TWI452647B - Transferring tool - Google Patents

Description

Transfer tool

The present invention relates to a transport tool, and more particularly to a transport tool capable of picking up an object to be transported, such as a semiconductor device by which the object is transported to another location.

Generally, a semiconductor device needs to be completely subjected to a package process that has undergone a plurality of tests, for example, these tests may be an aging test conducted by an external temperature coefficient, an electrical test for a direct current characteristic, or the like. According to the test results, the semiconductor device can be classified into good or defective products.

During the testing and sorting process, the semiconductor devices are loaded onto the trays and/or pallets and the trays are transported sequentially.

The semiconductor device mounted on the tray and/or the pallet will be picked up by the transport tool for transport to the socket, tray, pallet, etc. of the inspection device.

A conventional transfer tool includes: a support bracket; and one or more pick-ups mounted on the support bracket, and each end of the pick-up has a suction head for absorbing the semiconductor device by forming a vacuum pressure surface. Also, the pickups may be configured to be continuously arranged in two, four, eight, etc. to simultaneously transfer a plurality of semiconductor devices.

However, a semiconductor device inspection device or sorting device having a transfer tool will have different inspection or sorting speeds depending on the number of semiconductor devices to be transferred by the transfer tool. Therefore, the transfer tool needs to be configured to be able to transfer a larger number of semiconductor devices.

In order to solve the above problems, a conveying tool having a pickup arranged in two rows has been provided. The conventional transfer tool having pickers arranged in two rows is configured to control the gap between the pickups (horizontal gap) and the one mounted with the pickup according to the loading gap between the semiconductor devices to be transferred. The gap between the fixed brackets (vertical gap).

However, in a conventional transfer tool having pickers arranged in two rows, a gap controller for controlling the adjustment of the horizontal gap or the vertical gap is mounted on a fixed bracket for supporting the pickup. This will cause the position of the pickup to be difficult to control due to the inertia of the gap controller when the transfer tool moves.

Moreover, in a conventional transfer tool having pickers arranged in two rows, a gap controller for controlling the adjustment of the horizontal gap or the vertical gap is connected to one of the pair of fixed brackets. This can result in inaccurate control of the pickup due to the asymmetry between the centers of gravity of the pair of fixed brackets.

Therefore, in view of the above problems, it is an object of the present invention to provide a method capable of avoiding pick-up by separating a support bracket attached to a row of pickups and a gap controller for controlling a gap between the adjustment pickups. The positioning of the device controls the transfer tool that is affected by the inertia of the gap controller.

Another object of the present invention is to provide a pair of support brackets capable of separating a gap between a support bracket and a gap controller for controlling the adjustment of the pickup by mounting one of the rows of pickups And a transfer tool in which the center of gravity of the pickup is symmetrical to each other and precisely controls the movement of the pickup.

In order to achieve these and other advantages of the present invention and in accordance with the present invention, the present invention is embodied and described in detail. The present invention provides a transfer tool comprising: a first support bracket that is mounted to be Moving along the transfer tool guide of the semiconductor device processor; a pair of second support brackets connected to the first support bracket and spaced apart from the first support bracket, and having a plurality of devices for picking up the semiconductor device a picker having a gap; and a vertical gap controller for controlling a gap of the pair of second support brackets by moving a pair of second support brackets, wherein the vertical gap controller comprises: a vertical drive unit, Mounted on the first support bracket to generate a vertical driving force; and the linear motion unit is mounted on the first support bracket and connected to the second support bracket, thereby being linearly moved through the vertical drive unit to control Adjust the gap between the second support brackets.

The vertical drive unit includes: a rotary drive unit mounted on the first support bracket; and a pair of pulleys mounted on the first support bracket and rotatable by the rotary drive unit, and the linear motion unit includes a control belt and a connection To the pair of pulleys described above, and connected to the second support bracket to control the gap between the second support brackets by being moved.

The vertical drive unit may include: a rotary drive unit mounted on the first support bracket; and a pair of gears mounted on the first support bracket and rotatable by the rotary drive unit. And, the linear motion unit may include a control rack coupled to the pair of gears and coupled to the second support bracket to control a gap between the second support brackets by being moved.

The first support bracket is formed with a hole above the pickup so that the pneumatic line for controlling the pickup can be connected to the pickup.

The vertical gap controller may be installed at a position corresponding to the center of the second support bracket or at a position corresponding to one end of the second support bracket.

The transfer tool may further include an auxiliary vertical gap controller, comprising: a pair of pulleys mounted at a position corresponding to the other end of the second support bracket; and a control belt connected to the pair of pulleys and connected The second support bracket is configured to control the gap between the second support brackets by being moved; and the connecting shaft is connected to the pulley of the vertical gap controller and connected to one of the pair of pulleys, thereby The rotational force of the pulley of the vertical gap controller is transmitted to one of the pair of pulleys.

The rotary drive unit may include: a drive motor mounted on the first support bracket, a drive pulley coupled to the drive motor, and a drive pulley coupled to connect the drive pulley to a pulley of the vertical gap controller Belt. Preferably, the diameter of the drive pulley can be configured to be smaller than the diameter of the driven pulley for driving the motor to decelerate.

The horizontal gap controller may include: a link unit having a link structure and mounted on a second support bracket for connecting a support member on which each pickup is mounted; and a drive unit mounted on a second support bracket, The driving link unit is used to control the adjustment of the gap between the supporting elements; and the driving force generating unit is configured to drive the driving unit.

The driving unit may include: a pair of pulleys rotatably mounted on the second support bracket, and rotatable by receiving a rotational force generated by the driving force generating unit; and a belt rotated by connecting the pair of pulleys And one or more moving elements, one end of which is connected to the belt and the other end of which is connected to a supporting element.

In order to move the support members provided at both ends of the second support bracket inward or outward, a pair of moving members are formed. A pair of moving elements can be coupled to the belt such that the direction of movement of the pair of moving elements can be reversed.

The driving force generating unit may include: a driving motor for generating a rotational force; a driving pulley connected to the driving motor; and a driven pulley connected to a rotating shaft of a pulley of the driving unit respectively mounted on the second supporting bracket And a drive belt for connecting the drive pulley to the driven pulley.

The diameter of the drive pulley can be configured to be smaller than the diameter of the driven pulley. And the drive motor can be directly connected to the drive unit of the second support bracket, respectively.

At least one rotating shaft of the pulley of the drive unit of the second support bracket may be coupled to a clutch having a controllable rotational shaft coupling length. Also, the driven pulley may be coupled to a rotating shaft of one of the pulleys of one of the second support brackets or may be mounted to the clutch.

The clutch may be configured with an insertion hole for movably inserting the rotation shaft of the pulley of the drive unit of the second support bracket.

Another aspect of the present invention provides a transfer tool comprising: a first support bracket mounted to be movable along a transfer tool guide of a semiconductor device processor; and a pair of second support brackets connected to the first Supporting the bracket and having a gap with the first support bracket, and having a plurality of pickers for picking up the semiconductor device with a gap therebetween; and a horizontal gap controller for controlling the adjustment to be mounted on the second support bracket a gap between the pickers, wherein the horizontal gap controller comprises: a link unit having a link structure and mounted on a second support bracket for connecting the support members on which the pickers are mounted; The driving unit on the two supporting brackets is configured to control the gap between the supporting members through the driving link unit; and the driving force generating unit is configured to drive the driving unit, and the driving force generating unit comprises: a drive motor for generating a rotational force; a drive pulley coupled to the drive motor; and a drive list respectively mounted to the second support bracket A driven pulley of a rotary shaft of the pulley; and a drive belt for connecting the drive pulley and the driven pulley.

Preferably, the diameter of the drive pulley can be configured to be smaller than the diameter of the driven pulley for driving the motor to decelerate. And preferably, the pulley and belt of the conveyor can be implemented as a timing pulley and a timing belt for precise control.

The transfer tool of the semiconductor device of the present invention has the following advantages:

First, since the support bracket (the second support bracket) is separated from the first support bracket that is installed with a gap controller for controlling the gap between the pickups by mounting one of the rows of pickups, Further, it is possible to prevent the position of the pickup from being affected by the inertia of the gap controller.

Secondly, since the support bracket is separated from the gap controller for controlling the gap between the pickups by mounting one of the series of pickups, and the center of gravity of the pair of support brackets and the pickup is symmetrical to each other In turn, the movement of the pickup can be precisely controlled.

Thirdly, since the timing belt and the timing pulley are used as the belt and the pulley for driving the above-described one of the row of pickups and the gap controller for controlling the gap between the pickups, it is possible to further Precise control of the movement of the pickup.

Fourth, in the conventional transfer device of the semiconductor device, the gap between the pair of support brackets is controlled by the coupling between the right-hand screw and the left-hand screw, or by using a cam. This causes the pair of support brackets to be moved inaccurately, and thus the first and second gaps have to be set in advance. This first gap corresponds to the gap between the semiconductor devices on the tray, and the second gap corresponds to the gap between the semiconductor devices on the socket or the like. Based on the above configuration, the gap between the semiconductor devices is passively controlled to be adjusted, that is, the gap can only be adjusted to the first and second gaps.

However, in the transfer tool of the semiconductor device of the present invention, the gap between the pair of support brackets is movably controlled to be adjusted in a manner in which the pulley and the belt and the gear and the rack are fitted. Therefore, it is possible to control the gap between the pair of support brackets at once without any restriction, thereby realizing active control.

Fifthly, in the transfer tool of the semiconductor device of the present invention, the diameter ratio between the plurality of pulleys is set to be different to drive the one of the above-described rows of pickups mounted to the support bracket and for controlling the adjustment of the pickup device The gap controller for the gap. It is therefore possible to reduce the rotational force of the drive motor without using an additional reducer.

The above and other objects, features, aspects and advantages of the present invention will become more apparent from

The invention will now be described in detail with reference to the drawings.

Hereinafter, the transfer tool of the present invention will be described in more detail with reference to the accompanying drawings.

The transport tool 700 of the present invention is for transporting an object to be transported, such as the semiconductor device 1, and the transport tool 700 is mounted on a semiconductor device processing device, such as a semiconductor device sorting device and a semiconductor device inspection device.

As shown in FIG. 1 and FIG. 2, a semiconductor device inspection apparatus including an example of a semiconductor device processing apparatus of the transfer tool 700 of the present invention includes a loading unit 100 mounted to the loading unit 100. a first visual inspection unit 400 for checking the appearance of the lower portion of the semiconductor device 1 on one side, a second visual inspection unit 500 mounted on the other side of the loading unit 100 for inspecting the appearance of the upper portion of the semiconductor device 1, and The classification unit 300 that classifies the semiconductor device 1 by the inspection results of the first and second visual detecting units 400 and 500.

The loading unit 100 can have a variety of different configurations. As shown in FIG. 1, the loading unit 100 may include: a guide rail portion 110 for guiding the movement of the tray 2 in which the plurality of semiconductor devices 1 are loaded, and a driving unit for moving the tray 2 along the rail portion 110. (Not shown in the drawing).

The first visual inspection unit 400 is mounted on the main body 10 and is used to inspect the appearance of each semiconductor device 1 by analyzing an image of the appearance of the lower portion of the semiconductor device 1. The first visual inspection unit 400 includes: an image acquisition device for acquiring an image, and an image analysis device for analyzing the image acquired by the image acquisition device.

The second visual detecting unit 500 can be similar in structure to the first visual inspection unit 400. However, the second visual detecting unit 500 can be mounted on the upper side of the main body 10 to obtain an image of the appearance of the upper portion of the semiconductor device 1.

The second visual detecting unit 500 includes an image capturing device 530 mounted above the tray 2 on which the semiconductor device 1 is mounted, thereby acquiring an image of the appearance of the upper portion of each of the semiconductor devices 1.

As shown in FIG. 1, the image capturing device 530 can be mounted above the loading unit 100 to move in the horizontal and vertical directions (X and Y directions) along the moving path of the tray 2 to improve the inspection of the semiconductor device 1. speed. Further, the rail portions 510, 540 for guiding the image capturing device 530 to move in the X and Y directions are attached to the main body 10.

The first and second visual detecting units 400, 500 are for verifying whether the ball lock package or the lead is damaged, inspecting an appearance condition such as a crack or a scratch, and checking whether the mark on the semiconductor device 1 is good or bad, etc. .

The classification unit 300 has a configuration similar to that of the loading unit 100, and can be configured in plural numbers to divide the semiconductor device 1 into 'G' (good), 'R1' (first order), according to the inspection result of the semiconductor device 1, 'R2' (second grade).

Each sorting unit 300 may include a rail portion 310 mounted in parallel on one side of the loading unit 100, and a driving unit (not shown in the drawing) for moving the tray 2 along the rail portion 310.

The tray 2 is transportable through a tray transfer device (not shown in the drawings) interposed between the loading unit 100 and the sorting unit 300. Also, the tray 2 may further include an empty tray unit 200 for conveying the tray 2 on which the semiconductor device 1 is not loaded, to the sorting unit 300.

This empty tray unit 200 may include a rail portion 210 mounted in parallel to one side of the loading unit 100, and a driving unit (not shown in the drawing) for moving the tray 2 along the rail portion 210.

The semiconductor device 1 is transferred between the first visual inspection unit 400 and the loading unit 100 and between the plurality of trays 2 through one or more transfer tools 700, 620 along the transfer tool guide 601 mounted on the main body 10.

In order to increase the inspection speed of the first visual inspection unit 400, it is necessary to transfer a large number of semiconductor devices 1 at the same time. Since the semiconductor device 1 is usually loaded in the tray 2 and transported, the transfer tools 700 and 620 need to be arranged in accordance with the structure of the tray 2, for example, the gap between the semiconductor devices 1 housed in the tray 2 and the size of the semiconductor device 1.

The size of the semiconductor device to be inspected or classified, or the gap between the sockets into which the semiconductor device 1 is inserted, or the gap between the receiving grooves in which the tray 2 for housing the semiconductor device 1 is accommodated may vary. Therefore, it is necessary to be configured to be capable of transmitting a large number of semiconductor devices 1, and to more actively cope with dimensional changes of the semiconductor device 1 or variations in gaps between the semiconductor devices 1.

Accordingly, a transfer tool 700, 620 can include a plurality of pickers 730 mounted in two rows so as to be movable along the transfer tool guide 601 as necessary to pick up the semiconductor device 1.

The pickup 730 that transports the semiconductor device 1 by picking up the semiconductor device 1 may have various configurations and may include a suction head 731. The tip 731 is for picking up the semiconductor device 1 by a suction method that generates vacuum pressure in combination with up and down movement. Each of the tips 731 can be mounted to be able to move up and down independently.

When a plurality of pickers 730 are installed in two rows, the support brackets can be implemented in different ways. As shown in "Fig. 3" to "Fig. 6", the support bracket includes: a first support bracket 710 movably mounted on the semiconductor device inspection device or the like, and is connected to the first support bracket 710 and mounted There is one of a plurality of pickers 730 having a gap therebetween to the second support bracket 720.

The first support bracket 710 is mounted to be movable along the transport tool rail 601 and can be transported by another transport device. Therefore, the second support bracket 720 can be moved to move the pickup 730.

The transfer tool guide 601 is used to guide the transfer tool 700 to move in different directions, such as X, Y, and X-Y directions.

As shown in FIG. 3 and FIG. 4, the engaging portion 711 for connecting the first support bracket 710 to the transport tool rail 601 may be formed on the first support bracket 710 or with the first support bracket. The rack 710 is connected.

The first support bracket 710 is provided with a hole 712 that is open above the pickup 730, that is, above the pickup 730. Through the hole 712, a pneumatic line (not shown in the drawing) for controlling the pickup 730 can be connected to the pickup 730.

The first support bracket 710 may further include an external air pressure line connecting member 713, which is first connected to an air pressure generator for generating air pressure through an external air pressure line (not shown in the drawing) (not shown in the drawing) And secondly connected to the pneumatic line for connecting the pickups 730, thereby preventing the movement of the pickup 730 from being affected by the pneumatic line.

A gap is disposed between the pair of second support brackets 720, and each of the second support brackets 720 can have a different configuration by which the pickup 730 is mounted. Each of the second support brackets 720 is mounted with a plurality of pickers 730 having a gap therebetween.

Here, the pickup 730 is mounted on each of the second support brackets 720 in the horizontal direction, wherein a pair of second support brackets are disposed in the vertical direction. In view of the structure of the pickup 730, the pickup 730 is preferably mounted above the lining of the second support bracket 720.

In the case where the pickup 730 is mounted on the facing of the adjacent second support bracket 720, the gap between the pickups 730 mounted on the adjacent second support brackets 720 can be minimized.

The pair of second support brackets 720 can be linearly movably coupled to the first support bracket 710 with a gap therebetween that can be adjusted by a vertical gap controller control which will be described later. Here, the second support bracket 720 is connectable to the first support bracket 710 through a linear movement guiding unit 740 for guiding linear movement of the second support bracket 720.

This linear movement guiding unit 740 may have any configuration to connect the second support bracket 720 to the first support bracket 710 in a linearly movable manner. As shown in "Fig. 3" and "Fig. 5", the linear movement guiding unit 740 may include: a guiding member 741 connected to the first supporting bracket 710; and a connecting to the guiding member 741 to move along the guiding member 741 and A guide block 742 is coupled to the second support bracket 720.

The transfer tool 700 can be installed to have a gap (Ph or Pv) that can be controlled and adjusted in at least one of a horizontal direction and a vertical direction. Also, the transfer tool 700 can be configured with a vertical gap controller for controlling the vertical gap (Pv) of the pair of second support brackets 720, and a horizontal gap controller for controlling the horizontal gap (Ph) of the pickup 730. .

The vertical gap controller is used to control the vertical gap (Pv) in which one of the pickups 730 is mounted to the second support bracket 720. And, the vertical gap controller includes: a vertical driving unit mounted on the first support bracket 710 to generate a vertical driving force; and a linear moving unit mounted on the first support bracket 710 and connected to the second support bracket For controlling the gap between the second support brackets by linearly moving through the vertical drive unit.

Vertical gap controllers are available in a variety of configurations, such as: belt to pulley fit, gear to rack fit, and threaded fit.

As shown in "Fig. 3" to "Fig. 6", an example of the vertical gap controller may include: a rotary driving unit 761 mounted on the first support bracket 710, and a pair mounted on the first support bracket The pulley 762 is rotated by the rotary drive unit 761 by the 710. Also, the linear movement unit may include a control belt 763 coupled to the pair of pulleys 762 and coupled to the second support bracket 720 to control the adjustment of the gap between the second support brackets 720 by being moved.

The rotary drive unit 761 for rotating the pulley 762 of the vertical gap controller can have a variety of different configurations. Also, the rotary drive unit 761 may include a drive motor 761a mounted on the first support bracket 710, a drive pulley 761b connected to the drive motor 761a, and a pulley 762 for connecting the drive pulley 761b to the vertical gap controller. Drive belt 761c. Drive motor 761a is preferably selectively mounted inwardly. In view of the above structure, the first support bracket 710 may be configured with a groove 716 therein for passing through the drive belt 761c.

Here, the pulley and the belt of the rotary drive unit 761 can be implemented as a timing pulley and a timing belt in consideration of accuracy. Thus, without the need of an additional speed reducer, the vertical gap controller can be more precisely controlled by controlling the diameter ratio between the drive belt 761b of the vertical gap controller and the pulley 762. Here, the diameter of the drive belt 761b may be configured to be smaller than the diameter of the pulley 762 of the vertical gap controller.

The rotary drive unit 761 may further include a driven pulley 761d in a combined structure between the pulley and the belt. Moreover, the rotary drive unit 761 can also rotate the pulley 762 of the vertical gap controller in a different manner, such as gear engagement.

The drive motor 761a is mounted on the first support bracket 710 such that its drive shaft does not affect the movement of the second support bracket 720. Further, the drive motor 761a is mounted parallel to the rotation shaft of the pulley 762 of the vertical gap controller 720.

A pair of pulleys 762 are mounted on the first support bracket 710 such that the control belt 763 can be mounted across the second support bracket 720. Also, the pulley 762 can be mounted to be rotatable by being supported by the auxiliary bracket 762a.

The control belt 763 is mounted to be connectable to a pair of pulleys 762 and is rotatable by rotation of the pulley 762. One or more grooves 729 may be formed on the second support bracket 720 to facilitate installation of the control belt 763.

Once the control belt 763 is connected to the driving element 721 fixedly connected to the second support bracket 720, the control belt 763 will be rotated by the rotation of the pulley 762, and the driving member 721 will move together, thereby moving and fixedly connected to the driving member 721. The second support bracket 720.

Preferably, the pulley 762 and the control belt 763 can be implemented as a timing pulley and a timing belt in terms of accuracy.

The vertical gap controller may be installed at different positions depending on the design, and may be installed at a position corresponding to the center of the second support bracket 720 or at a position corresponding to one end of the second support bracket 720.

In the case where the vertical gap controller is mounted at a position corresponding to one end of the second support bracket 720, the vertical gaps can be controlled to be symmetrical with each other. Thus, an auxiliary vertical gap controller can be further installed, comprising: a pair of pulleys 862 mounted at positions corresponding to the other ends of the second support bracket 720; the control belt 863 is coupled to the pair of pulleys 862 and Connected to the second support bracket 720 to control the gap between the second support brackets 720 by being moved; and the connecting shaft 865 is connected to the pulley 762 of the vertical gap controller and connected to the pair of pulleys 862 Thereby, the rotational force of the pulley 862 of the vertical gap controller is transmitted to one of the pair of pulleys 862.

Preferably, the vertical gap controller may further include a sensor for sensing a gap between the second support brackets 720.

The vertical gap controller can be accurately moved through the cooperation between the belt and the pulley and the cooperation between the gear and the rack, thereby more actively controlling the semiconductor device according to the size of the semiconductor device and the structure of the tray or the socket. The gap between them.

Referring to "Fig. 7" and "Fig. 8", the process of adjusting the vertical gap (Pv) of the pickups 730 arranged in two rows by the vertical gap controller control will now be described. Here, the vertical gap described is reduced. However, the vertical gap can also be increased, and the vertical gap between the pickups 730 can be differently set by using a timing belt and a timing pulley.

As shown in "Fig. 7", a plurality of pickups 730 arranged in two rows are disposed at predetermined positions with a predetermined vertical gap (Pv) therebetween.

When the semiconductor device 1 is picked up or transferred and the vertical gap needs to be narrowed, a controller (not shown in the drawing) will drive the vertical gap controller.

First, the drive motor 761a of the rotary drive unit 761 is rotated by the drive signal under the control of the controller. When the drive motor 761a rotates, the control belt 763 is rotated by the drive pulley 761c which is coupled to the drive pulley 761b, the driven pulley 761d is coupled to the drive belt 761c, and the pulley 762 is coupled to the driven pulley 761d.

Once the control belt 763 is rotated, the drive elements 721 connected to the control belt 763 will be moved together. Therefore, the second support bracket 720 connected to the drive member 721 will be moved as shown in "Fig. 8". Here, the second support bracket 720 can be moved more smoothly through the auxiliary vertical gap controller connected to the pulley 762 via the connecting shaft 865.

Here, the gap between the pickups 730 connected to the second support bracket 720 in a row will form a vertical gap (Pv) as the second support bracket 720 is moved.

When a vertical adjustment (Pv) of the pickup 730 disposed in two rows is to be controlled, a vertical gap controller will be used.

The vertical gap (Pv) of the pickup 730 can be more precisely controlled by using a timing belt and a timing pulley as a vertical gap controller.

The auxiliary vertical gap controller has a structure similar to that of the vertical gap controller except for the connection shaft 865, and thus detailed description thereof will be omitted.

The horizontal gap controller is used to control the horizontal gap (Ph) of the adjustment picker 730, and can have a variety of different configurations. As shown in FIG. 9 and FIG. 10, the horizontal gap controller may include: a link unit 751 mounted on the second support bracket 720 for connecting the support members 732 to which the pickup 730 is mounted. The driving unit mounted on the second supporting bracket 720 is configured to control the adjustment of the gap between the supporting members 732 through the driving link unit 751; and the driving force generating unit is configured to drive the driving unit.

The linking unit 751 is used to control the horizontal gap between the pickups 730, and can have various configurations depending on the design. Also, the link unit 751 may include a plurality of link elements 751a and pins 751b for interconnecting the link units 751a. Here, the link unit 751 is coupled to the support member 732 through the engagement pin 752. Preferably, the portion of the rail for guiding the movement of the support member 732 can be mounted to the second support bracket 720.

The drive unit can continuously move the link unit 751 or the support member 732 to control the horizontal gap (Ph) of the support member 732 as shown in "Fig. 9" and "Fig. 10".

The driving unit may include: a pair of pulleys 754 rotatably mounted on the second support bracket 720, and rotatable by receiving a rotational force generated from the driving force generating unit; rotating by being coupled to the pair of pulleys 754 The belt 755; and one or more moving elements 757 are connected at one end to the belt 755 and at the other end to a support member 732.

Preferably, each moving element 757 is coupled to each of the support members 732 at its ends. In order to move the support member 732 inward or outward, the moving member 757 is formed as a pair. The pair of moving elements 757 can be coupled to the belt 755 such that their direction of movement can be opposite to each other. In the case where the moving member 757 and the supporting member 732 are mounted on the opposite surfaces of the second supporting bracket 720, the groove 727 may be formed by considering the connection and movement thereof.

The driving force generation unit for operating the link unit 751 by driving the drive unit may have various configurations.

As shown in "Fig. 3" and "Fig. 6", the driving force generating unit may include: a driving motor 753 for generating a rotational force; and a driving belt 753c for connecting the driving pulley 753a coupled to the driving motor 753 and The driven pulley 753b is configured to transmit a rotational force; and the driven pulley 753b is coupled to a rotating shaft 759 of the pulley 754 respectively mounted on the second support bracket 720. In order to decelerate the drive motor 753, the diameter of the drive pulley 753a is preferably smaller than the diameter of the driven pulley 753b.

In view of the fact that the second support bracket 720 is vertically moved, the drive motor 753 is preferably mounted on the first support bracket 710 instead of the second support bracket 720. The first support bracket 710 can be configured with a groove 717 to facilitate mounting of the drive belt 753c.

The drive motor 753 can be configured to be directly coupled to the drive unit of the second support bracket 720. And at least one rotating shaft 759 of the pulley 754 is connectable to the clutch 758, and the driven pulley 753b is coupled to a pulley 754 of the driving unit of the second supporting bracket 720 or to the clutch 758.

There may be different gaps between the pair of second support brackets 720. Therefore, the driving force generation unit needs to smoothly transmit the driving force to the driving unit without being affected by the gap change.

The clutch 758 is configured to have a variable coupling length such that the gap between the second support brackets 720 can be controlled and adjusted by the vertical gap controller. For example, as shown in FIG. 3 and FIG. 6, the clutch 758 is configured to be rotatable through a fixing bracket 758a disposed on the first support bracket 710, and may include: at least one through hole or Two insertion holes 758b are used to rotatably insert the rotation shaft 759 of the pulley 754 of the drive unit of the second support bracket 720.

The rotating shaft 759 of the pulley 754 of the driving unit of the second supporting bracket 720, and the through hole or the two insertion holes 758b may have a polygonal cross section. And, the rotating shaft 759 is connected to the through hole or the two insertion holes 758b to thereby move in the axial direction and simultaneously rotate.

Preferably, the horizontal gap controller may be further configured with a sensor 820 to sense a gap between the pickers 730 mounted on the second support bracket 720.

Referring to "Fig. 9" and "Fig. 10", the process of controlling the horizontal gap (Ph) of the pickups 730 arranged in two rows will now be described. Here, the horizontal gap described is reduced. However, the horizontal gap can also be increased, and the horizontal gap between the pickups 730 can be differently set by using a timing belt and a timing pulley.

As shown in Fig. 9, a plurality of pickups 730 arranged in two rows are disposed at predetermined positions with a predetermined horizontal gap (Ph) therebetween.

When the semiconductor device 1 is picked up or transferred and the horizontal gap needs to be narrowed, a controller (not shown in the drawing) will drive the horizontal gap controller.

First, the drive motor 753 of the driving force generation unit is rotated by the drive signal under the control of the controller. When the drive motor 753 rotates, the drive pulley 753a is rotated, the drive belt 753c is coupled to the drive pulley 753a, the driven pulley 753b is coupled to the drive belt 753c, and the clutch 758 is coupled to the driven pulley 753b.

Once the clutch 758 is rotated, the rotating shaft 759 coupled to the clutch 758 will be rotated and the belt 755 will be rotated through the pulley 754 coupled to the rotating shaft 759.

Once the belt 755 is rotated, the moving elements 757 connected to the belt 755 will be moved together. When the moving member 757 is moved, the second support bracket 720 connected to the moving member 757 will be moved as shown in "Fig. 9". Here, the rotating shaft 759 is coupled to the clutch 758 so as to be axially movable and can be simultaneously rotated, thereby smoothly controlling the adjustment of the gap between the second support brackets 720.

When the second support bracket 720 is moved, the pickup 730 mounted in two rows on the second support bracket 720 can have a controllable horizontal gap (Ph).

When the horizontal gap (Ph) of the pickups 730 arranged in two rows is to be controlled and adjusted, a horizontal gap controller can be used.

In particular, the horizontal gap between the pickers 730 can be more precisely controlled by using a timing belt and a timing pulley as a horizontal gap controller.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1. . . Semiconductor device

2. . . tray

10. . . main body

100. . . Loading unit

110. . . Rail section

200. . . Empty tray unit

210. . . Rail section

300. . . Classification unit

310. . . Rail section

400. . . First visual inspection unit

500. . . Second visual detection unit

510. . . Rail section

530. . . Image acquisition device

540. . . Rail section

601. . . Transfer tool guide

620. . . Transfer tool

700. . . Transfer tool

710. . . First support bracket

711. . . Joint part

712. . . Hole

713. . . External pneumatic line connection element

716. . . Trench

717. . . Trench

720. . . Second support bracket

721. . . Drive component

727. . . Trench

729. . . Trench

730. . . Picker

731. . . Tip

732. . . Supporting element

740. . . Linear movement guide unit

741. . . Guiding element

742. . . Guide block

751. . . Link unit

751a. . . Link component

751b. . . Pin

752. . . Engagement pin

753. . . Drive motor

753a. . . Drive pulley

753b. . . Driven pulley

753c. . . Drive belt

754. . . Pulley

755. . . Belt

757‧‧‧Mobile components

758‧‧‧Clutch

758a‧‧‧Fixed bracket

758b‧‧‧ insertion hole

759‧‧‧Rotary axis

761‧‧‧Rotary drive unit

761a‧‧‧Drive motor

761b‧‧‧ drive pulley

761c‧‧‧ drive belt

761d‧‧‧ driven pulley

762‧‧‧ Pulley

762a‧‧‧Auxiliary bracket

763‧‧‧Control belt

862‧‧‧ Pulley

863‧‧‧Control belt

865‧‧‧Connected shaft

G‧‧‧ good products

R1‧‧‧ first-class defective

R2‧‧‧Second defective

Ph‧‧‧ horizontal gap

Pv‧‧‧ vertical gap

Fig. 1 is a schematic view showing a semiconductor device inspection apparatus equipped with a transfer tool of the semiconductor device of the present invention.

Fig. 2 is a view showing the configuration of a transfer tool of the semiconductor device inspection apparatus of Fig. 1.

Fig. 3 is a perspective view showing an example of the conveying tool of Fig. 2.

Figure 4 is a plan view of the transfer tool of Figure 3.

Figures 5 and 6 are side views of the transfer tool of Figure 3.

Figures 7 and 8 are schematic views of a vertical gap controller for controlling the vertical gap between the transfer tools of Figure 3, respectively.

Fig. 9 and Fig. 10 are schematic views respectively showing a horizontal gap controller for controlling the horizontal gap between the transfer tools of Fig. 3.

700. . . Transfer tool

710. . . First support bracket

711. . . Joint part

712. . . Hole

713. . . External pneumatic line connection element

716. . . Trench

717. . . Trench

720. . . Second support bracket

721. . . Drive component

727. . . Trench

730. . . Picker

740. . . Linear movement guide unit

741. . . Guiding element

742. . . Guide block

753. . . Drive motor

754. . . Pulley

755. . . Belt

757. . . Moving component

758. . . clutch

758a. . . Fixed bracket

759. . . Rotary axis

761. . . Rotary drive unit

761a. . . Drive motor

761b. . . Drive pulley

761c. . . Drive belt

762. . . Pulley

762a. . . Auxiliary bracket

763. . . Control belt

862. . . Pulley

863. . . Control belt

865. . . Connecting shaft

Claims (26)

A transfer tool comprising: a first support bracket mounted to be movable along a transport tool guide of a semiconductor device processor; a pair of second support brackets coupled to the first support bracket and The first support bracket is spaced apart by a gap, and has a plurality of pickers for picking up the semiconductor device with a gap therebetween; and a vertical gap controller for controlling the adjustment by moving the pair of second support brackets a gap to the second support bracket, wherein the vertical gap controller includes: a vertical drive unit mounted on the first support bracket to generate a vertical driving force; and a linear motion unit mounted on the The first support bracket is coupled to the second support brackets, thereby being linearly moved through the vertical drive unit to control the adjustment of the gap between the second support brackets. The transfer tool of claim 1, wherein the vertical drive unit comprises: a rotary drive unit mounted on the first support bracket; and the first drive bracket mounted on the first support bracket rotatable by the rotary drive unit A pair of pulleys, and the linear motion unit includes a control belt coupled to the pair of pulleys and coupled to the second support brackets for controlling the gap between the second support brackets by being moved. The transfer tool of claim 1, wherein the vertical drive unit comprises: a rotary drive unit mounted on the first support bracket; and mounted on the first support bracket and rotatable by the rotary drive unit a pair of gears, and wherein the linear motion unit includes a control rack coupled to the pair of gears and coupled to the second support brackets for controlling movement between the second support brackets by being moved gap. The transfer tool of claim 1, wherein the first support bracket is formed with a hole above the pickers such that a pneumatic line for controlling the pickers can be connected to the pickers . The transfer tool of claim 1, wherein the vertical gap controller is installed at a position corresponding to a center of the second support brackets or is mounted at one end of the second support brackets position. The transfer tool of any one of claims 1 to 5, further comprising an auxiliary vertical gap controller comprising: a pair of pulleys mounted at positions corresponding to the other ends of the second support brackets a control belt coupled to the pair of pulleys and coupled to the second support brackets for controlling a gap between the second support brackets by being moved; and a connecting shaft coupled to the a pulley of a vertical gap controller and connected to one of the pair of pulleys, whereby the vertical gap controller is skinned The rotational force of the pulley is transmitted to one of the pair of pulleys. The transfer tool of claim 2 or 3, wherein the rotary drive unit comprises: a drive motor mounted on the first support bracket; a drive pulley coupled to the drive motor; and a drive belt The drive pulley is coupled to a driven pulley coupled to a pulley of the vertical gap controller. The transporting tool of any one of claims 1 to 5, further comprising a horizontal gap controller for controlling a gap of the pickers mounted at the second support brackets. The transfer tool of claim 8, wherein the horizontal gap controller comprises: a link unit having a link structure and mounted on a second support bracket for connecting a support member on which each pickup is mounted; A driving unit on a second supporting bracket is configured to control a gap between the supporting members through the driving link unit, and a driving force generating unit is configured to drive the driving unit. The transporting tool of claim 9, wherein the driving unit comprises: a pair of pulleys rotatably mounted on the second supporting brackets, and permeable to receiving a rotational force generated from the driving force generating unit Rotating; rotating one of the belts by connecting the pair of pulleys; and one or more moving elements, one end of which is coupled to the belt and the other end of which is coupled to a support member. A transfer tool according to claim 10, wherein a pair of moving members are formed to move the support members disposed at both ends of the second support brackets inward or outward, and wherein the pair of moving members are coupled to the support member The belt is positioned such that the moving elements move in opposite directions. The transporting tool of claim 10, wherein the driving force generating unit comprises: a driving motor for generating a rotational force; a driving pulley connected to the driving motor; and being connected to the second supporting brackets respectively mounted a driven pulley of one of the pulleys of the upper driving unit; and a driving belt for connecting the driving pulley and the driven pulley. The transfer tool of claim 10, wherein the diameter of the drive pulley is configured to be smaller than the diameter of the driven pulley. The transfer tool of claim 12, wherein the drive motors are directly coupled to the drive units of the second support brackets, respectively. The transfer tool of claim 12, wherein at least one rotating shaft of the pulley of the drive unit of the second support bracket is coupled to a clutch having a controllable rotational shaft coupling length, and wherein the driven pulley A rotating shaft coupled to one of the pulleys of one of the second support brackets or to the clutch. The transfer tool of claim 15, wherein the clutch system is configured with an insertion a hole for rotatably inserting a rotating shaft of a pulley of the driving unit of the second support bracket. The transfer tool of claim 2, wherein the pulleys and the control belt are synchronous pulleys and timing belts. The transfer tool of claim 6, wherein the pulleys and the control belt are synchronous pulleys and timing belts. The transfer tool of claim 7, wherein the drive pulley and the drive belt are synchronous pulleys and timing belts. The transfer tool of claim 10, wherein the pulleys and the belt are synchronized pulleys and timing belts. A transfer tool comprising: a first support bracket mounted to be movable along a transport tool guide of a semiconductor device processor; a pair of second support brackets coupled to the first support bracket and The first support bracket is spaced apart by a gap, and has a plurality of pickers for picking up the semiconductor device with a gap therebetween; and a horizontal gap controller for controlling the adjustment and mounting on the second support brackets a gap between the pickers, wherein the horizontal gap controller comprises: a link unit having a link structure and mounted on a second support bracket for connecting the support elements on which the pickers are mounted; a driving unit mounted on a second supporting bracket for controlling a gap between the supporting members through the driving link unit; and a driving force generating unit for driving the driving unit, and the driving unit The driving force generating unit includes: a driving motor for generating a rotational force; a driving pulley connected to the driving motor; and a rotating shaft connected to a pulley of the driving unit respectively mounted on the second supporting brackets a driven pulley; and a driving belt for connecting the driving pulley and the driven pulley. The transfer tool of claim 21, wherein the drive motors are directly coupled to the drive units of the second support brackets, respectively. The transfer tool of claim 21, wherein at least one rotating shaft of the pulley of the driving unit of the second support bracket is coupled to a clutch having a controllable rotational shaft coupling length, and wherein the driven pulley A rotating shaft coupled to one of the pulleys of one of the second support brackets or to the clutch. The transfer tool of claim 23, wherein the clutch is provided with an insertion hole for movably inserting a rotation shaft of a pulley of the drive unit of the second support bracket. The transfer tool of claim 21, wherein the diameter of the drive pulley is matched Set to be smaller than the diameter of the driven pulley. The transfer tool of claim 21, wherein the drive belt is a timing belt, and the pulley, the drive pulley and the driven pulley are synchronous pulleys.