WO2008126502A1 - Scribe device and scribe method - Google Patents

Scribe device and scribe method Download PDF

Info

Publication number
WO2008126502A1
WO2008126502A1 PCT/JP2008/053696 JP2008053696W WO2008126502A1 WO 2008126502 A1 WO2008126502 A1 WO 2008126502A1 JP 2008053696 W JP2008053696 W JP 2008053696W WO 2008126502 A1 WO2008126502 A1 WO 2008126502A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutter
workpiece
section
height
scribe
Prior art date
Application number
PCT/JP2008/053696
Other languages
French (fr)
Japanese (ja)
Inventor
Takanobu Hoshino
Masanori Mito
Akio Hanyu
Takaya Kono
Yoshiaki Shishido
Original Assignee
Thk Co., Ltd.
Beldex Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thk Co., Ltd., Beldex Corporation filed Critical Thk Co., Ltd.
Priority to JP2009508968A priority Critical patent/JPWO2008126502A1/en
Publication of WO2008126502A1 publication Critical patent/WO2008126502A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005—Devices for the automatic drive or the program control of the machines
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

A scribe device that allows a cutter to accurately follow irregularities of a workpiece even if the workpiece has an uneven flatness. The scribe device has the cutter (6) coming into contact with a workpiece (W), a relative movement section (20) for moving the cutter (6) relative to the surface of the workpiece (W), a cut depth adjustment section (31) for adjusting the depth of cut in the workpiece (W) by the cutter (6), a height measurement section (18) for measuring, while the cutter (16) forms a scribe line on the workpiece (W), the height of that measurement point (W1) of the workpiece (W) which is ahead in the advancement direction of the cutter (6), and a control section for controlling, when the cutter (6) pass through the measurement point (W1) of the workpiece (W), the cut depth adjustment section (31) based on the height of the measurement point (W1) of the workpiece (W) which is measured by the height measurement section (18). The height measurement section (18) is placed at a position ahead in the advancement direction of the cutter (6). Because values measured by the height measurement section (18) are reflected (but not immediately) when the cutter (6) passes through the measurement point (W1), the cutter (6) can be made to accurately follow irregularities of the workpiece (W).
PCT/JP2008/053696 2007-03-30 2008-02-29 Scribe device and scribe method WO2008126502A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009508968A JPWO2008126502A1 (en) 2007-03-30 2008-02-29 Scribing apparatus and scribing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-095048 2007-03-30
JP2007095048 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008126502A1 true WO2008126502A1 (en) 2008-10-23

Family

ID=39863658

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053696 WO2008126502A1 (en) 2007-03-30 2008-02-29 Scribe device and scribe method

Country Status (3)

Country Link
JP (1) JPWO2008126502A1 (en)
TW (1) TW200900365A (en)
WO (1) WO2008126502A1 (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009057474A1 (en) * 2007-10-31 2009-05-07 Central Glass Co., Ltd. Device for scoring glass sheet
JP2010526751A (en) * 2007-05-09 2010-08-05 コーニング インコーポレイテッド Constant force scoring device and method of using the same
JP2011155151A (en) * 2010-01-27 2011-08-11 Mitsuboshi Diamond Industrial Co Ltd Scribing apparatus for thin-film solar cell
JP2013086288A (en) * 2011-10-14 2013-05-13 Mitsuboshi Diamond Industrial Co Ltd Substrate top-surface detection method and scribing device
JP2013144635A (en) * 2011-12-15 2013-07-25 Amagasaki Kosakusho:Kk Apparatus and method having profiling control and for forming scribed line on hard brittle plate
JP2016216281A (en) * 2015-05-15 2016-12-22 平田機工株式会社 Cutting method and cutting device
KR101807493B1 (en) * 2011-08-01 2017-12-11 주식회사 탑 엔지니어링 A scribing apparatus and a method for maintaining press load thereof
CN109307634A (en) * 2018-10-12 2019-02-05 华南理工大学 The micro-nano delineation hard brittle material experimental rig of one kind and its test method
KR20190037829A (en) * 2017-09-29 2019-04-08 주식회사 탑 엔지니어링 Scribing apparatus
CN110282867A (en) * 2019-08-01 2019-09-27 中电科风华信息装备股份有限公司 A kind of special-shaped scribe structure of multitool pen machine
WO2020110459A1 (en) * 2018-11-27 2020-06-04 三星ダイヤモンド工業株式会社 Pressure measurement mechanism and breaking device provided with said pressure measurement mechanism
CN113686679A (en) * 2021-08-26 2021-11-23 山东建筑大学 High-speed mechanical scribing test method and device for semiconductor crystal
CN113776659A (en) * 2021-11-11 2021-12-10 枣庄高新区立正安装工程有限公司 Ventilation system mechanical vibration testing arrangement
CN114034539A (en) * 2021-11-11 2022-02-11 哈尔滨工业大学 Impact scoring device for high strain rate deformation and damage analysis of hard and brittle materials
CN116449475A (en) * 2023-06-16 2023-07-18 中国科学院长春光学精密机械与物理研究所 Scribing depth adjusting device, tool rest system and adjusting method
CN114034539B (en) * 2021-11-11 2024-05-03 哈尔滨工业大学 Impact scoring device for high strain rate deformation and damage analysis of hard and brittle materials

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5854398B2 (en) * 2011-09-13 2016-02-09 学校法人福岡大学 Scribing equipment
TWI610772B (en) * 2017-02-22 2018-01-11 Gao Rui Gan Positionable tool holder
KR102030403B1 (en) * 2017-11-13 2019-10-10 한국미쯔보시다이아몬드공업(주) Multifunctional scribe head and scribing method using the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06102480A (en) * 1992-09-22 1994-04-15 Nec Kagoshima Ltd Scribing device
JPH0740335A (en) * 1993-07-29 1995-02-10 Rohm Co Ltd Dicing method
JPH10338534A (en) * 1997-06-03 1998-12-22 Toshiba Corp Scriber, breaker, glass cutter and scribing method
JP2001139337A (en) * 1999-11-11 2001-05-22 Toshiba Corp Working device, glass scribing device and glass cutting method
JP2002187732A (en) * 2000-12-21 2002-07-05 Sony Corp Dicing method and dicing device
JP2003034543A (en) * 2001-07-18 2003-02-07 Seiko Epson Corp Device for forming scribe groove, method for forming scribe groove, method for cutting glass substrate, method for producing electroptical device, electroptical device, and electronic device
WO2004041493A1 (en) * 2002-11-06 2004-05-21 Mitsuboshi Diamond Industrial Co.,Ltd. Scribe line forming device and scribe line forming method
JP2004224601A (en) * 2003-01-20 2004-08-12 Nec Kagoshima Ltd Method of cutting liquid crystal display panel

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06102480A (en) * 1992-09-22 1994-04-15 Nec Kagoshima Ltd Scribing device
JPH0740335A (en) * 1993-07-29 1995-02-10 Rohm Co Ltd Dicing method
JPH10338534A (en) * 1997-06-03 1998-12-22 Toshiba Corp Scriber, breaker, glass cutter and scribing method
JP2001139337A (en) * 1999-11-11 2001-05-22 Toshiba Corp Working device, glass scribing device and glass cutting method
JP2002187732A (en) * 2000-12-21 2002-07-05 Sony Corp Dicing method and dicing device
JP2003034543A (en) * 2001-07-18 2003-02-07 Seiko Epson Corp Device for forming scribe groove, method for forming scribe groove, method for cutting glass substrate, method for producing electroptical device, electroptical device, and electronic device
WO2004041493A1 (en) * 2002-11-06 2004-05-21 Mitsuboshi Diamond Industrial Co.,Ltd. Scribe line forming device and scribe line forming method
JP2004224601A (en) * 2003-01-20 2004-08-12 Nec Kagoshima Ltd Method of cutting liquid crystal display panel

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010526751A (en) * 2007-05-09 2010-08-05 コーニング インコーポレイテッド Constant force scoring device and method of using the same
JP2009107897A (en) * 2007-10-31 2009-05-21 Central Glass Co Ltd Device for scoring glass sheet
WO2009057474A1 (en) * 2007-10-31 2009-05-07 Central Glass Co., Ltd. Device for scoring glass sheet
JP2011155151A (en) * 2010-01-27 2011-08-11 Mitsuboshi Diamond Industrial Co Ltd Scribing apparatus for thin-film solar cell
EP2352163A3 (en) * 2010-01-27 2011-12-28 Mitsuboshi Diamond Industrial Co., Ltd. Scribing apparatus for thin film solar cells
KR101251896B1 (en) * 2010-01-27 2013-04-08 미쓰보시 다이야몬도 고교 가부시키가이샤 Scribing apparatus for thin film solar cell
KR101807493B1 (en) * 2011-08-01 2017-12-11 주식회사 탑 엔지니어링 A scribing apparatus and a method for maintaining press load thereof
JP2013086288A (en) * 2011-10-14 2013-05-13 Mitsuboshi Diamond Industrial Co Ltd Substrate top-surface detection method and scribing device
JP2013144635A (en) * 2011-12-15 2013-07-25 Amagasaki Kosakusho:Kk Apparatus and method having profiling control and for forming scribed line on hard brittle plate
JP2016216281A (en) * 2015-05-15 2016-12-22 平田機工株式会社 Cutting method and cutting device
KR101991269B1 (en) 2017-09-29 2019-06-20 주식회사 탑 엔지니어링 Scribing apparatus
KR20190037829A (en) * 2017-09-29 2019-04-08 주식회사 탑 엔지니어링 Scribing apparatus
CN109307634A (en) * 2018-10-12 2019-02-05 华南理工大学 The micro-nano delineation hard brittle material experimental rig of one kind and its test method
WO2020110459A1 (en) * 2018-11-27 2020-06-04 三星ダイヤモンド工業株式会社 Pressure measurement mechanism and breaking device provided with said pressure measurement mechanism
CN110282867A (en) * 2019-08-01 2019-09-27 中电科风华信息装备股份有限公司 A kind of special-shaped scribe structure of multitool pen machine
CN113686679A (en) * 2021-08-26 2021-11-23 山东建筑大学 High-speed mechanical scribing test method and device for semiconductor crystal
CN113776659A (en) * 2021-11-11 2021-12-10 枣庄高新区立正安装工程有限公司 Ventilation system mechanical vibration testing arrangement
CN114034539A (en) * 2021-11-11 2022-02-11 哈尔滨工业大学 Impact scoring device for high strain rate deformation and damage analysis of hard and brittle materials
CN114034539B (en) * 2021-11-11 2024-05-03 哈尔滨工业大学 Impact scoring device for high strain rate deformation and damage analysis of hard and brittle materials
CN116449475A (en) * 2023-06-16 2023-07-18 中国科学院长春光学精密机械与物理研究所 Scribing depth adjusting device, tool rest system and adjusting method
CN116449475B (en) * 2023-06-16 2023-09-01 中国科学院长春光学精密机械与物理研究所 Scribing depth adjusting device, tool rest system and adjusting method

Also Published As

Publication number Publication date
JPWO2008126502A1 (en) 2010-07-22
TW200900365A (en) 2009-01-01

Similar Documents

Publication Publication Date Title
WO2008126502A1 (en) Scribe device and scribe method
TW200727986A (en) A method for adjusting nozzle clearance of a liquid coater, and the liquid coater
RU2448817C2 (en) Strip and sheet cutter and method of determination and/or calibration of clearance between cutter blades
TW200627567A (en) Apparatus and method for positioning
JP2009220405A5 (en)
TW200636794A (en) Method of measuring beam angle
GB0625260D0 (en) A method for measuring a workpiece using a machine tool
EP1903325A3 (en) Apparatus and method for preparing sliced specimen
ATE448842T1 (en) LINE DRAWING DEVICE
EP2322319A3 (en) Tool radius adjusting system for boring holder, tool radius adjusting method in machine tool, and machine tool
JP2006343249A5 (en)
MY148527A (en) Automatic level adjustment for die bonder
US20160167149A1 (en) Method of cutting and removing adhesive matter at end of cuboid metal material and removal apparatus
CN205448998U (en) Non -contact flatness detecting device
CN204584546U (en) A kind of laser cutting machine of accurate control depth of cut
JP2012000729A5 (en)
CN202853591U (en) Automatic rapid positioning detection tool for product thickness
WO2012115389A3 (en) Device for slitting
WO2014028664A3 (en) Sample preparation saw
CN103776408A (en) Product thickness automatic rapid positioning detection jig
ATE497859T1 (en) METHOD AND DEVICE FOR CONTROLLING A TOOL USING ULTRASONIC WAVES
US8844918B1 (en) Micro adjustable stop
FI20125492L (en) Procedure for measuring a workpiece when edging, measuring device, measuring slide and edge press
WO2006000501A8 (en) Method and device for measuring the beam profile of a laser beam, laser machining device
JP2013066452A5 (en)

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08721116

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009508968

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08721116

Country of ref document: EP

Kind code of ref document: A1