TWI588274B - 放熱零件用銅合金板以及放熱零件 - Google Patents
放熱零件用銅合金板以及放熱零件 Download PDFInfo
- Publication number
- TWI588274B TWI588274B TW105109030A TW105109030A TWI588274B TW I588274 B TWI588274 B TW I588274B TW 105109030 A TW105109030 A TW 105109030A TW 105109030 A TW105109030 A TW 105109030A TW I588274 B TWI588274 B TW I588274B
- Authority
- TW
- Taiwan
- Prior art keywords
- mass
- copper alloy
- heat
- aging treatment
- less
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 73
- 230000032683 aging Effects 0.000 claims description 53
- 238000010438 heat treatment Methods 0.000 claims description 44
- 239000010949 copper Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 12
- 239000011247 coating layer Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 229910052749 magnesium Inorganic materials 0.000 claims description 8
- 229910052748 manganese Inorganic materials 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 230000035882 stress Effects 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 229910052726 zirconium Inorganic materials 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 25
- 229910052802 copper Inorganic materials 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000012360 testing method Methods 0.000 description 11
- 230000001965 increasing effect Effects 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 238000001556 precipitation Methods 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000003507 refrigerant Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000004018 waxing Methods 0.000 description 6
- 238000005275 alloying Methods 0.000 description 5
- 229910052785 arsenic Inorganic materials 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000007872 degassing Methods 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 239000006104 solid solution Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 229910017755 Cu-Sn Inorganic materials 0.000 description 4
- 229910017927 Cu—Sn Inorganic materials 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052745 lead Inorganic materials 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229910052711 selenium Inorganic materials 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000000265 homogenisation Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 238000001887 electron backscatter diffraction Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- FZQBLSFKFKIKJI-UHFFFAOYSA-N boron copper Chemical compound [B].[Cu] FZQBLSFKFKIKJI-UHFFFAOYSA-N 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015066518A JP6031548B2 (ja) | 2015-03-27 | 2015-03-27 | 放熱部品用銅合金板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201702391A TW201702391A (zh) | 2017-01-16 |
| TWI588274B true TWI588274B (zh) | 2017-06-21 |
Family
ID=57005589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105109030A TWI588274B (zh) | 2015-03-27 | 2016-03-23 | 放熱零件用銅合金板以及放熱零件 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6031548B2 (ja) |
| KR (1) | KR101979532B1 (ja) |
| CN (1) | CN107429323B (ja) |
| TW (1) | TWI588274B (ja) |
| WO (1) | WO2016158391A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6151813B1 (ja) * | 2016-03-23 | 2017-06-21 | 株式会社神戸製鋼所 | ベーパチャンバーの製造方法 |
| JP6446010B2 (ja) * | 2016-09-29 | 2018-12-26 | 株式会社神戸製鋼所 | 放熱部品用銅合金板 |
| KR102226988B1 (ko) * | 2016-10-05 | 2021-03-11 | 가부시키가이샤 고베 세이코쇼 | 방열 부품용 구리 합금판, 방열 부품, 및 방열 부품의 제조 방법 |
| CN109402446A (zh) * | 2018-12-24 | 2019-03-01 | 中铝洛阳铜加工有限公司 | 一种高端框架材料用铜带制备工艺 |
| CN109930099B (zh) * | 2019-01-31 | 2020-06-02 | 河南师范大学 | 一种高强度强立方织构Cu-Fe-Zr-P合金基带的制备方法 |
| CN115091153A (zh) * | 2022-07-05 | 2022-09-23 | 珠海市斗门区宇博电子科技有限公司 | 一种散热器制作工艺 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011252215A (ja) * | 2010-06-03 | 2011-12-15 | Mitsubishi Shindoh Co Ltd | 放熱性及び樹脂密着性に優れた電子機器用銅合金条材 |
| JP2015048517A (ja) * | 2013-09-03 | 2015-03-16 | Jx日鉱日石金属株式会社 | 導電性及び曲げたわみ係数に優れる銅合金板 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09296237A (ja) * | 1996-04-28 | 1997-11-18 | Nikko Kinzoku Kk | 半導体パッケージング用金属基板材料 |
| JP2001326308A (ja) * | 2000-05-15 | 2001-11-22 | A & A Kenkyusho:Kk | スカイブ放熱部材 |
| JP4567906B2 (ja) * | 2001-03-30 | 2010-10-27 | 株式会社神戸製鋼所 | 電子・電気部品用銅合金板または条およびその製造方法 |
| JP2003277853A (ja) | 2002-03-26 | 2003-10-02 | Dowa Mining Co Ltd | ヒートスプレッダ用銅合金 |
| JP4590264B2 (ja) * | 2002-09-13 | 2010-12-01 | オリン コーポレイション | 時効硬化性銅基合金および製造方法 |
| JP4112602B2 (ja) | 2005-09-01 | 2008-07-02 | 株式会社渕上ミクロ | ヒートパイプ |
| JP4878317B2 (ja) | 2007-03-22 | 2012-02-15 | 株式会社コベルコ マテリアル銅管 | 銅または銅合金からなる銅管 |
| JP5214701B2 (ja) * | 2010-10-18 | 2013-06-19 | Ｊｘ日鉱日石金属株式会社 | 強度、導電率及び曲げ加工性に優れたチタン銅及びその製造方法 |
| JP6176433B2 (ja) | 2013-01-10 | 2017-08-09 | 株式会社Ｗｅｌｃｏｎ | ベーパチャンバ |
| JP5467163B1 (ja) | 2013-03-26 | 2014-04-09 | Ｊｘ日鉱日石金属株式会社 | 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法 |
-
2015
- 2015-03-27 JP JP2015066518A patent/JP6031548B2/ja not_active Expired - Fee Related
-
2016
- 2016-03-15 KR KR1020177030354A patent/KR101979532B1/ko active IP Right Grant
- 2016-03-15 CN CN201680018249.2A patent/CN107429323B/zh not_active Expired - Fee Related
- 2016-03-15 WO PCT/JP2016/058183 patent/WO2016158391A1/ja active Application Filing
- 2016-03-23 TW TW105109030A patent/TWI588274B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011252215A (ja) * | 2010-06-03 | 2011-12-15 | Mitsubishi Shindoh Co Ltd | 放熱性及び樹脂密着性に優れた電子機器用銅合金条材 |
| JP2015048517A (ja) * | 2013-09-03 | 2015-03-16 | Jx日鉱日石金属株式会社 | 導電性及び曲げたわみ係数に優れる銅合金板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016186103A (ja) | 2016-10-27 |
| KR101979532B1 (ko) | 2019-05-16 |
| WO2016158391A1 (ja) | 2016-10-06 |
| CN107429323B (zh) | 2019-08-02 |
| KR20170125987A (ko) | 2017-11-15 |
| CN107429323A (zh) | 2017-12-01 |
| TW201702391A (zh) | 2017-01-16 |
| JP6031548B2 (ja) | 2016-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |