TWI597127B - Workpiece grinding device - Google Patents

Workpiece grinding device Download PDF

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Publication number
TWI597127B
TWI597127B TW103114539A TW103114539A TWI597127B TW I597127 B TWI597127 B TW I597127B TW 103114539 A TW103114539 A TW 103114539A TW 103114539 A TW103114539 A TW 103114539A TW I597127 B TWI597127 B TW I597127B
Authority
TW
Taiwan
Prior art keywords
workpiece
polishing
template
abrasive
polishing cloth
Prior art date
Application number
TW103114539A
Other languages
English (en)
Chinese (zh)
Other versions
TW201505762A (zh
Inventor
橋本浩昌
佐佐木正直
Original Assignee
信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越半導體股份有限公司 filed Critical 信越半導體股份有限公司
Publication of TW201505762A publication Critical patent/TW201505762A/zh
Application granted granted Critical
Publication of TWI597127B publication Critical patent/TWI597127B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW103114539A 2013-05-16 2014-04-22 Workpiece grinding device TWI597127B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013103719A JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置

Publications (2)

Publication Number Publication Date
TW201505762A TW201505762A (zh) 2015-02-16
TWI597127B true TWI597127B (zh) 2017-09-01

Family

ID=51897996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103114539A TWI597127B (zh) 2013-05-16 2014-04-22 Workpiece grinding device

Country Status (8)

Country Link
US (1) US20160082567A1 (https=)
JP (1) JP5870960B2 (https=)
KR (1) KR102192288B1 (https=)
CN (1) CN105189045B (https=)
DE (1) DE112014002107T5 (https=)
SG (1) SG11201509094YA (https=)
TW (1) TWI597127B (https=)
WO (1) WO2014185003A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10341371B2 (en) * 2016-08-31 2019-07-02 Nicira, Inc. Identifying and handling threats to data compute nodes in public cloud
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
JP7139126B2 (ja) * 2018-03-16 2022-09-20 富士紡ホールディングス株式会社 保持具及びその製造方法
CN110394706A (zh) * 2019-07-25 2019-11-01 西安奕斯伟硅片技术有限公司 一种硅片处理装置及方法
CN111644977A (zh) * 2020-07-17 2020-09-11 中国科学院微电子研究所 研磨用固定环以及研磨头

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
TW353203B (en) * 1995-04-10 1999-02-21 Matsushita Electric Industrial Co Ltd Apparatus for holding substrate to be polished
JP3615592B2 (ja) 1995-07-11 2005-02-02 不二越機械工業株式会社 研磨装置
JPH1190820A (ja) 1997-09-12 1999-04-06 Shin Etsu Handotai Co Ltd ウエーハ研磨用テンプレートと該テンプレートを利用したウエーハ剥がし方法
US6899610B2 (en) * 2001-06-01 2005-05-31 Raytech Innovative Solutions, Inc. Retaining ring with wear pad for use in chemical mechanical planarization
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
JP2005169568A (ja) * 2003-12-11 2005-06-30 Mitsui Chemicals Inc リテーナリング及びそれを用いた研磨装置
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
US20080076253A1 (en) * 2004-09-30 2008-03-27 Hiroshi Fukada Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
CN101137464A (zh) * 2005-04-12 2008-03-05 日本精密电子株式会社 Cmp装置用挡圈及其制造方法、以及cmp装置
US20070224864A1 (en) * 2005-05-24 2007-09-27 John Burns CMP retaining ring
JP4534165B2 (ja) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
JP5615589B2 (ja) * 2010-05-07 2014-10-29 富士紡ホールディングス株式会社 枠材および枠材を有する保持具
JP5683398B2 (ja) * 2011-07-06 2015-03-11 株式会社クレハ 研磨装置用ワークピース保持リング

Also Published As

Publication number Publication date
KR20160008550A (ko) 2016-01-22
TW201505762A (zh) 2015-02-16
CN105189045B (zh) 2017-05-10
US20160082567A1 (en) 2016-03-24
KR102192288B1 (ko) 2020-12-17
DE112014002107T5 (de) 2016-01-14
JP5870960B2 (ja) 2016-03-01
WO2014185003A1 (ja) 2014-11-20
CN105189045A (zh) 2015-12-23
JP2014223692A (ja) 2014-12-04
SG11201509094YA (en) 2015-12-30

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