TW201611931A - Laser processing machine, and skewed work-piece compensation method of the same - Google Patents

Laser processing machine, and skewed work-piece compensation method of the same

Info

Publication number
TW201611931A
TW201611931A TW104111256A TW104111256A TW201611931A TW 201611931 A TW201611931 A TW 201611931A TW 104111256 A TW104111256 A TW 104111256A TW 104111256 A TW104111256 A TW 104111256A TW 201611931 A TW201611931 A TW 201611931A
Authority
TW
Taiwan
Prior art keywords
laser processing
laser
work piece
processing machine
locations
Prior art date
Application number
TW104111256A
Other languages
Chinese (zh)
Other versions
TWI577483B (en
Inventor
Masami Suzuki
Junichi Matsumoto
Yuki Norita
Masaharu Kamiya
Satoshi Tokuoka
Original Assignee
Kataoka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kataoka Corp filed Critical Kataoka Corp
Publication of TW201611931A publication Critical patent/TW201611931A/en
Application granted granted Critical
Publication of TWI577483B publication Critical patent/TWI577483B/en

Links

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Numerical Control (AREA)

Abstract

This invention achieves the goal of increasing the precision of laser processing performed by a laser processing machine. The laser processing machine equips with: a support framework which supports a work piece; a laser light irradiation device which emits a laser beam onto the work piece supported by the support framework; and a controller which detects the locations of multiple alignment markers marked on the work piece by referencing the pictures, photographed by a camera sensor, of the workpiece supported by said supporting framework, so as to obtain the positional deviation of each detected alignment marker locations. Calculate the error of a hypothetical position between any single alignment marker and other alignment markers via the measured error of each alignment marker locations. According to these positional errors, correctional instruction is given to the corresponding laser irradiation device during laser processing, so laser beam can be applied onto the work piece at the expected laser targeting position.
TW104111256A 2014-09-30 2015-04-08 Laser processing machine, laser processing machine workpiece skew correction method TWI577483B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014201939A JP5952875B2 (en) 2014-09-30 2014-09-30 Laser processing machine, work distortion correction method for laser processing machine

Publications (2)

Publication Number Publication Date
TW201611931A true TW201611931A (en) 2016-04-01
TWI577483B TWI577483B (en) 2017-04-11

Family

ID=55789828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111256A TWI577483B (en) 2014-09-30 2015-04-08 Laser processing machine, laser processing machine workpiece skew correction method

Country Status (4)

Country Link
JP (1) JP5952875B2 (en)
KR (1) KR101698269B1 (en)
CN (1) CN106181075B (en)
TW (1) TWI577483B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6174636B2 (en) * 2015-07-24 2017-08-02 ファナック株式会社 Work positioning device for positioning work
WO2018012199A1 (en) * 2016-07-14 2018-01-18 三菱電機株式会社 Substrate measurement device and laser processing system
KR101938812B1 (en) * 2016-11-29 2019-01-15 주식회사 알이디테크놀로지 Laser engraving machine with auto feeding and focusing function
CN110650818B (en) * 2017-05-25 2021-08-27 三菱电机株式会社 Laser processing apparatus
JP6422622B1 (en) * 2017-05-25 2018-11-14 三菱電機株式会社 Laser processing equipment
BE1025292B1 (en) * 2017-06-06 2019-01-15 Layerwise N.V. APPARATUS FOR ADDITIVELY MANUFACTURING A PRODUCT WITH A CALIBRATION DEVICE AND METHOD FOR CALIBRATING SUCH A DEVICE
CN107649543B (en) * 2017-10-26 2023-09-29 郑州万达重工股份有限公司 Intelligent gun barrel correction system
CN108391847A (en) * 2018-03-16 2018-08-14 山西大学 A kind of cigarette laser marking system and method based on image procossing
CN110340936B (en) * 2018-04-03 2024-01-30 泰科电子(上海)有限公司 Calibration method and calibration system
CN108489592A (en) * 2018-04-13 2018-09-04 东莞市鸿博电子有限公司 A kind of automatic quadrangle output error update the system of parallel beam load cell
JP6574915B1 (en) * 2018-05-15 2019-09-11 東芝機械株式会社 Workpiece processing method and work piece processing machine
JP7117903B2 (en) * 2018-06-11 2022-08-15 住友重機械工業株式会社 Processing method and processing equipment
CN111515523B (en) * 2019-01-17 2022-01-28 深圳市创客工场科技有限公司 Laser processing method and device, laser processing equipment and storage medium
EP3915883A4 (en) 2019-01-21 2022-08-31 Sky Perfect JSAT Corporation Spacecraft and control system
JP7396851B2 (en) * 2019-10-18 2023-12-12 ファナック株式会社 Control device, control system, and program
CN111275667B (en) * 2020-01-13 2024-05-24 武汉科技大学 Machining error detection method, device and machining method
CN111157533B (en) * 2020-01-16 2022-07-08 东莞市兆丰精密仪器有限公司 Constant-speed three-dimensional continuous interpolation laser detection method
CN114918195B (en) * 2022-05-31 2023-08-25 深圳吉阳智能科技有限公司 Laser cleaning control method, system and readable storage medium

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519123A (en) * 1978-07-26 1980-02-09 Eiichirou Tani Falling gear in case of emergency
JP3209078B2 (en) * 1996-03-18 2001-09-17 三菱電機株式会社 Laser processing equipment
JP2002160080A (en) * 2000-11-28 2002-06-04 Hitachi Via Mechanics Ltd Method and device for laser beam working
KR20020077589A (en) * 2001-04-02 2002-10-12 주식회사 애트랩 A method for controlling intensity of illumination of light image dectecting apparatus
JP2006136923A (en) * 2004-11-12 2006-06-01 Hitachi Via Mechanics Ltd Laser beam machine and laser beam machining method
JP4749092B2 (en) * 2005-02-28 2011-08-17 パナソニック電工Sunx株式会社 Laser processing method and laser processing apparatus
JP4297952B2 (en) * 2007-05-28 2009-07-15 三菱電機株式会社 Laser processing equipment
JP5519123B2 (en) 2008-06-10 2014-06-11 株式会社片岡製作所 Laser processing machine
JP5288987B2 (en) * 2008-10-21 2013-09-11 三菱電機株式会社 Laser processing equipment
JP4958020B2 (en) 2009-03-31 2012-06-20 大日本印刷株式会社 Touch panel sensor, laminate for manufacturing touch panel sensor, and method for manufacturing touch panel sensor
JP2010240694A (en) * 2009-04-07 2010-10-28 Panasonic Corp Laser beam machining method and laser beam machining device
JP2013086145A (en) 2011-10-19 2013-05-13 Toray Eng Co Ltd Apparatus and method for laser beam machining, and apparatus and method for manufacturing thin-film solar cell
KR101398320B1 (en) * 2012-02-01 2014-05-23 미쓰비시덴키 가부시키가이샤 Laser processing method and laser processing apparatus

Also Published As

Publication number Publication date
TWI577483B (en) 2017-04-11
CN106181075A (en) 2016-12-07
KR101698269B1 (en) 2017-01-19
KR20160038712A (en) 2016-04-07
JP2016068133A (en) 2016-05-09
CN106181075B (en) 2018-03-20
JP5952875B2 (en) 2016-07-13

Similar Documents

Publication Publication Date Title
TW201611931A (en) Laser processing machine, and skewed work-piece compensation method of the same
TW201612651A (en) Exposure device and out-of-focus and tilt error compensation method
MX2013010355A (en) Robotic work object cell calibration device, system, and method.
MX2016010485A (en) Automatic calibration method for robot systems using a vision sensor.
SG11201806983VA (en) Exposure system, exposure device and exposure method
MX2017016364A (en) Laser welding head with dual movable mirrors providing beam movement.
TW201614761A (en) Substrate processing apparatus and substrate processing method
EP2826591B8 (en) Clamping device for positioning workpieces, machine tool with such a device, method for positioning workpieces by means of such a clamping device
GB2551458A (en) 3D Laser projection, scanning and object tracking
WO2014019846A3 (en) Position measuring apparatus, position measuring method, lithographic apparatus and device manufacturing method
MX2015003654A (en) Dispensing machine automatically dispensing fluid to predetermined locations.
BR112015014984A2 (en) laser-based automatic alignment system and method
MX2015003652A (en) Soldering machine.
JP2016221622A (en) Production system equipped with robot having position correction function
WO2013174680A3 (en) Adjustment device and mask inspection device with such an adjustment device
WO2012152809A3 (en) Irradiation system and calibration thereof
EP2105814A3 (en) Method for controlling a machine tool and apparatus therefor
MX2017013724A (en) Flexible fixturing.
MX2016013278A (en) Machine tool.
MX2015004510A (en) Forming machine and method for control of a forming machine.
JP2015052736A5 (en) Optical device and control method of optical device
PT3079855T (en) Laser beam machine for thermally treating workpieces with a cable guidance system having a fitted deflection unit
SG11201902847PA (en) Optical measurement device and method
EP3524931A4 (en) Method for verifying accuracy of rtk tilt compensation measurement
WO2014042668A3 (en) Automatic and manual robot work finder calibration systems and methods