TWI598401B - Semiconductor element protection material and semiconductor device - Google Patents

Semiconductor element protection material and semiconductor device Download PDF

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Publication number
TWI598401B
TWI598401B TW104123309A TW104123309A TWI598401B TW I598401 B TWI598401 B TW I598401B TW 104123309 A TW104123309 A TW 104123309A TW 104123309 A TW104123309 A TW 104123309A TW I598401 B TWI598401 B TW I598401B
Authority
TW
Taiwan
Prior art keywords
semiconductor element
weight
epoxy compound
protecting
cured product
Prior art date
Application number
TW104123309A
Other languages
English (en)
Chinese (zh)
Other versions
TW201609945A (zh
Inventor
Takashi Nishimura
Hiroshi Maenaka
Yuusuke Kobayashi
Shigeru Nakamura
Takuji Aoyama
Chizuru Kim
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201609945A publication Critical patent/TW201609945A/zh
Application granted granted Critical
Publication of TWI598401B publication Critical patent/TWI598401B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW104123309A 2014-07-18 2015-07-17 Semiconductor element protection material and semiconductor device TWI598401B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014147608 2014-07-18

Publications (2)

Publication Number Publication Date
TW201609945A TW201609945A (zh) 2016-03-16
TWI598401B true TWI598401B (zh) 2017-09-11

Family

ID=55078557

Family Applications (4)

Application Number Title Priority Date Filing Date
TW108104052A TWI704649B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置
TW104123309A TWI598401B (zh) 2014-07-18 2015-07-17 Semiconductor element protection material and semiconductor device
TW106123589A TWI653714B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置
TW109126737A TWI754342B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW108104052A TWI704649B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW106123589A TWI653714B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置
TW109126737A TWI754342B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置

Country Status (5)

Country Link
JP (1) JPWO2016010067A1 (fr)
KR (3) KR102383397B1 (fr)
CN (1) CN105849187A (fr)
TW (4) TWI704649B (fr)
WO (1) WO2016010067A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102460328B1 (ko) * 2015-08-17 2022-10-28 세키스이가가쿠 고교가부시키가이샤 반도체 장치 및 반도체 소자 보호용 재료
KR102611441B1 (ko) * 2017-01-03 2023-12-07 주식회사 아모센스 절연성 방열 코팅조성물 및 이를 통해 구현된 절연성 방열 물품
KR101756824B1 (ko) * 2017-01-03 2017-07-11 주식회사 아모센스 절연성 방열 코팅조성물 및 이를 통해 구현된 절연성 방열 물품
JP6678809B2 (ja) * 2017-02-24 2020-04-08 三菱電機株式会社 熱伝導性樹脂組成物、その硬化物、ならびに熱伝導性シートおよびその製造方法
WO2020158259A1 (fr) * 2019-02-01 2020-08-06 富士フイルム株式会社 Composition pour former un matériau conducteur de la chaleur et matériau conducteur de la chaleur
WO2023140644A1 (fr) * 2022-01-20 2023-07-27 (주)에버텍엔터프라이즈 Résine époxy modifiée pour encapsulation de dispositif à semi-conducteur, son procédé de fabrication, et composition de résine liquide pour encapsulation de dispositif à semi-conducteur présentant un faible gauchissement contenant celle-ci

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2817474B2 (ja) 1991-09-25 1998-10-30 信越化学工業株式会社 エポキシ樹脂組成物及び硬化物
JP3821173B2 (ja) 1996-12-19 2006-09-13 信越化学工業株式会社 エポキシ樹脂組成物
JP2005200533A (ja) 2004-01-15 2005-07-28 Kyocera Chemical Corp 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP2006023295A (ja) * 2004-06-10 2006-01-26 Canon Inc 複屈折測定法及びそれを用いた複屈折測定装置
JP2006232950A (ja) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2007217469A (ja) 2006-02-14 2007-08-30 Kyocera Chemical Corp 封止用エポキシ樹脂組成物および半導体装置
US7838577B2 (en) * 2007-07-19 2010-11-23 Sekisui Chemical Co., Ltd. Adhesive for electronic component
PT2221666E (pt) * 2007-11-12 2013-10-31 Hitachi Chemical Co Ltd Composição de resina fotossensível de tipo positivo, método para a produção de um padrão de revestimento fotossensível e dispositivo semicondutor
MY152342A (en) * 2008-12-10 2014-09-15 Sumitomo Bakelite Co Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
JP5721416B2 (ja) * 2010-12-13 2015-05-20 積水化学工業株式会社 熱伝導性接着剤
JP2012201696A (ja) 2011-03-23 2012-10-22 Panasonic Corp 電子部品用液状エポキシ樹脂組成物とそれを用いた電子装置
JP5860151B2 (ja) * 2012-07-31 2016-02-16 旭化成イーマテリアルズ株式会社 エポキシ樹脂組成物、エポキシ樹脂、及び硬化物
JP2014040538A (ja) 2012-08-23 2014-03-06 Hitachi Chemical Co Ltd ２液タイプのエポキシ樹脂組成物

Also Published As

Publication number Publication date
JPWO2016010067A1 (ja) 2017-04-27
TW202105621A (zh) 2021-02-01
KR20170013195A (ko) 2017-02-06
KR20210127793A (ko) 2021-10-22
TWI704649B (zh) 2020-09-11
CN105849187A (zh) 2016-08-10
WO2016010067A1 (fr) 2016-01-21
TW201735273A (zh) 2017-10-01
KR102383397B1 (ko) 2022-04-08
TW201921605A (zh) 2019-06-01
TWI754342B (zh) 2022-02-01
KR101808472B1 (ko) 2017-12-12
TWI653714B (zh) 2019-03-11
KR102313846B1 (ko) 2021-10-18
KR20170118261A (ko) 2017-10-24
TW201609945A (zh) 2016-03-16

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