TWI593513B - 用於化學機械研磨中研磨速率校正的反饋的方法 - Google Patents

用於化學機械研磨中研磨速率校正的反饋的方法 Download PDF

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Publication number
TWI593513B
TWI593513B TW100116191A TW100116191A TWI593513B TW I593513 B TWI593513 B TW I593513B TW 100116191 A TW100116191 A TW 100116191A TW 100116191 A TW100116191 A TW 100116191A TW I593513 B TWI593513 B TW I593513B
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TW
Taiwan
Prior art keywords
region
substrate
time
indicator
grinding
Prior art date
Application number
TW100116191A
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English (en)
Chinese (zh)
Other versions
TW201210742A (en
Inventor
錢隽
蓋瑞森查爾斯Ｃ
迪漢達潘尼席維庫瑪
大衛傑弗瑞杜魯
李哈利Ｑ
Original Assignee
應用材料股份有限公司
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Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201210742A publication Critical patent/TW201210742A/zh
Application granted granted Critical
Publication of TWI593513B publication Critical patent/TWI593513B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW100116191A 2010-05-17 2011-05-09 用於化學機械研磨中研磨速率校正的反饋的方法 TWI593513B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/781,644 US8190285B2 (en) 2010-05-17 2010-05-17 Feedback for polishing rate correction in chemical mechanical polishing

Publications (2)

Publication Number Publication Date
TW201210742A TW201210742A (en) 2012-03-16
TWI593513B true TWI593513B (zh) 2017-08-01

Family

ID=44912179

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100116191A TWI593513B (zh) 2010-05-17 2011-05-09 用於化學機械研磨中研磨速率校正的反饋的方法

Country Status (5)

Country Link
US (3) US8190285B2 (https=)
JP (1) JP6009436B2 (https=)
KR (1) KR101769886B1 (https=)
TW (1) TWI593513B (https=)
WO (1) WO2011146208A2 (https=)

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US10643853B2 (en) 2012-02-10 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer thinning apparatus having feedback control and method of using
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CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
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TWI810069B (zh) 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
KR102737625B1 (ko) * 2020-06-26 2024-12-04 어플라이드 머티어리얼스, 인코포레이티드 변형가능한 기판 척
JP7389718B2 (ja) * 2020-06-29 2023-11-30 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
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JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
CN113246012B (zh) * 2021-05-14 2022-08-09 上海华力集成电路制造有限公司 化学机械研磨的控制方法、设备和存储介质
JP2024040885A (ja) * 2022-09-13 2024-03-26 株式会社荏原製作所 研磨装置におけるグラフの表示方法およびコンピュータプログラム
CN115946036B (zh) * 2022-12-15 2025-08-05 北京晶亦精微科技股份有限公司 一种研磨压力修整方法、装置、计算机设备及介质
CN117140200A (zh) * 2023-09-19 2023-12-01 安徽久泰电气有限公司 一种打磨机器人全自动打磨抛光控制方法及系统

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Also Published As

Publication number Publication date
US8755927B2 (en) 2014-06-17
WO2011146208A2 (en) 2011-11-24
JP6009436B2 (ja) 2016-10-19
KR101769886B1 (ko) 2017-08-21
WO2011146208A3 (en) 2012-03-01
TW201210742A (en) 2012-03-16
KR20130079441A (ko) 2013-07-10
US8467896B2 (en) 2013-06-18
JP2013529386A (ja) 2013-07-18
US20120231701A1 (en) 2012-09-13
US20110281501A1 (en) 2011-11-17
US20130273812A1 (en) 2013-10-17
US8190285B2 (en) 2012-05-29

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