TWI595586B - 基板傳輸裝置及移動基板之方法 - Google Patents

基板傳輸裝置及移動基板之方法 Download PDF

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Publication number
TWI595586B
TWI595586B TW102131409A TW102131409A TWI595586B TW I595586 B TWI595586 B TW I595586B TW 102131409 A TW102131409 A TW 102131409A TW 102131409 A TW102131409 A TW 102131409A TW I595586 B TWI595586 B TW I595586B
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TW
Taiwan
Prior art keywords
substrate
support
cavity
track
support members
Prior art date
Application number
TW102131409A
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English (en)
Chinese (zh)
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TW201417207A (zh
Inventor
雷波 林登博克
Original Assignee
應用材料股份有限公司
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Publication of TW201417207A publication Critical patent/TW201417207A/zh
Application granted granted Critical
Publication of TWI595586B publication Critical patent/TWI595586B/zh

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Classifications

    • H10P72/3208—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H10P72/0456—
    • H10P72/3206—
    • H10P72/3308—
    • H10P72/3314—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
TW102131409A 2012-09-10 2013-08-30 基板傳輸裝置及移動基板之方法 TWI595586B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/067659 WO2014037058A1 (en) 2012-09-10 2012-09-10 Substrate transfer device and method of moving substrates

Publications (2)

Publication Number Publication Date
TW201417207A TW201417207A (zh) 2014-05-01
TWI595586B true TWI595586B (zh) 2017-08-11

Family

ID=46934521

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102131409A TWI595586B (zh) 2012-09-10 2013-08-30 基板傳輸裝置及移動基板之方法

Country Status (7)

Country Link
US (1) US20150303090A1 (enExample)
EP (1) EP2892834B1 (enExample)
JP (1) JP6096905B2 (enExample)
KR (2) KR20170135982A (enExample)
CN (1) CN104619619B (enExample)
TW (1) TWI595586B (enExample)
WO (1) WO2014037058A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104986573B (zh) * 2015-05-28 2017-03-08 合肥京东方光电科技有限公司 用于承载基板的承载装置
EP3405973A1 (en) * 2016-01-18 2018-11-28 Applied Materials, Inc. Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber
EP3458390A4 (en) * 2017-03-06 2020-07-29 ATS Automation Tooling Systems Inc. LINEAR MOTOR CONVEYOR SYSTEM WITH UNDROLLER AND PROCESS FOR DESIGNING AND CONFIGURING THE SAME
CN109790618B (zh) * 2017-08-25 2022-10-04 应用材料公司 用于提升或降低载体的组件、用于在真空腔室中运输载体的设备、以及用于提升或降低载体的方法
JP2019532485A (ja) * 2017-08-25 2019-11-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内でキャリアを搬送するための装置、及び真空チャンバ内でキャリアを搬送するための方法
CN112218971A (zh) * 2018-05-24 2021-01-12 应用材料公司 用于运输载体的磁悬浮系统、用于磁悬浮系统的载体、用于竖直处理基板的处理系统以及运输载体的方法
CN109132546A (zh) * 2018-08-23 2019-01-04 通彩智能科技集团有限公司 一种薄板输送装置
CN216435860U (zh) * 2019-04-03 2022-05-03 应用材料公司 载体运输系统和真空沉积系统
US11885773B2 (en) * 2019-06-24 2024-01-30 Illinois Tool Works Inc. Methods and apparatus to perform load measurements on flexible substrates
KR102790235B1 (ko) * 2019-08-14 2025-04-01 어플라이드 머티어리얼스, 인코포레이티드 경로 스위칭 조립체, 이를 갖는 챔버 및 기판 프로세싱 시스템, 및 이들을 위한 방법들
CN111219978B (zh) * 2020-03-18 2024-09-03 无锡先导智能装备股份有限公司 中转装置及烘干设备
CN111593314B (zh) * 2020-05-25 2022-04-19 宁波大榭开发区佳洁锌铸件有限公司 一种真空镀膜工艺及装置
CN119213544A (zh) * 2022-05-17 2024-12-27 应用材料公司 载体运输系统、真空沉积系统和运输载体的方法

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JPH11288097A (ja) * 1998-04-03 1999-10-19 Nippon Densan Shinpo Kk 露光装置
US6082377A (en) * 1997-11-18 2000-07-04 Frey; Bernhard M. Vertical wafer cleaning and drying system
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
TW201003827A (en) * 2008-06-27 2010-01-16 Applied Materials Inc Processing system and method of operating a processing system
CN102046840A (zh) * 2008-03-25 2011-05-04 奥宝科技Lt太阳能有限公司 处理装置及处理方法

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US1724235A (en) * 1924-07-22 1929-08-13 H M Smith Mechanical store
DE431698C (de) * 1925-05-16 1926-07-15 Maschf Ag Fa Deutsche Vorrichtung zum Aufstapeln der einen Abfuhrrollgang verlassenden Platinen
US1851539A (en) * 1929-09-27 1932-03-29 Motor Terminals Co System of handling freight
GB429375A (en) * 1934-01-29 1935-05-29 John Drysdale Improvements in or relating to the handling in bulk of small articles
US8215473B2 (en) 2008-05-21 2012-07-10 Applied Materials, Inc. Next generation screen printing system
KR100885877B1 (ko) * 2008-07-11 2009-02-26 주식회사 인아텍 기판 이송장치
JP2012001282A (ja) * 2008-09-05 2012-01-05 Canon Anelva Corp 基板搬送装置及び真空処理装置
EP2489759B1 (en) * 2011-02-21 2014-12-10 Applied Materials, Inc. System for utilization improvement of process chambers and method of operating thereof
JP6055229B2 (ja) * 2012-08-09 2016-12-27 株式会社アルバック 被処理体の搬送機構および真空処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6082377A (en) * 1997-11-18 2000-07-04 Frey; Bernhard M. Vertical wafer cleaning and drying system
JPH11288097A (ja) * 1998-04-03 1999-10-19 Nippon Densan Shinpo Kk 露光装置
CN102046840A (zh) * 2008-03-25 2011-05-04 奥宝科技Lt太阳能有限公司 处理装置及处理方法
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
TW201003827A (en) * 2008-06-27 2010-01-16 Applied Materials Inc Processing system and method of operating a processing system

Also Published As

Publication number Publication date
EP2892834A1 (en) 2015-07-15
US20150303090A1 (en) 2015-10-22
CN104619619A (zh) 2015-05-13
KR20150053984A (ko) 2015-05-19
EP2892834B1 (en) 2018-05-02
JP6096905B2 (ja) 2017-03-15
TW201417207A (zh) 2014-05-01
CN104619619B (zh) 2017-08-11
WO2014037058A1 (en) 2014-03-13
JP2015527750A (ja) 2015-09-17
KR101853105B1 (ko) 2018-04-27
KR20170135982A (ko) 2017-12-08

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