TW201611931A - Laser processing machine, and skewed work-piece compensation method of the same - Google Patents
Laser processing machine, and skewed work-piece compensation method of the sameInfo
- Publication number
- TW201611931A TW201611931A TW104111256A TW104111256A TW201611931A TW 201611931 A TW201611931 A TW 201611931A TW 104111256 A TW104111256 A TW 104111256A TW 104111256 A TW104111256 A TW 104111256A TW 201611931 A TW201611931 A TW 201611931A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser processing
- laser
- work piece
- processing machine
- locations
- Prior art date
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Laser Beam Processing (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Numerical Control (AREA)
Abstract
This invention achieves the goal of increasing the precision of laser processing performed by a laser processing machine. The laser processing machine equips with: a support framework which supports a work piece; a laser light irradiation device which emits a laser beam onto the work piece supported by the support framework; and a controller which detects the locations of multiple alignment markers marked on the work piece by referencing the pictures, photographed by a camera sensor, of the workpiece supported by said supporting framework, so as to obtain the positional deviation of each detected alignment marker locations. Calculate the error of a hypothetical position between any single alignment marker and other alignment markers via the measured error of each alignment marker locations. According to these positional errors, correctional instruction is given to the corresponding laser irradiation device during laser processing, so laser beam can be applied onto the work piece at the expected laser targeting position.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014201939A JP5952875B2 (en) | 2014-09-30 | 2014-09-30 | Laser processing machine, work distortion correction method for laser processing machine |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201611931A true TW201611931A (en) | 2016-04-01 |
TWI577483B TWI577483B (en) | 2017-04-11 |
Family
ID=55789828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104111256A TWI577483B (en) | 2014-09-30 | 2015-04-08 | Laser processing machine, laser processing machine workpiece skew correction method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5952875B2 (en) |
KR (1) | KR101698269B1 (en) |
CN (1) | CN106181075B (en) |
TW (1) | TWI577483B (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6174636B2 (en) * | 2015-07-24 | 2017-08-02 | ファナック株式会社 | Work positioning device for positioning work |
WO2018012199A1 (en) * | 2016-07-14 | 2018-01-18 | 三菱電機株式会社 | Substrate measurement device and laser processing system |
KR101938812B1 (en) * | 2016-11-29 | 2019-01-15 | 주식회사 알이디테크놀로지 | Laser engraving machine with auto feeding and focusing function |
CN110650818B (en) * | 2017-05-25 | 2021-08-27 | 三菱电机株式会社 | Laser processing apparatus |
JP6422622B1 (en) * | 2017-05-25 | 2018-11-14 | 三菱電機株式会社 | Laser processing equipment |
BE1025292B1 (en) * | 2017-06-06 | 2019-01-15 | Layerwise N.V. | APPARATUS FOR ADDITIVELY MANUFACTURING A PRODUCT WITH A CALIBRATION DEVICE AND METHOD FOR CALIBRATING SUCH A DEVICE |
CN107649543B (en) * | 2017-10-26 | 2023-09-29 | 郑州万达重工股份有限公司 | Intelligent gun barrel correction system |
CN108391847A (en) * | 2018-03-16 | 2018-08-14 | 山西大学 | A kind of cigarette laser marking system and method based on image procossing |
CN110340936B (en) * | 2018-04-03 | 2024-01-30 | 泰科电子(上海)有限公司 | Calibration method and calibration system |
CN108489592A (en) * | 2018-04-13 | 2018-09-04 | 东莞市鸿博电子有限公司 | A kind of automatic quadrangle output error update the system of parallel beam load cell |
JP6574915B1 (en) * | 2018-05-15 | 2019-09-11 | 東芝機械株式会社 | Workpiece processing method and work piece processing machine |
JP7117903B2 (en) * | 2018-06-11 | 2022-08-15 | 住友重機械工業株式会社 | Processing method and processing equipment |
CN111515523B (en) * | 2019-01-17 | 2022-01-28 | 深圳市创客工场科技有限公司 | Laser processing method and device, laser processing equipment and storage medium |
EP3915883A4 (en) | 2019-01-21 | 2022-08-31 | Sky Perfect JSAT Corporation | Spacecraft and control system |
JP7396851B2 (en) * | 2019-10-18 | 2023-12-12 | ファナック株式会社 | Control device, control system, and program |
CN111275667B (en) * | 2020-01-13 | 2024-05-24 | 武汉科技大学 | Machining error detection method, device and machining method |
CN111157533B (en) * | 2020-01-16 | 2022-07-08 | 东莞市兆丰精密仪器有限公司 | Constant-speed three-dimensional continuous interpolation laser detection method |
CN114918195B (en) * | 2022-05-31 | 2023-08-25 | 深圳吉阳智能科技有限公司 | Laser cleaning control method, system and readable storage medium |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5519123A (en) * | 1978-07-26 | 1980-02-09 | Eiichirou Tani | Falling gear in case of emergency |
JP3209078B2 (en) * | 1996-03-18 | 2001-09-17 | 三菱電機株式会社 | Laser processing equipment |
JP2002160080A (en) * | 2000-11-28 | 2002-06-04 | Hitachi Via Mechanics Ltd | Method and device for laser beam working |
KR20020077589A (en) * | 2001-04-02 | 2002-10-12 | 주식회사 애트랩 | A method for controlling intensity of illumination of light image dectecting apparatus |
JP2006136923A (en) * | 2004-11-12 | 2006-06-01 | Hitachi Via Mechanics Ltd | Laser beam machine and laser beam machining method |
JP4749092B2 (en) * | 2005-02-28 | 2011-08-17 | パナソニック電工Sunx株式会社 | Laser processing method and laser processing apparatus |
JP4297952B2 (en) * | 2007-05-28 | 2009-07-15 | 三菱電機株式会社 | Laser processing equipment |
JP5519123B2 (en) | 2008-06-10 | 2014-06-11 | 株式会社片岡製作所 | Laser processing machine |
JP5288987B2 (en) * | 2008-10-21 | 2013-09-11 | 三菱電機株式会社 | Laser processing equipment |
JP4958020B2 (en) | 2009-03-31 | 2012-06-20 | 大日本印刷株式会社 | Touch panel sensor, laminate for manufacturing touch panel sensor, and method for manufacturing touch panel sensor |
JP2010240694A (en) * | 2009-04-07 | 2010-10-28 | Panasonic Corp | Laser beam machining method and laser beam machining device |
JP2013086145A (en) | 2011-10-19 | 2013-05-13 | Toray Eng Co Ltd | Apparatus and method for laser beam machining, and apparatus and method for manufacturing thin-film solar cell |
KR101398320B1 (en) * | 2012-02-01 | 2014-05-23 | 미쓰비시덴키 가부시키가이샤 | Laser processing method and laser processing apparatus |
-
2014
- 2014-09-30 JP JP2014201939A patent/JP5952875B2/en active Active
-
2015
- 2015-04-08 TW TW104111256A patent/TWI577483B/en active
- 2015-06-16 KR KR1020150085221A patent/KR101698269B1/en active IP Right Grant
- 2015-06-16 CN CN201510333958.7A patent/CN106181075B/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI577483B (en) | 2017-04-11 |
CN106181075A (en) | 2016-12-07 |
KR101698269B1 (en) | 2017-01-19 |
KR20160038712A (en) | 2016-04-07 |
JP2016068133A (en) | 2016-05-09 |
CN106181075B (en) | 2018-03-20 |
JP5952875B2 (en) | 2016-07-13 |
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