TWI577649B - Scribing apparatus and method of maintaining pressing pressure of the same - Google Patents

Scribing apparatus and method of maintaining pressing pressure of the same Download PDF

Info

Publication number
TWI577649B
TWI577649B TW101127762A TW101127762A TWI577649B TW I577649 B TWI577649 B TW I577649B TW 101127762 A TW101127762 A TW 101127762A TW 101127762 A TW101127762 A TW 101127762A TW I577649 B TWI577649 B TW I577649B
Authority
TW
Taiwan
Prior art keywords
unit
cutting
relative displacement
cutting device
axis motor
Prior art date
Application number
TW101127762A
Other languages
Chinese (zh)
Other versions
TW201307224A (en
Inventor
崔漢鉉
盧光碩
文炫碩
Original Assignee
塔工程有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 塔工程有限公司 filed Critical 塔工程有限公司
Publication of TW201307224A publication Critical patent/TW201307224A/en
Application granted granted Critical
Publication of TWI577649B publication Critical patent/TWI577649B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04Cutting or splitting in curves, especially for making spectacle lenses
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

切割裝置及維持其加壓壓力之方法 Cutting device and method for maintaining the same

本發明係關於一種切割裝置以及關於一種維持該切割裝置加壓壓力之方法,特別係關於一種切割裝置,其能在切割玻璃基板時,即使玻璃基板之表面有曲度,也能維持對玻璃基板施予一致的一加壓壓力,本發明另外亦特別係關於一種維持該切割裝置之加壓壓力之方法。 The present invention relates to a cutting device and a method for maintaining the pressing pressure of the cutting device, and more particularly to a cutting device capable of maintaining a glass substrate even when the surface of the glass substrate has curvature when the glass substrate is cut. In accordance with a uniform pressurization pressure, the present invention is also particularly directed to a method of maintaining the pressurization pressure of the cutting device.

一般來說,液晶顯示面板(Liquid Crystal Displays,LCD)、發光二極體(Light-Emitting Diode,LED)、有機電致發光面板(organic EL panels)、無機電致發光面板(inorganic EL panels)、穿透式投影面板(transparent projector panels)、反射式投影面板(reflective projector panels)等係均廣泛地用作平板顯示器(flat panel displays)。這些平板顯示器的製程係包括了切割具脆性之母玻璃基板(之後簡稱為「玻璃基板」)成固定大小。 In general, a liquid crystal display (LCD), a light-emitting diode (LED), an organic EL panel, an inorganic electroluminescent panel (inorganic EL panels), Transparent projector panels, reflective projector panels, and the like are widely used as flat panel displays. The process of these flat panel displays includes cutting a fragile mother glass substrate (hereinafter simply referred to as a "glass substrate") to a fixed size.

切割玻璃基板之過程係包括移動一切割刀輪之一切割過程,切割刀輪之材質係如鑽石,切割刀輪會在一壓力下沿著玻璃基板上一預設的切線(cutting line)進行切割,以於玻璃基板上形成一切割線(scribing line);以及一破碎過程,可藉由對玻璃基板施壓並對玻璃基板提供一彎曲力矩,或是藉由對玻璃基板提供蒸氣並使切割線之裂痕變寬。 The process of cutting the glass substrate comprises moving a cutting wheel, the material of which is a diamond, and the cutting wheel is cut under a pressure along a predetermined cutting line on the glass substrate. Forming a scribing line on the glass substrate; and a crushing process by applying pressure to the glass substrate and providing a bending moment to the glass substrate, or by supplying vapor to the glass substrate and cutting the line The crack is widened.

圖1為一種用以導引切割過程之切割裝置之一代表例。以下,將說明切割過程之關於說明。 Figure 1 is a representative example of a cutting device for guiding a cutting process. Hereinafter, the description of the cutting process will be explained.

如圖1所示,切割裝置1000係包括一基座100、一Z軸馬達200、一移動單元300以及一加壓單元400。Z軸馬達200係設置於基座100上。移動單元300係藉由Z軸馬達200而縱向移動。一柱狀體310係連接於移動單元300。加壓單元400係包括一切割頭410以及一切割刀輪422。切割頭410係連接於柱狀體310之一柱狀桿311。刀輪支架421係設置於切割頭410下方。加壓單元400係能對應移動單元300縱向移動。 As shown in FIG. 1, the cutting device 1000 includes a base 100, a Z-axis motor 200, a moving unit 300, and a pressurizing unit 400. The Z-axis motor 200 is disposed on the base 100. The moving unit 300 is longitudinally moved by the Z-axis motor 200. A columnar body 310 is coupled to the mobile unit 300. The pressurizing unit 400 includes a cutting head 410 and a cutting cutter wheel 422. The cutting head 410 is coupled to one of the cylindrical rods 311 of the columnar body 310. The cutter wheel bracket 421 is disposed below the cutting head 410. The pressurizing unit 400 is capable of moving longitudinally corresponding to the moving unit 300.

Z軸馬達200係固設於基座100。一傳送螺絲210係連接於Z軸馬達200,移動單元300係連接於傳送螺絲210,使移動單元300能藉由Z軸馬達200之作動而縱向移動。 The Z-axis motor 200 is fixed to the susceptor 100. A transfer screw 210 is coupled to the Z-axis motor 200, and the moving unit 300 is coupled to the transfer screw 210 to enable the mobile unit 300 to move longitudinally by actuation of the Z-axis motor 200.

一導引元件,如一線性導引元件110係包括一導軌(未表示)係設置於基座100上,以導引移動單元300。 A guiding member, such as a linear guiding member 110, includes a guide rail (not shown) disposed on the base 100 to guide the moving unit 300.

移動單元300係包括一移動塊320以及一移動支架330。移動塊320係連接於傳送螺絲210,移動支架330係固設於移動塊320。移動支架330係連接於線性導引元件110,使得移動支架330能沿基座100之導軌反覆進行縱向地移動。 The mobile unit 300 includes a moving block 320 and a mobile bracket 330. The moving block 320 is coupled to the transfer screw 210, and the moving bracket 330 is fixed to the moving block 320. The moving bracket 330 is coupled to the linear guiding member 110 such that the moving bracket 330 can be longitudinally moved along the guide rail of the base 100.

柱狀體310係固設於移動塊320,柱狀體310之柱狀桿311係連接於加壓單元400。 The columnar body 310 is fixed to the moving block 320, and the columnar rod 311 of the columnar body 310 is connected to the pressurizing unit 400.

加壓單元400係包括一切割頭410以及一刀輪單元 420。切割頭410係連接於柱狀桿311,刀輪單元420係連接於切割頭410之下方。 The pressurizing unit 400 includes a cutting head 410 and a cutter wheel unit 420. The cutting head 410 is coupled to the cylindrical rod 311, and the cutter wheel unit 420 is coupled to the lower side of the cutting head 410.

刀輪單元420係包括一刀輪支架(wheel holder)421以及一切割刀輪422。刀輪支架421係設置於切割頭410下方,且能水平地旋轉,而切割刀輪422係連接於刀輪支架421。 The cutter wheel unit 420 includes a wheel holder 421 and a cutter wheel 422. The cutter wheel bracket 421 is disposed below the cutting head 410 and is horizontally rotatable, and the cutter wheel 422 is coupled to the cutter wheel bracket 421.

較佳地,切割頭410係連接於基座100之線性導引元件110或一交叉滾子導引組件120,使得切割頭410能縱向地移動。 Preferably, the cutting head 410 is coupled to the linear guide element 110 of the base 100 or a cross roller guide assembly 120 such that the cutting head 410 can move longitudinally.

一壓力控制單元500,如一調節器(regulator)或其相似物,係連接於柱狀體310。壓力控制單元500係用以維持施予玻璃基板(如圖2所示之元件符號P)之加壓壓力的恆定。 A pressure control unit 500, such as a regulator or the like, is coupled to the columnar body 310. The pressure control unit 500 is for maintaining a constant pressure of the pressing force applied to the glass substrate (element symbol P as shown in FIG. 2).

舉例來說,如圖2所示,若玻璃基板P具有一彎曲部分,則在切割過程中,柱狀桿311會瞬間向上移動。在此情況下,壓力控制單元500操控柱狀體310的壓力,使切割刀輪422對玻璃基板P施予的壓力能維持恆定。 For example, as shown in FIG. 2, if the glass substrate P has a curved portion, the cylindrical rod 311 moves instantaneously upward during the cutting process. In this case, the pressure control unit 500 manipulates the pressure of the columnar body 310 so that the pressure applied to the glass substrate P by the cutter wheel 422 can be maintained constant.

然而,切割過程中,切割裝置移動的速度相對較快,使得調節器要能快速地對於玻璃基板P的曲度變化進行反應並且改變柱狀體310的內壓是相當困難的。施予玻璃基板P表面的壓力無法維持恆定,最後會導致產品發生缺陷。 However, the cutting device moves relatively fast during the cutting process, so that it is quite difficult for the regulator to quickly react to the change in the curvature of the glass substrate P and change the internal pressure of the column 310. The pressure applied to the surface of the glass substrate P cannot be maintained constant, and eventually the product is defective.

有鑑於上述先前技術所造的問題,本發明之一目的係 提供一種切割裝置,於切割玻璃基板時,即使玻璃基板的表面有彎曲,也能維持對玻璃基板的壓力恆定,另提供一種維持該切割裝置之施壓壓力的方法。 In view of the problems caused by the prior art described above, one of the objects of the present invention is Provided is a cutting device capable of maintaining a constant pressure against a glass substrate even when the surface of the glass substrate is bent when the glass substrate is cut, and a method of maintaining the pressing pressure of the cutting device.

為達上述目的,本發明之一實施例之切割裝置,係包括一Z軸馬達、一移動單元、一加壓單元、一壓力控制單元、一相對位移感測單元以及一控制單元。移動單元係藉由Z軸馬達而上下移動,且一柱狀體係連接於移動單元。加壓單元係對應移動單元而上下移動。加壓單元係包括一切割頭及一切割刀輪。切割頭之一第一端係連接於柱狀體之一柱狀桿,切割刀輪係設置於切割頭之一第二端。壓力控制單元係控制柱狀體之一內壓,使加壓單元產生一加壓壓力。相對位移感測單元係測量加壓單元及移動單元間之一相對位移。一控制單元係接收來自相對位移感測單元之一相對位移訊號,並傳輸一驅動訊號至Z軸馬達。 To achieve the above object, a cutting device according to an embodiment of the present invention includes a Z-axis motor, a moving unit, a pressurizing unit, a pressure control unit, a relative displacement sensing unit, and a control unit. The mobile unit is moved up and down by a Z-axis motor, and a columnar system is connected to the mobile unit. The pressurizing unit moves up and down corresponding to the moving unit. The pressurizing unit includes a cutting head and a cutting wheel. One of the first ends of the cutting head is coupled to one of the columnar rods, and the cutting wheel system is disposed at one of the second ends of the cutting head. The pressure control unit controls the internal pressure of one of the columns to cause the pressurizing unit to generate a pressurizing pressure. The relative displacement sensing unit measures a relative displacement between the pressing unit and the moving unit. A control unit receives a relative displacement signal from one of the relative displacement sensing units and transmits a drive signal to the Z-axis motor.

在本發明一實施例中,相對位移感測單元係設置於移動單元及加壓單元或移動單元及加壓單元其中之一。 In an embodiment of the invention, the relative displacement sensing unit is disposed in one of the mobile unit and the pressurizing unit or the mobile unit and the pressurizing unit.

在本發明另一實施例中,本發明係提供一切割裝置,包括一Z軸馬達、一移動單元、一加壓單元、一壓力控制單元、一相對位移感測單元以及一控制單元。移動單元係藉由Z軸馬達而上下移動,且一柱狀體係連接於移動單元。加壓單元係對應移動單元而上下移動。加壓單元係包括一切割頭及一切割刀輪。切割頭之一第一端係連接於柱狀體之一柱狀桿。切割刀輪係設置於切割頭之一第二端。壓力控制單元係控制柱狀體之一內壓,使加壓單元產生一 加壓壓力。一相對位移感測單元,測量移動單元及一玻璃基板之一表面間之一相對位移。控制單元係接收來自相對位移感測單元之一相對位移訊號,並傳輸一驅動訊號至Z軸馬達。 In another embodiment of the present invention, the present invention provides a cutting apparatus including a Z-axis motor, a moving unit, a pressurizing unit, a pressure control unit, a relative displacement sensing unit, and a control unit. The mobile unit is moved up and down by a Z-axis motor, and a columnar system is connected to the mobile unit. The pressurizing unit moves up and down corresponding to the moving unit. The pressurizing unit includes a cutting head and a cutting wheel. One of the first ends of the cutting head is coupled to one of the columnar rods of the columnar body. The cutter wheel train is disposed at one of the second ends of the cutting head. The pressure control unit controls one of the internal pressures of the column body to cause the pressurizing unit to generate a Pressurized pressure. A relative displacement sensing unit measures a relative displacement between the moving unit and a surface of one of the glass substrates. The control unit receives a relative displacement signal from one of the relative displacement sensing units and transmits a driving signal to the Z-axis motor.

在本發明一實施例中,相對位移感測單元係包括一間隙感測器,設置於移動單元。 In an embodiment of the invention, the relative displacement sensing unit includes a gap sensor disposed on the mobile unit.

在本發明一實施例中,間隙感測器係對應該切割裝置移動之一方向上之前側。 In an embodiment of the invention, the gap sensor is adjacent to the front side in one of the directions in which the cutting device is moved.

本發明另提供一種維持一切割裝置之一加壓壓力之方法,其步驟包括利用一壓力控制單元控制一柱狀體之一內壓,並切割一玻璃基板;當切割玻璃基板時,測量一移動單元與一加壓單元間之一相對位移;以及當測量到的相對位移改變時,傳輸一訊號至Z軸馬達,並於相對位移改變之一方向上補償移動單元之一位移。 The present invention further provides a method for maintaining a pressing pressure of a cutting device, the method comprising: controlling a pressure of one of the columns by a pressure control unit, and cutting a glass substrate; and measuring a movement when cutting the glass substrate a relative displacement between the unit and a pressurizing unit; and when the measured relative displacement changes, transmitting a signal to the Z-axis motor and compensating for one of the displacements of the mobile unit in one of the relative displacement changes.

本發明係又提供一種維持一切割裝置之一加壓壓力之方法,其方法步驟係包括利用一壓力控制單元控制一柱狀體之一內壓,並切割一玻璃基板;當切割玻璃基板時,利用一感測器測量一移動單元與玻璃基板間之一間隙,其中感測器係固設於移動單元;以及當測量到的間隙改變時,傳輸一訊號至一Z軸馬達,並於該間隙改變之一方向上補償該移動單元之一位移。 The invention further provides a method for maintaining a pressing pressure of a cutting device, the method step comprising: controlling a pressure of one of the columnar bodies by using a pressure control unit, and cutting a glass substrate; when cutting the glass substrate, Measuring, by a sensor, a gap between a mobile unit and a glass substrate, wherein the sensor is fixed to the mobile unit; and when the measured gap changes, transmitting a signal to a Z-axis motor, and in the gap One of the directions changes to compensate for the displacement of one of the mobile units.

在本發明一實施例中,測量間隙之步驟係被導引於切割裝置移動之一方向之前側測量。 In an embodiment of the invention, the step of measuring the gap is directed to the front side of the direction in which the cutting device moves.

在本發明一實施例中,補償步驟之一補償位移係藉由 將Z軸馬達之一旋轉圈數乘以一傳送螺絲之一螺距而決定,其中傳送螺絲係連接於Z軸馬達。 In an embodiment of the invention, one of the compensation steps compensates for the displacement by It is determined by multiplying the number of revolutions of one of the Z-axis motors by the pitch of one of the transfer screws, wherein the transfer screw is connected to the Z-axis motor.

在本發明一實施例中,相對位移之一變化速率係對應於一柱狀桿延伸或收縮之一速率。 In an embodiment of the invention, the rate of change of one of the relative displacements corresponds to a rate at which a cylindrical rod extends or contracts.

以下將參照相關圖式,說明依本發明較佳實施例之一種切割裝置及一種維持該切割裝置之施壓壓力的方法,其中相同的元件將以相同的參照符號加以說明。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a cutting apparatus and a method of maintaining the pressing pressure of the cutting apparatus according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

以下,本發明將參照圖3至圖7說明本發明之較佳實施例。其中,相同之元件符號將表示為相同或相似之元件。 Hereinafter, the present invention will be described with reference to Figs. 3 to 7 for a preferred embodiment of the present invention. Wherein, the same component symbols will be denoted by the same or similar components.

如圖3及圖4所示,本發明之一切割裝置1000係包括一基座100、一Z軸馬達200、一移動單元300、一加壓單元400以及一壓力控制單元500。Z軸馬達200係設置於基座100上。移動單元300係藉由Z軸馬達200而縱向移動。一柱狀體310係連接於移動單元300。加壓單元400係包括一切割頭410及一切割刀輪422。切割頭410之一第一端係連接於柱狀體310之一柱狀桿311,切割刀輪422係設置於切割頭410之一第二端。加壓單元400之設置方式為能對應移動單元300而縱向移動。壓力控制單元500係控制柱狀體310之一內壓。 As shown in FIG. 3 and FIG. 4, a cutting device 1000 of the present invention includes a base 100, a Z-axis motor 200, a moving unit 300, a pressurizing unit 400, and a pressure control unit 500. The Z-axis motor 200 is disposed on the base 100. The moving unit 300 is longitudinally moved by the Z-axis motor 200. A columnar body 310 is coupled to the mobile unit 300. The pressurizing unit 400 includes a cutting head 410 and a cutting cutter wheel 422. One of the first ends of the cutting head 410 is coupled to one of the cylindrical rods 311 of the columnar body 310, and the cutting wheel 422 is disposed at one of the second ends of the cutting head 410. The pressurizing unit 400 is disposed in such a manner as to be movable longitudinally corresponding to the moving unit 300. The pressure control unit 500 controls one of the internal pressures of the columnar body 310.

詳細來說,Z軸馬達200係固設於基座100。傳送螺絲210係連接於Z軸馬達200,移動單元300係連接於傳送螺絲210,使得移動單元300能藉由Z軸馬達200之作動而縱向移動。 In detail, the Z-axis motor 200 is fixed to the susceptor 100. The transfer screw 210 is coupled to the Z-axis motor 200, and the moving unit 300 is coupled to the transfer screw 210 such that the mobile unit 300 can be moved longitudinally by the action of the Z-axis motor 200.

一導引元件,如一線性導引元件110係包括一導軌(未表示)設置在基座100上以導引移動單元300。 A guiding member, such as a linear guiding member 110, includes a rail (not shown) disposed on the base 100 to guide the moving unit 300.

移動單元300係包括一移動塊320以及一移動支架330。移動塊320係連接於傳送螺絲210,而移動支架330係固設於移動塊320。移動支架330係連接於線性導引元件110,使移動支架330能沿基座100之導軌反覆地縱向移動。 The mobile unit 300 includes a moving block 320 and a mobile bracket 330. The moving block 320 is coupled to the transfer screw 210, and the moving bracket 330 is fixed to the moving block 320. The moving bracket 330 is coupled to the linear guiding member 110 such that the moving bracket 330 can be longitudinally moved along the guide rail of the base 100.

柱狀體310係固設於移動塊320,柱狀體310之柱狀桿311係連接於加壓單元400。 The columnar body 310 is fixed to the moving block 320, and the columnar rod 311 of the columnar body 310 is connected to the pressurizing unit 400.

加壓單元400係包括切割頭410以及一刀輪單元420。切割頭410係連接於柱狀桿311,刀輪單元420係連接於切割頭410之下方。 The pressurizing unit 400 includes a cutting head 410 and a cutter wheel unit 420. The cutting head 410 is coupled to the cylindrical rod 311, and the cutter wheel unit 420 is coupled to the lower side of the cutting head 410.

刀輪單元420係包括一刀輪支架421以及切割刀輪422。刀輪支架421係設置於切割頭410下方,且能水平地旋轉。切割刀輪422係連接於刀輪支架421。 The cutter wheel unit 420 includes a cutter wheel bracket 421 and a cutter wheel 422. The cutter wheel holder 421 is disposed below the cutting head 410 and is horizontally rotatable. The cutter wheel 422 is coupled to the cutter wheel holder 421.

較佳地,切割頭410係連接於基座100之線性導引元件110或一交叉滾子導引組件120,使切割頭410能縱向地移動。 Preferably, the cutting head 410 is coupled to the linear guiding element 110 of the base 100 or a cross roller guiding assembly 120 to enable the cutting head 410 to move longitudinally.

最終,移動單元300能藉由Z軸馬達200之旋轉而縱向移動,以及加壓單元400能藉由設置在移動單元300上之柱狀體310而對應移動單元300縱向移動。 Finally, the mobile unit 300 can be moved longitudinally by the rotation of the Z-axis motor 200, and the pressurizing unit 400 can be moved longitudinally corresponding to the mobile unit 300 by the columnar body 310 disposed on the moving unit 300.

壓力控制單元500可係為習知之一調節器或其相似物。 The pressure control unit 500 can be one of the conventional regulators or the like.

如圖3及圖4所示,一位移感測器610係設置於移動 單元300及/或加壓單元400。位移感測器610係用以測量移動單元300及加壓單元400間之一相對位移。 As shown in FIG. 3 and FIG. 4, a displacement sensor 610 is disposed on the mobile Unit 300 and/or pressurizing unit 400. The displacement sensor 610 is configured to measure a relative displacement between the mobile unit 300 and the pressurizing unit 400.

位移感測器610可係為一接觸式的位移感測器(contact displacement sensor)或一非接觸式的位移感測器(non-contact displacement sensor)。 The displacement sensor 610 can be a contact displacement sensor or a non-contact displacement sensor.

接觸式位移感測器之代表例可為一差動變壓器(differential transformer),如線性可動差動變壓器(Linear Variable Differential Transformer,LVDT)。此一差動變壓器係包括三個線圈(一個初級線圈(primary coil)及兩個次級線圈(secondary coils))以及一活動鐵芯(moving core),其作動原理是,交流電將初級線圈磁化,當活動鐵芯接觸一目標物後,每個次級線圈會產生一電壓,將兩有差異的電壓相結合後,能計算出一電壓差,並藉此輸出位移。 A representative example of the contact displacement sensor can be a differential transformer such as a Linear Variable Differential Transformer (LVDT). The differential transformer includes three coils (a primary coil and two secondary coils) and a moving core. The principle of operation is that the alternating current magnetizes the primary coil. When the movable iron core contacts a target, each secondary coil generates a voltage, and after combining the two different voltages, a voltage difference can be calculated and the displacement is output.

在本發明之一實施例中,位移感測器係為接觸式位移感測器,其中三個線圈及活動鐵芯係分別設置於移動單元300以及加壓單元400,或分別係設置於加壓單元400以及移動單元300。 In one embodiment of the present invention, the displacement sensor is a contact displacement sensor, wherein three coils and a movable iron core are respectively disposed on the moving unit 300 and the pressing unit 400, or are respectively set to be pressurized. Unit 400 and mobile unit 300.

非接觸式位移感測器主要可係為一渦電流感測器(eddy current sensor)、一光學感測器(optical sensor)、一超音波感測器(ultrasonic sensor)等。 The non-contact displacement sensor can be mainly an eddy current sensor, an optical sensor, an ultrasonic sensor, and the like.

渦電流感測器係利用一高頻磁場(high-frequency magnetic field)進行作動。詳細來說,設置在感測器頭部之一線圈係通以一高頻電流後,會產生一高頻磁場。在這磁場中若具有一目標物,由於電磁誘導的關係,磁通量會 流經目標物的表面且垂直的渦電流也會流過目標物,因而改變感應線圈之阻抗。此現象會導致震動的變化。渦電流感測器就是利用震動的變化來偵測與目標物的距離。 The eddy current sensor operates with a high-frequency magnetic field. In detail, after a coil of the sensor head is connected to a high-frequency current, a high-frequency magnetic field is generated. If there is a target in this magnetic field, due to electromagnetic induction, the magnetic flux will The eddy current flowing through the surface of the target and vertical flows also flows through the target, thus changing the impedance of the induction coil. This phenomenon can cause changes in vibration. The eddy current sensor uses the change in vibration to detect the distance from the target.

尤其是,當目標物與感應器頭部間的距離變小,若測到的一波形與一參考波形的相差增加時,則震動的強度會變小。因此,係正比於目標物與感測器頭部間距離的一數值,能藉由偵測震動強度及相差而得。 In particular, when the distance between the target and the head of the sensor becomes smaller, if the difference between the measured waveform and a reference waveform increases, the intensity of the vibration becomes small. Therefore, a value proportional to the distance between the target and the sensor head can be obtained by detecting the vibration intensity and the phase difference.

在本發明一實施例中,位移感測器係為渦電流感測器,而感測器頭部係設置於移動單元300或加壓單元400其中之一,使磁通量能通過另一者之表面。 In an embodiment of the invention, the displacement sensor is an eddy current sensor, and the sensor head is disposed in one of the moving unit 300 or the pressing unit 400 to enable the magnetic flux to pass through the surface of the other .

光學感測器係包括一發光單元(light-emitting unit)以及一光學元件(optical element),係分別套設至相對移動的兩元件上。再者,一分度盤(index plate)以及一活動刻度(moving scale)係設置於發光單元及光學元件之間,並分別設置在兩相對移動之元件上。光學感測器之作動方式是當活動刻度相對於分度盤移動時,光學元件能讀取分度盤及移動刻度間的光的亮度訊號(luminance signals),因而能測得兩者之間的一位移。而光學感測器可係為具代表性的一線性刻度(linear scale)。 The optical sensor includes a light-emitting unit and an optical element that are respectively sleeved onto the two components that move relatively. Furthermore, an index plate and a moving scale are disposed between the light-emitting unit and the optical element, and are respectively disposed on the two relatively moving components. The optical sensor is actuated by the fact that when the active scale is moved relative to the indexing disk, the optical component can read the luminance signals of the light between the indexing disk and the moving scale, thereby measuring the difference between the two. A displacement. The optical sensor can be a representative linear scale.

在本發明一實施例中,位移感測器係為光學感測器,如圖3及圖4所示,一發光單元及一活動刻度611係設置在加壓單元400上,而一刻度讀取器(scale reader)612係設置於移動單元300上,其中刻度讀取器612係包括一光學元件及一分度盤。 In an embodiment of the invention, the displacement sensor is an optical sensor. As shown in FIG. 3 and FIG. 4, an illumination unit and an active scale 611 are disposed on the pressing unit 400, and a scale reading is performed. A scale reader 612 is disposed on the mobile unit 300, wherein the scale reader 612 includes an optical component and an indexing disk.

舉例來說,圖3、圖4以及圖5為說明活動刻度611固設於切割頭410,且刻度讀取器612係連接於移動支架330。 For example, FIGS. 3, 4, and 5 illustrate that the active scale 611 is fixed to the cutting head 410, and the scale reader 612 is coupled to the moving bracket 330.

而超音波感測器之作用原理為,一感測器頭部能產生一超音波,並接收一目標物反射回來之回音,之後,感測器計算發出訊號到接收到回音之間的時間差,來決定到目標物之間的距離。 The principle of the ultrasonic sensor is that a sensor head can generate an ultrasonic wave and receive an echo reflected back from the target, and then the sensor calculates the time difference between sending the signal and receiving the echo. To determine the distance to the target.

在本發明一實施例中,位移感測器係為超音波感測器,超音波感測器的頭部係設置在移動單元300或加壓單元400其中之一,而一反射盤(reflective plate)可設置在另一者,以增進回音接收的可靠度。由於超音波感測器的特性,測量的範圍可以很廣。因此,超音波感測器能輕易地套用於本發明之切割裝置,而不須考量移動單元300及加壓單元400間的距離。 In an embodiment of the invention, the displacement sensor is an ultrasonic sensor, and the head of the ultrasonic sensor is disposed in one of the moving unit 300 or the pressing unit 400, and a reflective plate ) can be set to the other to improve the reliability of echo reception. Due to the characteristics of the ultrasonic sensor, the range of measurement can be wide. Therefore, the ultrasonic sensor can be easily applied to the cutting device of the present invention without considering the distance between the moving unit 300 and the pressurizing unit 400.

此外,如圖6所示,本發明之移動單元300上可設置一間隙感測器620,以測量移動單元300及玻璃基板P間的間隙。 In addition, as shown in FIG. 6, a gap sensor 620 can be disposed on the mobile unit 300 of the present invention to measure the gap between the mobile unit 300 and the glass substrate P.

需特別注意的是,當間隙感測器620設置於切割裝置1000相對於玻璃基板P向前移動之方向的前側時,間隙感測器620能在切割裝置接觸到曲度之前先偵測到一曲度,因而能使一控制單元700更精準且容易地控制切割裝置,進而提升Z軸馬達200針對玻璃基板P曲度變化進行反應的效能。而有關於控制單元700之描述,將於稍後描述。 It should be particularly noted that when the gap sensor 620 is disposed on the front side of the cutting device 1000 in the direction in which the glass substrate P moves forward, the gap sensor 620 can detect one before the cutting device contacts the curvature. The curvature thus enables a control unit 700 to more accurately and easily control the cutting device, thereby improving the effectiveness of the Z-axis motor 200 in reacting to changes in the curvature of the glass substrate P. A description of the control unit 700 will be described later.

對此,本發明之間隙感測器620能依據切割刀輪422 對應玻璃基板P之輸送方向而設置在移動單元300之前側、左側及右側,而間隙感測器620能依據玻璃基板P相對於切割裝置1000之移動方向而選擇性地設置。 In this regard, the gap sensor 620 of the present invention can be based on the cutting wheel 422 The gap sensor 620 can be selectively disposed according to the moving direction of the glass substrate P with respect to the cutting device 1000 in accordance with the transport direction of the glass substrate P on the front side, the left side, and the right side of the moving unit 300.

若如圖3、圖4及圖5所示之位移感測器610或如圖6所示之間隙感測器620測得一相對位移,並產生一相關訊號,控制單元700能依據相對位移訊號,傳輸一驅動訊號至Z軸馬達200。 If the displacement sensor 610 shown in FIG. 3, FIG. 4 and FIG. 5 or the gap sensor 620 shown in FIG. 6 detects a relative displacement and generates a correlation signal, the control unit 700 can detect the relative displacement signal according to the relative displacement signal. A drive signal is transmitted to the Z-axis motor 200.

換句話說,Z軸馬達200是在控制單元700之控制下作動,藉此讓移動單元300在加壓單元400相對於移動單元300位移改變的一方向上移動,或是在移動單元300與玻璃基板P表面間之間隙改變的一方向上移動,以降低柱狀體310之內壓,因而能維持加壓壓力之恆定。 In other words, the Z-axis motor 200 is actuated under the control of the control unit 700, thereby moving the moving unit 300 upward in the direction in which the pressurizing unit 400 is displaced relative to the moving unit 300, or in the moving unit 300 and the glass substrate. The one in which the gap between the P surfaces changes is moved upward to lower the internal pressure of the columnar body 310, thereby maintaining the constant pressing pressure.

本發明之一相對位移感測單元600,如圖3所示,可以係為位移感測器610或間隙感測器620。 One of the relative displacement sensing units 600 of the present invention, as shown in FIG. 3, may be a displacement sensor 610 or a gap sensor 620.

以下,將參照圖5及圖7說明本發明之一實施例之一種維持切割裝置之加壓壓力的方法。 Hereinafter, a method of maintaining the pressing pressure of the cutting device according to an embodiment of the present invention will be described with reference to FIGS. 5 and 7.

圖7係說明維持切割裝置之加壓壓力之方法,且該切割裝置之移動單元300及/或加壓單元400係設有位移感測器610。 FIG. 7 illustrates a method of maintaining the pressing pressure of the cutting device, and the moving unit 300 and/or the pressurizing unit 400 of the cutting device is provided with a displacement sensor 610.

首先,當壓力控制單元500依據玻璃基板P被施壓之一預設壓力來調整柱狀體310之內壓至一數值,以完成切割之作動。 First, when the pressure control unit 500 adjusts the internal pressure of the column body 310 to a value according to a preset pressure at which the glass substrate P is pressed, the cutting operation is completed.

當完成切割作動之後,位移感測器610係偵測移動單元300與加壓單元400間的一相對位移。 After the cutting operation is completed, the displacement sensor 610 detects a relative displacement between the moving unit 300 and the pressing unit 400.

若相對位移維持在原始數值而沒有改變,表示玻璃基板P沒有曲度,則能正常地繼續進行切割之作動。 If the relative displacement is maintained at the original value without change, indicating that the glass substrate P has no curvature, the cutting operation can be continued normally.

同時,若在切割過程中,因玻璃基板P之曲度而使測量到的相對位移發生變化,則相對位移之變化速率係傳輸至控制單元700。舉例來說,測得的相對位移變化速率係與柱狀桿311之延伸或收縮之一速率有關。 Meanwhile, if the measured relative displacement changes due to the curvature of the glass substrate P during the cutting process, the rate of change of the relative displacement is transmitted to the control unit 700. For example, the measured relative displacement rate of change is related to a rate at which the columnar rod 311 extends or contracts.

控制單元700根據相對位移的變化速率傳輸一訊號至Z軸馬達200,並驅動傳送螺絲210,使移動單元300能於相對位移改變的方向上移動,因而對相對位移的改變進行補償。 The control unit 700 transmits a signal to the Z-axis motor 200 according to the rate of change of the relative displacement, and drives the transfer screw 210 to move the moving unit 300 in the direction in which the relative displacement changes, thereby compensating for the change in the relative displacement.

在補償相對位移之改變的步驟中,一補償位移能藉由將Z軸馬達200之旋轉圈數乘以連接於Z軸馬達200之傳送螺絲210的螺距而決定。 In the step of compensating for the change in the relative displacement, a compensation displacement can be determined by multiplying the number of revolutions of the Z-axis motor 200 by the pitch of the transfer screw 210 connected to the Z-axis motor 200.

這樣一來,當相對位移的改變得到補償,柱狀桿311的延伸或收縮速率實質上沒有改變,則能維持壓力控制單元500預設的加壓壓力。 In this way, when the change in the relative displacement is compensated, the extension or contraction rate of the columnar rod 311 is substantially unchanged, the preset pressure of the pressure control unit 500 can be maintained.

也就是說,在切割過程中對應於玻璃基板P的曲度,移動單元300會跟著上下移動,因此對玻璃基板P所施予之加壓壓力係維持在預設值。 That is, the moving unit 300 moves up and down corresponding to the curvature of the glass substrate P during the cutting process, so that the pressing pressure applied to the glass substrate P is maintained at a preset value.

雖然在圖中所顯示的玻璃基板P的曲度是一向上凸面,但本發明相同之技術手段亦可以係應用於具有向下凸面的曲度之玻璃基板P。 Although the curvature of the glass substrate P shown in the drawing is an upward convex surface, the same technical means of the present invention can be applied to the glass substrate P having a curvature of a downward convex surface.

綜上所述,在本發明中,即使玻璃基板的表面彎曲,但當切割玻璃基板時,對玻璃基板施予的加壓壓力能維持 在預設值,因而能避免切割的作動失敗。 As described above, in the present invention, even when the surface of the glass substrate is curved, when the glass substrate is cut, the pressing pressure applied to the glass substrate can be maintained. At the preset value, it is thus possible to avoid the failure of the cutting operation.

以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

100‧‧‧基座 100‧‧‧Base

1000‧‧‧切割裝置 1000‧‧‧ cutting device

110‧‧‧線性導引元件 110‧‧‧Linear guiding element

120‧‧‧交叉滾子導引組件 120‧‧‧cross roller guide assembly

200‧‧‧Z軸馬達 200‧‧‧Z-axis motor

210‧‧‧傳送螺絲 210‧‧‧Transfer screw

300‧‧‧移動單元 300‧‧‧Mobile unit

310‧‧‧柱狀體 310‧‧‧ columnar body

311‧‧‧柱狀桿 311‧‧‧column rod

320‧‧‧移動塊 320‧‧‧moving block

330‧‧‧移動支架 330‧‧‧Mobile bracket

400‧‧‧加壓單元 400‧‧‧ Pressurizing unit

410‧‧‧切割頭 410‧‧‧ cutting head

420‧‧‧刀輪單元 420‧‧‧Cutter wheel unit

421‧‧‧刀輪支架 421‧‧‧Cutter wheel bracket

422‧‧‧切割刀輪 422‧‧‧Cutting cutter wheel

500‧‧‧壓力控制單元 500‧‧‧pressure control unit

600‧‧‧相對位移感測單元 600‧‧‧relative displacement sensing unit

610‧‧‧位移感測器 610‧‧‧ Displacement Sensor

611‧‧‧活動刻度 611‧‧‧ activity scale

612‧‧‧刻度讀取器 612‧‧‧Grade reader

620‧‧‧間隙感測器 620‧‧‧Gap sensor

700‧‧‧控制單元 700‧‧‧Control unit

P‧‧‧玻璃基板 P‧‧‧glass substrate

圖1為習知技術之一切割裝置之示意圖;圖2為習知技術之一切割裝置沿一玻璃基板之一彎曲表面通過之側視圖;圖3為本發明之一切割裝置之示意圖;圖4為圖3之為一位移感測器之結構之局部放大示意圖;圖5為本發明之一實施例之切割裝置之示意圖,其中該切割裝置之加壓壓力係能維持恆定;圖6為本發明之另一實施例之切割裝置之結構示意圖,其中該切割裝置之加壓壓力係能維持恆定;以及圖7為維持圖5結構之加壓壓力之方法流程圖。 1 is a schematic view of a cutting device of one of the prior art; FIG. 2 is a side view of a cutting device passing through a curved surface of a glass substrate; FIG. 3 is a schematic view of a cutting device of the present invention; 3 is a partially enlarged schematic view showing the structure of a displacement sensor; FIG. 5 is a schematic view of a cutting device according to an embodiment of the present invention, wherein the pressing pressure of the cutting device can be maintained constant; A schematic structural view of a cutting device according to another embodiment, wherein the pressing pressure of the cutting device can be maintained constant; and FIG. 7 is a flow chart of a method for maintaining the pressing pressure of the structure of FIG.

200‧‧‧Z軸馬達 200‧‧‧Z-axis motor

210‧‧‧傳送螺絲 210‧‧‧Transfer screw

300‧‧‧移動單元 300‧‧‧Mobile unit

310‧‧‧柱狀體 310‧‧‧ columnar body

311‧‧‧柱狀桿 311‧‧‧column rod

400‧‧‧加壓單元 400‧‧‧ Pressurizing unit

410‧‧‧切割頭 410‧‧‧ cutting head

500‧‧‧壓力控制單元 500‧‧‧pressure control unit

610‧‧‧位移感測器 610‧‧‧ Displacement Sensor

611‧‧‧活動刻度 611‧‧‧ activity scale

612‧‧‧刻度讀取器 612‧‧‧Grade reader

700‧‧‧控制單元 700‧‧‧Control unit

P‧‧‧玻璃基板 P‧‧‧glass substrate

Claims (10)

一種切割裝置,包括:一Z軸馬達;一移動單元,其係藉由該Z軸馬達而上下移動,且一柱狀體係連接於該移動單元;一加壓單元,其係對應該移動單元而上下移動,該加壓單元係包括:一切割頭,其一第一端係連接於該柱狀體之一柱狀桿,及一切割刀輪,其係設置於該切割頭之一第二端;一壓力控制單元,其係控制該柱狀體之一內壓,使該加壓單元產生一加壓壓力;一相對位移感測單元,測量該加壓單元及該移動單元間之一相對位移;以及一控制單元,接收來自該相對位移感測單元之一相對位移訊號,並傳輸一驅動訊號至該Z軸馬達。 A cutting device comprising: a Z-axis motor; a moving unit that is moved up and down by the Z-axis motor, and a columnar system is coupled to the moving unit; and a pressurizing unit that is corresponding to the moving unit Moving up and down, the pressurizing unit comprises: a cutting head, a first end is connected to one of the columnar rods of the columnar body, and a cutting wheel is disposed at one of the second ends of the cutting head a pressure control unit for controlling an internal pressure of the column body to generate a pressurizing pressure; and a relative displacement sensing unit for measuring a relative displacement between the pressurizing unit and the moving unit And a control unit that receives a relative displacement signal from the one of the relative displacement sensing units and transmits a driving signal to the Z-axis motor. 如申請專利範圍第1項所述之切割裝置,其中該相對位移感測單元係設置於該移動單元及該加壓單元或該移動單元及該加壓單元其中之一。 The cutting device of claim 1, wherein the relative displacement sensing unit is disposed in the mobile unit and the pressurizing unit or one of the moving unit and the pressurizing unit. 一種切割裝置,包括:一Z軸馬達;一移動單元,其係藉由該Z軸馬達而上下移動,且一柱狀體係連接於該移動單元;一加壓單元,其係對應該移動單元而上下移動,該加 壓單元係包括:一切割頭,其一第一端係連接於該柱狀體之一柱狀桿,及一切割刀輪,其係設置於該切割頭之一第二端;一壓力控制單元,其係控制該柱狀體之一內壓,使該加壓單元產生一加壓壓力;一相對位移感測單元,測量該移動單元及一玻璃基板之一表面間之一相對位移;以及一控制單元,接收來自該相對位移感測單元之一相對位移訊號,並傳輸一驅動訊號至該Z軸馬達。 A cutting device comprising: a Z-axis motor; a moving unit that is moved up and down by the Z-axis motor, and a columnar system is coupled to the moving unit; and a pressurizing unit that is corresponding to the moving unit Move up and down, the plus The pressing unit comprises: a cutting head, a first end of which is connected to one of the cylindrical rods, and a cutting wheel disposed at a second end of the cutting head; a pressure control unit Controlling an internal pressure of the column to cause a pressure of the pressurizing unit; and a relative displacement sensing unit for measuring a relative displacement between the surface of the moving unit and a glass substrate; and The control unit receives a relative displacement signal from the one of the relative displacement sensing units and transmits a driving signal to the Z-axis motor. 如申請專利範圍第3項所述之切割裝置,其中該相對位移感測單元係包括一間隙感測器,設置於該移動單元。 The cutting device of claim 3, wherein the relative displacement sensing unit comprises a gap sensor disposed on the mobile unit. 如申請專利範圍第4項所述之切割裝置,其中該間隙感測器係對應該切割裝置移動之一方向上之前側。 The cutting device of claim 4, wherein the gap sensor is adjacent to a front side in a direction in which the cutting device moves. 一種維持一切割裝置之一加壓壓力之方法,其中該切割裝置係如申請專利範圍第1項所述之切割裝置,該方法包括下列步驟:利用一壓力控制單元控制一柱狀體之一內壓,並切割一玻璃基板;當切割該玻璃基板時,測量一移動單元與一加壓單元間之一相對位移;以及當測量到的該相對位移改變時,傳輸一訊號至一Z軸馬達,並於該相對位移改變之一方向上補償該移動單 元之一位移。 A method for maintaining a pressing pressure of a cutting device, wherein the cutting device is the cutting device according to claim 1, the method comprising the steps of: controlling one of the columns by using a pressure control unit Pressing and cutting a glass substrate; measuring a relative displacement between a moving unit and a pressing unit when cutting the glass substrate; and transmitting a signal to a Z-axis motor when the measured relative displacement is changed, And compensating the mobile list in one of the relative displacement changes One of the displacements. 一種維持一切割裝置之一加壓壓力之方法,其中該切割裝置係如申請專利範圍第3項所述之切割裝置,該方法包括下列步驟:利用一壓力控制單元控制一柱狀體之一內壓,並切割一玻璃基板;當切割該玻璃基板時,利用一感測器測量一移動單元與該玻璃基板間之一間隙,其中該感測器係固設於該移動單元;以及當測量到的該間隙改變時,傳輸一訊號至一Z軸馬達,並於該間隙改變之一方向上補償該移動單元之一位移。 A method of maintaining a pressing pressure of a cutting device, wherein the cutting device is a cutting device according to claim 3, the method comprising the steps of: controlling a column in one of the columns by using a pressure control unit Pressing and cutting a glass substrate; when cutting the glass substrate, measuring a gap between a moving unit and the glass substrate by using a sensor, wherein the sensor is fixed to the mobile unit; and when measured When the gap is changed, a signal is transmitted to a Z-axis motor, and one of the displacements of the mobile unit is compensated in one of the gap changes. 如申請專利範圍第7項所述之方法,其中該測量該間隙之步驟係被導引於該切割裝置移動之一方向之前側測量。 The method of claim 7, wherein the step of measuring the gap is measured on a front side of the direction in which the cutting device moves. 如申請專利範圍第6項或第7項所述之方法,其中該補償步驟之一補償位移係藉由將該Z軸馬達之一旋轉圈數乘以一傳送螺絲之一螺距而決定,其中該傳送螺絲係連接於該Z軸馬達。 The method of claim 6 or 7, wherein the compensating step is determined by multiplying a number of revolutions of one of the Z-axis motors by a pitch of a transfer screw, wherein A transfer screw is coupled to the Z-axis motor. 如申請專利範圍第9項所述之方法,其中該相對位移之一變化速率係對應於一柱狀桿延伸或收縮之一速率。 The method of claim 9, wherein the rate of change of one of the relative displacements corresponds to a rate at which a cylindrical rod extends or contracts.
TW101127762A 2011-08-01 2012-08-01 Scribing apparatus and method of maintaining pressing pressure of the same TWI577649B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110076538A KR101807493B1 (en) 2011-08-01 2011-08-01 A scribing apparatus and a method for maintaining press load thereof

Publications (2)

Publication Number Publication Date
TW201307224A TW201307224A (en) 2013-02-16
TWI577649B true TWI577649B (en) 2017-04-11

Family

ID=47609419

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101127762A TWI577649B (en) 2011-08-01 2012-08-01 Scribing apparatus and method of maintaining pressing pressure of the same

Country Status (3)

Country Link
KR (1) KR101807493B1 (en)
CN (1) CN102910811B (en)
TW (1) TWI577649B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104625721B (en) * 2015-02-05 2017-01-11 苏州鸿普精密模具有限公司 Inductance type air cylinder displacement ejection module of compressor inner core pressing fit machine
CN104690367B (en) * 2015-02-11 2017-08-25 长春理工大学 A kind of novel and multifunctional mechanical scratching knife rest
KR102605919B1 (en) * 2016-03-17 2023-11-27 주식회사 탑 엔지니어링 Scribing apparatus and scribing method
CN106956241A (en) * 2017-03-23 2017-07-18 天津比亚迪汽车有限公司 A kind of equidistant scriber of electronics
KR102626399B1 (en) * 2020-10-19 2024-01-18 주식회사 탑 엔지니어링 Scribing apparatus
CN113735429B (en) * 2021-08-24 2023-09-08 芜湖东旭光电科技有限公司 Glass scribing and cutting device and cutting method thereof
KR20240000723U (en) 2022-10-26 2024-05-03 박기범 Curve shaped dust brush

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005225730A (en) * 2004-02-13 2005-08-25 Amagasaki Kosakusho:Kk Scribe head device for brittle material and method of scribing brittle material
TW200914386A (en) * 2007-05-09 2009-04-01 Corning Inc Constant force scoring device and method for using same
TW201124351A (en) * 2010-01-04 2011-07-16 Top Eng Co Ltd Scribing apparatus including chip pre-processing unit and scribing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0841131A1 (en) * 1996-11-07 1998-05-13 Bullmer Spezialmaschinen GmbH Cutting device with stroke adjusting means
JP2001139337A (en) * 1999-11-11 2001-05-22 Toshiba Corp Working device, glass scribing device and glass cutting method
JP4433555B2 (en) * 2000-03-23 2010-03-17 坂東機工株式会社 Glass plate processing method and apparatus
KR100637590B1 (en) * 2005-07-08 2006-10-23 주식회사 탑 엔지니어링 Apparatus for cutting glass substrates in manufacturing process of flat type displayer
WO2008126502A1 (en) * 2007-03-30 2008-10-23 Thk Co., Ltd. Scribe device and scribe method
CN201366730Y (en) * 2009-02-20 2009-12-23 褚留顺 Cut buffering and constant pressure device of slicing machine
KR20110067185A (en) * 2009-12-14 2011-06-22 주식회사 탑 엔지니어링 A scribing apparaus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005225730A (en) * 2004-02-13 2005-08-25 Amagasaki Kosakusho:Kk Scribe head device for brittle material and method of scribing brittle material
TW200914386A (en) * 2007-05-09 2009-04-01 Corning Inc Constant force scoring device and method for using same
TW201124351A (en) * 2010-01-04 2011-07-16 Top Eng Co Ltd Scribing apparatus including chip pre-processing unit and scribing method

Also Published As

Publication number Publication date
CN102910811B (en) 2015-07-29
KR101807493B1 (en) 2017-12-11
KR20130014837A (en) 2013-02-12
TW201307224A (en) 2013-02-16
CN102910811A (en) 2013-02-06

Similar Documents

Publication Publication Date Title
TWI577649B (en) Scribing apparatus and method of maintaining pressing pressure of the same
CN102898012B (en) The adjustable off device of level height and the method for adjustment of level height thereof
TW425472B (en) Method and apparatus of measuring thin plate thickness and bend
WO2014000334A1 (en) Parallelism detection system and method
JP2013144635A (en) Apparatus and method having profiling control and for forming scribed line on hard brittle plate
JPWO2008126502A1 (en) Scribing apparatus and scribing method
KR101406992B1 (en) The on-line scale thickness measurement device for steel plate
CN103398664A (en) Instrument for measuring thickness of thin plate with high bright reflective surface
CN103292720A (en) Method and system for testing substrate deflection
CN102829740B (en) Contact type measurement instrument
CN103389044A (en) Manual single-measure-head contact-type measuring method for veneer board thickness
TW201213254A (en) Glass sheet scoring apparatus and method
CN102840833A (en) Method and device for measuring thickness of wafer
KR20180063421A (en) Scribing apparatus
CN109824253A (en) Cutter for substrate
US8743375B2 (en) Parallelism measuring system and method thereof
CN109116052A (en) Velocity sensor gap adjust automatically and detection device
CN103201675A (en) Jig for adjusting film pitch, apparatus for joining film having the same, and method of adjusting film pitch using the apparatus
KR101259415B1 (en) A jig for property measurement of flexible display panel
CN203148391U (en) Contact measuring head
KR200479321Y1 (en) Measuring device for large length member
KR20200065211A (en) Scribing apparatus
CN104215186A (en) Device and method for measuring spatial position coordinate relationship of measuring head system of swing arm type contourgraph
CN103389059A (en) Contact-type device for measuring thickness of wide-breadth precision sheet
US8875979B2 (en) Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck