KR101769886B1 - 화학적 기계적 폴리싱에서 폴리싱 레이트를 교정하기 위한 피드백 - Google Patents

화학적 기계적 폴리싱에서 폴리싱 레이트를 교정하기 위한 피드백 Download PDF

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KR101769886B1
KR101769886B1 KR1020127032822A KR20127032822A KR101769886B1 KR 101769886 B1 KR101769886 B1 KR 101769886B1 KR 1020127032822 A KR1020127032822 A KR 1020127032822A KR 20127032822 A KR20127032822 A KR 20127032822A KR 101769886 B1 KR101769886 B1 KR 101769886B1
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zone
polishing
index
substrate
adjustable
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KR20130079441A (ko
Inventor
준 첸
찰스 씨. 갈레트슨
시바쿠마르 다한다파니
제프리 드류 데이비드
해리 큐. 리
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127032822A 2010-05-17 2011-04-26 화학적 기계적 폴리싱에서 폴리싱 레이트를 교정하기 위한 피드백 Active KR101769886B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/781,644 US8190285B2 (en) 2010-05-17 2010-05-17 Feedback for polishing rate correction in chemical mechanical polishing
US12/781,644 2010-05-17
PCT/US2011/033998 WO2011146208A2 (en) 2010-05-17 2011-04-26 Feedback for polishing rate correction in chemical mechanical polishing

Publications (2)

Publication Number Publication Date
KR20130079441A KR20130079441A (ko) 2013-07-10
KR101769886B1 true KR101769886B1 (ko) 2017-08-21

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KR1020127032822A Active KR101769886B1 (ko) 2010-05-17 2011-04-26 화학적 기계적 폴리싱에서 폴리싱 레이트를 교정하기 위한 피드백

Country Status (5)

Country Link
US (3) US8190285B2 (https=)
JP (1) JP6009436B2 (https=)
KR (1) KR101769886B1 (https=)
TW (1) TWI593513B (https=)
WO (1) WO2011146208A2 (https=)

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KR20190055132A (ko) * 2016-10-10 2019-05-22 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 실시간 프로파일 제어

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US8292693B2 (en) * 2008-11-26 2012-10-23 Applied Materials, Inc. Using optical metrology for wafer to wafer feed back process control
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US10643853B2 (en) 2012-02-10 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer thinning apparatus having feedback control and method of using
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TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
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TWI810069B (zh) 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
KR102737625B1 (ko) * 2020-06-26 2024-12-04 어플라이드 머티어리얼스, 인코포레이티드 변형가능한 기판 척
JP7389718B2 (ja) * 2020-06-29 2023-11-30 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
JP7637482B2 (ja) * 2020-08-11 2025-02-28 株式会社荏原製作所 基板処理装置及び研磨部材のドレッシング制御方法
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KR102747336B1 (ko) * 2021-03-03 2024-12-31 어플라이드 머티어리얼스, 인코포레이티드 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들
US11919121B2 (en) 2021-03-05 2024-03-05 Applied Materials, Inc. Control of processing parameters during substrate polishing using constrained cost function
JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
CN113246012B (zh) * 2021-05-14 2022-08-09 上海华力集成电路制造有限公司 化学机械研磨的控制方法、设备和存储介质
JP2024040885A (ja) * 2022-09-13 2024-03-26 株式会社荏原製作所 研磨装置におけるグラフの表示方法およびコンピュータプログラム
CN115946036B (zh) * 2022-12-15 2025-08-05 北京晶亦精微科技股份有限公司 一种研磨压力修整方法、装置、计算机设备及介质
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Also Published As

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US8755927B2 (en) 2014-06-17
WO2011146208A2 (en) 2011-11-24
JP6009436B2 (ja) 2016-10-19
WO2011146208A3 (en) 2012-03-01
TW201210742A (en) 2012-03-16
TWI593513B (zh) 2017-08-01
KR20130079441A (ko) 2013-07-10
US8467896B2 (en) 2013-06-18
JP2013529386A (ja) 2013-07-18
US20120231701A1 (en) 2012-09-13
US20110281501A1 (en) 2011-11-17
US20130273812A1 (en) 2013-10-17
US8190285B2 (en) 2012-05-29

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