IC元件100之搬送亦相同。 The transfer from the supply tray 2 to the IC component 100 of the tray 52 is also the same.

(檢查用機器人) (checking robot)

檢查用機器人9係將收納於托盤42、52中之IC元件100向檢查用插口6搬送,並且將配置於檢查用插口6中、已完成電氣特性之檢查之IC元件100向托盤43、53搬送之機器人。 The inspection robot 9 transports the IC component 100 stored in the trays 42 and 52 to the inspection socket 6 , and transports the IC component 100 disposed in the inspection socket 6 and has completed the inspection of the electrical characteristics to the trays 43 and 53 . Robot.

又,檢查用機器人9於自托盤42、52向檢查用插口6搬送IC元件100時,可進行IC元件100相對於檢查用插口6(檢查用個別插口61)之定位,進而,於將IC元件100配置於檢查用插口6中而進行電氣特性之檢查時,可將IC元件100按壓於探針上,對IC元件100施加特定之檢查壓。 Further, when the inspection robot 9 transports the IC component 100 to the inspection socket 6 from the trays 42 and 52, the IC component 100 can be positioned relative to the inspection socket 6 (inspection individual socket 61), and further, the IC component can be placed. When the 100 is placed in the inspection socket 6 and the electrical characteristics are inspected, the IC device 100 can be pressed against the probe, and a specific inspection pressure can be applied to the IC device 100.

如圖1所示,檢查用機器人9包括:第1框911,其係相對於基座11而固定地設置;第2框912,其支持於第1框911上,且可相對於第1框911向Y方向往返移動;第1手單元支持部913及第2手單元支持部914,其支持於第2框912上,且可相對於第2框912沿Z方向升降;8個第1手單元92,其支持於第1手單元支持部913上;及8個第2手單元 93,其支持於第2手單元支持部914上。 As shown in FIG. 1, the inspection robot 9 includes a first frame 911 that is fixedly disposed with respect to the base 11, and a second frame 912 that is supported by the first frame 911 and that is movable relative to the first frame. The 911 moves back and forth in the Y direction; the first hand unit support portion 913 and the second hand unit support portion 914 are supported by the second frame 912 and are movable up and down in the Z direction with respect to the second frame 912; 8 first hands Unit 92, which is supported by the first hand unit support unit 913; and 8 second hand units 93, which is supported by the second hand unit support unit 914.

第1、第2手單元支持部913、914均支持於第2框912上,故而可沿X方向及Y方向一體地移動,而沿Z方向分別獨立地移動。第2框912相對於第1框911之移動、各手單元支持部913、914相對於第2框912之移動係藉由以例如線性馬達作為驅動源之未圖示之驅動器件而進行。 Since the first and second hand unit supporting portions 913 and 914 are supported by the second frame 912, they are integrally movable in the X direction and the Y direction, and are independently moved in the Z direction. The movement of the second frame 912 with respect to the first frame 911 and the movement of the respective hand unit supporting portions 913 and 914 with respect to the second frame 912 are performed by a driving device (not shown) using, for example, a linear motor as a driving source.

8個第1手單元92係以沿X方向排列4個、沿Y方向排列2個之方式呈矩陣狀地配置於第1手單元支持部913之下側。又,8個第1手單元92之配設間距與形成於托盤42、43上之8個凹穴421、431及設置於檢查用插口6中之8個檢查用個別插口61之配設間距大致相等。因此,可更順利地進行托盤42、43與檢查用插口6之間之IC元件100之搬送。 The eight first hand units 92 are arranged in a matrix on the lower side of the first hand unit support portion 913 so as to be arranged in four in the X direction and two in the Y direction. Further, the arrangement pitch of the eight first hand units 92 is substantially the same as the arrangement pitch of the eight pockets 421 and 431 formed on the trays 42 and 43 and the eight individual inspection sockets 61 provided in the inspection socket 6. equal. Therefore, the transfer of the IC device 100 between the trays 42, 43 and the inspection socket 6 can be performed more smoothly.

同樣地,8個第2手單元93係於第2梭子5之各托盤52、53與檢查用插口6之間搬送IC元件100之裝置。又,其亦係於將未檢查之IC元件100自托盤52搬送至檢查用插口6時進行IC元件100相對於檢查用插口6之定位之裝置。 Similarly, the eight second hand units 93 are devices for transporting the IC device 100 between the trays 52 and 53 of the second shuttle 5 and the inspection sockets 6. Moreover, it is also a device for positioning the IC element 100 with respect to the inspection socket 6 when the unchecked IC device 100 is transported from the tray 52 to the inspection socket 6.

8個第2手單元93係以沿X方向排列4個、沿Y方向排列2個之方式呈矩陣狀地配置於第2手單元支持部914之下側。又,8個第2手單元93之配置間距與上述8個第1手單元92同樣地,與形成於托盤42、43上之8個凹穴421、431及設置於檢查用插口6中之8個檢查用個別插口61之配設間距大致相等。因此,可更順利地進行托盤52、53與檢查用插口6之間之IC元件100之搬送。 The eight second hand units 93 are arranged in a matrix on the lower side of the second hand unit support portion 914 in such a manner that four of them are arranged in the X direction and two are arranged in the Y direction. Further, the arrangement pitch of the eight second hand units 93 is the same as that of the eight first hand units 92, and the eight pockets 421 and 431 formed on the trays 42 and 43 and the eight sockets 431 provided in the inspection socket 6. The spacing of the individual inspection sockets 61 is substantially equal. Therefore, the transfer of the IC device 100 between the trays 52, 53 and the inspection socket 6 can be performed more smoothly.

以下,對8個第1手單元92及8個第2手單元93之構成進行說明,但各手單元92、93係彼此相同之構成,故而以下,以1個第1手單元92為代表而進行說明,對於其他第1手單元92及第2手單元93,省略其說明。 Hereinafter, the configuration of the eight first hand units 92 and the eight second hand units 93 will be described. However, the respective hand units 92 and 93 are identical to each other. Therefore, the first hand unit 92 is exemplified below. In the description, the description of the other first hand unit 92 and the second hand unit 93 will be omitted.

如圖11所示,第1手單元92包括:支持部94,其支持、固定於第1手單元支持部913上;第1移動部95,其支持於支持部94上,且可相對 於支持部94於±X方向上往返移動;第2移動部96,其支持於第1移動部95上,且可相對於第1移動部95於±Y方向上往返移動;旋轉部97,其支持於第2移動部96上,且可相對於第2移動部96繞Z軸旋轉;及保持部98,其支持於旋轉部97上。於支持部94上,設置有用以進行所保持之IC元件100相對於檢查用個別插口61之定位之元件標記941。又,保持部98係由例如吸附嘴所構成,可藉由吸附IC元件100而進行保持。 As shown in FIG. 11, the first hand unit 92 includes a support portion 94 that is supported and fixed to the first hand unit support portion 913. The first moving portion 95 is supported by the support portion 94 and is relatively movable. The support portion 94 reciprocates in the ±X direction; the second moving portion 96 is supported by the first moving portion 95 and is reciprocally movable in the ±Y direction with respect to the first moving portion 95; the rotating portion 97 is The second moving portion 96 is supported and rotatable about the Z axis with respect to the second moving portion 96. The holding portion 98 is supported by the rotating portion 97. On the support portion 94, an element mark 941 for performing positioning of the held IC element 100 with respect to the inspection individual socket 61 is provided. Further, the holding portion 98 is constituted by, for example, a suction nozzle, and can be held by adsorbing the IC element 100.

又,第1手單元92包括:未圖示之第1驅動器件,其使第1移動部95相對於支持部94於±X方向上往返移動;未圖示之第2驅動器件,其使第2移動部96相對於第1移動部95於±Y方向上往返移動;及第3驅動機構,其使旋轉部97相對於第2移動部96繞Z軸旋轉。該等第1、第2、第3驅動機構形成為可以例如線性馬達作為驅動源,此外根據需要而添加有用以使馬達之旋轉運動轉換成直線運動之齒條、小齒輪等構成之構成。 Further, the first hand unit 92 includes a first driving device (not shown) that reciprocates the first moving portion 95 in the ±X direction with respect to the support portion 94; the second driving device (not shown) The moving unit 96 reciprocates in the ±Y direction with respect to the first moving unit 95, and the third driving mechanism rotates the rotating unit 97 around the Z axis with respect to the second moving unit 96. The first, second, and third drive mechanisms are formed by, for example, a linear motor as a drive source, and a configuration including a rack, a pinion, and the like for converting a rotational motion of the motor into a linear motion is added as needed.

此種第1手單元92係以如下方式,進行所保持之IC元件100之定位(目視對準)。將收納於托盤42中之未檢查之IC元件100保持於保持部98上,於第1手單元92自托盤42之正上方移動至檢查用插口6之正上方之途中,第1手單元92通過第1攝像機600之正上方。第1攝像機600於第1手單元92通過其正上方時,以捕捉保持於第1手單元92上之IC元件100及元件標記941之方式進行攝影。所得之圖像資料被發送至控制裝置10,並藉由控制裝置10予以圖像識別處理。 The first hand unit 92 performs positioning (visual alignment) of the held IC component 100 as follows. The unchecked IC device 100 housed in the tray 42 is held by the holding portion 98, and the first hand unit 92 passes while the first hand unit 92 is moving directly above the tray 42 to directly above the inspection socket 6. Directly above the first camera 600. When the first hand unit 92 passes directly above the first hand unit 600, the first camera 600 captures the IC element 100 and the component mark 941 held by the first hand unit 92. The obtained image data is sent to the control device 10, and subjected to image recognition processing by the control device 10.

具體而言,於圖像識別處理中,對自第1攝像機600取得之圖像資料實施特定之處理,而算出元件標記941與IC元件100之相對位置及相對角度。然後,將所算出之相對位置及相對角度與表示元件標記941與IC元件100之適當之位置關係之基準位置及基準角度進行對比,分別演算相對位置與基準位置之間所產生之「偏移位置量」、及相對 角度與基準角度之間所產生之「偏移角度量」。再者,上述「基準位置」及上述「基準角度」係指於第1手單元92配置在預先設定之檢查用原點位置時、IC元件100之外部端子較佳地連接於檢查用個別插口61之探針之位置。 Specifically, in the image recognition processing, the image data acquired from the first camera 600 is subjected to a specific process, and the relative position and relative angle between the component mark 941 and the IC component 100 are calculated. Then, the calculated relative position and relative angle are compared with the reference position and the reference angle indicating the appropriate positional relationship between the component mark 941 and the IC component 100, and the "offset position" between the relative position and the reference position is calculated respectively. Quantity" and relative The "offset angle amount" generated between the angle and the reference angle. In addition, the "reference position" and the "reference angle" are preferably when the first hand unit 92 is placed at a predetermined inspection origin position, and the external terminal of the IC component 100 is preferably connected to the inspection individual socket 61. The position of the probe.

然後,控制裝置10基於所求出之「偏移位置量」及「偏移角度量」,根據需要驅動第1、第2、第3驅動器件,以使相對位置及相對角度與基準位置及基準角度一致之方式,修正IC元件100之位置及姿勢(角度)。藉由此種控制,可進行由保持部98保持之IC元件100之定位。 Then, the control device 10 drives the first, second, and third driving devices as needed based on the obtained "offset position amount" and "offset angle amount" so that the relative position and the relative angle are compared with the reference position and the reference. The position and posture (angle) of the IC component 100 are corrected in such a manner that the angles are uniform. By such control, the positioning of the IC component 100 held by the holding portion 98 can be performed.

控制裝置10係以可分別獨立地控制8個第1手單元92之驅動之方式構成,故而可分別獨立地進行保持於各第1手單元92上之8個IC元件100之定位(位置修正)。 Since the control device 10 is configured to independently control the driving of the eight first hand units 92, the positioning (position correction) of the eight IC elements 100 held by the respective first hand units 92 can be independently performed. .

利用第2手單元93之IC元件100之定位除了使用第2攝像機500取代第1攝像機600以外,其他與上述第1手單元92之情形相同,故而省略其說明。 The positioning of the IC component 100 by the second hand unit 93 is the same as that of the first hand unit 92 except that the second camera 500 is used instead of the first camera 600, and thus the description thereof will be omitted.

(回收機器人) (recycling robot)

回收機器人8係用以將收納於托盤43、53中之檢查結束之IC元件100搬送至回收托盤3之機器人。 The collection robot 8 is a robot for transporting the IC elements 100 stored in the trays 43 and 53 to the collection tray 3 .

回收機器人8形成為與供給機器人7相同之構成。即,回收機器人8包括:支持框8a,其支持於基座11上;移動框8b,其支持於支持框8a上,且可相對於支持框8a於Y方向上往返移動;及手單元8c,其支持於移動框8b上,且可相對於移動框8b於X方向上往返移動。該等各部之構成與供給機器人7之對應之各部之構成相同,故而省略其說明。又,回收機器人8之驅動亦與供給機器人7之驅動相同,故而省略其說明。 The recovery robot 8 is formed in the same configuration as the supply robot 7. That is, the recycling robot 8 includes: a support frame 8a supported on the base 11; a moving frame 8b supported on the support frame 8a and reciprocally movable in the Y direction with respect to the support frame 8a; and a hand unit 8c, It is supported on the moving frame 8b and is reciprocally movable in the X direction with respect to the moving frame 8b. The configuration of each of the units is the same as the configuration of each unit corresponding to the supply robot 7, and therefore the description thereof will be omitted. Further, the drive of the recovery robot 8 is also the same as the drive of the supply robot 7, and the description thereof will be omitted.

此處,會存在如下情形:於收納在托盤43(53)中之檢查結束之IC 元件100之中,存在無法發揮特定之電氣特性之不良品。因此,例如,亦可準備2個回收托盤3,將一者作為用以收納滿足特定之電氣特性之良品之托盤而使用,將另一者作為用以回收上述不良品之托盤而使用。又,於使用1個回收托盤3之情形時,亦可利用特定之凹穴31作為用以收納上述不良品之凹穴。藉此,可明確地區分良品與不良品。 Here, there is a case where the inspection is completed in the tray 43 (53). Among the elements 100, there are defective products that cannot exhibit specific electrical characteristics. Therefore, for example, two collection trays 3 may be prepared, one of which is used as a tray for storing a good product that satisfies a specific electrical characteristic, and the other is used as a tray for collecting the defective product. Further, when one recovery tray 3 is used, a specific pocket 31 can be used as a recess for accommodating the defective product. In this way, it is possible to clearly distinguish between good and bad products.

(控制裝置) (control device)

控制裝置10包括驅動控制部102、及檢查控制部101。驅動控制部102例如對供給托盤2、回收托盤3、第1梭子4及第2梭子5之移動、或供給機器人7、回收機器人8、檢查用機器人9、載置狀態檢測器件200、第1攝像機600及第2攝像機500等之機械性之驅動進行控制。一檢查控制部101基於記憶在未圖示之記憶體內之程式,進行配置於檢查用插口6中之IC元件100之電氣特性之檢查。 The control device 10 includes a drive control unit 102 and an inspection control unit 101. For example, the drive control unit 102 moves the supply tray 2, the recovery tray 3, the first shuttle 4, and the second shuttle 5, or the supply robot 7, the collection robot 8, the inspection robot 9, the placement state detecting device 200, and the first camera. The mechanical drive of 600 and the second camera 500 is controlled. The inspection control unit 101 performs inspection of the electrical characteristics of the IC component 100 disposed in the inspection socket 6 based on a program stored in a memory (not shown).

以上,對檢查裝置1之構成進行了說明。 The configuration of the inspection apparatus 1 has been described above.

[檢查裝置之檢查方法] [Inspection method of inspection device]

其次,對檢查裝置1對IC元件100之檢查方法進行說明。再者,以下所說明之檢查方法尤其是IC元件100之搬送順序僅為一例,並不限定於此。 Next, a method of inspecting the IC device 100 by the inspection device 1 will be described. In addition, the inspection method described below, in particular, the transfer order of the IC device 100 is merely an example, and is not limited thereto.

(步驟1) (step 1)

首先,如圖12所示,將於各凹穴21內收納有IC元件100之供給托盤2向區域S內搬送,並且使第1、第2梭子4、5移動至-X方向側,而形成托盤42、52分別相對於供給托盤2排列於+Y方向側之狀態。 First, as shown in FIG. 12, the supply tray 2 in which the IC device 100 is housed in each of the pockets 21 is transported into the region S, and the first and second shuttles 4 and 5 are moved to the -X direction side to form The trays 42 and 52 are arranged on the +Y direction side with respect to the supply tray 2, respectively.

(步驟2) (Step 2)

其次,如圖13所示,藉由供給機器人7,將收納於供給托盤2中之IC元件100轉移至托盤42、52上,並將IC元件100收納於托盤42、52之各凹穴421、521中。 Next, as shown in FIG. 13, the IC device 100 stored in the supply tray 2 is transferred to the trays 42 and 52 by the supply robot 7, and the IC device 100 is housed in the pockets 421 of the trays 42, 52, 521.

其次,藉由載置狀態檢測器件200,檢測收納於托盤42、52之各 凹穴421、521中之IC元件100之載置狀態。即便於僅檢測出1個異常之載置狀態之IC元件100之情形時,驅動控制部102亦臨時使各部之驅動停止,糾正異常之載置狀態,於確認IC元件100全部處於正常之載置狀態下之後,再次開始各部之驅動。 Next, by the placement state detecting device 200, each of the trays 42 and 52 is detected and stored. The mounting state of the IC device 100 in the pockets 421, 521. In other words, when it is convenient to detect only one abnormality of the IC device 100 in the mounted state, the drive control unit 102 temporarily stops the driving of each unit, corrects the abnormal placement state, and confirms that the IC component 100 is normally placed. After the state, the driving of each part is started again.

(步驟3) (Step 3)

其次,如圖14所示,將第1、第2梭子4、5均移動至+X方向側,而形成托盤42相對於檢查用插口6排列於+Y方向側、托盤52相對於檢查用插口6排列於-Y方向側之狀態。 Next, as shown in FIG. 14, both the first and second shuttles 4 and 5 are moved to the +X direction side, and the tray 42 is formed on the +Y direction side with respect to the inspection socket 6, and the tray 52 is opposed to the inspection socket. 6 is arranged in the state of the -Y direction side.

其次,如圖15所示,使第1、第2手單元支持部913、914一體地移動至+Y方向側,而形成第1手單元支持部913位於托盤42之正上方並且第2手單元支持部914位於檢查用插口6之正上方之狀態。其後,藉由各第1手單元92保持收納於托盤42中之IC元件100。 Next, as shown in FIG. 15, the first and second hand unit supporting portions 913 and 914 are integrally moved to the +Y direction side, and the first hand unit supporting portion 913 is formed directly above the tray 42 and the second hand unit is formed. The support portion 914 is located directly above the inspection socket 6. Thereafter, the IC elements 100 housed in the tray 42 are held by the respective first hand units 92.

(步驟5) (Step 5)

其次,如圖16所示,使第1、第2手單元支持部913、914一體地移動至-Y方向側,而形成第1手單元支持部913位於檢查用插口6之正上方(檢查用原點位置)並且第2手單元支持部914位於托盤52之正上方之狀態。於該移動之過程中,基於藉由第1攝像機600拍攝所得之圖像資料,獨立地進行各IC元件100之定位(目視對準)。 Then, as shown in FIG. 16, the first and second hand unit supporting portions 913 and 914 are integrally moved to the -Y direction side, and the first hand unit supporting portion 913 is formed directly above the inspection socket 6 (for inspection) The origin position is) and the second hand unit support portion 914 is located directly above the tray 52. During the movement, the positioning (visual alignment) of each IC element 100 is independently performed based on the image data captured by the first camera 600.

與此種第1、第2手單元支持部913、914之移動及IC元件100之定位同時地,亦進行如下之作業。首先,使第1梭子4移動至-X方向側,而形成托盤43相對於檢查用插口6沿+Y方向排列之狀態,並且形成托盤42相對於供給托盤2沿+Y方向排列之狀態。其次,藉由供給機器人7,將收納於供給托盤2中之IC元件100轉移至托盤42上,將IC元件100收納於托盤42之各凹穴421中。然後,與上述同樣地,藉由載置狀態檢測器件200,檢測收納於各凹穴421中之IC元件100之載置狀態。 Simultaneously with the movement of the first and second hand unit support units 913 and 914 and the positioning of the IC device 100, the following operations are also performed. First, the first shuttle 4 is moved to the -X direction side, and the trays 43 are arranged in the +Y direction with respect to the inspection socket 6, and the trays 42 are arranged in the +Y direction with respect to the supply tray 2. Next, the IC device 100 stored in the supply tray 2 is transferred to the tray 42 by the supply robot 7, and the IC device 100 is housed in each of the pockets 421 of the tray 42. Then, in the same manner as described above, the placed state detecting device 200 detects the placed state of the IC device 100 accommodated in each of the pockets 421.

(步驟6) (Step 6)

其次,使第1手單元支持部913下降,將由各第1手單元92保持之IC元件100配置於檢查用插口6之各檢查用個別插口61內。此時,各第1手單元92以特定之檢查壓(壓力)將IC元件100按壓於檢查用個別插口61中。藉此,IC元件100之外部端子與設置於檢查用個別插口61中之探針形成為電性連接之狀態,於該狀態下,藉由控制裝置10之檢查控制部101對各檢查用個別插口61內之IC元件100實施電氣特性之檢查。若該檢查結束,則使第1手單元支持部913上升,自檢查用個別插口61中取出由各第1手單元92保持之IC元件100。 Then, the first hand unit support unit 913 is lowered, and the IC element 100 held by each of the first hand units 92 is placed in each of the individual inspection sockets 61 for the inspection socket 6. At this time, each of the first hand units 92 presses the IC element 100 against the inspection individual socket 61 with a specific inspection pressure (pressure). Thereby, the external terminals of the IC device 100 and the probes provided in the individual inspection sockets 61 are electrically connected. In this state, the inspection control unit 101 of the control device 10 controls the individual sockets for each inspection. The IC component 100 in 61 performs inspection of electrical characteristics. When the inspection is completed, the first hand unit support portion 913 is raised, and the IC component 100 held by each of the first hand units 92 is taken out from the individual inspection socket 61.

與此種作業(IC元件100之檢查)同時地,支持於第2手單元支持部914上之各第2手單元93保持收納於托盤52中之IC元件100,再自托盤52中取出IC元件100。 Simultaneously with this operation (inspection of the IC device 100), each of the second hand units 93 supported by the second hand unit support unit 914 holds the IC component 100 housed in the tray 52, and then takes out the IC component from the tray 52. 100.

(步驟7) (Step 7)

其次,如圖17所示,使第1、第2手單元支持部913、914移動至+Y方向側,而形成第1手單元支持部913位於第1梭子4之托盤43之正上方並且第2手單元支持部914位於檢查用插口6之正上方(檢查用原點位置)之狀態。於該移動之過程中,基於藉由第2攝像機500拍攝所得之圖像資料,獨立地進行各IC元件100之定位(目視對準)。 Next, as shown in FIG. 17, the first and second hand unit support portions 913 and 914 are moved to the +Y direction side, and the first hand unit support portion 913 is formed directly above the tray 43 of the first shuttle 4 and The 2-hand unit support unit 914 is in a state of being directly above the inspection socket 6 (inspection origin position). During the movement, the positioning (visual alignment) of each IC element 100 is independently performed based on the image data captured by the second camera 500.

與此種第1、第2手單元支持部913、914之移動同時地,亦進行如下之作業。首先,使第2梭子5移動至-X方向側,而形成托盤53相對於檢查用插口6沿-Y方向排列之狀態,並且形成托盤52相對於供給托盤2沿+Y方向排列之狀態。其次,藉由供給機器人7,將收納於供給托盤2中之IC元件100轉移至托盤52上,將IC元件100收納於托盤52之各凹穴521中。然後,與上述同樣地,藉由載置狀態檢測器件200,檢測收納於各凹穴521中之IC元件100之載置狀態。 Simultaneously with the movement of the first and second hand unit support units 913 and 914, the following operations are also performed. First, the second shuttle 5 is moved to the -X direction side, and the trays 53 are arranged in the -Y direction with respect to the inspection socket 6, and the trays 52 are arranged in the +Y direction with respect to the supply tray 2. Next, the IC device 100 stored in the supply tray 2 is transferred to the tray 52 by the supply robot 7, and the IC device 100 is housed in each of the pockets 521 of the tray 52. Then, in the same manner as described above, the placed state detecting device 200 detects the placed state of the IC device 100 accommodated in each of the pockets 521.

(步驟8) (Step 8)

其次,如圖18所示,使第2手單元支持部914下降,將由各第2手 單元93保持之IC元件100配置於檢查用插口6之各檢查用個別插口61內。然後,藉由檢查控制部101,對各檢查用個別插口61內之IC元件100實施電氣特性之檢查。若該檢查結束,則使第2手單元支持部914上升,自檢查用個別插口61中取出由第2手單元93保持之IC元件100。 Next, as shown in FIG. 18, the second hand unit support unit 914 is lowered, and each second hand is used. The IC device 100 held by the unit 93 is disposed in each of the individual inspection sockets 61 for the inspection socket 6. Then, the inspection control unit 101 performs inspection of the electrical characteristics of the IC component 100 in each of the individual inspection sockets 61. When the inspection is completed, the second hand unit support portion 914 is raised, and the IC component 100 held by the second hand unit 93 is taken out from the individual inspection socket 61.

與此種作業同時地進行如下之作業。首先,將各第1手單元92所保持之檢查結束之IC元件100收納於托盤43之各凹穴431中。其次,使第1梭子4移動至+X方向側,而形成托盤42相對於檢查用插口6沿+Y方向排列且位於各第1手單元92之正下方之狀態,並且形成托盤43相對於回收托盤3沿+Y方向排列之狀態。其次,各第1手單元92保持收納於托盤42中之IC元件100,並且藉由回收機器人8,將收納於托盤43中之檢查結束之IC元件100轉移至回收托盤3中。 The following operations are performed simultaneously with such work. First, the IC device 100 in which the inspection of each of the first hand units 92 is completed is stored in each of the pockets 431 of the tray 43. Then, the first shuttle 4 is moved to the +X direction side, and the tray 42 is formed in the +Y direction with respect to the inspection socket 6 and is located immediately below each of the first hand units 92, and the tray 43 is formed with respect to the recovery. The trays 3 are arranged in the +Y direction. Then, each of the first hand units 92 holds the IC device 100 housed in the tray 42, and the recovery robot 8 transfers the IC component 100 stored in the tray 43 to the recovery tray 3.

(步驟9) (Step 9)

其次,如圖19所示,使第1、第2手單元支持部913、914移動至-Y方向側,而形成第1手單元支持部913位於檢查用插口6之正上方(檢查用原點位置)並且第2手單元支持部914位於托盤52之正上方之狀態。此時,亦與上述步驟5同樣地,進行保持於第1手單元92上之IC元件100之定位。 Then, as shown in FIG. 19, the first and second hand unit supporting portions 913 and 914 are moved to the -Y direction side, and the first hand unit supporting portion 913 is formed directly above the inspection socket 6 (inspection origin) Position) The second hand unit support portion 914 is located directly above the tray 52. At this time, similarly to the above-described step 5, the positioning of the IC device 100 held by the first hand unit 92 is performed.

與此種第1、第2手單元支持部913、914之移動同時地,亦進行如下之作業。首先,使第1梭子4移動至-X方向側,而形成托盤43相對於檢查用插口6沿+Y方向排列之狀態,並且形成托盤42相對於供給托盤2沿+Y方向排列之狀態。其次,藉由供給機器人7,將收納於供給托盤2中之IC元件100轉移至托盤42上,將IC元件100收納於托盤42之各凹穴421中。然後,與上述同樣地,藉由載置狀態檢測器件200,檢測收納於各凹穴421中之IC元件100之載置狀態。 Simultaneously with the movement of the first and second hand unit support units 913 and 914, the following operations are also performed. First, the first shuttle 4 is moved to the -X direction side, and the trays 43 are arranged in the +Y direction with respect to the inspection socket 6, and the trays 42 are arranged in the +Y direction with respect to the supply tray 2. Next, the IC device 100 stored in the supply tray 2 is transferred to the tray 42 by the supply robot 7, and the IC device 100 is housed in each of the pockets 421 of the tray 42. Then, in the same manner as described above, the placed state detecting device 200 detects the placed state of the IC device 100 accommodated in each of the pockets 421.

(步驟10) (Step 10)

其次,如圖20所示,使第1手單元支持部913下降,將由各第1手 單元92保持之IC元件100配置於檢查用插口6之各檢查用個別插口61內。然後,藉由檢查控制部101,對各檢查用個別插口61內之IC元件100實施電氣特性之檢查。若該檢查結束,則使第1手單元支持部913上升,自檢查用個別插口61中取出由各第1手單元92保持之IC元件100。 Next, as shown in FIG. 20, the first hand unit support unit 913 is lowered, and each first hand is used. The IC device 100 held by the unit 92 is disposed in each of the individual inspection sockets 61 for the inspection socket 6. Then, the inspection control unit 101 performs inspection of the electrical characteristics of the IC component 100 in each of the individual inspection sockets 61. When the inspection is completed, the first hand unit support portion 913 is raised, and the IC component 100 held by each of the first hand units 92 is taken out from the individual inspection socket 61.

與此種作業同時地進行如下之作業。首先,將各第2手單元93所保持之檢查結束之IC元件100收納於托盤53之各凹穴531中。其次,使第2梭子5移動至+X方向側,而形成托盤52相對於檢查用插口6沿-Y方向排列且位於第2手單元93之正下方之狀態,並且形成托盤53相對於回收托盤3沿+Y方向排列之狀態。其次,各第2手單元93保持收納於托盤52中之IC元件100,並且藉由回收機器人8,將收納於托盤53中之檢查結束之IC元件100轉移至回收托盤3中。 The following operations are performed simultaneously with such work. First, the IC device 100 that has been inspected by each of the second hand units 93 is stored in each of the pockets 531 of the tray 53. Next, the second shuttle 5 is moved to the +X direction side, and the tray 52 is formed in the -Y direction with respect to the inspection socket 6 and is located immediately below the second hand unit 93, and the tray 53 is formed with respect to the recovery tray. 3 states arranged in the +Y direction. Next, each of the second hand units 93 holds the IC device 100 housed in the tray 52, and the recovery robot 8 transfers the IC component 100 stored in the tray 53 to the recovery tray 3.

(步驟11) (Step 11)

自此以後,重複上述步驟7~步驟10。再者,於該重複之途中,若收納於供給托盤2中之IC元件100已全部移動至第1梭子4中,則供給托盤2向區域S外移動。然後,於向供給托盤2供給新IC元件100、或已與收納有IC元件100之其他供給托盤2交換之後,供給托盤2再次向區域S內移動。同樣地,於重複之途中,若IC元件100已收納於回收托盤3之所有凹穴31中,則回收托盤3向區域S外移動。然後,卸除收納於回收托盤3中之IC元件100,或將回收托盤3更換成其他空回收托盤3,之後回收托盤3再次向區域S內移動。 From then on, repeat steps 7 through 10 above. Further, in the middle of the repetition, when all of the IC elements 100 accommodated in the supply tray 2 have moved to the first shuttle 4, the supply tray 2 moves outside the region S. Then, after the new IC device 100 is supplied to the supply tray 2 or exchanged with the other supply tray 2 in which the IC component 100 is stored, the supply tray 2 moves again in the region S. Similarly, in the middle of the repetition, if the IC component 100 is housed in all the pockets 31 of the recovery tray 3, the recovery tray 3 moves outside the region S. Then, the IC component 100 stored in the recovery tray 3 is removed, or the recovery tray 3 is replaced with another empty recovery tray 3, and then the recovery tray 3 is again moved into the region S.

根據此種方法,可以較佳效率進行IC元件100之檢查。具體而言,檢查用機器人9具有第1手單元92及第2手單元93,例如,於正利用檢查用插口6檢查第1手單元92(關於第2手單元93亦相同)所保持之IC元件100之狀態下,第2手單元93同時將已完成檢查之IC元件100收納於托盤53中,並且保持下個要檢查之IC元件100而等待。如此,可 使用2個手單元,分別同時地進行不同之作業,藉此可削減無需之時間,而有效率地進行IC元件100之檢查。 According to this method, the inspection of the IC component 100 can be performed with higher efficiency. Specifically, the inspection robot 9 includes the first hand unit 92 and the second hand unit 93. For example, the IC that is being held by the first hand unit 92 (the same as the second hand unit 93) is being inspected by the inspection socket 6. In the state of the component 100, the second hand unit 93 simultaneously stores the IC component 100 that has been inspected in the tray 53, and waits for the next IC component 100 to be inspected. So, you can By using two hand units and performing different operations at the same time, it is possible to reduce the unnecessary time and efficiently perform inspection of the IC component 100.

<第2實施形態> <Second embodiment>

其次,對本發明之檢查裝置之第2實施形態進行說明。 Next, a second embodiment of the inspection apparatus of the present invention will be described.

圖21係表示本發明之第2實施形態之檢查裝置所具有之供給機器人之手單元之平面圖,圖22係圖21所示之手單元所具有之支持部之平面圖。 Fig. 21 is a plan view showing a hand unit for supplying a robot included in the inspection apparatus according to the second embodiment of the present invention, and Fig. 22 is a plan view showing a support portion of the hand unit shown in Fig. 21.

以下,以與上述實施形態之不同點為中心,對第2實施形態之檢查裝置進行說明,關於相同之事項,省略其說明。 In the following, the inspection apparatus according to the second embodiment will be described focusing on differences from the above-described embodiment, and the description of the same matters will be omitted.

本發明之第2實施形態之檢查裝置除了供給機器人及回收機器人之手單元所具有之Y方向移動機構之構成不同以外,其他與上述第1實施形態相同。再者,對與上述第1實施形態相同之構成,標註相同符號。又,於本實施形態中,供給機器人所具有之手單元與回收機器人所具有之手單元之構成彼此相同,故而以下,以供給機器人所具有之手單元為代表而進行說明,關於回收機器人所具有之手單元,省略其說明。 The inspection apparatus according to the second embodiment of the present invention is the same as the above-described first embodiment except that the configuration of the Y-direction moving mechanism included in the hand unit of the robot and the collection robot is different. The same components as those in the above-described first embodiment are denoted by the same reference numerals. Further, in the present embodiment, the configuration of the hand unit included in the supply robot and the hand unit included in the collection robot are the same, and therefore, the hand unit included in the supply robot will be described as a representative, and the collection robot has The hand unit is omitted.

如圖21所示,本實施形態之手單元7c所具有之Y方向移動機構77'包括:第1支持部用單元1100,其設置於第1支持部71上;第2支持部用單元1200,其設置於第2支持部72上;第3支持部用單元1300,其設置於第3支持部73上;第4支持部用單元1400,其設置於第4支持部74上;及驅動機構1500,其驅動各單元1100、1200、1300、1400。 As shown in FIG. 21, the Y-direction moving mechanism 77' included in the hand unit 7c of the present embodiment includes a first support portion unit 1100 provided on the first support portion 71, and a second support portion unit 1200. The third support portion unit 1300 is provided on the third support portion 73, the fourth support portion unit 1400 is disposed on the fourth support portion 74, and the drive mechanism 1500. It drives each unit 1100, 1200, 1300, 1400.

驅動機構1500包括:一對滑輪(第1移動機構用第1引導輪、第1移動機構用第2引導輪)1508、1509,其設置於第2基底752上;皮帶(第1移動機構用第1環形驅動索)1510,其架設於一對滑輪1508、1509之間;花鍵軸(動力傳遞軸)1501,其同軸固定於滑輪1509上,且沿X方向延伸;4個花鍵螺帽1502、1503、1504、1505,其設置於花鍵軸 1501之外周;及馬達1507,其使滑輪1508旋轉。 The drive mechanism 1500 includes a pair of pulleys (a first guide wheel for the first movement mechanism and a second guide wheel for the first movement mechanism) 1508 and 1509 which are provided on the second base 752 and a belt (for the first movement mechanism) 1 ring drive cable 1510, which is mounted between a pair of pulleys 1508, 1509; a spline shaft (power transmission shaft) 1501 coaxially fixed to the pulley 1509 and extending in the X direction; 4 spline nuts 1502 , 1503, 1504, 1505, which are set on the spline shaft The outer circumference of 1501; and a motor 1507 that rotates the pulley 1508.

馬達1507固定於第2基底752上。若驅動馬達1507,則其驅動力經由皮帶1510傳遞至滑輪1509,而使花鍵軸1501繞其軸旋轉。以此方式,藉由將馬達1507固定於基部75上,可使馬達1507穩定地驅動,並且可防止第1~第4支持部71~74之重量之增加。 The motor 1507 is fixed to the second base 752. When the motor 1507 is driven, its driving force is transmitted to the pulley 1509 via the belt 1510, and the spline shaft 1501 is rotated about its axis. In this manner, by fixing the motor 1507 to the base portion 75, the motor 1507 can be stably driven, and the weight of the first to fourth support portions 71 to 74 can be prevented from increasing.

4個花鍵螺帽1502、1503、1504、1505分別相對於花鍵軸1501向其軸向自如移動,但繞其軸之旋轉受到限制。即,若花鍵軸1501藉由馬達1507而旋轉,則花鍵螺帽1502、1503、1504、1505亦分別旋轉。 The four spline nuts 1502, 1503, 1504, 1505 are axially movable relative to the spline shaft 1501, respectively, but the rotation about their axes is restricted. That is, if the spline shaft 1501 is rotated by the motor 1507, the spline nuts 1502, 1503, 1504, and 1505 are also rotated, respectively.

又,花鍵螺帽1502、1503、1504、1505之中,花鍵螺帽1502旋轉自如地支持於第1支持部71上,花鍵螺帽1503旋轉自如地支持於第2支持部72上,花鍵螺帽1504旋轉自如地支持於第3支持部73上,花鍵螺帽1505旋轉自如地支持於第4支持部74上。 Further, among the spline nuts 1502, 1503, 1504, and 1505, the spline nut 1502 is rotatably supported by the first support portion 71, and the spline nut 1503 is rotatably supported by the second support portion 72. The spline nut 1504 is rotatably supported by the third support portion 73, and the spline nut 1505 is rotatably supported by the fourth support portion 74.

再者,如上所述,花鍵螺帽1503、1504、1505相對於花鍵軸1501向其軸向(X方向)自如移動,故而Y方向移動機構77'不會阻礙第2、第3、第4支持部72、73、74藉由X方向移動機構76向X方向之移動。 Further, as described above, the spline nuts 1503, 1504, and 1505 are freely movable in the axial direction (X direction) with respect to the spline shaft 1501, so that the Y-direction moving mechanism 77' does not hinder the second, third, and third The support portions 72, 73, and 74 are moved in the X direction by the X-direction moving mechanism 76.

如圖22所示,第1支持部用單元1100包括一對滑輪(第1移動機構用第3引導輪、第1移動機構用第4引導輪)1101、1102、及架設於一對滑輪1101、1102之間之皮帶(第1移動機構用第2環形驅動索)1103。其中,滑輪1101同軸固定於花鍵螺帽1502上,與花鍵螺帽1502一併繞花鍵軸1501之軸旋轉。又,滑輪1102係相對於滑輪1101於Y方向上相隔,且旋轉自如地支持於第1支持部71上。而且,於該等滑輪1101、1102之間架設有皮帶1103。皮帶1103於滑輪1101、1102之間具有沿Y方向延伸之2個區域1103a、1104b,於區域1103a內第1移動部715固定於皮帶1103上。再者,花鍵螺帽1503亦可兼作滑輪1101。 As shown in FIG. 22, the first support unit 1100 includes a pair of pulleys (a third guide wheel for the first movement mechanism, a fourth guide wheel for the first movement mechanism) 1101, 1102, and a pair of pulleys 1101. A belt between 1102 (a second loop drive cable for the first moving mechanism) 1103. The pulley 1101 is coaxially fixed to the spline nut 1502 and rotates together with the spline nut 1502 about the axis of the spline shaft 1501. Further, the pulley 1102 is spaced apart from the pulley 1101 in the Y direction, and is rotatably supported by the first support portion 71. Further, a belt 1103 is placed between the pulleys 1101 and 1102. The belt 1103 has two regions 1103a and 1104b extending in the Y direction between the pulleys 1101 and 1102, and the first moving portion 715 is fixed to the belt 1103 in the region 1103a. Furthermore, the spline nut 1503 can also double as the pulley 1101.

第2支持部用單元1200之構成與上述第1支持部用單元1100之構成 相同。第2支持部用單元1200包括一對滑輪(第1移動機構用第5引導輪、第1移動機構用第6引導輪)1201、1202、及架設於一對滑輪1201、1202之間之皮帶(第1移動機構用第3環形驅動索)1203。其中,滑輪1201同軸固定於花鍵螺帽1503上,與花鍵螺帽1503一併繞花鍵軸1501旋轉。又,滑輪1202係相對於滑輪1201於Y方向上相隔,且旋轉自如地支持於第2支持部72上。而且,於該等滑輪1201、1202之間架設有皮帶1203。皮帶1203於滑輪1201、1202之間具有沿Y方向延伸之2個區域1203a、1204b,於區域1203a內第2移動部725固定於皮帶1203上。 The configuration of the second support unit unit 1200 and the configuration of the first support unit unit 1100 the same. The second support unit 1200 includes a pair of pulleys (a fifth guide wheel for the first movement mechanism, a sixth guide wheel for the first movement mechanism) 1201 and 1202, and a belt that is placed between the pair of pulleys 1201 and 1202 ( The first moving mechanism uses a third ring-shaped driving cable 1203. The pulley 1201 is coaxially fixed to the spline nut 1503 and rotates around the spline shaft 1501 together with the spline nut 1503. Further, the pulley 1202 is spaced apart from the pulley 1201 in the Y direction, and is rotatably supported by the second support portion 72. Further, a belt 1203 is placed between the pulleys 1201 and 1202. The belt 1203 has two regions 1203a and 1204b extending in the Y direction between the pulleys 1201 and 1202, and the second moving portion 725 is fixed to the belt 1203 in the region 1203a.

第3支持部用單元1300之構成亦與上述第1支持部用單元1100之構成相同。第3支持部用單元1300包括一對滑輪(第1移動機構用第7引導輪、第1移動機構用第8引導輪)1301、1302、及架設於一對滑輪1301、1302之間之皮帶(第1移動機構用第4環形驅動索)1303。其中,滑輪1301同軸固定於花鍵螺帽1504上,與花鍵螺帽1504一併繞花鍵軸1501旋轉。又,滑輪1302係相對於滑輪1301於Y方向上相隔,且旋轉自如地支持於第3支持部73上。而且,於該等滑輪1301、1302之間架設有皮帶1303。皮帶1303於滑輪1301、1302之間具有沿Y方向延伸之2個區域1303a、1304b,於區域1303a內第3移動部735固定於皮帶1303上。 The configuration of the third support unit unit 1300 is also the same as the configuration of the first support unit unit 1100 described above. The third support unit 1300 includes a pair of pulleys (a seventh guide wheel for the first movement mechanism, an eighth guide wheel for the first movement mechanism) 1301, 1302, and a belt that is placed between the pair of pulleys 1301 and 1302 ( The first moving mechanism uses a fourth ring drive cable 1303. The pulley 1301 is coaxially fixed to the spline nut 1504 and rotates around the spline shaft 1501 together with the spline nut 1504. Further, the pulley 1302 is spaced apart from the pulley 1301 in the Y direction, and is rotatably supported by the third support portion 73. Further, a belt 1303 is placed between the pulleys 1301 and 1302. The belt 1303 has two regions 1303a and 1304b extending in the Y direction between the pulleys 1301 and 1302, and the third moving portion 735 is fixed to the belt 1303 in the region 1303a.

第4支持部用單元1400之構成亦與上述第1支持部用單元1100之構成相同。第4支持部用單元1400包括一對滑輪(第1移動機構用第9引導輪、第1移動機構用第10引導輪)1401、1402、及架設於一對滑輪1401、1402之間之皮帶(第1移動機構用第5環形驅動索)1403。其中,滑輪1401同軸固定於花鍵螺帽1505上,且與花鍵螺帽1505一併繞花鍵軸1501旋轉。又,滑輪1402係相對於滑輪1401於Y方向上相隔,且旋轉自如地支持於第4支持部74上。而且,於該等滑輪1401、1402之間 架設有皮帶1403。皮帶1403於滑輪1401、1402之間具有沿Y方向延伸之2個區域1403a、1404b,於區域1403a內第4移動部745係固定於皮帶1403上。 The configuration of the fourth support unit unit 1400 is also the same as the configuration of the first support unit unit 1100 described above. The fourth support unit 1400 includes a pair of pulleys (a first guide wheel for a first movement mechanism, a first guide wheel for a first movement mechanism) 1401, 1402, and a belt that is placed between the pair of pulleys 1401 and 1402 ( The first moving mechanism uses a fifth ring-shaped driving cable 1403. The pulley 1401 is coaxially fixed to the spline nut 1505 and rotates together with the spline nut 1505 around the spline shaft 1501. Further, the pulley 1402 is spaced apart from the pulley 1401 in the Y direction, and is rotatably supported by the fourth support portion 74. Moreover, between the pulleys 1401, 1402 A belt 1403 is provided. The belt 1403 has two regions 1403a and 1404b extending in the Y direction between the pulleys 1401 and 1402, and the fourth moving portion 745 is fixed to the belt 1403 in the region 1403a.

再者,滑輪1101、1102、1201、1202、1301、1302、1401、1402分別具有相等之外徑。 Furthermore, the pulleys 1101, 1102, 1201, 1202, 1301, 1302, 1401, 1402 have equal outer diameters, respectively.

於此種構成之Y方向移動機構77'中,若藉由馬達1507使花鍵軸1501旋轉,而將其旋轉力傳遞至各滑輪1101、1201、1301、1401,使各皮帶1103、1203、1303、1403旋轉,則於區域1103a、1203a、1303a、1403a中,皮帶1103、1203、1303、1403向Y方向之相同側以相等之速度進給。從而,若皮帶1103、1203、1303、1403旋轉,則各移動部715、725、735、745相對於各支持部71、72、73、74於Y方向上一體地且以相等之距離移動。 In the Y-direction moving mechanism 77' having such a configuration, when the spline shaft 1501 is rotated by the motor 1507, the rotational force is transmitted to the respective pulleys 1101, 1201, 1301, and 1401, so that the respective belts 1103, 1203, and 1303 are provided. When the rotation of 1403 is performed, in the regions 1103a, 1203a, 1303a, and 1403a, the belts 1103, 1203, 1303, and 1403 are fed at equal speeds on the same side in the Y direction. Therefore, when the belts 1103, 1203, 1303, and 1403 are rotated, the respective moving portions 715, 725, 735, and 745 are integrally and equally moved in the Y direction with respect to the respective support portions 71, 72, 73, and 74.

根據此種構成之Y方向移動機構77,可確實地一面將吸附嘴713、718之相隔距離、吸附嘴723、728之相隔距離、吸附嘴733、738之相隔距離、及吸附嘴743、748之相隔距離維持為彼此相等,一面變更該等相隔距離。又,於Y方向移動機構77中,每個支持部71~74均設置有專用之單元,故而可更確實地使各移動部715~745向Y方向移動。 According to the Y-direction moving mechanism 77 having such a configuration, the distance between the suction nozzles 713 and 718, the distance between the suction nozzles 723 and 728, the distance between the suction nozzles 733 and 738, and the suction nozzles 743 and 748 can be surely separated. The distances are kept equal to each other, and the distances are changed. Further, in the Y-direction moving mechanism 77, each of the support portions 71 to 74 is provided with a dedicated unit, so that the respective moving portions 715 to 745 can be more reliably moved in the Y direction.

於此種第2實施形態中,亦可發揮與上述第1實施形態相同之效果。 In the second embodiment, the same effects as those of the first embodiment described above can be exerted.

再者,於上述驅動機構1500中,形成將花鍵軸1501與花鍵螺帽1502~1505組合之構成,但只要可發揮與該等相同之機能,則驅動機構1500之構成並無特別限定。 Further, in the drive mechanism 1500, the spline shaft 1501 and the spline nut 1502 to 1505 are combined. However, the configuration of the drive mechanism 1500 is not particularly limited as long as the same function as the above is exerted.

以上,基於圖示之實施形態,對本發明之處理器及檢查裝置進行了說明,但本發明並不限定於此,各部之構成可置換成具有相同功能之任意之構成。又,於本發明中,亦可添加其他任意之構成物。 又,亦可將各實施形態適當地組合。 Although the processor and the inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any configuration having the same function. Further, in the present invention, any other constituents may be added. Further, each embodiment can be combined as appropriate.

1‧‧‧檢查裝置 1‧‧‧Checking device

2‧‧‧供給托盤 2‧‧‧Supply tray

3‧‧‧回收托盤 3‧‧‧Recycling tray

4‧‧‧第1梭子 4‧‧‧1st shuttle

5‧‧‧第2梭子 5‧‧‧2nd shuttle

6‧‧‧檢查用插口 6‧‧‧Check socket

7‧‧‧供給機器人 7‧‧‧Supply robot

7a‧‧‧支持框 7a‧‧‧Support box

7b‧‧‧移動框 7b‧‧‧ moving box

7c‧‧‧手單元 7c‧‧‧Hand unit

8‧‧‧回收機器人 8‧‧‧Recycling robot

8a‧‧‧支持框 8a‧‧‧Support box

8b‧‧‧移動框 8b‧‧‧ moving box

8c‧‧‧手單元 8c‧‧‧Hand unit

9‧‧‧檢查用機器人 9‧‧‧Check robot

10‧‧‧控制裝置 10‧‧‧Control device

21‧‧‧凹穴 21‧‧‧ recess

23‧‧‧軌道 23‧‧‧ Track

31‧‧‧凹穴 31‧‧‧ recess

33‧‧‧軌道 33‧‧‧ Track

41‧‧‧基底構件 41‧‧‧Base member

42‧‧‧托盤 42‧‧‧Tray

43‧‧‧托盤 43‧‧‧Tray

44‧‧‧軌道 44‧‧‧ Track

51‧‧‧基底構件 51‧‧‧Base member

52‧‧‧托盤 52‧‧‧Tray

53‧‧‧托盤 53‧‧‧Tray

54‧‧‧軌道 54‧‧‧ Track

61‧‧‧檢查用個別插口 61‧‧‧Inspection with individual sockets

92‧‧‧手單元 92‧‧‧Hand unit

93‧‧‧手單元 93‧‧‧Hand unit

100‧‧‧IC元件 100‧‧‧IC components

101‧‧‧檢查控制部 101‧‧‧Check Control Department

102‧‧‧驅動控制部 102‧‧‧Drive Control Department

421‧‧‧凹穴 421‧‧‧ recess

431‧‧‧凹穴 431‧‧‧ recesses

500‧‧‧第2攝像機 500‧‧‧2nd camera

521‧‧‧凹穴 521‧‧‧ recess

531‧‧‧凹穴 531‧‧‧ recess

600‧‧‧第1攝像機 600‧‧‧1st camera

911‧‧‧框 911‧‧‧ box

912‧‧‧框 912‧‧‧ box

913‧‧‧手單元支持部 913‧‧‧Hand Unit Support

914‧‧‧手單元支持部 914‧‧‧Hand Unit Support

S‧‧‧區域 S‧‧‧ area

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

Claims (11)

一種處理器,其特徵在於:當將相互正交之3個方向設為第1方向、第2方向及第3方向時,該處理器包括:基部;第1支持部,其被支持於上述基部上;第2支持部,其被支持為可相對於上述基部沿上述第1方向移動;第3支持部,其被支持為可相對於上述基部沿上述第1方向移動,且能夠以較上述第2支持部之移動量更多的移動量進行移動。 A processor, wherein when the three directions orthogonal to each other are the first direction, the second direction, and the third direction, the processor includes: a base; and a first support portion supported by the base The second support portion is supported to be movable in the first direction with respect to the base portion, and the third support portion is supported to be movable in the first direction with respect to the base portion, and is capable of being movable in the first direction 2 The amount of movement of the support part is more mobile. 如請求項1之處理器,其中上述第3支持部之移動量於上述第1方向上為上述第2支持部之移動量的2倍。 The processor of claim 1, wherein the amount of movement of the third support portion is twice the amount of movement of the second support portion in the first direction. 如請求項1或2之處理器,其更包括:第2移動機構,其可使上述第2支持部沿上述第1方向移動,且可使上述第3支持部以上述第2支持部之移動量之2倍的移動量沿上述第1方向移動。 The processor of claim 1 or 2, further comprising: a second moving mechanism that moves the second support portion in the first direction and allows the third support portion to move by the second support portion The amount of movement twice the amount moves in the first direction described above. 如請求項1或2之處理器,其中上述第2移動機構包括:於上述第1方向上相隔的第2移動機構用第1引導輪及第2移動機構用第2引導輪;第2移動機構用環形驅動索,其架設於上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪之間;以及第2移動機構用驅動源,其使上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪之至少一者旋轉而使上述第2移動機構用環形驅動索旋轉;且至少上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪分別可旋轉地被支持於上述基部上。 The processor of claim 1 or 2, wherein the second moving mechanism includes a second guiding mechanism for the second moving mechanism and a second guiding wheel for the second moving mechanism that are spaced apart from each other in the first direction; and a second moving mechanism a ring-shaped driving cable that is disposed between the first guiding mechanism for the second moving mechanism and the second guiding wheel for the second moving mechanism; and a driving source for the second moving mechanism that uses the second moving mechanism At least one of the guide wheel and the second guide wheel for rotating the second movement mechanism rotates the second movement mechanism by the ring drive cable; and at least the second movement mechanism first guide wheel and the second movement mechanism The second guide wheel is rotatably supported on the base portion, respectively. 如請求項4之處理器,其中上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪包括小徑滑輪、及直徑為上述小徑滑輪之2倍的大徑滑輪;上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪之各自的上述小徑滑輪架設有第2移動機構用第1環形驅動索;上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪之各自的上述大徑滑輪架設有第2移動機構用第2環形驅動索;上述第2支持部連結於第2移動機構用第1環形驅動索;上述第3支持部連結於第2移動機構用第2環形驅動索。 The processor of claim 4, wherein the second moving mechanism first guiding wheel and the second moving mechanism second guiding wheel comprise a small diameter pulley and a large diameter pulley having a diameter twice the diameter of the small diameter pulley; The small-diameter pulley frame of each of the first guide wheel for the second moving mechanism and the second guide wheel for the second moving mechanism is provided with a first ring-shaped driving cable for the second moving mechanism, and the first guiding device for the second moving mechanism is for the first guiding device. a second ring-shaped driving cable for the second moving mechanism is disposed on the large-diameter pulley frame of each of the second moving mechanism second guiding wheels; and the second supporting portion is coupled to the second ring-shaped driving cable for the second moving mechanism; The third support unit is coupled to the second loop drive cable for the second movement mechanism. 如請求項5之處理器,其更包括:第1零件保持部,其可移動地設置於上述第1支持部上,且設置為可相對於上述基部沿上述第3方向移動;第1移動部,其可移動地設置於上述第1支持部上,且可相對於上述基部沿上述第2方向移動;第2零件保持部,其可移動地設置於上述第1移動部上,且可相對於上述基部沿上述第3方向移動;第3零件保持部,其可移動地設置於上述第2支持部上,且可相對於上述基部沿上述第3方向移動;第2移動部,其可移動地設置於上述第2支持部上,且可相對於上述基部沿上述第2方向移動;第4零件保持部,其可移動地設置於上述第2移動部上,且可相對於上述基部沿上述第3方向移動;第5零件保持部,其可移動地設置於上述第3支持部上,且可相對於上述基部沿上述第3方向移動; 第3移動部,其可移動地設置於上述第3支持部上,且可相對於上述基部沿上述第2方向移動;第6零件保持部,其可移動地設置於上述第3移動部上,且可相對於上述基部沿上述第3方向移動。 The processor of claim 5, further comprising: a first component holding portion movably provided on the first support portion and configured to be movable in the third direction with respect to the base portion; the first moving portion And movably disposed on the first support portion and movable in the second direction with respect to the base portion; the second component holding portion is movably disposed on the first moving portion, and is detachable from the first movable portion The base portion moves in the third direction; the third component holding portion is movably provided on the second support portion and movable in the third direction with respect to the base portion; and the second moving portion is movably Provided on the second support portion and movable in the second direction with respect to the base portion; the fourth component holding portion is movably provided on the second moving portion, and is movable along the base portion Moving in three directions; a fifth component holding portion movably provided on the third support portion and movable in the third direction with respect to the base portion; The third moving portion is movably provided on the third support portion and movable in the second direction with respect to the base portion, and the sixth component holding portion is movably provided on the third moving portion. And moving in the third direction relative to the base. 如請求項6之處理器,其更包括:第1移動機構,其使上述第1移動部及上述第2移動部可沿上述第2方向移動。 The processor of claim 6, further comprising: a first moving mechanism that moves the first moving portion and the second moving portion in the second direction. 如請求項7之處理器,其中上述第1移動機構之至少一部分被支持於上述基部上。 The processor of claim 7, wherein at least a portion of said first moving mechanism is supported on said base. 如請求項8之處理器,其中上述第1移動機構包括:於上述第2方向上相隔的第1移動機構用第1引導輪及第1移動機構用第2引導輪;第1移動機構用第1環形驅動索,其架設於上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪之間;以及第1移動機構用驅動源,其使上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪之至少一者旋轉而使上述第1移動機構用第1環形驅動索旋轉;且至少上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪分別可旋轉地被支持於上述基部上。 The processor of claim 8, wherein the first moving mechanism includes a first guiding mechanism for the first moving mechanism and a second guiding wheel for the first moving mechanism that are spaced apart from each other in the second direction; a ring-shaped driving cable that is disposed between the first moving mechanism first guiding wheel and the first moving mechanism second guiding wheel; and a first moving mechanism driving source that makes the first moving mechanism At least one of the guide wheel and the second guide wheel for rotating the first movement mechanism rotates the first movement mechanism by the first ring drive cable; and at least the first guide wheel for the first movement mechanism and the first The moving mechanism is rotatably supported by the base portion by the second guide wheels. 如請求項9之處理器,其中上述第1移動部及上述第2移動部分別直接或間接地連結於上述第1移動機構用第1環形驅動索上,且隨著上述第1移動機構用第1環形驅動索之旋轉,上述第1移動部相對於上述第1支持部沿上述第2方向移動,並且上述第2移動部相對於上述第2支持部沿上述第2方向移動。 The processor of claim 9, wherein the first moving unit and the second moving unit are directly or indirectly connected to the first moving mechanism first first driving cable, and the first moving mechanism is used When the ring drive cable rotates, the first moving portion moves in the second direction with respect to the first support portion, and the second moving portion moves in the second direction with respect to the second support portion. 如請求項10之處理器,其中上述第1零件保持部、上述第2零件保持部、上述第3零件保持部及上述第4零件保持部分別具有藉由吸附而保持對象物之吸附嘴。 The processor of claim 10, wherein the first component holding portion, the second component holding portion, the third component holding portion, and the fourth component holding portion each have a suction nozzle that holds an object by suction.
TW104126144A 2012-06-28 2013-06-25 Processor TWI603419B (en)

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