TWI600121B - Method for manufacturing magnetoresistive element and vacuum processing apparatus - Google Patents
Method for manufacturing magnetoresistive element and vacuum processing apparatus Download PDFInfo
- Publication number
- TWI600121B TWI600121B TW105125449A TW105125449A TWI600121B TW I600121 B TWI600121 B TW I600121B TW 105125449 A TW105125449 A TW 105125449A TW 105125449 A TW105125449 A TW 105125449A TW I600121 B TWI600121 B TW I600121B
- Authority
- TW
- Taiwan
- Prior art keywords
- magnetoresistive element
- magnetic film
- gas
- metal oxide
- mgo
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016000030A JP6506702B2 (ja) | 2016-01-04 | 2016-01-04 | 磁気抵抗素子の製造方法および真空処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201725663A TW201725663A (zh) | 2017-07-16 |
| TWI600121B true TWI600121B (zh) | 2017-09-21 |
Family
ID=59226958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105125449A TWI600121B (zh) | 2016-01-04 | 2016-08-10 | Method for manufacturing magnetoresistive element and vacuum processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10243140B2 (enExample) |
| JP (1) | JP6506702B2 (enExample) |
| KR (1) | KR101786776B1 (enExample) |
| TW (1) | TWI600121B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856454B (zh) * | 2018-06-20 | 2023-09-29 | 株式会社日立高新技术 | 磁阻元件的制造方法 |
| CN109346390A (zh) * | 2018-08-31 | 2019-02-15 | 湖北汉光科技股份有限公司 | 铯束管用电子倍增器的二次发射体的制作方法 |
| US10840441B2 (en) * | 2018-09-14 | 2020-11-17 | International Business Machines Corporation | Diamond-like carbon hardmask for MRAM |
| US11997931B2 (en) | 2018-10-31 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bar-type magnetoresistive random access memory cell |
| KR20220125050A (ko) * | 2021-03-04 | 2022-09-14 | 삼성전자주식회사 | 자기터널접합 소자, 자기터널접합 소자를 포함하는 메모리 장치, 및 자기터널접합 소자의 제조 방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2677321B2 (ja) | 1995-03-15 | 1997-11-17 | 科学技術庁金属材料技術研究所長 | ドライエッチング方法 |
| EP1340269B1 (en) * | 2000-11-30 | 2009-02-25 | Asm International N.V. | Thin films for magnetic devices |
| JP4111274B2 (ja) | 2003-07-24 | 2008-07-02 | キヤノンアネルバ株式会社 | 磁性材料のドライエッチング方法 |
| US8119018B2 (en) * | 2006-09-13 | 2012-02-21 | Canon Anelva Corporation | Magnetoresistive effect element manufacturing method and multi-chamber apparatus for manufacturing magnetoresistive effect element |
| JP2008181971A (ja) * | 2007-01-23 | 2008-08-07 | Renesas Technology Corp | 不揮発性記憶装置、磁気抵抗素子および磁気抵抗素子の製造方法 |
| JP5366235B2 (ja) | 2008-01-28 | 2013-12-11 | 東京エレクトロン株式会社 | 半導体装置の製造方法、半導体製造装置及び記憶媒体 |
| US9147833B2 (en) * | 2013-07-05 | 2015-09-29 | Headway Technologies, Inc. | Hybridized oxide capping layer for perpendicular magnetic anisotropy |
-
2016
- 2016-01-04 JP JP2016000030A patent/JP6506702B2/ja active Active
- 2016-08-02 KR KR1020160098405A patent/KR101786776B1/ko active Active
- 2016-08-10 TW TW105125449A patent/TWI600121B/zh active
- 2016-08-30 US US15/251,595 patent/US10243140B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6506702B2 (ja) | 2019-04-24 |
| KR20170081556A (ko) | 2017-07-12 |
| US20170194560A1 (en) | 2017-07-06 |
| KR101786776B1 (ko) | 2017-10-18 |
| US10243140B2 (en) | 2019-03-26 |
| TW201725663A (zh) | 2017-07-16 |
| JP2017123355A (ja) | 2017-07-13 |
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