TWI577483B - Laser processing machine, laser processing machine workpiece skew correction method - Google Patents

Description

Workpiece skew correction method for laser processing machine and laser processing machine

The present invention relates to a laser processing machine and a laser processing machine for applying laser light to any part of a workpiece (workpiece).

Recently, a touch panel device has been widely used as an input device. The touch panel device is mounted on a device in which a display device such as a liquid crystal display or an organic EL display is incorporated, and is an intuitive input means for the device.

The touch panel device includes a touch panel sensor, a control circuit for understanding a contact device on the touch panel, a wiring, and a flexible printed substrate. The area of the touch panel sensor that overlaps with the image display area of the explicit device becomes transparent, and constitutes an active area in which the contact position of the object can be detected.

The projection type capacitive coupling type touch sensor is characterized by a dielectric body and a first sensing electrode and a second sensing electrode formed on both sides of the dielectric body in mutually different patterns. The first sensing electrode and the second sensing electrode are laid outside the active area through the substrate supporting the sensing electrodes The extraction wiring (the conductor for extraction) in the region is connected to an external control circuit.

Although the first sensing electrode and the second sensing electrode laid in the active region use a transparent conductive material, the taken-out wiring laid in the inactive region does not have to be transparent. Conventionally, a wiring pattern composed of a conductive material such as a metal having a high electrical conductivity has been printed on a substrate (see Patent Document 1 below).

In the past, in order to further enlarge the image display area of the display device and/or to further improve the design, it is required to narrow the so-called "frame" region (frame) surrounding the image display area. In order to achieve narrowing of the frame area, it is necessary to make the inactive area in the touch panel sensor small in area.

When the take-out wiring laid in the inactive area is sufficiently high-definition, the inactive area and the frame area can be reduced. However, in the current screen printing method, it is difficult to form a high-definition wiring pattern.

In this case, when a conductive layer made of a conductive material is formed on the surface of the substrate, and the conductive layer is cut by irradiating the laser light to form a wiring pattern by laser processing, the screen printing can be realized. High-precision take-out wiring that cannot be obtained in the law.

At the time of laser processing, a laser processing machine that irradiates laser light to any place of the workpiece is used. As an example of such a laser processing machine, a combination of a galvanometer scanner and a collecting lens that can change the direction of the laser optical axis can be cited.

In the scan that shifts the optical axis of the laser beam, due to the current The rotational positioning error of the mirror of the scanner or the optical skew of the concentrating lens produces an error with respect to the planar coordinate system. This error must be removed beforehand when performing laser processing.

In the past, in the test piece laser processing test pattern, and using the microscope to observe this, the ideal pattern and the actual formed pattern error were measured, and the error was reduced by adding the command value issued by the galvanometer scanner. Correct the amount to correct (calibrate) the position of the laser light. The correction using such a test piece is troublesome and time consuming due to the special hand.

Recently, a processing sensor (CCD, CMOS, etc.) that detects the high resolution of the irradiation position by receiving irradiation of laser light is attached to the processing machine, so that the target irradiation position of the laser light is automatically performed and the sensor is used. Correction of the error of the actual irradiation position detected (refer to Patent Document 2 below).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-033558

[Patent Document 2] Japanese Patent No. 5519123

The workpiece to be processed for laser processing is large When a film (for example, a PET film) or a thin plate or the like is used, a part thereof is elongated or contracted to cause skew. On the surface of the workpiece, there are many cases where the contour of the wiring pattern (conductive layer) or the alignment mark for positioning is marked before processing, but the workpiece is heated in the drying process after printing of the patterns. One of the reasons for skewing the workpiece.

Since the alignment mark of the surface of the workpiece is referenced in the past, the positional deviation of the workpiece from the horizontal direction of the laser processing machine is detected, that is, the X-axis and Y-axis directions are biased and the winding is taken as the vertical axis. The amount of rotation of the Z axis, and the target irradiation position (alignment) of the laser light is corrected. However, it can be said that there is no countermeasure against skew caused by local extension or contraction of the workpiece, and the accuracy of the irradiation position of the laser light and the precision of the laser processing are improved.

The present invention is intended to achieve an improvement in the precision of processing by a laser processing machine.

In the present invention, a laser processing machine includes: a support body that supports a workpiece; and a laser light irradiation device that irradiates the workpiece supported by the support body with laser light; and controls a portion that refers to an image of a workpiece supported by the support body by a camera sensor, detects that it is marked on the workpiece, and is distributed and disposed by the laser light irradiation device. The position of at least ten alignment marks of the range of possible exposure of the laser light, the X-axis of the position at which each alignment mark should be originally located and the position of each alignment mark actually detected The direction error and the Y-axis direction error, and the X-axis direction error and the Y-axis direction error of the position of each alignment mark are used to generate an X-axis direction error and a Y-axis direction error respectively appearing in any of the above-mentioned illumination possible ranges. The approximation of the X-axis direction error and the approximation of the Y-axis direction error, and the X-axis direction error and the Y-axis direction error calculated by the approximation formula are determined for laser processing. The amount of correction of the command of the desired target irradiation position on the workpiece is irradiated with the laser light.

Further, in the present invention, a laser processing machine includes: a support body that supports a workpiece; and a laser light irradiation device that irradiates laser light toward a workpiece supported by the support; The control unit detects an image of the object to be processed supported by the support by the camera sensor, detects the position of the alignment mark indicated by the plurality of objects, and knows the alignment. The error between the position of the mark and the position of each of the alignment marks actually detected, and the assumption of the position between the alignment mark and the other alignment mark using the error of the position of each alignment mark The error of the position is further based on an error between the commanded irradiation position and the actual irradiation position of the laser light when the laser light irradiation device is commanded to give an irradiation position without adding a correction amount, and is added to the object to be processed. The error obtained by the error of the position of the alignment mark corresponding to the command irradiation position is determined by the expectation of irradiating the laser light onto the workpiece during laser processing. Command correction amount of the irradiation position of the mark.

The above-described laser light irradiation device is configured using, for example, a galvanometer scanner that can change the direction of the optical axis of the laser light.

Furthermore, the workpiece skew correction method of the laser processing machine according to the present invention is a method using a laser processing machine, the laser processing machine includes: a support body that supports the workpiece; and a laser light irradiation device The laser beam is irradiated toward the workpiece supported by the support; and the control unit is configured to irradiate the position and the actual laser light according to an instruction to the laser light irradiation device to give an irradiation position without a correction amount. The error of the irradiation position is determined by the correction amount of the command for irradiating the laser light to the desired target irradiation position on the workpiece during laser processing, and the method is characterized in that it is supported by the camera sensor pair The object to be processed on the support is imaged, and the position of the alignment mark marked on the plurality of objects to be processed is detected by referring to the image captured by the camera sensor, and the original mark is determined to be The position of the position and the error of the position of each alignment mark actually detected, and the error of the position of each alignment mark is used to calculate an alignment mark and other Aligning the error of the hypothetical position between the marks, and also giving the control unit the commanded irradiation position and the actual laser light irradiation when the laser light irradiation device gives an instruction to irradiate the position without adding the correction amount. The error of the position is determined by an error obtained by an error of the position of the alignment mark corresponding to the irradiation position of the command on the workpiece to determine the correction amount.

According to the present invention, the accuracy of the laser processing performed by the laser processing machine is further improved.

0‧‧‧Laser processing machine

1‧‧‧Laser light irradiation device

11, 12‧‧‧ galvanometer scanner

14‧‧‧Camera sensor

3‧‧‧ drive

5‧‧‧Control device

9‧‧‧Processed objects

91, 92‧‧‧ alignment marks

L‧‧‧Laser beam

Fig. 1 is a perspective view showing an outline of a laser processing machine according to an embodiment of the present invention.

Fig. 2 is a perspective view showing the configuration of a laser beam irradiation apparatus in the same laser processing machine.

Fig. 3 is a plan view schematically showing an error of an irradiation position of laser light with characteristics of a laser beam irradiation device itself of a laser processing machine.

Fig. 4 is a view showing the configuration of a hardware resource of the laser processing machine.

Fig. 5 is a block diagram showing the functional blocks of the same laser processing machine.

Fig. 6 is a view showing an example of an alignment mark indicating a workpiece.

FIG. 7 is an enlarged view of an important part of FIG. 7. FIG.

Fig. 8 is a flow chart showing a procedure of processing performed at the time of calibration with the laser processing machine.

Fig. 9 is a flow chart showing a procedure of processing performed at the time of calibration with the laser processing machine.

Fig. 10 is a flow chart showing a procedure of processing performed when the laser processing machine performs laser irradiation.

An embodiment of the present invention will be described with reference to the drawings. As shown in Fig. 1, the laser processing machine 0 of the present embodiment is provided with a mounting table 4 as a support for setting a workpiece, and a workpiece to be placed on the mounting table 4. The laser light irradiation device 1 that irradiates the laser light L is a device that can apply laser processing to any part of the workpiece.

In the present embodiment, as the workpiece, it is assumed that the article is a very long article wound into a film of a drum, or a large article. Further, for example, laser processing is performed on a wide range of the workpiece while the workpiece is fed from one of the rollers and taken up by the other roller. Therefore, in the laser processing machine 0 of the present embodiment, the laser beam irradiation device 1 can be moved back and forth, left and right, and the optical axis of the laser beam L emitted from the laser beam irradiation device 1 can be shifted forward and backward.

The laser light irradiation device 1 is moved slightly parallel to the installation table 4 by a driving device (or XY stage) 3. The drive device 3 includes a Y-axis rail 31 that extends in the front-rear direction, an X-axis unit 32 that is guided by the Y-axis rail 31 and that travels in the front-rear direction, and that is expanded in the left-right direction and has an X-axis rail 321 provided on the upper portion thereof. The shaft rail 321 is guided to guide the trolley 322 in the left-right direction. The X-axis unit 32 and the cart 322 are linear motor carts that use a linear servo rotor as a drive source. The laser light irradiation device 1 is supported by the above-described trolley 322.

The drive unit 3 is provided with a linear scale (not shown). The X-axis linearity scale is a position detecting mechanism for detecting the left-right direction of the laser light irradiation device 1, that is, the position in the X-axis direction, and the Y-axis linearity scale is for detecting the front-rear direction of the laser light irradiation device 1, That is, the position detecting mechanism is the position in the Y-axis direction. The X-axis linearity scale is, for example, a magnetic sensory probe provided on the carriage 322, and a magnetic strip scale set on the magnetic grid pattern of the X-axis unit 32 as an element. And by magnetically sexy The probe reads the scale of the strip scale, and detects the position of the trolley 322 and the laser light irradiation device 1 in the X-axis direction and outputs a signal indicating the position coordinate. Similarly, the Y-axis linearity scale also detects the X-axis unit 32 and the laser light irradiation device 1 by using the magnetic sensor head disposed on the X-axis unit 32 and the magnetic strip scale provided along the Y-axis track 31 as an element. The Y-axis direction position outputs a signal indicating the position coordinate.

That is, the driving device 3 can position the laser light irradiation device 1 at an arbitrary XY coordinate.

As shown in FIG. 2, the laser light irradiation device 1 has a laser oscillator (not shown) as a supply source of the laser light L, and a galvanometer scanner that scans the laser light L that is oscillated from the laser oscillator. 11, 12, and a collecting lens 13 for collecting the laser light L.

The galvanometer scanners 11 and 12 are used by servo motors, stepping motors, and the like 111 and 121 to rotate the reflected light 112 and 122 reflected by the laser light L, and the optical axis of the light L can be changed. In the present embodiment, the X-axis galvanometer scanner 11 that changes the optical axis of the light L to the X-axis direction and the Y-axis galvanometer scanner 12 that changes the optical axis of the light L to the Y-axis direction are provided. The irradiation position of the light L is controlled in the XY secondary direction. The condensing lens 13 is, for example, an Fθ lens.

The irradiation position of the laser light L emitted from the laser beam irradiation device 1 is affected by the rotational positioning error of the motors 111 and 112 of the galvanomirror scanners 11, 12. In addition to this, an optical skew due to the condensing lens 13 is also generated. Due to the error of the irradiation position of the laser light L generated by the factors, the laser light irradiation device 1 itself has characteristics The error tends to become larger as the distance from the center of the scanning range of the galvanometer scanners 11, 12 becomes larger. 2 and 3 schematically show the error A. In FIG. 3, the frame line B drawn by the broken line is an irradiation position and an irradiation range of the ideal laser light L. On the other hand, the frame type A of the barrel type which is formed by the chain line is changed, and the XY coordinates (x, y) of the target irradiation position (without adding the correction amount for error correction) are simply supplied to the galvanometer scanner 11 At the time of 12, the irradiation position and the irradiation range of the laser light L.

In order to carry out the processing using the laser processing machine 0, it is necessary to perform calibration for correcting the error of the above irradiation position. The correction of the irradiation position is performed by irradiating the beam detecting detector 2 with the laser light L.

In the present embodiment, it is assumed that the workpiece is a long or large article, and such a workpiece is attached to a slightly full area of the setting table 4. Therefore, in the present embodiment, the beam detector 2 is disposed in a portion where there is no vicinity of the installation table 4 covered by the workpiece. The beam detecting sensor 2 is a detecting sensor that detects the high resolution of the irradiation position by receiving the irradiation of the laser light L. Typically it is a CCD sensor or a CMOS sensor. The setting table 4 and the beam detecting sensor 2 do not move during laser processing or correction. At the time of correction, the laser light irradiation device 1 is moved by the driving device 3 to a position above the beam detecting sensor 2.

When the error of the irradiation position of the characteristic of the laser light irradiation device 1 is corrected, the laser beam is emitted with the target point (x _i , y _i ) of the XY plane coordinate system set on the beam detecting sensor 2 as the target. L, the result obtains an error (Δx _i , Δy _i )=(x _i -) with the irradiation position (x _i ', y _i ') of the actual laser light L sensed by the beam detecting sensor 2. x _i ', y _i -y _i '). Here, the subscript i refers to any one of the plural points and is given a specific identification code. Further, based on the detected error (Δx _i , Δy _i ) of each point i, the correction amount of each point i required to compensate the error is determined. In the correction of the error, the detection of the error (Δx _i , Δy _i ) from hundreds of points to several thousand points and the determination of the correction amount are performed.

The accuracy of the laser processing, in other words, whether or not the laser light L can be irradiated onto the desired position on the workpiece depends not only on the irradiation precision of the laser light L of the laser light irradiation apparatus 1 itself. The positioning error of the laser processing machine 0 when the workpiece is placed on the installation table 4 is also a factor that deteriorates the accuracy of the laser processing. That is, there is a bias in the X-axis direction and a bias in the Y-axis direction with respect to the positional shift of the workpiece to the laser processing machine 0 in the horizontal direction. In addition to this, the workpiece also has a Z-axis rotation about a vertical axis orthogonal to the X-axis and the Y-axis.

The correction of the positioning errors of the workpieces is performed by the camera sensors 14 attached to the laser beam irradiation device 1 to image the alignment marks 91 and 92 indicated on the surface of the workpiece.

FIG. 6 shows an example of the workpiece 9 and the alignment marks 91 and 92 indicated on the workpiece 9. The alignment marks 91, 92 are marked in the vicinity of the corners (particularly diagonal) of the workpiece 9, or are indicated in each unit included in the workpiece 9. When the workpiece 9 is a touch device, one unit corresponds to one article. A film layer 93 formed by coating a conductive material such as a metal having a high electrical conductivity (for example, silver paste) into a three-sided frame or a four-sided frame is provided at a peripheral portion of each unit. When the wiring pattern required for the product is formed, the thin film layer 93 is irradiated with the laser light L to remove the The part that is needed is only left as part of the wiring. The base material of the workpiece 9 at this time is a film made of PET other resin, and the alignment marks 91 and 92 are printed on the resin film in advance. Further, there are cases where the alignment marks 91 and 92 are printed by mask printing or screen printing or the like, and the film layer 93 is applied in the same manner.

In the conventional laser processing machine, the alignment of the error in locating the position of the workpiece to the processing machine is performed by using the camera sensor 14 attached to the laser light irradiation device 1 to align the alignment of the workpiece 9. The marks 91 and 92 detect the position coordinates of the alignment marks 91 and 92 in the photographic image, and the respective elements (the film layer 93 of the object to be cut) included in the workpiece 9 or the workpiece 9 are found along the X. The axial direction and the Y-axis direction are only slightly biased, and only how much is rotated about the Z-axis. Further, the target irradiation position (x, y) supplied to the laser light L of the galvanometer scanners 11, 12 or the corrected laser light irradiation device 1 pair setting is corrected so as to offset the amount of deflection and/or the amount of rotation. The relative position of the workpiece of the table 4 is set. Further, although the setting table 4 of the laser processing machine 0 of the present embodiment cannot move, the setting table for supporting the workpiece can be moved in the X-axis direction and the Y-axis direction and/or can be rotated around the Z-axis. By shifting and/or rotating the setting light to the laser light irradiation device 1, the amount of deflection and/or the amount of rotation can be offset.

A workpiece such as a resin film is stretched or shrunk to cause skew on the workpiece. In particular, after the alignment marks 91, 92 are printed on the substrate of the resin film or the conductive material 93 is applied, heat is applied to the film in the process of drying the film. The possibility of partial elongation or contraction. Further, for handling, the tension applied to the roller for winding the film or the roller for feeding the film also contributes to the local skew of the workpiece.

However, the alignment in the conventional laser processing machine does not take into account the local skew such as elongation or contraction of a part of the workpiece. Therefore, there is a space where the desired position of the workpiece, for example, the film layer 93 should be cut and removed, and the laser beam L cannot be accurately irradiated, and the laser processing result remains improved.

Therefore, in the present embodiment, in addition to the offset of the workpiece to the XY direction of the laser processing machine 0 and the rotation about the Z axis, the alignment method is modified to make it possible to cope with the workpiece. Localized skew.

In the laser processing machine 0 of the present embodiment, the control unit 5 for controlling the driving device 3 and the galvanometer scanners 11, 12 has a processor 5a, a main memory 5b, and an auxiliary memory device 5c as shown in Fig. 4 . The I/O interface 5d and the like are controlled to perform a joint operation by the controller 5e (system controller, I/O controller, etc.). The auxiliary memory device 5c is a flash memory, a hard disk drive, or the like. The I/O interface 5d includes a servo driver (servo controller). Further, the control unit 5 is configured to use a general-purpose personal computer, a servo computer, a workstation, or the like.

The program to be executed by the control unit 5 is stored in the auxiliary memory device 5c, and is read into the main memory 5b when the program is executed, and is interpreted by the processor 5a. Further, the control unit 5 emits light as the irradiation position command unit 51, the device position command unit 52, the correction position data storage unit 53, the correction error acquiring unit 54, and the alignment mark shown in Fig. 5 in accordance with the program. The functions of the position data storage unit 55, the alignment error acquisition unit 56, the machining position data storage unit 57, and the machining time control unit 58.

The irradiation position command unit 51 instructs the laser light irradiation device 1 to irradiate the laser light L to the target irradiation position. Specifically, in order to irradiate the laser light L to the XY coordinate (x, y) indicating the target irradiation position, a control signal corresponding to the coordinate (x, y) is input to the galvanometer scanners 11, 12, and the operation mirror 112 is operated. , 122 angle.

The device position command unit 52 instructs the drive device 3 to move the laser light irradiation device 1 to the vicinity of the target irradiation position. Specifically, in order to position the laser light irradiation device 1 at a destination indicating the laser light irradiation device 1, a control signal corresponding to the XY coordinates is input to the drive device 3, and the positions of the X-axis unit 32 and the carriage 322 are operated.

The calibration position data storage unit 53 stores the position data for correction by using the memory area required by the main memory 5b or the auxiliary memory device 5c. As described above, in the present embodiment, in order to correct the error of the irradiation position which is the characteristic of the laser light irradiation apparatus 1, the laser beam L is irradiated to the complex point (x _i , y _i ) of the XY plane coordinate system. A correction operation for detecting an error (Δx _i , Δy _i ) of the irradiation position of each point i is detected. Usually, since the error of several hundred to several thousand points (Δx _i , Δy _i ) is detected, the XY coordinates (x _i , y _i ) of hundreds of thousands to thousands of points are memorized as the positional data for correction. .

The correction error acquiring unit 54 obtains an error (Δx _i , Δy _i ) of the irradiation position of the laser light L. That is, the XY coordinates (x _i , y _i ) of the points i included in the calibration position data are obtained, and the beam detecting sensor 2 is irradiated with the laser light L as the target of the XY coordinates. The error (Δx _i , Δy _i ) of the XY coordinate (x _i ', y _i ') of the actual irradiation position is detected. Further, the error (Δx _i , Δy _i ) of each point i is associated with the target XY coordinate (x _i , y _i ), and is stored in the memory area required by the main memory 5b or the auxiliary memory device 5c.

FIG. 8 shows an example of a procedure executed by the control unit 5 when the calibration of the irradiation position of the laser light L is corrected. The control unit 5 reads the XY coordinates (x _i , y _i ) included in the stored correction memory data (step S1), in order to use the read coordinates (x _i , y _i ) as the target irradiation position. The laser light L is irradiated, and the galvanometer scanners 11, 12 are operated to adjust the optical axis of the laser light L (step S2).

And, in step S2, the optical axis of the laser light L directed toward the target illumination position coordinate (x _i , y _i ) via the galvanometer scanners 11 and 12 is incident on the beam detection detector 2 In the position, the driving device 3 is operated to adjust the position of the laser light irradiation device 1 (step S3). More specifically, the coordinates of the target irradiation position when the laser beam L is emitted from the vertical lower side of the laser light irradiation device 1 as the target irradiation position are (0, 0), and are indicated by the correction position data ( Further, when the coordinates of the target irradiation position of the galvanometer scanners 11 and 12 are (x _i , y _i ), the position of the laser light irradiation device 1 from the beam detecting sensor 2 is positive. The upper direction moves along the X-axis direction to bias only -x _i , and only the position of -y _i is biased along the Y-axis direction. Accordingly, if there is no error in the irradiation position, the laser light L emitted from the laser beam irradiation device 1 is irradiated to the sighting position (0, 0) on the beam detecting sensor 2. That is, in the correction operation, the optical axis of the laser light L emitted from the laser light irradiation position 1 is directed to the collimation position (0, 0) on the beam detecting sensor 2.

Further, the laser light irradiation device 1 is actually irradiated with the laser light L (step S4), the sighting position on the beam detecting sensor 2 is obtained, and the beam detecting sensor 2 actually senses the position of the laser light L. The X-axis direction error of the XY coordinates and the Y-axis direction error (step S5). The mean error of the laser light L irradiating the target position (x _i, y _i) and the actual irradiation position _{(x i ', y i'} ) of the error _{(△ x i, △ y i} ).

Then, the control unit 5 memorizes the acquired error (Δx _i , Δy _i ) and the target irradiation position (x _i , y _i ) (step S6). The control unit 5 repeats the above-described steps S1 to S7 until the error (Δx _i , Δy _i ) is obtained for all the target irradiation positions i included in the calibration position data (step S7).

After the completion of the calibration or during the laser processing, the laser light irradiation position 1 is restored by the driving device 3 to a position above the setting table 4 on which the workpiece is placed.

The alignment position data storage unit 55 uses the memory area required by the main memory 5b or the auxiliary storage device 5c to memorize the position data for alignment. The position data for alignment is marked in advance by the object to be processed placed on the setting table 4, and is an XY coordinate (x _Mn , which is the original position of the alignment marks 91 and 92 indicating the plural number. a collection of y _Mn ). Here, the subscript n is an identification code that is specified by any one of the plurality of alignment marks 91 and 92 on the workpiece. The coordinates (x _Mn , y _Mn ) which are the elements of the alignment position data and the number thereof depend on the type or individual of the workpiece, and can vary depending on the type of the workpiece or the solid. That is, each position coordinate (x _Mn , y _Mn ) has a relative positional coordinate based on the edge (edge) or the corner of the workpiece.

The alignment error acquisition unit 56 analyzes the captured image obtained by imaging the surface of the workpiece provided on the installation table 4 by the camera sensor 14 attached to the laser light irradiation device 1, and detects that the image is captured. The XY coordinates (x _Mn ', y _Mn ') of the actual positions of the alignment marks 91, 92 are obtained by aligning the marks 91, 92 on the surface of the workpiece. Further, at each alignment mark n, an error (x _Mn , y _Mn ') of the actual position (x _Mn ', y _Mn ') and the original position (x _Mn , y _Mn ) of the alignment marks 91, 92 is obtained (Δx) _Mn , Δy _Mn ) = (x _{Mn -} x _Mn ', y _{Mn -} y _Mn '). The error (Δx _Mn , Δy _Mn ) indicates the positional deviation of the workpiece placed on the setting table 4 from the laser processing machine 0, that is, the deviation in the X-axis and Y-axis directions and the amount of rotation around the Z-axis. And the local skew of the workpiece. It is assumed that there is no positional deviation of the workpiece from the laser processing machine 0, and there is no local elongation or contraction of the workpiece, and any error (Δx _Mn , Δy _Mn ) for each alignment mark n is used. Should be 0.

Further, the alignment error acquiring unit 56 estimates the cause of the object in the coordinates (x _i , y _i ) of the XY plane coordinate system based on the error (Δx _Mn , Δy _Mn ) of each alignment mark n. The error caused by the positional deviation and skew (Δx _Mi , Δy _Mi ).

Fig. 7 is a hypothetical representation of the position (x _i , y _i ) of the correction point 94 for correcting the error of the irradiation position of the laser light L of the laser light irradiation apparatus 1 itself in a white circle. As shown in FIG. 7, the XY coordinates (x _i , y _i ) of the correction points 94, the positional deviation of the workpiece, and the XY coordinates of the alignment marks 91, 92 for eliminating the influence of local skew ( x _Mn , y _Mn ) does not necessarily coincide. It is better to say that there are more inconsistencies between the two. The number of alignment marks 91, 92 originally indicated on the workpiece is smaller than the number of correction points 94, and the density of the alignment marks 91, 92 is also less than the density of the correction point 94. Therefore, the error (Δx _Mi , Δy _Mi ) in the coordinates (x _i , y _i ) cannot be directly obtained from the photographic image of the workpiece imaged by the camera sensor 14 .

Accordingly, in the present embodiment, the possible range of illumination from the laser light L distributed by the laser light irradiation device 1 is at least ten pairs of the scanning ranges of the galvanometer scanners 11, 12. The X-axis direction error Δx _Mn and the Y-axis direction error Δy _{Mn at} the positions of the quasi-marks 91 and 92 respectively generate an approximation of the X-axis direction error Δx _M among any XY coordinates (x, y) in the same scanning range. Equation F ₁ (x, y), and an approximate expression F ₂ (x, y) indicating the Y-axis direction error Δy _M .

F ₁ (x, y) and F ₂ (x, y) belonging to the function of the XY coordinates (x, y) can respectively be derived from the errors (Δx _Mn , Δy _Mn ) measured for the respective alignment marks n. The collection is estimated using the most approximate estimation method and other known methods. For example, the estimation of the function F ₁ (x, y) can be estimated by the three-dimensional space coordinate system developed in the X-axis, the Y-axis, and the F ₁ axis, and the ideal position corresponding to each alignment mark n (x _Mn , y _Mn ) error Δx _Mn and the function value F ₁ (x _Mn , y _Mn ) approximate the curved surface F ₁ (if by the least squares method, the square of the residual image of the errors Δx _Mn and F ₁ And the way to be the smallest, the coefficient of the function F ₁ is determined to be executed. Similarly, the estimation of the function F ₂ (x, y) can be estimated by the ideal position of each alignment mark n by the three-dimensional space coordinate system developed in the X-axis, the Y-axis and the F ₂ axis (x _Mn , y _Mn ) error Δy _Mn and function value F ₂ (x _Mn , y _Mn ) approximate curved surface F ₂ (if by least squares method, the square of the residual image with errors Δy _Mn and F ₂ And the smallest way, the coefficient of the function F ₂ is determined to be executed. When the approximate expressions F ₁ and F ₂ thus estimated are used, the errors (Δx _Mi , Δy _Mi ) in the coordinates (x _i , y _i ) can be estimated. That is, Δx _Mi = F ₁ (x _i , y _i ), Δy _Mi = F ₂ (x _i , y _i ).

Further, in order to obtain the coordinate (x _i, y _i) of the error _{(△ x Mi, △ y Mi} ), even close to the complex by coordinate (x _i, y _i) of the alignment mark (x _Mn, y _Mn ) Interpolation of the error (Δx _Mi , Δy _Mi ) may be performed to calculate the X-axis direction error Δx _Mi and the Y-axis direction error Δy _Mi. For example, in the XY plane coordinate system, three alignment marks (x _Mn , y _Mn ) closest to the coordinates (x _i , y _i ) are selected. Further, the X-axis coordinate x _Mn and the Y-axis coordinate y _{Mn of the} three alignment marks 91 and 92 and the error Δx _Mn corresponding to the alignment marks 91 and 92 are drawn by the X-axis, the Y-axis, and Δ. When the x-dimensional space is expanded by the x _M axis, it is assumed that the plane passing through the three points can be calculated, and the error Δx _Mi corresponding to the coordinates (x _i , y _i ) on the plane can be calculated. Similarly, if the X-axis coordinate x _Mn and the Y-axis coordinate y _{Mn of the} three alignment marks 91, 92 and the error Δy _Mn corresponding to the alignment marks 91, 92 are drawn by the X-axis, the Y-axis, and △ when y _M axis expanded three-dimensional space can be assumed that a plane passing through the three points, and can be calculated with the coordinates (x _i, y _i) on the plane corresponding to the error △ y _Mi.

Further, the error (Δx _Mi , Δy _Mi ) of each point i is associated with the target XY coordinate (x _i , y _i ), and is stored in the memory area required by the main memory 5b or the auxiliary memory device 5c.

FIG. 9 shows an example of a procedure executed by the control unit 5 when measuring the positional deviation of the workpiece and the alignment of the local skew. The control unit 5 images the workpiece placed on the installation table 4 by the camera sensor 14 attached to the laser beam irradiation device 1 (step S8), and detects each of the alignment marks 91 and 92 in the photographic image. The XY coordinates (x _Mn ', y _Mn ') are obtained at the position (step S9). Further, for each alignment mark n, the XY coordinates (x _Mn ', y _Mn ') of the actual position and the X-axis direction errors Δx _Mn and Y of the XY coordinates (x _Mn , y _Mn ) of the ideal position are calculated. The axial direction error Δy _Mn (step S10).

Then, from the positions (x _Mn , y _Mn ) of the respective alignment marks n and the corresponding errors (Δx _Mn , Δy _Mn ), the XY coordinates (x _i , y _i ) of the respective correction points i are estimated. The error (Δx _Mi , Δy _Mi ) (step S11), and the set of the estimated error (Δx _Mi , Δy _Mi ) and the target irradiation position (x _i , y _i ) are memorized (step S12). The control unit 5 repeats the above-described steps S11 to S12 until the error (Δx _Mi , Δy _Mi ) is acquired for all the target irradiation positions i included in the calibration position data (step S13).

The processing position data storage unit 57 stores the position data for laser processing using the memory area required by the main memory 5b or the auxiliary memory device 5c. The processing position data storage unit 56 sets a CAD data or the like for specifying which portion of the workpiece to be irradiated by the laser light L, or The XY coordinates of the complex point of the laser beam L during working hours are memorized as processing coordinate position data.

The machining time control unit 58 controls the laser light irradiation device 1 in order to irradiate the laser light L to the irradiation position specified by the processing position data. Specifically, the XY coordinates (x _T , y _T ) of the target irradiation position of the laser light L are obtained by reading the processing position data. Moreover, according to the calibration error (Δx _i , Δy _i ) and the calibration error (Δx _Mi , Δy _Mi ), the laser light L is accurately irradiated to the target illumination position coordinate (x _T , y _T ). The amount of correction required.

Coordinates (x _T, y _T) when the calibration points i and a plurality of the sum of any of a standard (x _i, y _i) are equal, the readout irradiation position of the targets with related rather to the coordinate (x _i, y _i) Memory error (Δx _i , Δy _i ) and error (Δx _Mi , Δy _Mi ), the total error (Δx _T , Δy _T ) = (Δx _i + Δx _Mi , △ y _i +Δy _Mi ). The error (Δx _T , Δy _T ) can be said to be the processed object to which the laser light L is actually irradiated when the target irradiation position (x _T , y _T ) is supplied to the galvanometer scanners 11 and 12 as such. The position of the upper position and the expected target irradiation position (x _T , y _T ).

When the coordinates (x _T , y _T ) of the target illumination position are not equal to any of the complex correction points i (x _i , y _i ), the error of each correction point i (Δx _i + △ _{x Mi, △ y i + △} y Mi) , based on the estimated target coordinates (x _T, y _T) of the error _{(△ x T, △ y T} ). The method of the calculation is the same as the method of estimating the error (Δx _Mi , Δy _Mi ) in the coordinates (x _i , y _i ) from the error (Δx _Mn , Δy _Mn ) of each alignment mark n. Therefore, the description is omitted here.

Further, the machining time control unit 58 substitutes the X-axis coordinate x _T , the Y-axis coordinate y _T , the X-axis direction error Δx _{T ,} and the Y-axis direction error Δy _T of the original target irradiation position into a specific functional formula, and calculates The X-axis direction correction amount x _A and the Y-axis direction correction amount y _A . By the correction amount (x _A , y _A ), the error of the irradiation position of the laser light L of the laser light irradiation device 1 itself can be offset, and the relative position of the workpiece to the laser processing machine 0 can be offset. And the partial deviation of the workpiece. Further, the irradiation position command unit 51 adds a coordinate (x _T + x _A , y _T + y _A ) of the correction amount (x _A , y _A ) to the XY coordinate (x _T , y _T ) at the target irradiation position. Corresponding control signals are input to the galvanometer scanners 11, 12. As a result, the laser light L is correctly irradiated to the target irradiation position on the workpiece.

FIG. 10 shows an example of a program executed by the control unit 5 during processing. The control unit 5 reads the XY coordinates (x _T , y _T ) of the target irradiation position specified by the stored processing position data (step S14), and calculates that the XY coordinates (x _T , y _T ) are irradiated with the laser light. The correction amount (x _A , y _A ) of the command issued by the galvanometer scanners 11 and 12 at the time of L (step S15).

Next, a control signal corresponding to the XY coordinate (x _T + x _A , y _T + y _A ) of the correction amount (x _A , y _A ) added to the coordinate (x _T , y _T ) of the target irradiation position is input to the current. The scanners 11, 12 are counted, and the galvanometer scanners 11, 12 are operated (step S16). Further, the laser light L is irradiated (step S17). The control unit 5 repeats the above-described steps S4 to S17 until the laser irradiation processing is performed on all of the target irradiation positions required for the processing position data (step S18).

In the present embodiment, a laser processing machine 0 including a support body 4 that supports a workpiece, and a laser beam irradiation device 1 that illuminates a workpiece supported by the support body 4 are formed. The laser light L; and the control unit 5 refer to the image of the workpiece supported by the support body 4 by the camera sensor 14, and detect the alignment mark of the plurality of objects to be processed. 91, 92 position (x _Mn ', y _Mn '), the original position (x _Mn , y _Mn ) of each of the alignment marks 91, 92 and the actually detected alignment marks 91, 92 are known. Error (Δx _Mn , Δy _Mn ) at position (x _Mn ', y _Mn '), and an alignment mark is calculated using the error (Δx _Mn , Δy _Mn ) of the position of each alignment mark 91, 92 The error of the hypothetical position (Δx _Mi , Δy _Mi ) between 91, 92 and other alignment marks 91, 92 (x _i , y _i ), and according to the position error (Δx _Mi , △ when y _Mi), determined by laser processing in order to expect the irradiation position (x _T, y _T) irradiating the laser beam L, the above-described laser beam irradiation apparatus 1 should be given on the above-described workpiece Command correction amount (x _A, y _A).

Further, in the present embodiment, when the laser processing machine 0 having the following members is used, the support body 4 supports the workpiece; the laser light irradiation device 1 is supported by the support body 4 The workpiece is irradiated with the laser beam L; and the control unit 5 is based on the command irradiation position (x _i ) when the laser light irradiation device 1 is commanded to emit the irradiation position (x _i , y _i ) without adding the correction amount. , y _i ) and the error (Δx _i , Δy _i ) of the irradiation position (x _i ', y _i ') of the actual laser light L are determined to be used to irradiate the laser light L to the above-mentioned quilt during laser processing. The correction amount (x _A , y _A ) of the command of the target irradiation position (x _T , y _T ) expected on the workpiece. The camera 14 images the workpiece supported by the support body 4, and refers to the image captured by the camera sensor 14 to detect the alignment mark 91 marked on the plurality of workpieces, The position of 92 (x _Mn ', y _Mn '), the original position (x _Mn , y _Mn ) of each of the alignment marks 91, 92 and the position of each of the alignment marks 91, 92 actually detected are known. (x _Mn ', y _Mn ') error (Δx _Mn , Δy _Mn ), and an alignment mark 91 is calculated using the errors (Δx _Mn , Δy _Mn ) of the positions of the alignment marks 91 and 92. , the error of the hypothetical position (Δx _Mi , Δy _Mi ) between (92, 92) and the other alignment marks 91, 92 (x _i , y _i ), and given to the above-mentioned control unit 5 the instruction irradiation position (x _i, y _i) when the emitted light irradiation device 1 issued without adding the irradiation position correction amounts of (x _i, y _i) of the instruction and the real of the irradiation position of the laser beam L of (x _i ', yi' The error (Δx _i , Δy _i ) plus the error of the position of the alignment marks 91, 92 corresponding to the position (x _i , y _i ) corresponding to the command illumination position on the workpiece (Δx) _Mi , Δy _Mi ) and the obtained error (Δx _i + Δx _Mi , Δy _i + Δy _Mi ) to determine the above correction amount (x _A , y _A ).

According to this embodiment, the irradiation position of the laser light L to the workpiece can be made closer to the intended target irradiation position, thereby further improving the precision of the laser processing and the quality of the processed product.

The above-described laser beam irradiation device 1 has a galvanometer scanner 11 and 12 that scans the laser light L that is oscillated from the laser oscillator, and a condensing lens 13 that condenses the laser light L, so that it can be switched to the existing one. Some of these in the laser processing machine 0.

Further, the present invention is not limited to the embodiment described in detail above. For example, in the above embodiment, at the time of laser processing, by inputting and correcting the amount (x _A , y _A ) at the target irradiation position (x _T , y _T ) to the galvanometer scanners 11 and 12 The control signal corresponding to the XY coordinates (x _T + x _A , y _T + y _A ) corrects the direction of the optical axis of the laser light L emitted from the laser light irradiation device 1.

Instead, the laser light is input to the driving device 3 by inputting a control signal corresponding to the correction amount (x _A , y _A ) required to properly irradiate the laser light L to the target irradiation position (x _T , y _T ). The irradiation device 1 is moved to the direction of the error (Δx _T , Δy _T ) of the offset irradiation position, and the laser light L may be irradiated from the laser light irradiation device 1 to the workpiece. At this time, the machining time control unit 58 of the control unit 5 determines the irradiation of the laser light L to the target irradiation position (x _T , in accordance with the error (Δx _i + Δx _Mi , Δy _i + Δy _Mi ). y _T ) The amount of correction (x _A , y _A ) to which the command to the drive unit 3 should be given. When the support body 4 supporting the workpiece can be moved to the XY direction, the support body 4 can be moved to the direction of the error (Δx _T , Δy _T ) of the offset irradiation position.

In the laser light irradiation device 1, the specific means for changing the optical axis of the laser light L is not limited to the galvanometer scanners 11, 12. For example, the angle of the laser beam that is attached to the end of the optical fiber that guides the laser light L that is oscillated from the laser oscillator can be controlled by a servo motor or the like.

The specific constitution of the other parts can be variously modified without departing from the spirit and scope of the invention.

[Industry use possibility]

The present invention can be applied to a laser processing machine that applies laser light to any part of a workpiece to be irradiated.

9‧‧‧Processed objects

91‧‧‧ alignment mark

92‧‧‧ alignment mark

93‧‧‧film layer

94‧‧‧ calibration point

Claims (2)

A laser processing machine comprising: a support body for supporting a workpiece; and a laser light irradiation device that uses a galvanometer scanner that can change a direction of an optical axis of the laser light, and is supported by the support body The workpiece is irradiated with the laser beam; the control unit detects the image of the object supported by the support by the camera sensor, and detects the alignment mark of the plurality of objects to be processed. Position (x _Mn ', y _Mn '), knowing where the alignment marks should be (x _Mn , y _Mn ) and the positions of the actually detected alignment marks (x _Mn ', y _Mn ') Error (Δx _Mn , Δy _Mn ), and using the position error (Δx _Mn , Δy _Mn ) of each alignment mark to calculate the position between an alignment mark and other alignment marks (x _i The error of the hypothetical position (Δx _Mi , Δy _Mi ) of y _i ) is also based on the instruction when the above-mentioned laser light irradiation device gives an instruction to irradiate the position (x _i , y _i ) without adding a correction amount The error between the illumination position (x _i , y _i ) and the actual laser light irradiation position (xi', y _i ') (Δx _i , Δy _i ), an error obtained by adding an error (Δx _Mi , Δy _Mi ) of the position of the alignment mark corresponding to the irradiation position of the command (x _i , y _i ) on the workpiece (Δx _i + Δx _Mi , Δy _i + Δy _Mi ) is determined as the correction amount of the command for irradiating the laser light to the desired target irradiation position on the workpiece during laser processing. A method for correcting a workpiece skew of a laser processing machine, which is a method for using a laser processing machine, the laser processing machine comprises: a support body for supporting a workpiece; and a laser light irradiation device, which is used for making a laser light The galvanometer scanner that changes the direction of the optical axis illuminates the laser beam toward the workpiece supported by the support; and the control unit that emits an illumination position without adding a correction amount to the laser light irradiation device (x _i , the irradiation position of the instruction irradiation position (x _i, y _i) when y _i) of the instruction and the real of the laser light of _{(x i ', y i'} ) of the error _{(△ x i, △ y i} ), determined by a correction amount of a command for irradiating laser light onto a desired target irradiation position on the workpiece during laser processing, the method being characterized in that the pair of cameras supported by the support body are processed When the object is imaged, the position of the alignment mark (x _Mn ', y _Mn ') indicated by the plurality of objects to be processed is detected by referring to the image captured by the camera sensor, and each alignment mark is known. Originally at the location (x _Mn , y _Mn ) and the error (Δx _Mn , Δy _Mn ) of the position (x _Mn ', y _Mn ') of each of the alignment marks actually detected, and the error of the position of each alignment mark (Δx _Mn , Δy _Mn ) and calculate the error of the hypothetical position (Δx _Mi , Δy _Mi ) between the alignment mark and the other alignment mark (x _i , y _i ), and also give the control unit the instruction irradiation position (x _i, y _i) the time of the irradiation laser beam means released without adding the correction amount of the irradiation position (x _i, y _i) of the command and the irradiation position of the actual of laser light of (x _i ', y The error of _i ') (Δx _i , Δy _i ), plus the error of the position of the above-mentioned alignment mark (Δx) corresponding to the irradiation position of the command on the workpiece (x _i , y _i ) _mi, △ y _mi) of the acquired error _{(△ x i + △ x mi} , △ yi + △ y mi), in determining the correction amount.