TWI595023B - 聚醯胺酸組成物、硬化膜以及電子零件 - Google Patents

聚醯胺酸組成物、硬化膜以及電子零件 Download PDF

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Publication number
TWI595023B
TWI595023B TW102143032A TW102143032A TWI595023B TW I595023 B TWI595023 B TW I595023B TW 102143032 A TW102143032 A TW 102143032A TW 102143032 A TW102143032 A TW 102143032A TW I595023 B TWI595023 B TW I595023B
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TW
Taiwan
Prior art keywords
formula
ether
acid composition
diamine
composition
Prior art date
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TW102143032A
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English (en)
Chinese (zh)
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TW201425391A (zh
Inventor
木村佑希
江頭友弘
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捷恩智股份有限公司
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Publication of TW201425391A publication Critical patent/TW201425391A/zh
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Publication of TWI595023B publication Critical patent/TWI595023B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW102143032A 2012-12-19 2013-11-26 聚醯胺酸組成物、硬化膜以及電子零件 TWI595023B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012276862A JP6020129B2 (ja) 2012-12-19 2012-12-19 ポリアミド酸組成物

Publications (2)

Publication Number Publication Date
TW201425391A TW201425391A (zh) 2014-07-01
TWI595023B true TWI595023B (zh) 2017-08-11

Family

ID=51130715

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102143032A TWI595023B (zh) 2012-12-19 2013-11-26 聚醯胺酸組成物、硬化膜以及電子零件

Country Status (3)

Country Link
JP (1) JP6020129B2 (ko)
KR (1) KR102085681B1 (ko)
TW (1) TWI595023B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101896271B1 (ko) * 2013-03-18 2018-09-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법
KR102122278B1 (ko) 2014-02-26 2020-06-15 도레이 카부시키가이샤 폴리이미드 수지, 이것을 이용한 수지 조성물 및 적층 필름
SG11201708251VA (en) * 2015-04-15 2017-11-29 Toray Industries Heat-resistant resin composition, method for manufacturing heat-resistant resin film, method for manufacturing interlayer insulation film or surface protective film, and method for manufacturing electronic component or semiconductor component
JP7367699B2 (ja) * 2018-11-28 2023-10-24 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201129615A (en) * 2009-12-03 2011-09-01 Jsr Corp Liquid crystal aligning agent and liquid crystal display element
TW201219495A (en) * 2010-09-21 2012-05-16 Pi R & Amp D Co Ltd Polyimide resin composition for formation of solar cell back reflective layer and method of forming solar cell back reflective layer using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101288875B1 (ko) 2009-04-14 2013-07-23 에스케이텔레콤 주식회사 로밍 가입자 데이터 호 처리 시스템 및 방법
CN102712755A (zh) * 2010-01-25 2012-10-03 三井化学株式会社 聚酰亚胺树脂组合物、含有该组合物的粘接剂、叠层体及组件

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201129615A (en) * 2009-12-03 2011-09-01 Jsr Corp Liquid crystal aligning agent and liquid crystal display element
TW201219495A (en) * 2010-09-21 2012-05-16 Pi R & Amp D Co Ltd Polyimide resin composition for formation of solar cell back reflective layer and method of forming solar cell back reflective layer using the same

Also Published As

Publication number Publication date
JP6020129B2 (ja) 2016-11-02
KR102085681B1 (ko) 2020-03-06
JP2014118532A (ja) 2014-06-30
KR20140079715A (ko) 2014-06-27
TW201425391A (zh) 2014-07-01

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