TWI595586B - 基板傳輸裝置及移動基板之方法 - Google Patents

基板傳輸裝置及移動基板之方法 Download PDF

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Publication number
TWI595586B
TWI595586B TW102131409A TW102131409A TWI595586B TW I595586 B TWI595586 B TW I595586B TW 102131409 A TW102131409 A TW 102131409A TW 102131409 A TW102131409 A TW 102131409A TW I595586 B TWI595586 B TW I595586B
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TW
Taiwan
Prior art keywords
substrate
support
cavity
track
support members
Prior art date
Application number
TW102131409A
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English (en)
Chinese (zh)
Other versions
TW201417207A (zh
Inventor
雷波 林登博克
Original Assignee
應用材料股份有限公司
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Publication of TW201417207A publication Critical patent/TW201417207A/zh
Application granted granted Critical
Publication of TWI595586B publication Critical patent/TWI595586B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
TW102131409A 2012-09-10 2013-08-30 基板傳輸裝置及移動基板之方法 TWI595586B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/067659 WO2014037058A1 (en) 2012-09-10 2012-09-10 Substrate transfer device and method of moving substrates

Publications (2)

Publication Number Publication Date
TW201417207A TW201417207A (zh) 2014-05-01
TWI595586B true TWI595586B (zh) 2017-08-11

Family

ID=46934521

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102131409A TWI595586B (zh) 2012-09-10 2013-08-30 基板傳輸裝置及移動基板之方法

Country Status (7)

Country Link
US (1) US20150303090A1 (https=)
EP (1) EP2892834B1 (https=)
JP (1) JP6096905B2 (https=)
KR (2) KR101853105B1 (https=)
CN (1) CN104619619B (https=)
TW (1) TWI595586B (https=)
WO (1) WO2014037058A1 (https=)

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CN104986573B (zh) * 2015-05-28 2017-03-08 合肥京东方光电科技有限公司 用于承载基板的承载装置
CN108475654B (zh) 2016-01-18 2022-06-07 应用材料公司 用于在真空腔室中传送基板载体的设备、用于真空处理基板的系统、及用于在真空腔室中传送基板载体的方法
WO2018161160A1 (en) * 2017-03-06 2018-09-13 Ats Automation Tooling Systems Inc. Linear motor conveyor system with diverter and method for design and configuration thereof
JP2019532485A (ja) * 2017-08-25 2019-11-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内でキャリアを搬送するための装置、及び真空チャンバ内でキャリアを搬送するための方法
KR102248738B1 (ko) * 2017-08-25 2021-05-04 어플라이드 머티어리얼스, 인코포레이티드 캐리어를 상승 또는 하강시키기 위한 조립체, 진공 챔버에서 캐리어를 운송하기 위한 장치, 및 캐리어를 상승 또는 하강시키기 위한 방법
CN112218971A (zh) * 2018-05-24 2021-01-12 应用材料公司 用于运输载体的磁悬浮系统、用于磁悬浮系统的载体、用于竖直处理基板的处理系统以及运输载体的方法
CN109132546A (zh) * 2018-08-23 2019-01-04 通彩智能科技集团有限公司 一种薄板输送装置
WO2020200443A1 (en) * 2019-04-03 2020-10-08 Applied Materials, Inc. Carrier transport system, vacuum deposition system, and method of transporting a carrier in a vacuum chamber
US11885773B2 (en) * 2019-06-24 2024-01-30 Illinois Tool Works Inc. Methods and apparatus to perform load measurements on flexible substrates
KR102790235B1 (ko) * 2019-08-14 2025-04-01 어플라이드 머티어리얼스, 인코포레이티드 경로 스위칭 조립체, 이를 갖는 챔버 및 기판 프로세싱 시스템, 및 이들을 위한 방법들
CN111219978B (zh) * 2020-03-18 2024-09-03 无锡先导智能装备股份有限公司 中转装置及烘干设备
CN111593314B (zh) * 2020-05-25 2022-04-19 宁波大榭开发区佳洁锌铸件有限公司 一种真空镀膜工艺及装置
WO2023222196A1 (en) * 2022-05-17 2023-11-23 Applied Materials, Inc. Carrier transport system, vacuum deposition system, and method of transporting carriers

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JPH11288097A (ja) * 1998-04-03 1999-10-19 Nippon Densan Shinpo Kk 露光装置
US6082377A (en) * 1997-11-18 2000-07-04 Frey; Bernhard M. Vertical wafer cleaning and drying system
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
TW201003827A (en) * 2008-06-27 2010-01-16 Applied Materials Inc Processing system and method of operating a processing system
CN102046840A (zh) * 2008-03-25 2011-05-04 奥宝科技Lt太阳能有限公司 处理装置及处理方法

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US1724235A (en) * 1924-07-22 1929-08-13 H M Smith Mechanical store
DE431698C (de) * 1925-05-16 1926-07-15 Maschf Ag Fa Deutsche Vorrichtung zum Aufstapeln der einen Abfuhrrollgang verlassenden Platinen
US1851539A (en) * 1929-09-27 1932-03-29 Motor Terminals Co System of handling freight
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US8215473B2 (en) 2008-05-21 2012-07-10 Applied Materials, Inc. Next generation screen printing system
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JP2012001282A (ja) * 2008-09-05 2012-01-05 Canon Anelva Corp 基板搬送装置及び真空処理装置
EP2489759B1 (en) * 2011-02-21 2014-12-10 Applied Materials, Inc. System for utilization improvement of process chambers and method of operating thereof
JP6055229B2 (ja) * 2012-08-09 2016-12-27 株式会社アルバック 被処理体の搬送機構および真空処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6082377A (en) * 1997-11-18 2000-07-04 Frey; Bernhard M. Vertical wafer cleaning and drying system
JPH11288097A (ja) * 1998-04-03 1999-10-19 Nippon Densan Shinpo Kk 露光装置
CN102046840A (zh) * 2008-03-25 2011-05-04 奥宝科技Lt太阳能有限公司 处理装置及处理方法
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
TW201003827A (en) * 2008-06-27 2010-01-16 Applied Materials Inc Processing system and method of operating a processing system

Also Published As

Publication number Publication date
CN104619619A (zh) 2015-05-13
JP2015527750A (ja) 2015-09-17
US20150303090A1 (en) 2015-10-22
JP6096905B2 (ja) 2017-03-15
KR20170135982A (ko) 2017-12-08
EP2892834B1 (en) 2018-05-02
CN104619619B (zh) 2017-08-11
EP2892834A1 (en) 2015-07-15
WO2014037058A1 (en) 2014-03-13
KR20150053984A (ko) 2015-05-19
KR101853105B1 (ko) 2018-04-27
TW201417207A (zh) 2014-05-01

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