JP6660440B1 - Electronic component inspection system for burn-in test - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection part for inspecting an electronic component, an electronic component inspection system for a burn-in test and an electronic component inspection device in which the possibility of damaging the electronic component is reduced. A burn-in test electronic component inspection system (10) includes a delivery table (20) on which electronic components are placed, a first delivery section (30) that delivers the electronic components placed on the delivery table (20) to a first position (P3), and a plan view. Then, the inspection unit 60 is arranged at a position different from the movement path of the first transport unit 30 and inspects the electronic component, and the electronic component at the first position P3 in plan view passes through the position of the inspection unit 60. The second transfer unit 70 that transfers the first transfer unit 30 to the movable second position P7 and the electronic component that has been transferred to the first position P3 by the first transfer unit 30 from the burn-in test board 12 And a third transport unit 50 to be inserted into the. [Selection diagram] Fig. 1

Description

The present invention also relates to a burn-in test for the electronic component inspection system.

  Patent Literature 1 can significantly reduce the number of device insertion errors, speed up the operation including classification work according to device functional test results, and reduce the time required for setup change of a device to be tested. A burn-in board loader-unloader device is described. This loader-unloader device includes suction head means for inserting and removing a semiconductor device from the burn-in board. The suction head means has four suction heads, and a line connecting the centers of these suction heads is substantially formed. The pitch of the two axes, which are two sides, is variable. Further, the loader-unloader device includes an image processing system that detects a socket position error, a socket damage, a device suction position error, and the like, and controls the insertion / removal operation accordingly.

JP-A-2000-111613

The present invention aims to provide an inspection unit and the electronic component testing system for burn-in test that possibility is reduced that the electronic component damage inspecting electronic components.

  According to the first aspect of the present invention, there is provided a delivery table on which an electronic component is mounted, a first transfer unit configured to transfer the electronic component mounted on the transfer table to a first position, and the first transfer in a plan view. An inspection unit for inspecting the electronic component, which is disposed at a position different from the movement path of the unit, and the first transport of the electronic component at the first position in plan view through the inspection unit position A second transport unit that transports the electronic component to a second position where the unit is movable, and a third transport unit that inserts the electronic component transported to the first position by the first transport unit into a burn-in test board. And a burn-in test electronic component inspection system comprising:

  According to a second aspect of the present invention, in the first aspect of the present invention, the second transport unit is located at a position separated from the first position in a direction intersecting the movement path in a plan view. , A suction collet that sucks and transports the electronic component placed on the first movement platform, and the electronic component transported by the suction collet sandwiches the inspection unit. A second moving table that is delivered at a fourth position opposite to the third position and moves from the fourth position to the second position.

  According to a third aspect of the present invention, in the second aspect of the present invention, the inspection unit includes a contact terminal that contacts a terminal of the electronic component, and a lifting mechanism that moves the contact terminal up and down.

The present invention can provide an inspection unit and the electronic component testing system for burn-in test that possibility is reduced that the electronic component damage inspecting electronic components.

It is a top view explaining composition of an electronic parts inspection system for a burn-in test concerning one embodiment of the present invention. It is explanatory drawing which shows the operation | movement along the axis AX1 of the electronic component inspection system for a burn-in test from a side view. It is explanatory drawing which shows the operation | movement along axis AX2 of the electronic component inspection system for a burn-in test from a side view. FIG. 4 is an explanatory diagram illustrating a transport path (outward path) in which electronic components are transported from a position P1 to a burn-in test board. FIG. 3 is an explanatory diagram illustrating a transfer path (return path) in which an electronic component is transferred from a burn-in test board to a position P1.

  Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. In the drawings, parts that are not relevant to the description may be omitted.

An electronic component inspection system for a burn-in test (hereinafter, referred to as an “electronic component inspection system”) 10 (see FIG. 1) according to an embodiment of the present invention uses a carrier tape wound on a reel 90 (see FIG. 4). The electronic components can be taken out and inserted into a plurality of sockets 122 provided on the burn-in test board 12.
After the burn-in test, the electronic component inspection system 10 removes the electronic component from the socket 122 on the burn-in test board 12, inspects the electrical characteristics of the electronic component, and then sticks (not shown) or carrier tape (not shown). Can be stored.
The electronic component is, for example, a surface-mount type semiconductor device.

As shown in FIG. 1, in a case where the XY orthogonal coordinate system is set by viewing the electronic component inspection system 10 in a plan view, the axes AX1 and AX2 are axes extending in the X-axis direction, respectively. They are arranged at positions spaced apart by a distance D in a direction intersecting with the axis AX1 (for example, in the Y-axis direction).
The position P1, the position P2, the position P7 (an example of the second position), and the position P3 (an example of the first position) are respectively on the axis AX1, and are sequentially arranged at intervals in the X-axis direction.
The position P6 (an example of the fourth position), the position P5, and the position P4 (an example of the third position) are located on AX2, and are sequentially arranged at intervals in the X-axis direction.

  As shown in FIGS. 1 and 2, the electronic component inspection system 10 includes a delivery table 20, a transport unit (an example of a first transport unit) 30, a board transport unit 40, and a transport unit (an example of a third transport unit). 50.

On the delivery table 20, four electronic components taken out from the carrier tape wound on the reel 90 (see FIG. 4) are placed side by side. The transfer table 20 sucks these electronic components and can move between the position P1 and the position P2 as indicated by an arrow A1.
On the upper surface of the transfer table 20, four mounting positions on which the four electronic components are mounted are provided at intervals in the X-axis direction. One set of these four places is further provided at an interval in the Y-axis direction. Two sets (eight places in total) of mounting places are provided in accordance with the package of the electronic component, and one of the mounting places is used according to the package of the electronic component.

The transport section 30 has a suction collet 302 shown in FIG. The suction collet 302 moves up and down along the Z-axis orthogonal to the X-axis and the Y-axis, moves along the axis AX1 (see FIG. 1), and moves the four electrons placed on the transfer table 20 at the position P2. The components can be simultaneously sucked and conveyed to a first moving table 72a, which will be described later, at the position P3.
In addition, the suction collet 302 can simultaneously suck four electronic components placed on a second moving table 72b, which will be described later, at the position P7 and convey the electronic components to the transfer table 20 at the position P2.

  The board transfer section 40 can move the burn-in test board 12 along the Y axis as shown by the arrow A2, and can position the burn-in test board 12 at a predetermined position.

  The transport section 50 (see FIG. 2) has a suction collet 502. The suction collet 502 moves up and down along the Z-axis and moves along the axis AX1 (see FIG. 1), and simultaneously moves four electronic components mounted on a first moving table 72a described later at a position P3. By sucking, each electronic component can be inserted into the socket 122 arranged on the burn-in test board 12.

The electronic component inspection system 10 further includes an inspection unit 60 and a transport unit (an example of a second transport unit) 70 (see FIG. 3).
The inspection unit 60 has four sets of contact terminals 602 (see FIG. 1) that respectively contact the terminals of the four electronic components, and can inspect the electrical characteristics of the electronic components contacted by the contact terminals 602.
In addition, the inspection unit 60 has an elevating mechanism 604 (see FIG. 3) that elevates the contact terminal 602.
The inspection unit 60 is arranged at a position P5. That is, the inspection unit 60 is disposed at a position different from the axis AX1 (see FIG. 1) that is a movement path of the suction collet 302 in plan view. That is, the suction collet 302 does not interfere with the expensive contact terminal 602.

The transport unit 70 can transport the four electronic components at the position P3 in plan view to the position P7 where the suction collet 302 can move through the inspection unit 60.
In detail, the transport unit 70 includes at least a first moving table 72a, a suction collet 74, and a second moving table 72b as shown in FIG.

On the upper surface of the first moving table 72a, mounting places for electronic components are provided at four places and two sets (a total of eight places), similarly to the transfer table 20.
At the position P3, the four electronic components conveyed from the transfer table 20 by the suction collet 302 or the four electronic components extracted from the burn-in test board 12 by the suction collet 502 are placed on the first moving table 72a at the position P3. .
The first moving table 72a can suck these electronic components and move between the position P3 and the position P4 as indicated by an arrow A3.

  The suction collet 74 moves up and down and moves along the axis AX2 (see FIG. 1), and simultaneously sucks the four electronic components placed on the first movable table at the position P4 to position P5 or position P6. Can be transported up to

On the upper surface of the second moving table 72b, mounting places for electronic components are provided at four places and two sets (eight places in total), similarly to the transfer table 20.
At the position P6, the four electronic components conveyed from the first movable table 72a via the inspection unit 60 by the suction collet 74 are placed on the second movable table 72b.
The second moving table 72b sucks these electronic components and can move between the position P6 and the position P7 as indicated by an arrow A4. Note that the position P6 is located on the opposite side of the position P4 across the inspection unit 60 located at the position P5.

In the electronic component inspection system 10 described above, as shown by the arrows in FIG. 4, the electronic components taken out of the carrier tape wound on the reel 90 and placed on the delivery table 20 are moved to the positions P1, P2, and P3. It is inserted into the socket 122 on the burn-in test board 12 sequentially. The burn-in test board 12 into which the electronic components have been inserted is carried out of the electronic component inspection system 10 and subjected to a burn-in test.
After the burn-in test, the burn-in test board 12 is carried into the electronic component inspection system 10 again, and the electronic components are removed from the socket 122 as shown by arrows in FIG. After sequentially passing through P7, position P2, and position P1, it is finally stored in a stick (not shown) or a carrier tape (not shown).

  Next, a detailed operation of the electronic component inspection system 10 will be described. The electronic component inspection system 10 can inspect an electronic component according to the following steps.

(Step S1-1)
Transport means (not shown) takes out four electronic components from the carrier tape wound on the reel 90 (see FIG. 4) and transports them to the delivery table 20 at the position P1. Note that the carrier tape on the reel 90 is pulled out in the negative direction of the Y axis, as indicated by an arrow A5.
The delivery table 20 that has received the electronic component sucks the electronic component and moves to the position P2.

(Step S1-2)
The suction collet 302 (see FIG. 2) sucks the electronic component placed on the transfer table 20 and transports it to the first moving table 72a at the position P3.

(Step S1-3)
The suction collet 502 sucks the electronic component placed on the first moving table 72 a and inserts it into the socket 122 on the burn-in test board 12. At this time, the electronic component passes above the camera CAM1, and the amount of displacement of the electronic component in the X-axis direction and the direction of the Y-axis and the amount of displacement of the angle around the Z-axis are measured by image recognition. The suction collet 502 inserts each electronic component into the socket 122 after correcting the measured positional deviation amount and angular deviation amount.
When the electronic components are inserted into the rows of the sockets 122 arranged in the X-axis direction, the board transport unit 40 moves the burn-in test board 12 by the pitch of the adjacent sockets 122 so that the electronic components can be inserted into the rows of the adjacent sockets 122. Only in the negative direction of the Y axis.
Thereafter, steps S1-1 to S1-3 described above are repeated until electronic components are inserted into all sockets 122.

(Step S2-1)
When the electronic components are inserted into all the sockets 122, the board transport unit 40 sends the burn-in test board 12 in the positive direction of the Y axis, and the burn-in test board 12 is carried out of the electronic component inspection system 10 to the outside. The carried-out burn-in test board 12 is subjected to a heat load, and a predetermined burn-in test is performed.

(Step S2-2)
After the burn-in test, the burn-in test board 12 is carried into the electronic component inspection system 10 again. The board transfer section 40 positions the burn-in test board 12 at a predetermined position.

(Step S3-1)
The suction collet 502 extracts four electronic components from the socket 122 of the burn-in test board 12 and transports them to the first movable table 72a at the position P3.

(Step S3-2)
When receiving the electronic components, the first moving table 72a sucks these electronic components and moves from the position P3 to the position P4.

(Step S3-3)
The suction collet 74 (see FIG. 3) sucks the four electronic components mounted on the first movable table 72a, moves to a position above the inspection unit 60 at the position P5, and stops.

(Step S3-4)
The elevating mechanism 604 of the inspection unit 60 raises the contact terminal 602 (see FIG. 1) and makes the contact terminal 602 contact the terminal of the electronic component held by the suction collet 74. After the contact, the inspection unit 60 inspects the electrical characteristics of the electronic component.
Here, in order to maintain this contact, a predetermined large contact pressure is required. However, if the transport unit 70 is configured so that the suction collet 74 is lowered instead of the contact terminal 602 of the inspection unit 60, the weight of the driving unit (not shown) increases in order to lower the suction collet 74 with a large thrust. The mechanism for moving the suction collet 74 from the position P4 to the position P6 via the position P5 becomes large. As a result, the cost increases and the size of the device increases. In addition, a decrease in the moving speed of the suction collet 74 causes a decrease in throughput.
Therefore, by increasing the contact terminals 602 of the inspection unit 60, an increase in the weight of the driving unit (not shown) of the suction collet 74 is suppressed, and a decrease in throughput is suppressed.

(Step S3-5)
After the inspection by the inspection unit 60, the lifting mechanism 604 lowers the contact terminal 602. Thereafter, the suction collet 74 conveys the electronic component from above the inspection unit 60 to the second moving table 72b at the position P6.

(Step S3-6)
When receiving the electronic components, the second movable table 72b sucks these electronic components and moves from the position P6 to the position P7.

(Step S3-7)
The suction collet 302 simultaneously sucks the four electronic components mounted on the second movable table 72b and transports them to the transfer table 20 at the position P2. At this time, the suction collet 302 passes over the camera CAM2 located below the transport path, and an appearance inspection of the back surface of the electronic component is performed.

(Step S3-8)
When receiving the electronic components, the transfer table 20 sucks these electronic components and moves from the position P2 to the position P1.
After the movement, the transport means (not shown) takes out the four electronic components from the delivery table 20 and stores them in a stick (not shown) or a carrier tape (not shown).
Thereafter, steps S3-1 to S3-8 are repeated until the electronic components are taken out from all the sockets 122.

As described above, according to the electronic component inspection system 10, the contact terminal 602 of the expensive inspection unit 60 is arranged at a position different from the movement path of the suction collet 302 that moves at a high speed over a long stroke. The possibility of the contact terminal 602 being damaged due to a defect is reduced.

As described above, the embodiments of the present invention have been described, but the present invention is not limited to the above-described embodiments, and all changes in conditions that do not depart from the gist are within the scope of the present invention.
In the electronic component inspection system 10, four electronic components have been transported at one time, but the number of electronic components is not limited to four.
INDUSTRIAL APPLICABILITY The application of the present invention is not limited to a burn-in test, but can be applied to an electronic component inspection apparatus having an inspection unit for inspecting an electronic component.

Reference Signs List 10 Electronic component inspection system for burn-in test 12 Burn-in test board 20 Delivery table 30 Transport unit 40 Board transport unit 50 Transport unit 60 Inspection unit 70 Transport unit 72a First movable platform 72b Second movable platform 74 Suction collet 90 Reel 122 Socket 302, 502 Suction collet 602 Contact terminal 604 Lifting mechanism CAM1, CAM2 Camera

Claims (3)

A delivery table on which electronic components are placed,
A first transport unit that transports the electronic component placed on the delivery table to a first position;
An inspection unit that is arranged at a position different from the movement path of the first transport unit in a plan view and inspects the electronic component;
A second transport unit that transports the electronic component at the first position in plan view to a second position where the first transport unit is movable through the position of the inspection unit;
A third transport section for inserting the electronic component transported to the first position by the first transport section into a burn-in test board. The electronic component inspection system for a burn-in test according to claim 1,
A first moving table, wherein the second transport unit moves from the first position to a third position that is away from the first position in a direction intersecting the movement path in a plan view;
A suction collet that sucks and transports the electronic component placed on the first moving table;
The electronic component conveyed by the suction collet is transferred at a fourth position located on the side opposite to the third position with the inspection unit interposed therebetween, and the second component is transferred from the fourth position to the second position. An electronic component inspection system for a burn-in test, comprising: a second movable table that moves to a position. The electronic component inspection system for a burn-in test according to claim 2,
A contact terminal for contacting the terminal of the electronic component,
An electronic component inspection system for a burn-in test, comprising: a lifting mechanism that raises and lowers the contact terminal.