KR20160038712A - Laser processing machine and calibration method for laser processing machine according to distortion of workpiece - Google Patents

Laser processing machine and calibration method for laser processing machine according to distortion of workpiece Download PDF

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KR20160038712A
KR20160038712A KR1020150085221A KR20150085221A KR20160038712A KR 20160038712 A KR20160038712 A KR 20160038712A KR 1020150085221 A KR1020150085221 A KR 1020150085221A KR 20150085221 A KR20150085221 A KR 20150085221A KR 20160038712 A KR20160038712 A KR 20160038712A
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error
workpiece
laser
laser beam
alignment mark
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KR1020150085221A
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KR101698269B1 (en
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마사미 스즈키
준이치 마츠모토
유키 노리타
마사하루 가미야
사토시 도쿠오카
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가부시키가이샤 가타오카 세이사쿠쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Numerical Control (AREA)

Abstract

The present invention relates to a laser processing machine which improves accuracy of laser processing. The laser processing machine comprises: a support body supporting an object to be processed; a laser beam radiating device radiating a laser beam toward the object to be processed, which is supported on the support body; and a control unit. The control unit detects a point of a plurality of alignment marks applied to the object to be processed by referring to an image in which the object supported on the support body is photographed by a camera sensor and obtains an error of a position of each alignment mark detected in real, and a position in which each alignment mark should initially be located. After the control unit calculates the error of a virtual position on the position between the alignment mark and an other alignment mark using the error of the position of each alignment mark, the control unit determines a correction rate of a command which should be applied to a laser radiating device to radiate the laser beam to a desired radiation position on the object in laser processing based on the error of the positions of the alignment marks.

Description

TECHNICAL FIELD [0001] The present invention relates to a laser machining apparatus, a laser machining apparatus, a laser machining apparatus,

TECHNICAL FIELD The present invention relates to a laser processing machine and a method of using a laser processing machine for irradiating a laser light to an arbitrary point of a work (work).

Today, a touch panel device is widely used as an input device. The touch panel device is mounted on a device in which a display device such as a liquid crystal display or an organic EL display is assembled, and becomes an intuitive input means for the device.

The touch panel device includes a touch panel sensor, a control circuit for obtaining a contact position on the touch panel sensor, wiring, and a flexible printed circuit board. The area overlapping the image display area of the display device in the touch panel sensor becomes transparent and an active area capable of detecting the contact position of the object in the area is constituted.

A touch panel sensor of a projection type capacitive coupling type has a dielectric body and first and second sensor electrodes formed on both sides of the dielectric body in different patterns. The first sensor electrode and the second sensor electrode are electrically connected to each other through an extraction wiring (extraction electric conductor) laid out in an area outside the active area of the base material supporting these sensor electrodes, Circuit.

A transparent conductive material is used for the first sensor electrode and the second sensor electrode to be attached to the active area, but the extraction wiring provided in the non-active area is not necessarily transparent. Conventionally, a wiring pattern made of a conductive material such as a metal having high conductivity is screen-printed on a substrate (see Patent Document 1).

Recently, a so-called " frame edge "area (bezel) surrounding the periphery of the image display area has been narrowed down for the purpose of further enlarging the image display area of the display device and / . In realizing the narrowing of the frame area, it is necessary to make the non-active area in the touch panel sensor small.

When the lead wiring provided in the non-active area is sufficiently high-precision, it is possible to reduce the non-active area and the frame area. However, in the current screen printing method, it is difficult to form a high-precision wiring pattern.

On the other hand, when a laser processing method in which a conductive layer made of a conductive material is formed on the surface of a substrate and then a conductive pattern is formed by irradiating the conductive layer with a laser beam to form a wiring pattern, High-precision lead-out wiring can be realized.

In the case of laser processing, a laser processing machine capable of irradiating a laser beam to an arbitrary point of the workpiece is used. An example of this type of laser processing machine is a combination of a galvano scanner and a condenser lens capable of changing the direction of the laser optical axis.

In the scanning for displacing the optical axis of the laser beam, an error occurs in the plane coordinate system due to the rotational positioning error of the mirror of the galvanometer scanner or the optical distortion of the condensing lens. When performing laser processing, it is necessary to remove this error in advance.

Previously, a test pattern was laser-machined on a test piece and observed with a microscope to measure an error between an ideal pattern and an actually formed pattern, and a correction amount for reducing the error was set as a command value for the galvanometer scanner (Calibration) of the irradiation position of the laser beam. Calibration using such a test piece is troublesome and takes a very long time due to manual operation.

In recent years, a high-resolution detection sensor (CCD, CMOS, or the like) which is irradiated with laser light and detects the irradiation position thereof is attached to the processing machine, and an error between the target irradiation position of the laser light and the actual irradiation position So that the calibration is automatically performed (see the following Patent Document 2).

Patent Document 1: JP-A-2013-033558 Patent Document 2: Japanese Patent No. 5519123

When a workpiece to be subjected to laser processing is a large film (for example, a PET film) or a thin plate, a part thereof may elongate or contract to cause distortion. In many cases, an outline (conductive layer) of an interconnection pattern or an alignment mark for alignment is often provided on the surface of a workpiece before processing. Heat is applied to the workpiece in a drying step after printing of the pattern, One of the causes is that the workpiece is distorted.

Conventionally, referring to the alignment marks on the surface of the workpiece, the position deviation along the horizontal direction with respect to the laser processing machine of the workpiece, that is, the deviation in the X and Y axis directions and the amount of rotation around the Z axis, And the target irradiation position of the laser beam is corrected (alignment). However, it is not carried out to cope with distortion due to local elongation or contraction of the workpiece, and it can be said that there is room for improvement in the precision of the irradiation position of the laser beam and in the precision of the laser machining.

It is an object of the present invention to realize an additional improvement in machining accuracy by a laser processing machine.

According to the present invention, there is provided an image forming apparatus comprising a support for supporting a workpiece, a laser beam irradiating device for irradiating the workpiece supported by the support for laser light, and an image picked up by the camera sensor The position of at least 10 alignment marks assigned to the workpiece and distributed in the range in which the laser beam can be irradiated by the laser beam irradiating device is detected and the position where each alignment mark should be originally detected and the position of each of the actually detected alignment marks Axis direction error and the Y-axis direction error of the position of each alignment mark in the X-axis direction and the Y-axis direction error of the position of each alignment mark, An approximate expression of the error in the X-axis direction expressing the distribution of the error and the Y-axis direction error and an approximate expression of the error in the Y- And a correction amount of a command for irradiating a laser beam to a desired target irradiation position on the workpiece during laser machining by using an X axis direction error and an Y axis direction error of an arbitrary point calculated by the approximation formula, And a control section for determining the laser beam intensity.

Further, in the present invention, a laser light irradiating device for irradiating a laser beam toward a workpiece supported by the support, a workpiece supported by the support, and an image picked up by a camera sensor Thereby obtaining an error between the original position of each of the alignment marks and the position of each of the actually detected alignment marks and correcting the error of the position of each of the alignment marks Is used to calculate an error of a virtual position at a position between any alignment mark and another alignment mark and thereafter the position of the irradiation position where the irradiation position without the correction amount is instructed to the laser light irradiation device The error of the actual irradiation position of the laser beam, Based on an error obtained by adding an error of the position of the alignment mark at a position corresponding to the irradiation position, determines a correction amount of a command for irradiating the laser light to a desired target irradiation position on the workpiece during laser machining And a laser processing unit.

The laser beam irradiating apparatus is made using, for example, a galvanometer scanner capable of changing the direction of the optical axis of the laser beam.

According to another aspect of the present invention, there is provided a method for correcting a workpiece distortion of a laser machining apparatus, the method comprising: a support for supporting a workpiece; a laser beam irradiating device for irradiating a laser beam toward a workpiece supported by the support; A correction amount of a command for irradiating a laser beam to a desired target irradiation position on the workpiece at the time of laser processing based on an error between the command irradiation position and the actual irradiation position of the laser light when the irradiation position without the irradiation is instructed And a controller for determining a position of the workpiece supported by the support member, wherein the method comprises the steps of capturing an image of a workpiece supported by the support by a camera sensor, referring to an image picked up by the camera sensor, The position of the mark is detected, and the position of each alignment mark An error of a position of each alignment mark actually detected with the alignment mark is obtained and an error of a virtual position at a position between any alignment mark and another alignment mark is calculated using the error of the position of each alignment mark , The control section is caused to determine whether or not the irradiation position of the reference position on the member to be irradiated with the laser light is irradiated to the error between the reference irradiation position and the actual irradiation position of the laser light, And the correction amount is determined by adding an error obtained by adding the error of the position of the alignment mark at the corresponding point.

According to the present invention, further improvement in accuracy of laser machining by the laser processing machine can be realized.

1 is a perspective view showing an outline of a laser machining apparatus according to an embodiment of the present invention.
Fig. 2 is a perspective view showing a configuration of a laser light irradiation device in the laser machining apparatus. Fig.
Fig. 3 is a plan view schematically showing an error of an irradiation position of a laser beam, which is a characteristic of the laser irradiation apparatus itself of the laser processing machine.
4 is a diagram showing a hardware resource configuration of the laser machining apparatus.
5 is a functional block diagram of the laser machining apparatus.
6 is a view showing an example of an alignment mark applied to a workpiece.
7 is an enlarged view of the main part of Fig.
Fig. 8 is a flow chart showing a procedure of a process performed by the laser machining apparatus at the time of calibration. Fig.
Fig. 9 is a flow chart showing a procedure of processing performed by the laser machining apparatus at the time of alignment.
Fig. 10 is a flow chart showing a procedure of processing performed by the laser machining apparatus during laser machining. Fig.

BEST MODE FOR CARRYING OUT THE INVENTION One embodiment of the present invention will be described with reference to the drawings. As shown in Fig. 1, the laser machining apparatus 0 according to the present embodiment includes a support chain 4 for supporting a workpiece, a laser beam L for irradiating a laser beam L toward a workpiece provided on the mount 4, It is possible to carry out the laser processing at an arbitrary point of the workpiece by providing the irradiation device 1. [

In the present embodiment, a very long article such as a film wound on a roll, or a large article is assumed as a workpiece. Then, for example, the workpiece is unwound from one of the rolls, and the workpiece is wound on the other roll, and laser processing is performed over a wide range of the workpiece. To this end, in the laser machining apparatus (0) of the present embodiment, the laser beam irradiating apparatus 1 is movable forward, backward, left and right, and the optical axis of the laser beam L emitted from the laser beam irradiating apparatus 1 is reversed Thereby making displacement possible.

The laser light irradiating apparatus 1 is moved approximately parallel to the mounting table 4 by a driving device (or XY stage) The Y-axis rail 31 extends in the fore-and-aft direction. The Y-axis rail 31 extends in the left-right direction while being guided by the Y-axis rail 31. The X- Axis unit 32 provided with an X-axis rail 321 and a truck 322 guided by the X-axis rail 321 and traveling in the left-right direction. The X-axis unit 32 and the truck 322 together are a linear motor carriage using the linear servo mover as a driving source. The laser beam irradiating device 1 is supported by the above-mentioned carriage 322.

In the drive unit 3, a linear scale (not shown) is additionally provided. The X-axis linear scale is a position detection mechanism for detecting the position in the left-right direction, i.e., the X-axis direction, of the laser light irradiating apparatus 1. The Y-axis linear scale is a position detection mechanism for detecting the position in the X- As shown in Fig. The X-axis linear scale includes, for example, a magnetic sensor head provided on the carriage 322 and a magnetic ribbon scale having magnetic grid lines provided on the X-axis unit 32 as scales. Then, by reading the scale of the ribbon scale with the magnetic sensor head, the position of the carriage 322 and further the X-axis direction of the laser irradiation apparatus 1 is detected and a signal indicating the position coordinate is output. Likewise, the Y-axis linear scale also has a magnetic sensor head provided in the X-axis unit 32 and a magnetic ribbon scale provided along the Y-axis rail 31 as elements, and the X-axis unit 32, Detects the position of the device 1 in the Y-axis direction, and outputs a signal indicating the position coordinates thereof.

In other words, the driving unit 3 can position the laser irradiation device 1 at an arbitrary XY coordinate.

2, the laser irradiation apparatus 1 includes a laser oscillator (not shown) as a source of the laser beam L, galvanometer scanners 11 and 12 for scanning the laser beam L emitted from the laser oscillator And a condenser lens 13 for condensing the laser light L.

The galvano scanners 11 and 12 rotate the mirrors 112 and 122 that reflect the laser light L by a servomotor, stepper motor 111 or 121 or the like to change the optical axis of the light L have. In the present embodiment, an X-axis galvanometer scanner 11 for changing the optical axis of the light L in the X-axis direction and a Y-axis galvanometer scanner 12 for changing the optical axis of the light L in the Y- The irradiation position of the light L can be controlled in the XY two-dimensional direction. The condenser lens 13 is, for example, an F? Lens.

The irradiating position of the laser beam L emitted from the laser beam irradiating apparatus 1 is influenced by the rotation position determining error of the motors 111 and 112 of the galvanometer scanners 11 and 12. [ In addition, optical distortion by the condenser lens 13 also occurs. The error of the irradiation position of the laser light L by these factors, that is, the error that the laser light irradiating apparatus 1 itself has as a characteristic increases as the distance from the center of the scanning range of the galvanometer scanner 11, 12 increases There is a tendency. Figs. 2 and 3 schematically show the state of the error A. Fig. In Fig. 3, the outline B drawn by the dashed line is the irradiation position and irradiation range of the ideal laser light L. On the other hand, the outline A deformed into a barrel type drawn in a chain line is obtained by simply calculating the XY coordinate (x, y) of the target irradiation position (without adding the correction amount for correcting the error) to the galvanometer scanner 11, and 12, the irradiation position and irradiation range of the laser light L are shown.

In order to perform processing using the laser machining apparatus 0, calibration for correcting the above-described error in the irradiation position needs to be performed first. The irradiation position is calibrated by irradiating the beam detection sensor 2 with the laser light L. [

In the present embodiment, a long or large workpiece is assumed as a workpiece, and such a workpiece covers almost all of the stand 4. Therefore, in the present embodiment, the beam detecting sensor 2 is disposed on the side of the mounting table 4, which is not covered by the workpiece. The beam detection sensor 2 is a high-resolution detection sensor that detects the irradiation position under the irradiation of the laser light L, and is typically a CCD sensor or a CMOS sensor. The mounting table 4 and the beam detecting sensor 2 do not move during laser processing or during calibration. At the time of calibration, the laser light irradiating apparatus 1 is moved to a position above the beam detecting sensor 2 via the drive unit 3. [

When correcting the error of the irradiation position, which is the characteristic of the laser beam irradiating apparatus 1 itself, the laser beam L (x i , y i ) is aimed at a plurality of points (x i , y i ) of the XY plane coordinate system set on the beam detecting sensor 2 emitted by, as a result, a beam detecting sensor (2) the irradiation position of the laser light L of the detected actual (x i ', y i') with the error (Δx i, Δy i) = (x i -x i 'a, y i -y i '). Here, the suffix i is an identifier specifying and designating one of a plurality of points. Then, on the basis of the errors (? X i ,? Y i ) for each detected point i, the correction amount for each point i necessary for compensating the error is determined. In the correction of this error, the detection of the errors (? X i ,? Y i ) of several hundreds to several thousands of points and the correction amount are determined.

Whether or not the accuracy of laser machining, in other words, whether or not the laser beam L can be accurately irradiated to a desired position on the workpiece is not determined solely by the irradiation accuracy of the laser beam L of the laser beam irradiator 1 itself. An error in positioning relative to the laser machining apparatus 0 when the workpiece is mounted on the mounting table 4 also causes a deterioration in precision of laser machining. That is, as the positional deviation of the workpiece with respect to the laser machining apparatus 0 in the horizontal direction, there are a bend in the X-axis direction and a bend in the Y-axis direction. In addition, the workpiece also rotates about the Z axis, which is a vertical axis orthogonal to the X and Y axes.

Correction of the positioning errors of these members is performed by imaging the alignment marks 91 and 92 provided on the surface of the member to be processed with the camera sensor 14 attached to the laser light irradiation device 1. [

Fig. 6 shows alignment marks 91 and 92 provided on the workpiece 9 and the workpiece 9, respectively. The alignment marks 91 and 92 are provided in the vicinity of the right angle (particularly, diagonal angle) of the workpiece 9 or in the vicinity of each of the cells 9 to which the workpiece 9 is held . When the workpiece 9 is a touch panel device, one cell corresponds to one product. A thin film layer 93 formed by coating a conductive material of a metal or the like (for example, silver paste) having a high conductivity in the shape of a three-sided rim or a four-sided rim is formed on the periphery of each cell . When forming a wiring pattern necessary for the product, the thin film layer 93 is irradiated with the laser light L to remove unnecessary portions, leaving only the portions to be wired. The base material of the workpiece 9 in this case is a film made of resin such as PET or the like and the alignment marks 91 and 92 are previously printed on the resin film. Printing of the alignment marks 91 and 92 and application of the thin film layer 93 may also be performed by the same process by mask printing or screen printing.

In the alignment for absorbing the positioning error of the workpiece with respect to the processing machine in the conventional laser processing machine, the workpiece 9 is grasped by using the camera sensor 14 attached to the laser beam irradiating device 1 The positional coordinates of the alignment marks 91 and 92 in the shot image are detected to pick up the alignment marks 91 and 92 of the work 9 or the work 9, Axis direction and the Y-axis direction, and how much it rotates about the Z-axis. Next, the target irradiating position (x, y) of the laser light L given to the galvano scanners 11, 12 is corrected so as to cancel the amount and / or the amount of rotation of the galvanometer scanner 11, The relative position of the laser light irradiating device 1 to one workpiece has been corrected. Further, the mounting base 4 of the laser machining apparatus 0 of this embodiment does not move, but when the mounting base for supporting the workpiece is movable along the X-axis direction and the Y-axis direction and / By moving and / or rotating the mounting table with respect to the laser beam irradiating device 1, the above-mentioned convenience and / or amount of rotation can be canceled.

In the case of a workpiece such as a resin film, a part of the workpiece may elongate or shrink, causing distortion of the workpiece. Particularly, in the step of printing the alignment marks 91 and 92 on the base material of the resin film or applying the conductive material 93 and drying the base material, heat is applied to the film to cause local stretching or shrinkage There is a possibility. In addition, a tension applied by a roll for winding the film or a roll or the like unwinding the film for conveying contributes to generation of local distortion of the work.

However, in the alignment in the conventional laser processing machine, local distortion such as elongation and contraction of a part of the workpiece is not considered. Therefore, the laser light L can not be irradiated accurately at a desired position of the workpiece, for example, at a proper position to be cut off in the thin film layer 93, and there is room for improvement in the laser machining result.

Thus, in this embodiment, the method of alignment is improved so as to cope with the local distortion of the workpiece in addition to the deviation in the XY direction and the rotation about the Z axis with respect to the laser machining apparatus 0 of the workpiece.

4, the control unit 5 for controlling the drive unit 3 and the galvanometer scanners 11 and 12 in the laser machining apparatus 0 of the present embodiment includes a processor 5a, a main memory 5b, an auxiliary storage device 5c, and an I / O interface 5d, which are controlled by the controller 5e (system controller, I / O controller, etc.) to operate in cooperation. The auxiliary storage device 5c is a flash memory, a hard disk drive, and the like. The I / O interface 5d may include a servo driver (servo controller). The control unit 5 may be constructed using a general-purpose personal computer, a server computer, a workstation, or the like.

The program to be executed by the control unit 5 is stored in the auxiliary storage device 5c and is read into the main memory 5b and deciphered by the processor 5a when the program is executed. 5, the control unit 5 includes an irradiation position command unit 51, an apparatus position command unit 52, a calibration position data storage unit 53, a calibration error acquisition unit 54, , The alignment mark position data storage section 55, the alignment error obtaining section 56, the machining position data storage section 57, and the machining time control section 58.

The irradiation position command section 51 instructs the laser irradiation device 1 to irradiate the laser irradiation light L to the target irradiation position. Specifically, control signals corresponding to the coordinates (x, y) are input to the galvanometer scanners 11 and 12 so as to irradiate the laser light L to the XY coordinates (x, y) indicating the target irradiation position , And the angles of the mirrors 112 and 122 are manipulated.

The apparatus position command section 52 instructs the drive device 3 to move the laser irradiation device 1 to the vicinity of the target irradiation position. Concretely, a control signal corresponding to the XY coordinate is inputted to the driving device 3 so that the laser irradiation device 1 can be positioned at the XY coordinate indicating the moving destination of the laser irradiation device 1, The position of the shaft unit 32 and the carriage 322 is manipulated.

The calibration position data storage unit 53 stores calibration position data using the necessary storage area of the main memory 5b or the auxiliary storage device 5c. As described above, in this embodiment, laser light L is applied to a plurality of points (x i , y i ) in the XY plane coordinate system so that the error of the irradiation position as the characteristic of the laser light irradiation apparatus 1 itself can be corrected And a correction operation for detecting the errors (? X i ,? Y i ) of the irradiation positions for each point i is performed. Since the detection of the normal line, can error of one hundred points to be cheonjeom (Δx i, Δy i), it should not be one hundred points to be stored as the XY coordinate data for the location (x i, y i) of the correction cheonjeom.

The calibration error obtaining section 54 obtains the errors (? X i ,? Y i ) of the irradiation position of the laser light L. That is, the XY coordinate (x i , y i ) of each point i included in the above calibration position data and the actual X-coordinate (x i , y i ) detected through the beam detecting sensor 2 obtains the XY coordinates (x i ', y i' ) with the error (Δx i, Δy i) of the irradiation position. And stores the necessary storage area of the error (Δx i, Δy i) of each point in each i, the target XY coordinates in association with a (x i, y i), a main memory (5b) or a secondary storage device (5c).

8 shows a procedure example of the process executed by the control unit 5 at the time of calibration to calibrate the irradiation position of the laser light L. In Fig. The control unit 5 reads the XY coordinates (x i , y i ) included in the stored calibration position data (step S1), sets the read coordinates (x i , y i ) The galvano scanner 11, 12 is operated to adjust the optical axis of the laser light L (step S2).

Almost simultaneously with step S2, the optical axis of the laser light L toward the target irradiation position coordinate (x i , y i ) through the galvanometer scanners 11 and 12 is converted to the collimating position The position of the laser irradiation device 1 is adjusted by operating the driving device 3 (step S3). More specifically, assuming that the coordinates of the target irradiation position at the time of outputting the laser light L with the vertical irradiation direction of the laser irradiation device 1 as the target irradiation position is (0, 0) When the coordinate of the target irradiation position instructed by the data (and instructed to the galvanometer scanner 11 or 12) is (x i , y i ), the laser irradiation device 1 is moved to the beam detection sensor 2, immediately above, and from convenience as -x i along the X-axis direction and along the Y-axis direction of the aiming position in the move to a position as convenience -y i. As a result, if there is no error in the irradiation position, the laser light L emitted from the laser irradiation device 1 is irradiated to the collimation positions (0, 0) on the beam detection sensor 2. That is, during the calibration operation, the optical axis of the laser light L emitted from the laser light irradiating device 1 is always directed to the collimating position (0, 0) on the beam detecting sensor 2.

Next, the laser light L is actually irradiated from the laser light irradiating device 1 (step S4), and the collimating position on the beam detecting sensor 2 and the position where the beam detecting sensor 2 actually senses the laser light L The X-axis directional error and the Y-axis directional error of the XY coordinate system (step S5). This error is, and the target irradiation position of the laser light L (x i, y i) and the error (Δx i, Δy i) of the actual irradiation position (x i ', y i' ).

Then, the control unit 5 stores the obtained errors (x i , y i ) and the set of the target irradiation positions (x i , y i ) (step S6). The control unit 5 repeats the above-described steps S1 to S7 until an error (? X i ,? Y i ) is obtained for all the target irradiation positions i included in the calibration position data (step S7).

After completion of the calibration or laser processing, the laser light irradiating apparatus 1 is returned to a position above the mounting table 4 on which the workpiece is mounted through the drive unit 3.

The alignment-use position data storage section 55 stores position data for alignment by using a necessary storage area of the main memory 5b or the auxiliary storage device 5c. Position data for alignment refers to XY coordinates (x Mn , y) indicating the position where the plurality of alignment marks 91, 92 should be originally provided, which are previously given to the workpiece to be mounted on the mounting table 4, Mn ). Here, the suffix n is an identifier specifying and specifying one of the plurality of alignment marks 91 and 92 on the workpiece. The coordinates (x Mn , y Mn ) and the number of the elements as the elements of the position data for alignment may vary depending on the kind or individual of the workpiece depending on the type or individual of the workpiece. In addition, each position coordinate (x Mn , y Mn ) is a relative position coordinate with the edge (end edge) of the workpiece or the right angle as a base point.

The alignment error obtaining section 56 analyzes the photographed image obtained by picking up the surface of the workpiece mounted on the mounting table 4 with the camera sensor 14 attached to the laser beam irradiating device 1, A plurality of alignment marks 91 and 92 provided on the surface are detected and the XY coordinates (x Mn ', y Mn ') of the actual positions of the alignment marks 91 and 92 are obtained. And each n, each alignment mark, the actual position (x Mn ', y Mn'), and the art alignment mark error (Δx Mn, Δy Mn) between the original position (x Mn, y Mn) should be in the 91, 92 to obtain a = (x Mn -x Mn ', y Mn -y Mn'). The errors DELTA x Mn and DELTA y Mn are calculated based on the positional deviations of the workpiece placed on the mounting table 4 with respect to the laser machining apparatus 0, that is, the amounts of rotation about the X axis and the Y axis direction and the Z axis, It shows local distortion. If there is no positional deviation with respect to the laser machining apparatus 0 and the workpiece is not locally elongated or contracted, the errors (DELTA x Mn , DELTA y Mn ) with respect to each alignment mark n are all zero will be.

Further, the alignment error obtaining section 56 obtains the position (x i , y i ) of the workpiece at the coordinates (x i , y i ) of the XY plane coordinate system on the basis of the errors Δx Mn and Δy Mn for each alignment mark n (Δx Mi , Δy Mi ) due to the deviation and distortion.

7, the position (x i , y i ) of the calibration point 94 for correcting the error of the irradiation position of the laser light L of the laser light irradiating apparatus 1 itself is virtually a white circle. 7, the XY coordinates (x i , y i ) of the calibration points 94 and the XY coordinates (X i , y i ) of the alignment marks 91, 92 for excluding the influence of the positional deviation and local distortion of the workpiece (x Mn , y Mn ) do not always coincide with each other. Rather than saying that, there are many that do not agree with each other. The number of the alignment marks 91 and 92 assigned to the workpiece is smaller than the number of the calibration points 94 and the density of the alignment marks 91 and 92 is also less than the density of the calibration points 94. [ Therefore, the errors (? X Mi ,? Y Mi ) in the coordinates (x i , y i ) can not be directly obtained from the image of the workpiece picked up by the camera sensor 14.

Therefore, in the present embodiment, at least ten alignment marks 91 and 92, which are distributed in the irradiation range of the laser light L by the laser light irradiating apparatus 1, that is, in the scanning range of the galvano scanners 11 and 12, optionally in from the X-axis direction error of the position Δx Mn and Y-axis direction error Δy Mn, the same scanning range of the XY coordinates (x, y) an approximate expression F 1 (x, y that represents the X-axis direction error Δx M in ) And an approximate expression F 2 (x, y) representing the Y-axis direction error? Y M , respectively.

F 1 (x, y) and F 2 (x, y) which are functions of the XY coordinate (x, y) are calculated from the set of errors (? X Mn ,? Y Mn ) measured for each alignment mark n, (maximum likelihood estimation) and other conventional techniques. For example, function F 1 (x, y) of the estimate, X-axis, Y-axis and the F 1 axis Therefore, in three-dimensional space coordinate system to be expanded, each alignment over the mark n (理想) position (x Mn, y Mn ), the corresponding error Δx Mn and also the sum of the squares of the value F 1 (x Mn, Mn y) is estimated by approximating a curved surface F 1 (as long as according to the least square method, the residual error (Δx殘差of Mn and F 1) that the And determining the coefficient of the function F 1 to be minimum). Likewise, the estimation of the function F 2 (x, y) is performed in the three-dimensional spatial coordinate system extending along the X-axis, the Y-axis and the F 2 -axis in such a manner that an error corresponding to the abnormal position (x Mn , y Mn ) also and Δy Mn value F 2 (x Mn, y Mn) is estimating a curved surface F 2 to approximate (as long as according to the method of least squares, the function coefficients of F 2 the sum of squares of the residual errors Δy Mn and F 2 so as to minimize ). ≪ / RTI > By using the estimated expressions F 1 and F 2 thus estimated, it is possible to estimate the errors (? X Mi ,? Y Mi ) in the coordinates (x i , y i ). That is,? X Mi = F 1 (x i , y i ) and? Y Mi = F 2 (x i , y i ).

Further, the error of the coordinates (x i, y i) error (Δx Mi, Δy Mi) the according to wanted, the coordinates (x i, y i) a plurality of alignment marks (x Mn, y Mn) close to the in (Mi Δx, Δy Mi) X-axis direction does not matter even if the estimated error Δx Δy Mi Mi and the Y-axis direction error by interpolation (補間) of. For example, three alignment marks (x Mn , y Mn ) having the closest distance from the coordinates (x i , y i ) are selected in the XY plane coordinate system. And three alignment marks (91, 92) of the X axis coordinate x Mn and Y-axis coordinate y Mn and art alignment marks (91, 92) which error Δx Mn of, X-axis, Y-axis and Δx M axis thus extended corresponding to When plotted in three-dimensional space, it is possible to assume a plane passing through the three points, it is possible to calculate the error Δx Mi corresponding to the coordinates (x i, y i) of the phase plane. Similarly, therefore the three alignment marks (91, 92) the error Δy Mn corresponding to the X-axis coordinate x Mn and Y-axis coordinate y Mn and art alignment marks 91 and 92, the X-axis, the axis Y-axis and Δy M of It is also possible to calculate the error? Y Mi corresponding to the coordinates (x i , y i ) on this plane by plotting in the expanded three-dimensional space and assuming a plane passing through three points.

And stores the necessary storage area of the error (Δx Mi, Δy Mi) of each point in each i, the target XY coordinates in association with a (x i, y i), a main memory (5b) or a secondary storage device (5c).

Fig. 9 shows a procedure example of the processing executed by the control unit 5 at the time of alignment for measuring positional deviation and local distortion of the workpiece. The control unit 5 captures the workpiece mounted on the mounting table 4 with the camera sensor 14 attached to the laser beam irradiating apparatus 1 (step S8), aligns the respective alignment marks 91 and 92 in the shot image, (X Mn ', y Mn ') is obtained (step S9). For each alignment mark n, the X-axis direction error x Mn and the Y-axis direction error y Mn of the XY coordinate (x Mn ', y Mn ') of the actual position and the XY coordinate (x Mn , y Mn ) (Step S10).

However, from the error (Δx Mn, Δy Mn) corresponding to each alignment position of the mark n (x Mn, y Mn) and which, for each calibration point i XY coordinates (x i, y i) error (Δx Mi in , Δy Mi) to be estimated and storing the set (step S11), the estimated error (Δx Mi, Mi Δy) and the target irradiation position (x i, y i) (step S12). The control unit 5 repeats the above-described steps S11 to S12 until an error (? X Mi ,? Y Mi ) is obtained with respect to all the target irradiation positions i included in the calibration position data (step S13).

The machining position data storage unit 57 stores the position data for laser machining by using the necessary storage area of the main memory 5b or the auxiliary storage device 5c. The machining-use position data storage unit 56 stores, as machining position data, CAD data specifying which spot of the workpiece is irradiated with the laser beam L, or XY coordinates of plural points irradiating the laser beam L at machining .

At the time of machining, the control unit 58 controls the laser beam irradiating apparatus 1 so as to irradiate the laser beam L to the irradiation position specified by the above-mentioned machining position data. Specifically, the position data for machining is read and the XY coordinate (x T , y T ) of the target irradiation position of the laser light L is acquired. And the correction amount required to correct the laser beam L in the art target irradiation position coordinates (x T, y T), on the basis of the error (Δx i, Δy i) and the error (Δx Mi, Δy Mi) of the alignment of the calibration .

When the coordinates (x T , y T ) of the target irradiation position are the same as any coordinates (x i , y i ) among the plurality of calibration points i, the error stored in association with the coordinates (x i , y i ) (Δx i, Δy i) and the error (Δx Mi, Mi Δy) to read out the error acquired by adding a proton (T Δx, Δy T) = a is obtained (Δx + Δx i Mi, i + Δy Δy Mi). The error (Δx T, Δy T), the target irradiation position (x T, y T), the same galvanometer and the location on the workpiece with the laser light L is actually irradiated when given away to the scanner (11, 12), which is originally desired It can be said to be the error of the target irradiation position (x T , y T ).

If the coordinates (x T , y T ) of the target irradiation position are not the same as any coordinates (x i , y i ) among the plurality of calibration points i, the error (Δx i + Δx Mi , Δy i based on the Mi + Δy), and the estimated error (Δx T, Δy T) of the target coordinates (x T, y T). Since the estimate of the method can be the same way to estimate the error (Δx Mi, Δy Mi) at the coordinates (x i, y i) from the error (Δx Mn, Δy Mn) of, for each alignment mark n, Description is omitted here.

In the following, processing when the control unit 58 substitutes the original X coordinate of the target irradiation position x T, Y-axis coordinate y T, X-axis error Δx T and the Y-axis direction error Δy T to a predetermined function expression, The X-axis direction correction amount x A and the Y-axis direction correction amount y A are calculated. By the art correction amount (x A, y A), the laser irradiation device 1 together with the error of the irradiation position of the laser light L of its own, the blood variation and the blood of the relative position of the laser beam machine (0) of the workpiece processing member It can offset the local distortion. (X T + x A , y T + y A ) corresponding to the correction amount (x A , y A ) added to the XY coordinate (x T , y T ) of the target irradiation position through the irradiation position command unit 51 And inputs the control signal to the galvanometer scanner 11, 12. As a result, the laser light L is correctly irradiated to the target irradiation position on the workpiece.

Fig. 10 shows a procedure example of the processing executed by the control unit 5 at the time of machining. The control unit 5 reads the XY coordinate (x T , y T ) of the target irradiation position defined by the stored processing position data (step S14), and outputs the laser beam L to the XY coordinate (x T , y T ) The correction amount (x A , y A ) of the command to the galvanometer scanner 11, 12 at the time of irradiation is calculated (step S15).

Then, the coordinates of the target irradiation position (x T, y T) to the correction amount (x A, y A) the twist XY coordinates (x T + x A, y T + y A) Galvano scanner control signals corresponding to (11, 12 to operate the galvanometer scanner 11, 12 (step S16). Then, the laser beam L is irradiated (step S17). The control section 5 repeats the above-described steps S4 to S17 until all of the necessary target irradiation positions defined in the machining position data are processed (step S18).

In this embodiment, a support 4 for supporting a workpiece, a laser beam irradiating device 1 for irradiating a laser beam L toward a workpiece supported by the support 4, ( XMn ', yMn ') of a plurality of alignment marks 91 and 92 provided on the workpiece with reference to an image of the workpiece taken by the camera sensor 14, 91 and 92 of the position (x Mn ', y Mn') error (Δx Mn, Δy Mn) of the location (x Mn, y Mn) and each of the alignment marks 91 and 92 is actually detected to the original must obtained also and, at the same time, the error of position of each alignment mark (91, 92) (Δx Mn, Δy Mn) which alignment marks (91, 92) using a and other alignment marks (91, 92) points (x i between , y i ) of the virtual positions (Δx Mi , Δy Mi ), and then, based on the errors (Δx Mi , Δy Mi ) (X A , y A ) of the command to be given to the laser beam irradiating device 1 in order to irradiate the laser beam L to the desired target irradiation position (x T , y T ) The laser processing machine 0 having the control section 5 for determining the laser beam intensity is determined.

In this embodiment, a support 4 for supporting a workpiece, a laser beam irradiating device 1 for irradiating a laser beam L toward a workpiece supported by the support 4, 1), irradiation position (not tinge to the correction amount in the x i, y i) for when instructions that command the irradiation position (x i, y i) and (x i 'actual laser beam L irradiation position in the, y i ') error (Δx i, Δy i) to the reference for the laser beam L at the time of laser processing in the blood (x T, y T desired objectives irradiation position on the workpiece), the correction amount based on the (x a, y A of the workpiece held by the supporting member 4 is picked up by the camera sensor 14 when the laser processing machine 0 having the control section 5 for determining the position The positions of the plurality of alignment marks 91 and 92 provided to the workpiece with reference to the picked- (x Mn ', y Mn') position detected by each alignment mark (91, 92), the original position (x Mn, y Mn) and each of the alignment marks 91 and 92 is actually detected to be in the (x Mn ', y Mn') error (Δx Mn, Δy Mn) to obtain also and at the same time, the error of position of each alignment mark (91, 92) (Δx Mn, Δy Mn) which alignment marks (91, 92 using the (? X Mi ,? Y Mi ) at a point (x i , y i ) between the laser beam spot 91 and the other alignment marks 91, 92, the reference irradiation position (x i, y i) and the irradiation position of the actual laser light L in in the case where a light irradiation device 1, the irradiation position (x i, y i) are not tinge to the correction amount to the command (x i a ', y i') error (Δx i, Δy i) of the position of the alignment marks (91, 92) of the point (xi, yi) corresponding to the art reference irradiation position on the work piece Given the difference (Δx Mi, Mi Δy) is obtained by adding the error (Δx i Mi + Δx, Δy i Mi + Δy) was shown to determine the correction amount (x A, y A).

According to this embodiment, it is possible to further bring the irradiation position of the laser light L to the workpiece close to a desired target irradiation position, and it is possible to further improve the precision of the laser processing and the quality of the processed product .

Since the laser irradiation apparatus 1 has the galvanometer scanners 11 and 12 for scanning the laser light L emitted from the laser oscillator and the condenser lens 13 for condensing the laser light L, And those in the laser machining apparatus 0 can be useful.

The present invention is not limited to the above-described embodiments. For example, in consideration of the correction amount (x A, y A) in the embodiment, at the time of laser processing, for a galvanometer scanner (11, 12), a target irradiation position (x T, y T), XY coordinates (x T + x A , y T + y A ), the direction of the optical axis of the laser light L emitted from the laser light irradiating device 1 is corrected.

A control signal corresponding to the correction amount (x A , y A ) necessary for accurately irradiating the laser beam L to the target irradiating position (x T , y T ) is inputted to the drive unit 3, in the direction of the offset error (Δx T, Δy T) of the position may be to move the laser irradiation device (1) from the next, the art laser light irradiation apparatus (1) to irradiate the laser beam L on the work piece. In this case, the control section 58 during the processing of the controller 5 is, on the basis of the errors (Δx i + Δx Mi, Δy i + Δy Mi), the laser light L to the target irradiation position at the time of machining (x T, y T) The correction amount (x A , y A ) of the command to be given to the drive device 3 is determined. When the supporting body 4 supporting the workpiece is movable in the X and Y directions, the supporting body 4 may be moved in the direction of canceling the errors (DELTA x T , DELTA y T ) of the irradiation positions.

The specific means for changing the optical axis of the laser light L in the laser light irradiating apparatus 1 is not limited to the galvanometer scanners 11 and 12. [ For example, a mechanism for controlling the angle of the laser beam emission nozzle mounted at the end of the optical fiber for guiding the laser beam L emitted from the laser oscillator by a servo motor or the like may be employed.

The specific configurations of the other parts can be variously modified within the scope not departing from the gist of the present invention.

The present invention can be applied to a laser machining apparatus that irradiates a laser beam to an arbitrary point of a workpiece to perform machining.

0 … Laser processing machine 1 ... Laser light irradiation device
11, 12 ... Galvano Scanner 14 ... Camera sensor
3 ... Drive device 5 ... controller
9 ... The workpieces 91, 92 ... Alignment mark
L ... Laser beam

Claims (4)

A support body for supporting the workpiece;
A laser beam irradiating device for irradiating the workpiece supported by the support with a laser beam;
A position of at least 10 alignment marks assigned to the member to be processed and arranged in a range in which the laser light can be irradiated by the laser light irradiating apparatus is referred to as an image obtained by photographing a workpiece supported by the support by a camera sensor, Axis direction error and the Y-axis direction error of the position where each alignment mark should originally be located and the position of each of the actually detected alignment marks, and also obtains the error of the position of each alignment mark in the X- An approximate expression of the error in the X-axis direction and an approximate expression of the error in the Y-axis direction expressing the distribution of the error in the X-axis direction error and the Y-axis direction error at any point within the irradiation range are respectively generated using the error, By using the error in the X axis direction and the error in the Y axis direction of an arbitrary point calculated by the approximate equation, Laser processing machine having a control unit for determining a correction amount of the command for checking the group desired target irradiation position on the work piece. A support body for supporting the workpiece;
A laser beam irradiating device for irradiating the workpiece supported by the support with a laser beam;
The positions of the plurality of alignment marks imparted to the workpiece are detected with reference to the image of the workpiece supported by the support by the camera sensor and the positions of the respective alignment marks and the positions of the actually detected alignment marks An error of a virtual position at a point between any one alignment mark and another alignment mark is calculated using the error of the position of each alignment mark and then the correction amount is set in the laser light irradiating device An error of the position of the alignment mark at a position corresponding to the command irradiation position on the workpiece is compared with an error between the command irradiation position and the actual irradiation position of the laser light when the irradiation position is commanded On the basis of the error obtained by addition, Laser processing machine having a control unit for determining a correction amount of the command for irradiating light to the desired target irradiation position on the work piece. The method according to claim 1 or 2,
Wherein the laser beam irradiation device uses a galvanometer scanner capable of changing the direction of the optical axis of the laser beam. A laser beam irradiating device for irradiating a laser beam toward a workpiece supported by the support, and a laser beam irradiating device for irradiating the laser beam irradiating device with a laser beam, And a control section for determining a correction amount of a command for irradiating a laser beam to a desired target irradiation position on the workpiece at the time of laser machining based on an error between the position and an actual irradiation position of the laser light,
A workpiece supported by the support is picked up by a camera sensor,
Detecting positions of a plurality of alignment marks provided on the workpiece with reference to an image picked up by the camera sensor to obtain an error between the original position of each alignment mark and the position of each actually detected alignment mark; The error of the position of each alignment mark is used to calculate an error of a virtual position at a position between any alignment mark and another alignment mark,
The control section is caused to respond to the command irradiation position on the workpiece on the basis of the error between the command irradiation position and the actual irradiation position of the laser light when the irradiation position without the correction amount is instructed to the laser light irradiation device Wherein the correction amount is determined by giving an error obtained by adding an error of a position of the alignment mark at a point where the alignment mark is corrected.
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