TWI600121B - Method for manufacturing magnetoresistive element and vacuum processing apparatus - Google Patents

Method for manufacturing magnetoresistive element and vacuum processing apparatus Download PDF

Info

Publication number
TWI600121B
TWI600121B TW105125449A TW105125449A TWI600121B TW I600121 B TWI600121 B TW I600121B TW 105125449 A TW105125449 A TW 105125449A TW 105125449 A TW105125449 A TW 105125449A TW I600121 B TWI600121 B TW I600121B
Authority
TW
Taiwan
Prior art keywords
magnetoresistive element
magnetic film
gas
metal oxide
mgo
Prior art date
Application number
TW105125449A
Other languages
English (en)
Chinese (zh)
Other versions
TW201725663A (zh
Inventor
佐竹真
山田将貴
横川賢悦
Original Assignee
日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TW201725663A publication Critical patent/TW201725663A/zh
Application granted granted Critical
Publication of TWI600121B publication Critical patent/TWI600121B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
TW105125449A 2016-01-04 2016-08-10 Method for manufacturing magnetoresistive element and vacuum processing apparatus TWI600121B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016000030A JP6506702B2 (ja) 2016-01-04 2016-01-04 磁気抵抗素子の製造方法および真空処理装置

Publications (2)

Publication Number Publication Date
TW201725663A TW201725663A (zh) 2017-07-16
TWI600121B true TWI600121B (zh) 2017-09-21

Family

ID=59226958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105125449A TWI600121B (zh) 2016-01-04 2016-08-10 Method for manufacturing magnetoresistive element and vacuum processing apparatus

Country Status (4)

Country Link
US (1) US10243140B2 (enExample)
JP (1) JP6506702B2 (enExample)
KR (1) KR101786776B1 (enExample)
TW (1) TWI600121B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102183391B1 (ko) 2018-06-20 2020-11-30 주식회사 히타치하이테크 자기 저항 소자의 제조 방법 및 자기 저항 소자
CN109346390A (zh) * 2018-08-31 2019-02-15 湖北汉光科技股份有限公司 铯束管用电子倍增器的二次发射体的制作方法
US10840441B2 (en) * 2018-09-14 2020-11-17 International Business Machines Corporation Diamond-like carbon hardmask for MRAM
US11997931B2 (en) 2018-10-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Bar-type magnetoresistive random access memory cell
KR20220125050A (ko) * 2021-03-04 2022-09-14 삼성전자주식회사 자기터널접합 소자, 자기터널접합 소자를 포함하는 메모리 장치, 및 자기터널접합 소자의 제조 방법
US20250300007A1 (en) * 2024-03-20 2025-09-25 Tokyo Electron Limited Plasma assisted metal oxide reduction

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2677321B2 (ja) 1995-03-15 1997-11-17 科学技術庁金属材料技術研究所長 ドライエッチング方法
WO2002045167A2 (en) 2000-11-30 2002-06-06 Asm International N.V. Thin films for magnetic devices
JP4111274B2 (ja) 2003-07-24 2008-07-02 キヤノンアネルバ株式会社 磁性材料のドライエッチング方法
JP4354519B2 (ja) 2006-09-13 2009-10-28 キヤノンアネルバ株式会社 磁気抵抗効果素子の製造方法
JP2008181971A (ja) * 2007-01-23 2008-08-07 Renesas Technology Corp 不揮発性記憶装置、磁気抵抗素子および磁気抵抗素子の製造方法
JP5366235B2 (ja) 2008-01-28 2013-12-11 東京エレクトロン株式会社 半導体装置の製造方法、半導体製造装置及び記憶媒体
US9147833B2 (en) * 2013-07-05 2015-09-29 Headway Technologies, Inc. Hybridized oxide capping layer for perpendicular magnetic anisotropy

Also Published As

Publication number Publication date
US10243140B2 (en) 2019-03-26
KR101786776B1 (ko) 2017-10-18
JP2017123355A (ja) 2017-07-13
KR20170081556A (ko) 2017-07-12
JP6506702B2 (ja) 2019-04-24
US20170194560A1 (en) 2017-07-06
TW201725663A (zh) 2017-07-16

Similar Documents

Publication Publication Date Title
TW201725663A (zh) 磁阻元件的製造方法及真空處理裝置
KR101903432B1 (ko) 플라스마 처리 방법
US11658043B2 (en) Selective anisotropic metal etch
US9330926B2 (en) Fabrication of a silicon structure and deep silicon etch with profile control
US8425786B2 (en) Plasma etching method and plasma etching apparatus
JP4354519B2 (ja) 磁気抵抗効果素子の製造方法
EP2916344B1 (en) Method of cleaning a plasma processing apparatus
KR101578077B1 (ko) 플라즈마 에칭 방법
US10157961B2 (en) Method of manufacturing magnetoresistive element
KR20170093718A (ko) 연속적인 플라즈마의 원자층 에칭
TWI457971B (zh) Plasma processing method
US11678583B2 (en) Method of manufacturing magnetic tunnel junction and magnetic tunnel junction
KR20160088855A (ko) 피에칭층을 에칭하는 방법
WO2010084909A1 (ja) 磁性膜加工チャンバのクリーニング方法、磁性素子の製造方法、および基板処理装置
TW201309848A (zh) 電漿蝕刻方法
JP4364669B2 (ja) ドライエッチング方法
JP6368837B2 (ja) プラズマエッチング方法
WO2009123325A1 (ja) 窒化珪素膜の製造方法、窒化珪素膜積層体の製造方法、コンピュータ読み取り可能な記憶媒体およびプラズマcvd装置