JP3209078B2 - Laser processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for performing laser drilling, laser cutting, marking, and the like with high speed and high accuracy.

[0002]

2. Description of the Related Art Drilling a thin plate such as a printed wiring board,
In a laser processing machine that performs cutting processing, it is necessary to perform processing by scanning a laser beam with high speed and high accuracy. In order to scan a laser beam with high speed and high accuracy, a method of scanning a laser beam using a galvanometer beam scanner is generally used. Such a laser processing apparatus often uses two position control systems, that is, a high-speed laser light scanning system that scans a laser beam with a beam scanner and an XY table control system that moves an installation table of a workpiece. The laser beam scanning control system scans the laser beam using a mirror, so it can scan the laser beam at high speed, but non-linear beam positioning errors occur due to the characteristics of the beam scanner and the lens used for focusing and correcting the optical path. appear. Further, a positioning error of the laser beam also occurs due to a mounting error of the beam scanner or the lens. Further, since the workpiece is installed on the table control system and is laser-processed, a processing error occurs due to an error in mounting the workpiece in addition to the positioning error of the laser beam. Conventionally,
In such a laser processing apparatus, a laser processing is performed on an object to be calibrated, the laser processing position is measured by an external measurement system using a television camera or the like, and a laser beam positioning error is corrected. There is a laser processing apparatus described in Japanese Patent Application Laid-Open Publication No. H10-26095.

[0003]

The conventional laser processing apparatus can correct the positioning error of the laser beam by the laser beam scanning system. However, the conventional laser beam processing system can correct the positioning error of the workpiece set on the XY table. There is no function to correct the positioning error of the generated laser beam. Therefore, in the conventional laser processing apparatus, it is necessary to mount the workpiece on the XY table with accurate positioning, and a jig that can fix the workpiece with high accuracy must be used, which increases the cost. Further, even if the above jig is used, there is a problem that a mounting error occurs due to the thermal deformation of the jig or the deformation of the workpiece, and high-precision laser processing cannot be performed.

The present invention has been made to solve the above-described problems, and has as its object to provide a laser processing apparatus capable of performing high-precision laser processing without requiring complicated operations.

[0005]

In a laser processing apparatus according to the present invention, a laser oscillating section for irradiating a laser beam to the workpiece and a trajectory of the laser beam irradiated by the laser oscillating section are changed. A laser beam scanning unit that scans the irradiation position of the laser beam, a laser beam position command unit that generates a position command for the laser beam scanning unit, and a first device that receives the position command and corrects a position error of the workpiece. A first workpiece correction unit for outputting a corrected position command, and a laser beam scanning unit for inputting the first corrected position command and outputting a second corrected position command for correcting a position error of the laser beam scanning unit. A correcting unit;
Is input to the laser beam scanning unit to scan the laser beam irradiation position.

[0006] Also, a work position control unit for controlling the irradiation position of the laser light emitted from the laser oscillation unit to the work by changing the position of the work, and a work position control unit for controlling the work position. A workpiece position command section for generating a position command, and a second command for inputting a position command from the workpiece position command section and outputting a third corrected position command for correcting a position error of the workpiece. The workpiece correction unit and the third correction position command are input to the workpiece position control unit to control the irradiation position on the workpiece.

The apparatus further includes a feature position measuring section for measuring and outputting a characteristic position of the workpiece, and inputting an output of the feature position measuring section to the first workpiece correcting section to perform the first correction. It outputs a position command.

The apparatus further includes a feature position measuring section for measuring and outputting a feature position of the workpiece, and inputting an output of the feature position measuring section to the second workpiece correcting section to perform the third correction. It outputs a position command.

[0009] In addition, the laser processing apparatus according to this invention,
A laser light scanning stillness determining unit that determines that the scanning of the laser light scanning unit has stopped, and controls a laser oscillation command to the laser oscillation unit based on an output of the laser light scanning stillness determining unit.

[0010] The laser light scanning stillness judging unit measures the moving distance information of the laser light scanning unit, data indicating the relationship between the moving distance of the laser light scanning unit and the resting time, and the resting time. The judgment result is output using a timer.

A laser beam oscillation end determining unit for determining that the laser oscillation unit has finished irradiating the laser beam;
The position command of the laser beam position command unit is controlled based on the output of the laser beam oscillation end determination unit.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments of the present invention. Embodiment 1 FIG. FIG. 1 is a block diagram showing a laser processing apparatus according to Embodiment 1 of the present invention. In the figure, 1 is a laser machine control unit of the present laser processing apparatus, 2 is a laser beam scanning unit that scans a laser beam composed of a galvano beam scanner (hereinafter abbreviated as a scanner), a mirror, a lens, etc., and 3 is a laser oscillator And 4, a feature position measuring unit for measuring the position of a feature point of the workpiece using a television camera or the like, 5 a workpiece position control unit including an XY table for installing and controlling the positioning of the workpiece, 10 Is a system control unit that controls the entire laser processing apparatus, 11 is a main control unit that decodes a program, performs processing according to the program, and outputs a command value, and 12 is a position of the laser beam scanning unit 2 from the main control unit 11. A laser beam position command section 13 for inputting and storing commands and outputting a position command in accordance with a processing cycle. The laser beam position command section 13 receives the position command from the laser beam position command section and takes a workpiece. A first workpiece correction unit that outputs a first correction position command for correcting an attachment error, receives the first correction position command, and detects a non-linear characteristic due to a mounting error or an optical characteristic of the laser beam scanning unit. The laser beam scanning correction unit outputs a second correction position command for correction. The second correction position command is input to the laser scanning unit 2. Reference numeral 15 denotes a laser oscillation command section that inputs and stores a control command for the laser oscillation section 3 from the main processing section and outputs a laser oscillation trigger signal to the laser oscillation section 3. Reference numeral 16 denotes a measurement processing unit which inputs measurement data from the characteristic position measurement unit 4 and processes the measurement data. The measurement information is output to the main processing unit 11. Reference numeral 17 denotes a workpiece position command unit,
A position command of the workpiece position control unit 5 is input and stored from the main control unit 11, and the position command is output according to a processing cycle.
Reference numeral 18 denotes a second workpiece correction unit that inputs the position command and outputs a third correction position command for correcting the mounting error of the workpiece. The third correction position command is input to the workpiece position correction unit 5. The system control unit 10
Comprises a computer system including one or more CPUs (central processing units), a memory, an input / output interface, and the like.

FIG. 2 is a diagram showing a laser machine control unit according to the first embodiment of the present invention. In the figure, 20 is an XY table, 21 is a motor for driving the X axis of the XY table 20, 22 is an encoder for measuring the position of the X axis table, 23 is a motor for driving the Y axis table, and 24 is a Y axis table An encoder for measuring the position; 25, a workpiece; 26, an XY table surface on which the workpiece 25 is installed;
Reference numeral 7 denotes a laser processing mark, and reference numeral 28 denotes a reference point used for positioning the workpiece 25. The reference point 28 is usually mounted on the workpiece 25 when the workpiece 25 is created. A table controller 29 controls the position of the XY table 20.
3 is driven. The table control device 29 inputs the third correction position command of the second workpiece correction unit and performs the position control calculation. Reference numeral 30 denotes a laser beam, 31 denotes a laser oscillator, and 32 denotes an oscillator control unit for controlling the laser oscillator. The oscillator control section operates to input an oscillation command from the laser oscillation command section 16 and irradiate the laser beam 30 in accordance with the command. 33 is a bend mirror that reflects the laser beam 30, 34 is a galvanometer beam scanner (abbreviated as a scanner) that scans the laser beam in the X-axis direction, 35 is an X-axis mirror, and 36 is a scanner that scans the laser beam in the Y-axis direction. ,
Reference numeral 37 denotes a Y-axis mirror, 38 denotes a lens that collects laser light and corrects an optical path, and 39 denotes a scanner control device that controls the positions of the scanners 34 and 36. The scanner control device 3
Numeral 8 inputs the second correction position command of the laser light scanning correction section 14, and performs the scanning and positioning operation of the laser light. 40
Denotes a television camera, 41 processes image information measured by the television camera 40 using a method such as pattern matching,
This is an image processing device that outputs two-dimensional coordinate values of a characteristic shape included in an image. Here, it outputs two-dimensional coordinates of the laser processing trace 27 and the reference point 28 on the workpiece 25. The output of the image processing device 41 is output to the measurement information processing unit 16. Reference numeral 43 denotes a laser scanning area which is an operation range of the laser beam 30. The laser beam scanning unit 2 is configured by scanners 34 and 36, mirrors 35 and 37, a lens 38, a bend mirror 33, and a scanner controller 39. The laser oscillator 3 includes a laser oscillator 31 and an oscillator controller 3
It has two configurations. The characteristic position measuring unit 4 is a television camera 1
8 and an image processing device 19. The workpiece position control unit 5 includes an XY table 20, a motor 21,
3, the configuration of the encoders 22 and 24, the XY table surface 26, and the table control device 29.

Next, the operation of the laser beam scanning correction unit of the laser processing apparatus according to the first embodiment will be described. The laser beam scanning unit 2 controls the rotation angles of the scanners 34 and 36 and
The laser beam 30 functions to scan and position the laser beam 30 on the Y table surface 26. However, usually, an optical error occurs due to a mounting error or a non-linear characteristic of an optical element such as a scanner, a mirror, or a lens (hereinafter, referred to as a laser beam). This causes a laser beam 30 irradiation position error. In order to correct this laser light scanning error, the laser light scanning correction section 14 outputs a second correction position command to remove the optical element error. The correction operation of the laser light scanning correction unit 14 includes a position command Xsc, Ysc input to the laser light scanning unit 2 and a laser processing mark 27 on the workpiece 25 when the laser light 30 is irradiated with the position command. The correction amount is obtained from the correspondence between the positions Xw and Yw. The correspondence relationship between Xsc and Ysc and Xw and Yw is represented by a correspondence data table or a coordinate conversion formula, and the correction amount is calculated based on these. The position of the processing mark 27 is measured by the characteristic position measuring unit 4.

Next, the first and second workpiece correction units 1
The correction operations 3 and 18 will be described. Even if the laser beam scanning unit 2 controls the laser beam 30 as instructed and the laser beam 30 is accurately irradiated on the XY table surface 26,
If the Y-table surface 26 is not accurately attached to the installation position, a processing error occurs. Therefore, the first workpiece correction unit 13 converts the position command input from the laser beam position command unit 12 according to the mounting error of the workpiece 25 in order to correct the mounting error of the workpiece 25. And correct. To perform the coordinate conversion, the positions of a plurality of reference points 28 set in advance on the workpiece 25 are measured by the characteristic position measuring unit 4. The measured position of the reference point 28 is Xm, Ym, and the position of the reference point 28 when the workpiece 25 is accurately mounted on the XY table surface 26 is Xm.
Assuming that b and Yb, these relations can be expressed using the following coordinate conversion formula. Xm = Pw1 · Xb + Pw2 · Yb + Pw3 (1) Ym = Pw4 · Xb + Pw5 · Yb + Pw6 (2) where Pw1, Pw2, Pw3, Pw4, Pw5, and Pw6 are parameters. The parameters are obtained by providing three or more reference points 28 on the workpiece 25 and measuring them by the feature point position measurement unit 4. Therefore, the coordinate conversion of the first workpiece correction unit 13 performs the following calculation using Expressions 1 and 2. The position command input from the laser beam position command unit 12 is Xsr, Ys
Assuming that r and outputs are Xsr1 and Ysr1, Xsr1 = Pw1 · Xsr + Pw2 · Ysr + Pw3 (3) Ysr1 = Pw4 · Xsr + Pw5 · Ysr + Pw6 (4)

The second workpiece correction unit 18 similarly converts the position command output from the workpiece position command unit 17 to correct the mounting error of the workpiece 25 by performing a third conversion. Create a corrected position command. The correction formula of the second workpiece correction unit 18 is as follows: the position command output from the workpiece position command unit 17 is Xtr, Ytr, and the coordinate-transformed third corrected position command is Xtr1, Ytr. Assuming tr1, the following calculation is performed. Xtr1 = Pw1 · Xtr + Pw2 · Ytr + Pw3 (5) Ytr1 = Pw4 · Xtr + Pw5 · Ytr + Pw6 (6)

A description will now be given of the correction when the first and second workpiece correction units 13 and 18 are simultaneously operated. Now, the workpiece position control unit 5 and the laser beam scanning unit 2
In comparison, the workpiece position control unit 5 has a long stroke, and the laser beam scanning unit 2 has a short stroke, but can control laser light at high speed. Therefore, if a coordinate conversion formula including an offset is used for the workpiece position control unit 5 having a long stroke, the offset of the laser beam scanning unit becomes 0, and advantageous processing can be performed. The coordinate transformation formula of the second workpiece correction unit is expressed by Formulas 7 and 8, Xtr1 = Pw1 · Xtr + Pw2 · Ytr + Pw3 (7) Ytr1 = Pw4 · Xtr + Pw5 · Ytr + Pw6 (8) However, from the equations 3, 4, 5, and 6, the coordinate conversion formula of the second workpiece correction unit is as follows: Xsr1 = Pw1 (Xsr-Xtr) + Pw2 (Ysr-Ytr) (9) Ysr1 = Pw4 (Xsr−Xtr) + Pw5 (Ysr−Ytr) (10) Note that the parameters Pw1, Pw in equations 7, 8, 9, and 10
w2, Pw3, Pw4, Pw5, and Pw6 have three or more reference points 28 on the workpiece 25 in FIG. 2, and can be obtained by measuring the positions of the reference points 28 by the feature position measuring unit 4. it can. Note that the coordinate conversion formulas of Expressions 1 to 10 are methods using six parameters Pw1, Pw2, Pw3, Pw4, Pw5, and Pw6, but Pw4 when the mounting error of the workpiece is an offset and a rotational displacement. = −Pw2, Pw5 = Pw1, and two or more reference points of the workpiece 25 are required.

The operation of the system control unit 10 shown in FIG. 1 will be described with reference to FIG. FIG. 3 is a flowchart showing the operation of the system control unit according to Embodiment 1 of the present invention. In step S1, the measurement information of the characteristic position measurement unit 4 and the position information of the workpiece position control unit 5 are input, and the position of the reference point 28 is calculated. In step S2, the parameters of the first workpiece correction unit 13 and the second workpiece correction unit 18 are calculated from the position measurement values of the reference point 28. Step S3
Then, the processing program is read, and the position command of the laser beam scanning unit 2 and the position command of the workpiece position control unit 5 are obtained.
In step S4, the first and second workpiece correction units 13 and 18 perform correction calculations based on the position commands , and calculate the first and third corrected position commands.
In step S5, the first correction position command is corrected by a laser beam scanning correction unit, and the second correction position command is calculated. In step S6, the second correction position command is output to the laser beam scanning unit 2, and the third correction position command is output to the workpiece position control unit 5. Step S7
Then, the laser oscillation command is output to the laser oscillator section as a laser oscillation trigger signal , and the command position of the workpiece 25 is processed. As described above, the first and second workpiece correction units 13,
18 and the laser light scanning correction section 14, good laser processing can be realized even if there is an attachment error in the workpiece.

Embodiment 2 FIG. 4 is a block diagram of a system control unit according to Embodiment 2 of the present invention. In the figure, 1 to 18 are the first embodiment.
Is the same as that shown in FIG. Reference numeral 60 denotes a system control unit that controls the overall laser processing apparatus, 61 denotes a main control unit that decodes a program, performs processing according to the program, and outputs a command value, and 62 denotes measurement information obtained from the characteristic position measurement unit 4. It is a measurement error correction unit for correcting. The system control unit 60 differs from the system control unit 10 in FIG. 1 in that a measurement error correction unit 62 is provided and the main control unit 61
Is partially different from the processing content of the main control unit 11 in FIG. The main control unit 61 is the main control unit 1
The difference from 1 is that processing for creating correction data to be input to the measurement error correction unit 62 is performed. FIG. 5 is a diagram illustrating a case where the TV camera according to Embodiment 2 of the present invention has an attachment error. More specifically, FIG. 5 illustrates a case where the TV camera 40 of FIG. Is shown. In the figure, reference numeral 70 denotes a measurement area of the characteristic position measurement unit 4 when the television camera 40 is correctly attached, and 71 denotes a measurement area when the television camera 40 has an attachment error. FIG. 6 is a flowchart illustrating an operation of the measurement error correction unit of the system control unit according to the second embodiment of the present invention to obtain a measurement correction parameter.

Next, the operation will be described. As shown in FIG. 5, when the measurement area is 70 and the television camera 40 is correctly attached, if the television camera 40 has an attachment error, the measurement area becomes 71 and the feature position measurement unit 4 Generates measurement error. To correct this measurement error, coordinate conversion from the measurement area 71 to the measurement area 70 may be performed. For example, when the TV camera 40 is correctly mounted, the output of the feature position measuring unit 4 is Xv1, Yv1.
Assuming that the output of the feature position measuring unit 4 when there is an attachment error in the television camera 40 is Xv, Yv, the output is related by, for example, the following coordinate conversion formula. Xv1 = Pv1 · Xv + Pv1 · Yv + Pv3 (11) Yv1 = Pv4 · Xv + Pv5 · Yv + Pv6 (12) Here, Pv1, Pv2, Pv3, Pv4, Pv5, and Pv6 are parameters for measurement correction. . Equations 11 and 12 are calculated in the measurement error correction unit, and the measurement information of the characteristic position measurement unit 4 is corrected. The measurement error correction parameter is a characteristic position measurement unit 4
Is used to measure three or more known positions on the XY table coordinates. In the second embodiment, the known position uses a calibration laser machining mark created on the workpiece 25 installed on the XY table.

The operation for obtaining the measurement correction parameters will be described with reference to FIG. In S10, the scanners 12 and 14 of the laser beam scanning unit 2 in FIG. 2 are positioned so that the laser beam 30 is projected onto the center position of the laser beam scanning area 42, and the workpiece 25 is irradiated with the laser beam 30. Then, the processing marks for calibration are created. The reason why the center position is used is that the influence of lens distortion of the lens 38 is smallest and the shape of the laser processing trace is closest to the point shape, and the measurement accuracy of the characteristic position measuring unit 4 is increased. In S <b> 11, the workpiece position control unit 5 is moved, the calibration laser processing trace is moved into the visual field of the television camera 40, and three different positions in the visual field are measured by the characteristic position measuring unit 4. S1
2, a measurement error correction parameter used by the measurement error correction unit 62 based on the position measurement information of three points in the field of view of the feature position measurement unit 4 and the position information of the three points when the television camera is correctly mounted. Is used for the correction calculation of the measurement error correction unit 62. As described above, the calibration error of the feature position measurement unit is calibrated using the laser processing trace, so that it is not necessary to create a new calibration mark, and high-precision measurement can be performed. High accuracy can be realized.

When a plurality of calibration laser processing marks are formed at the center position of the laser beam scanning area 42, it goes without saying that the measurement correction parameters of the measurement error correction section 62 can be obtained even faster.

Embodiment 3 FIG. FIG. 7 is a diagram for explaining a laser processing apparatus for a laser beam scanning unit according to Embodiment 3 of the present invention. In the figure, reference numerals 1 to 18 are the same as the configuration of FIG. 1 showing the first embodiment. Reference numeral 80 denotes a system control unit that controls the entire laser processing apparatus; 81, a main control unit that decodes a program, performs processing according to the program, and outputs a command value;
Is a data table describing the relationship between the moving distance of the laser beam scanning unit 2 and the stationary time, 83 is a laser beam scanning stationary unit that determines whether the laser beam scanning unit 2 is stationary, and 84 is a laser beam scanning stationary unit. A timer 85 of the judgment unit 83, a laser oscillation end judgment unit for judging whether or not the oscillation of the laser light of the laser oscillation unit 3 has ended, and 86 a timer of the laser oscillation end judgment unit 85. The system control unit 80 differs from the system control unit 10 of FIG.
1 and the main control unit 11 of FIG.
1 has been changed. The main control unit 81 is shown in FIG.
In addition to the processing contents of the main control unit, the output of the position command and the output of the laser oscillation command are performed using the judgment results of the laser beam scanning stillness judgment unit 83 and the laser oscillation end judgment unit 85. FIG. 8 is a diagram showing a state of a time response to a position command of the laser beam scanning unit according to Embodiment 3 of the present invention. FIG.
(A) is the case of D1 where the moving distance is short, and the quiescent time at this time is Ts1. FIG. 8B shows the case of D2 where the moving distance is long, and the rest time at this time is Ts2. FIG. 9 is a diagram for explaining data according to Embodiment 3 of the present invention, in which the rest time for each moving distance is measured in advance. This data is measured by the stationary time when the moving speed of the laser beam scanning unit 2 is moved at the maximum speed of the scanners 34 and 36. FIG. 10 is a diagram illustrating a time response of a laser output according to the third embodiment of the present invention, and illustrates a case where a laser oscillation command is input to laser oscillation unit 3.
Note that the laser light oscillation time is Tb. FIG. 11 is a flowchart showing the operation of the laser processing apparatus according to Embodiment 3 of the present invention.

Next, the operation will be described. When drilling a printed wiring board or the like, laser processing is performed by positioning the laser beam scanning unit 2 at a large number of randomly arranged hole positions. In such laser processing, if laser processing is not performed in a state where the laser beam scanning unit 2 is stationary, there arises a problem that the processing accuracy of irradiating the laser light to the command position is deteriorated. Further, if the laser beam scanning unit 2 is moved while the laser oscillation unit 3 is irradiating the laser beam, the laser processing accuracy similarly deteriorates. Therefore, the laser processing apparatus according to the third embodiment employs a configuration using a laser beam scanning stillness determination unit 83 and a laser beam oscillation end determination unit 85 as shown in FIG. 7 in order to realize highly accurate processing. The rest time of the laser beam scanning unit 2 in FIG. 8 is the sum of the time when the laser beam scanning unit 2 reaches the command position and the settling time of the vibration after reaching the target position. The laser beam scanning stillness determination unit 83 estimates the stillness time based on the moving distance of the command position. Since the relationship between the moving distance and the stationary time is measured in advance and has a data table as shown in FIG. 9, the estimation can be easily obtained by a table lookup method. Further, since the laser beam scanning stillness determination section 83 has the timer 84, it can determine whether or not the laser scanning section has stopped. The determination result is output to the main processing unit 81. Further, the laser light oscillation end determination unit 85 also measures the laser oscillation time for each processing condition (laser peak output, laser pulse width, etc.) because the laser oscillation time in FIG. As a data table. However, in the third embodiment, the laser oscillation time has one value of Tb because the processing conditions of the laser oscillation section are not changed.

The operation of the present laser processing apparatus when a plurality of holes are drilled will be described with reference to the flowchart of FIG. Steps S1 and S2 perform the same processing as in FIG. 3 of the first embodiment. In step S20, the position command of the work position control unit 17 is read from the processing program and stored in the work position command unit 17. In step S21, the second work correction unit 18 performs correction calculation. Step S
At 22, a third correction position command is output to the workpiece position control unit 5 to perform a positioning operation of the workpiece position control unit. In step S23, the laser beam scanning unit 2 is
Is read out and stored in the laser beam position command section 12. In step S24, processing for obtaining the time from the position command is performed. The laser light scanning stillness determination unit performs the following processing to obtain the laser light scanning stillness time. The position commands are Xc and Yc, and the laser beam position command
Assuming that the position commands stored in 2 are Xcd and Ycd, the moving distance Dc is obtained by the following calculation. Dx = | Xc-Xcd | (13) Dy = | Yc-Ycd | (14) As the moving distance Dc to be obtained, the larger of the values of Dx and Dy is selected.

Next, using the Dc and the data table 82, a laser beam scanning stationary time is obtained by a linear interpolation formula. For example, if Dc is in the data table of FIG. 9 and D1 <Dc <D2, the laser beam scanning stationary time Ts to be obtained can be obtained by the following equation. Ts = Dc · (Ts2−Ts1) / (D2−D1) (15) In step S25, a correction calculation of the first workpiece correction unit 18 is performed from the position command of the laser position command unit 17, and the first correction position is calculated. Ask for a command. Further, a correction calculation of the laser beam scanning correction unit 14 is performed from the first correction position command to obtain a second correction position command. In step S26, the second correction position command is output to the laser beam scanning unit 2. Here, the position control of the laser beam scanning unit 2 is started in accordance with the second correction position command. In step S27, the timer 84 of the laser beam scanning stillness determination unit 83 is started to start time measurement. Step S28 is a process for determining whether the laser light scanning unit 2 is stationary. If the time measurement value of the timer 84 is smaller than the light scanning stationary time Ts, it is determined that the laser light scanning unit is not stationary, and the value is increased to N. If it is determined that the standstill has been completed, the flow branches to Y. In step S29, a trigger signal as a laser oscillation command is output from the laser oscillation command section 15 to the laser oscillation section 3. In step 30, the trigger signal is input, the timer 86 of the laser oscillation end determination unit 85 is started, and time measurement is started. In step S31, in the process of determining the oscillation end of the laser oscillation unit 3, if the time measurement value of the timer 86 is smaller than the laser light oscillation time Tb, it is determined that the laser oscillation has not ended and N
If it is larger, it is determined that the laser oscillation has ended, and the flow branches to Y. In S32, it is determined whether or not the processing has been completed. If the machining is not completed, the process branches to Y and returns to the process of step S22 to perform the next hole machining. If the processing is completed, the processing ends.
Since the laser beam is oscillated in the state where the laser beam scanning section 2 is reliably stopped by operating as described above, laser processing with a small processing error can be realized. Further, since the laser beam scanning unit moves after the laser oscillation of the laser oscillation unit is reliably stopped, laser processing with less processing error can be realized.

[0027]

Since the present invention is configured as described above, it has the following effects.

Since a first workpiece correction unit for correcting a position error of the workpiece and a laser beam scanning correction unit are provided,
High-precision laser processing can be performed even when the mounting error of the workpiece is large.

Further, a second method for correcting a position error of the workpiece is provided.
Since the workpiece correction section is provided, high-precision laser processing can be performed even when a mounting error of the workpiece is large.

Further, the first workpiece correction unit performs the correction using the result of measuring the characteristic position of the workpiece by the characteristic position measuring unit. Therefore, even if the mounting error of the workpiece is large, high accuracy is achieved. Laser processing.

Further, the second workpiece correction unit performs the correction using the result of measuring the characteristic position of the workpiece by the characteristic position measuring unit, so that even if the mounting error of the workpiece is large, high accuracy is achieved. such laser processing Ru can.

[0032] Also, since the output of the laser oscillation command based on the output of the laser beam scanning stillness determining unit, without the laser beam scanning unit is a laser processing while moving, it is highly accurate laser processing.

Further, information on the moving distance of the laser beam scanning unit;
Since the laser oscillation command is output using the data indicating the relationship between the moving distance of the laser beam scanning unit and the stationary time and the result of the determination of the stationary state of the laser beam scanning unit using the timer, the laser beam scanning unit outputs High-precision laser processing can be performed without laser processing during movement.

A laser light oscillation end determining unit for judging that the laser oscillation unit has finished irradiating the laser light;
Since the position command of the laser scanning unit is output based on this output, laser beam scanning does not move during laser oscillation, and high-precision laser processing can be performed.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a laser processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a laser machine control unit according to the first embodiment of the present invention.

FIG. 3 is a flowchart illustrating an operation of a system control unit according to the first embodiment of the present invention.

FIG. 4 is a block diagram of a system control unit according to Embodiment 2 of the present invention.

FIG. 5 is a diagram showing a case where the television camera according to Embodiment 2 of the present invention has an attachment error.

FIG. 6 is a flowchart illustrating an operation of a measurement error correction unit of a system control unit according to a second embodiment of the present invention to obtain a measurement correction parameter.

FIG. 7 is a diagram for explaining a laser processing apparatus for a laser beam scanning unit according to Embodiment 3 of the present invention.

FIG. 8 is a diagram showing a state of a time response to a position command of a laser beam scanning unit according to a third embodiment of the present invention.

FIG. 9 is a diagram for explaining data according to Embodiment 3 of the present invention.

FIG. 10 is a diagram showing a time response of a laser output according to a third embodiment of the present invention.

FIG. 11 is a flowchart illustrating an operation of the laser processing apparatus according to the third embodiment of the present invention.

[Explanation of symbols]

2 laser beam scanning section, 3 laser oscillation section, 4 characteristic position measuring section, 5 workpiece position control section, 12 laser beam position command section, 13 first workpiece correction section, 14 laser beam scanning correction section, 17 Workpiece position command section, 18 Second work piece correction section, 27 Laser processing mark, 62 Measurement error correction section, 83 Laser beam scanning stationary judgment section, 82 Data table, 84 Timer, 85 Laser beam oscillation end judgment section , 86 timer.

Continuation of front page (56) References JP-A-6-79479 (JP, A) JP-A-3-35892 (JP, A) JP-A-60-82288 (JP, A) JP-A-5-309482 (JP) JP-A-7-112288 (JP, A) JP-A-7-236989 (JP, A) JP-A-4-43486 (JP, U) JP-A-63-180961 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) B23K 26/08 B23K 26/00 B23K 26/04

Claims (7)

(57) [Claims] 1. A laser processing apparatus for processing a workpiece by using a laser beam, wherein a laser oscillating section for irradiating the workpiece with the laser beam and a trajectory of the laser beam irradiated by the laser oscillating section are changed. A laser beam scanning unit that scans the irradiation position of the laser beam, a laser beam position command unit that generates a position command for the laser beam scanning unit, and inputs the position command to correct a position error of the workpiece. A first workpiece correction unit that outputs a first correction position command, and the first correction position command are input, and a position error of the laser beam scanning unit is corrected based on the first correction position command. A laser processing apparatus which outputs a second correction position command to a laser beam scanning unit, and scans the laser beam irradiation position by inputting the second correction position command to the laser beam scanning unit. 2. A workpiece position control section for controlling an irradiation position of a laser beam emitted from a laser oscillation section on the workpiece by changing a position of the workpiece, and a workpiece position control section. A workpiece position command section for generating a position command, and a second command for inputting a position command from the workpiece position command section and outputting a third corrected position command for correcting a position error of the workpiece. 2. The laser processing apparatus according to claim 1, wherein a workpiece correction unit and the third correction position command are input to the workpiece position control unit to control an irradiation position on the workpiece. 3. A feature position measuring section for measuring and outputting a feature position of the workpiece, wherein an output of the feature position measuring section is input to the first workpiece correcting section to perform the first correction. 2. The laser processing apparatus according to claim 1, wherein a position command is output. 4. A feature position measuring unit for measuring and outputting a feature position of a workpiece, and inputting an output of the feature position measuring unit to the second workpiece correcting unit to perform the third correction. 3. The laser processing apparatus according to claim 2, wherein the apparatus outputs a position command. 5. The method according to claim 1, wherein the scanning of the laser beam scanning unit is stopped.
A laser light scanning stillness determining unit for determining
The laser oscillation unit is controlled based on the output of the scanning stillness determination unit.
2. The method according to claim 1, wherein the control unit controls a user oscillation command.
Laser processing equipment. 6. The laser light scanning stillness determining section,
Moving distance information of the light scanning unit and movement of the laser light scanning unit
Data indicating the relationship between the distance and the stationary time;
Output a judgment result using a timer that measures
The laser processing apparatus according to claim 5, wherein: 7. The laser oscillating unit finishes emitting laser light.
Comprising a laser light oscillation end determination unit for determining that
The laser light based on the output of the laser light oscillation end determination unit
Controlling a position command of the position command unit.
Item 2. A laser processing apparatus according to Item 1.