TWI600121B - Method for manufacturing magnetoresistive element and vacuum processing apparatus - Google Patents

Method for manufacturing magnetoresistive element and vacuum processing apparatus Download PDF

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Publication number
TWI600121B
TWI600121B TW105125449A TW105125449A TWI600121B TW I600121 B TWI600121 B TW I600121B TW 105125449 A TW105125449 A TW 105125449A TW 105125449 A TW105125449 A TW 105125449A TW I600121 B TWI600121 B TW I600121B
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TW
Taiwan
Prior art keywords
magnetoresistive element
magnetic film
gas
metal oxide
mgo
Prior art date
Application number
TW105125449A
Other languages
English (en)
Chinese (zh)
Other versions
TW201725663A (zh
Inventor
佐竹真
山田将貴
横川賢悦
Original Assignee
日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TW201725663A publication Critical patent/TW201725663A/zh
Application granted granted Critical
Publication of TWI600121B publication Critical patent/TWI600121B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/01Manufacture or treatment
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816Pressure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/10Magnetoresistive devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/80Constructional details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334Etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
TW105125449A 2016-01-04 2016-08-10 Method for manufacturing magnetoresistive element and vacuum processing apparatus TWI600121B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016000030A JP6506702B2 (ja) 2016-01-04 2016-01-04 磁気抵抗素子の製造方法および真空処理装置

Publications (2)

Publication Number Publication Date
TW201725663A TW201725663A (zh) 2017-07-16
TWI600121B true TWI600121B (zh) 2017-09-21

Family

ID=59226958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105125449A TWI600121B (zh) 2016-01-04 2016-08-10 Method for manufacturing magnetoresistive element and vacuum processing apparatus

Country Status (4)

Country Link
US (1) US10243140B2 (enExample)
JP (1) JP6506702B2 (enExample)
KR (1) KR101786776B1 (enExample)
TW (1) TWI600121B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110856454B (zh) * 2018-06-20 2023-09-29 株式会社日立高新技术 磁阻元件的制造方法
CN109346390A (zh) * 2018-08-31 2019-02-15 湖北汉光科技股份有限公司 铯束管用电子倍增器的二次发射体的制作方法
US10840441B2 (en) * 2018-09-14 2020-11-17 International Business Machines Corporation Diamond-like carbon hardmask for MRAM
US11997931B2 (en) 2018-10-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Bar-type magnetoresistive random access memory cell
KR20220125050A (ko) * 2021-03-04 2022-09-14 삼성전자주식회사 자기터널접합 소자, 자기터널접합 소자를 포함하는 메모리 장치, 및 자기터널접합 소자의 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2677321B2 (ja) 1995-03-15 1997-11-17 科学技術庁金属材料技術研究所長 ドライエッチング方法
EP1340269B1 (en) * 2000-11-30 2009-02-25 Asm International N.V. Thin films for magnetic devices
JP4111274B2 (ja) 2003-07-24 2008-07-02 キヤノンアネルバ株式会社 磁性材料のドライエッチング方法
US8119018B2 (en) * 2006-09-13 2012-02-21 Canon Anelva Corporation Magnetoresistive effect element manufacturing method and multi-chamber apparatus for manufacturing magnetoresistive effect element
JP2008181971A (ja) * 2007-01-23 2008-08-07 Renesas Technology Corp 不揮発性記憶装置、磁気抵抗素子および磁気抵抗素子の製造方法
JP5366235B2 (ja) 2008-01-28 2013-12-11 東京エレクトロン株式会社 半導体装置の製造方法、半導体製造装置及び記憶媒体
US9147833B2 (en) * 2013-07-05 2015-09-29 Headway Technologies, Inc. Hybridized oxide capping layer for perpendicular magnetic anisotropy

Also Published As

Publication number Publication date
JP6506702B2 (ja) 2019-04-24
KR20170081556A (ko) 2017-07-12
US20170194560A1 (en) 2017-07-06
KR101786776B1 (ko) 2017-10-18
US10243140B2 (en) 2019-03-26
TW201725663A (zh) 2017-07-16
JP2017123355A (ja) 2017-07-13

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