TWI598980B - 基板處理裝置及方法 - Google Patents

基板處理裝置及方法 Download PDF

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Publication number
TWI598980B
TWI598980B TW104127840A TW104127840A TWI598980B TW I598980 B TWI598980 B TW I598980B TW 104127840 A TW104127840 A TW 104127840A TW 104127840 A TW104127840 A TW 104127840A TW I598980 B TWI598980 B TW I598980B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid chemical
heating
supply
unit
Prior art date
Application number
TW104127840A
Other languages
English (en)
Chinese (zh)
Other versions
TW201624585A (zh
Inventor
鄭光逸
李炳垂
柳柱馨
Original Assignee
杰宜斯科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140112153A external-priority patent/KR102064804B1/ko
Priority claimed from KR1020140112152A external-priority patent/KR102069078B1/ko
Application filed by 杰宜斯科技有限公司 filed Critical 杰宜斯科技有限公司
Publication of TW201624585A publication Critical patent/TW201624585A/zh
Application granted granted Critical
Publication of TWI598980B publication Critical patent/TWI598980B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW104127840A 2014-08-27 2015-08-26 基板處理裝置及方法 TWI598980B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140112153A KR102064804B1 (ko) 2014-08-27 2014-08-27 기판 처리장치 및 기판 처리방법
KR1020140112152A KR102069078B1 (ko) 2014-08-27 2014-08-27 기판 처리장치

Publications (2)

Publication Number Publication Date
TW201624585A TW201624585A (zh) 2016-07-01
TWI598980B true TWI598980B (zh) 2017-09-11

Family

ID=55400053

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104127840A TWI598980B (zh) 2014-08-27 2015-08-26 基板處理裝置及方法
TW104127838A TWI593009B (zh) 2014-08-27 2015-08-26 基板處理裝置及方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104127838A TWI593009B (zh) 2014-08-27 2015-08-26 基板處理裝置及方法

Country Status (2)

Country Link
TW (2) TWI598980B (ko)
WO (2) WO2016032241A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102624577B1 (ko) 2020-10-28 2024-01-15 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102584512B1 (ko) 2020-12-31 2023-10-05 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025012A (en) * 1995-09-20 2000-02-15 Matsushita Electric Industrial Co., Ltd. Method and apparatus for determining film thickness control conditions and discharging liquid to a rotating substrate
KR100265286B1 (ko) * 1998-04-20 2000-10-02 윤종용 반도체장치 제조용 케미컬 순환공급장치 및 이의 구동방법
KR100436297B1 (ko) * 2000-03-14 2004-06-18 주성엔지니어링(주) 반도체 소자 제조용 플라즈마 스프레이 장치 및 이를이용한 반도체 소자 제조방법
US6902622B2 (en) * 2001-04-12 2005-06-07 Mattson Technology, Inc. Systems and methods for epitaxially depositing films on a semiconductor substrate
JP3982402B2 (ja) * 2002-02-28 2007-09-26 東京エレクトロン株式会社 処理装置及び処理方法
KR100877102B1 (ko) * 2007-05-28 2009-01-09 주식회사 하이닉스반도체 열처리 장치 및 이를 이용한 열처리 방법
KR101431782B1 (ko) * 2009-10-28 2014-08-20 엘아이지에이디피 주식회사 금속 유기물 화학 기상 증착장치 및 이를 위한 온도제어방법
KR20130142033A (ko) * 2012-06-18 2013-12-27 주식회사 제우스 기판 처리 장치
JP6242057B2 (ja) * 2013-02-15 2017-12-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
TW201624585A (zh) 2016-07-01
TW201633395A (zh) 2016-09-16
WO2016032241A1 (ko) 2016-03-03
WO2016032242A1 (ko) 2016-03-03
TWI593009B (zh) 2017-07-21

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