TWI598474B - High-frequency circuit copper foil, copper clad laminate, printed wiring substrate - Google Patents

High-frequency circuit copper foil, copper clad laminate, printed wiring substrate Download PDF

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Publication number
TWI598474B
TWI598474B TW105125612A TW105125612A TWI598474B TW I598474 B TWI598474 B TW I598474B TW 105125612 A TW105125612 A TW 105125612A TW 105125612 A TW105125612 A TW 105125612A TW I598474 B TWI598474 B TW I598474B
Authority
TW
Taiwan
Prior art keywords
copper foil
less
roughened particles
roughened
particles
Prior art date
Application number
TW105125612A
Other languages
English (en)
Chinese (zh)
Other versions
TW201718951A (zh
Inventor
Yuko Okuno
Kensaku Shinozaki
Takeo Uno
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=57983646&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI598474(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201718951A publication Critical patent/TW201718951A/zh
Application granted granted Critical
Publication of TWI598474B publication Critical patent/TWI598474B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW105125612A 2015-08-12 2016-08-11 High-frequency circuit copper foil, copper clad laminate, printed wiring substrate TWI598474B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015159424 2015-08-12

Publications (2)

Publication Number Publication Date
TW201718951A TW201718951A (zh) 2017-06-01
TWI598474B true TWI598474B (zh) 2017-09-11

Family

ID=57983646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105125612A TWI598474B (zh) 2015-08-12 2016-08-11 High-frequency circuit copper foil, copper clad laminate, printed wiring substrate

Country Status (5)

Country Link
JP (1) JP6089160B1 (ko)
KR (1) KR101954556B1 (ko)
CN (1) CN107113971B (ko)
TW (1) TWI598474B (ko)
WO (1) WO2017026490A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6543001B2 (ja) 2017-03-30 2019-07-10 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
JP6380626B1 (ja) 2017-07-19 2018-08-29 オムロン株式会社 樹脂構造体の製造方法および樹脂構造体
CN111194362B (zh) * 2017-07-24 2022-03-11 古河电气工业株式会社 表面处理铜箔、以及使用其的覆铜板及印刷配线板
TWI646227B (zh) * 2017-12-08 2019-01-01 南亞塑膠工業股份有限公司 應用於信號傳輸的銅箔以及線路板組件的製造方法
CN112004964B (zh) * 2018-04-25 2022-03-18 古河电气工业株式会社 表面处理铜箔、覆铜板以及印刷电路板
US10619262B1 (en) 2019-06-27 2020-04-14 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil
TWI715458B (zh) * 2020-03-04 2021-01-01 金像電子股份有限公司 硬式電路板的製造方法
WO2021251288A1 (ja) * 2020-06-11 2021-12-16 三井金属鉱業株式会社 両面銅張積層板
KR20220022060A (ko) 2020-08-16 2022-02-24 이프렌드 주식회사 블루투스 5.0기반 센서와 제어장치를 포함하는 클라우드 공유작물관리 시스템
CN113099605B (zh) * 2021-06-08 2022-07-12 广州方邦电子股份有限公司 金属箔、带载体金属箔、覆铜层叠板及印刷线路板
CN114603946B (zh) * 2022-05-12 2022-09-06 广州方邦电子股份有限公司 金属箔、覆铜层叠板、线路板、半导体、负极材料和电池

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5178064A (ja) 1974-12-28 1976-07-07 Stanley Electric Co Ltd Chiogurikoorusanhaisuishorihoho
JP3476264B2 (ja) 1993-12-24 2003-12-10 三井金属鉱業株式会社 プリント回路内層用銅箔およびその製造方法
JPH08222857A (ja) 1995-02-16 1996-08-30 Mitsui Mining & Smelting Co Ltd 銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板
JP4833556B2 (ja) * 2004-02-06 2011-12-07 古河電気工業株式会社 表面処理銅箔
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP2006210689A (ja) 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
JP2010110092A (ja) 2008-10-29 2010-05-13 Tokai Rika Co Ltd 駆動装置
JP5242710B2 (ja) 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP5634103B2 (ja) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5885054B2 (ja) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP4999126B2 (ja) * 2010-06-15 2012-08-15 古河電気工業株式会社 回路部品
MY161680A (en) * 2010-09-27 2017-05-15 Jx Nippon Mining & Metals Corp Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP2014224313A (ja) * 2013-04-26 2014-12-04 Jx日鉱日石金属株式会社 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法
WO2016174998A1 (ja) * 2015-04-28 2016-11-03 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板

Also Published As

Publication number Publication date
CN107113971B (zh) 2019-04-26
JP6089160B1 (ja) 2017-03-01
WO2017026490A1 (ja) 2017-02-16
KR101954556B1 (ko) 2019-03-05
CN107113971A (zh) 2017-08-29
KR20170097054A (ko) 2017-08-25
JPWO2017026490A1 (ja) 2017-08-10
TW201718951A (zh) 2017-06-01

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