TWI585513B - A mark and alignment method with focus and tilt correction design - Google Patents

A mark and alignment method with focus and tilt correction design Download PDF

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Publication number
TWI585513B
TWI585513B TW104129780A TW104129780A TWI585513B TW I585513 B TWI585513 B TW I585513B TW 104129780 A TW104129780 A TW 104129780A TW 104129780 A TW104129780 A TW 104129780A TW I585513 B TWI585513 B TW I585513B
Authority
TW
Taiwan
Prior art keywords
focus
mark
marks
pair
alignment
Prior art date
Application number
TW104129780A
Other languages
English (en)
Chinese (zh)
Other versions
TW201614365A (en
Inventor
Rong Du
yue-fei Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201614365A publication Critical patent/TW201614365A/zh
Application granted granted Critical
Publication of TWI585513B publication Critical patent/TWI585513B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706845—Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/708—Mark formation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Head (AREA)
TW104129780A 2014-09-09 2015-09-09 A mark and alignment method with focus and tilt correction design TWI585513B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410456314.2A CN105467781B (zh) 2014-09-09 2014-09-09 一种具有调焦及倾斜校正设计的标记及对准方法

Publications (2)

Publication Number Publication Date
TW201614365A TW201614365A (en) 2016-04-16
TWI585513B true TWI585513B (zh) 2017-06-01

Family

ID=55458350

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104129780A TWI585513B (zh) 2014-09-09 2015-09-09 A mark and alignment method with focus and tilt correction design

Country Status (6)

Country Link
JP (1) JP6309694B2 (ja)
KR (1) KR101948906B1 (ja)
CN (1) CN105467781B (ja)
SG (1) SG11201701903QA (ja)
TW (1) TWI585513B (ja)
WO (1) WO2016037562A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107450287B (zh) * 2016-05-31 2019-10-25 上海微电子装备（集团）股份有限公司 调焦调平测量装置及方法
CN108333880B (zh) * 2017-01-19 2020-08-04 上海微电子装备（集团）股份有限公司 光刻曝光装置及其焦面测量装置和方法
JP7186531B2 (ja) * 2018-07-13 2022-12-09 キヤノン株式会社 露光装置、および物品製造方法
CN111624856B (zh) * 2019-02-28 2021-10-15 上海微电子装备（集团）股份有限公司 一种掩模版、运动台定位误差补偿装置及补偿方法
CN110849266B (zh) * 2019-11-28 2021-05-25 江西瑞普德测量设备有限公司 一种影像测量仪的远心镜头远心度调试方法
CN111383537A (zh) * 2020-04-02 2020-07-07 上海天马有机发光显示技术有限公司 显示面板和显示装置
CN115356898A (zh) * 2022-08-25 2022-11-18 上海华力集成电路制造有限公司 提高光刻套刻精度的方法
CN117492336B (zh) * 2024-01-02 2024-04-09 天府兴隆湖实验室 对准标记及图形对准方法

Citations (4)

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JP2006261644A (ja) * 2005-02-16 2006-09-28 Nikon Corp 露光装置およびレチクルと感応基板ステージとの位置合わせ方法
JP2006332480A (ja) * 2005-05-30 2006-12-07 Nikon Corp 位置計測方法、露光方法、デバイスの製造方法及び位置計測装置並びに露光装置
TW200729195A (en) * 2005-07-04 2007-08-01 Koninkl Philips Electronics Nv Optical pick-up and/or recording device
CN100526994C (zh) * 2007-08-20 2009-08-12 上海微电子装备有限公司 透射对准标记组合及光刻装置的对准方法

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NL9000503A (nl) * 1990-03-05 1991-10-01 Asm Lithography Bv Apparaat en werkwijze voor het afbeelden van een maskerpatroon op een substraat.
JPH06196387A (ja) * 1992-12-22 1994-07-15 Canon Inc 基板の焦点合わせ方法および投影露光方法
US6136662A (en) * 1999-05-13 2000-10-24 Lsi Logic Corporation Semiconductor wafer having a layer-to-layer alignment mark and method for fabricating the same
JP2004279166A (ja) * 2003-03-14 2004-10-07 Canon Inc 位置検出装置
JP4516826B2 (ja) * 2004-11-15 2010-08-04 Ｏｋｉセミコンダクタ株式会社 フォ−カスモニタ方法
JP2007305696A (ja) * 2006-05-09 2007-11-22 Nsk Ltd 位置決め装置の精度測定方法
JP2010098143A (ja) * 2008-10-16 2010-04-30 Canon Inc 露光装置およびデバイス製造方法
CN101943865B (zh) * 2009-07-09 2012-10-03 上海微电子装备有限公司 一种用于光刻设备的对准标记和对准方法
CN102566338B (zh) * 2010-12-28 2013-11-13 上海微电子装备有限公司 光刻对准系统中对对准位置进行修正的方法
CN103163747B (zh) * 2011-12-14 2015-03-25 上海微电子装备有限公司 基于区域照明的小光斑离轴对准系统
CN203553154U (zh) * 2013-11-14 2014-04-16 中芯国际集成电路制造(北京)有限公司 测量标记

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261644A (ja) * 2005-02-16 2006-09-28 Nikon Corp 露光装置およびレチクルと感応基板ステージとの位置合わせ方法
JP2006332480A (ja) * 2005-05-30 2006-12-07 Nikon Corp 位置計測方法、露光方法、デバイスの製造方法及び位置計測装置並びに露光装置
TW200729195A (en) * 2005-07-04 2007-08-01 Koninkl Philips Electronics Nv Optical pick-up and/or recording device
CN100526994C (zh) * 2007-08-20 2009-08-12 上海微电子装备有限公司 透射对准标记组合及光刻装置的对准方法

Also Published As

Publication number Publication date
SG11201701903QA (en) 2017-04-27
CN105467781B (zh) 2017-12-29
JP6309694B2 (ja) 2018-04-11
WO2016037562A1 (zh) 2016-03-17
KR20170051480A (ko) 2017-05-11
CN105467781A (zh) 2016-04-06
TW201614365A (en) 2016-04-16
JP2017528766A (ja) 2017-09-28
KR101948906B1 (ko) 2019-02-15

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