TWI576657B - Photomask cleaning apparatus and method - Google Patents

Photomask cleaning apparatus and method Download PDF

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Publication number
TWI576657B
TWI576657B TW103145403A TW103145403A TWI576657B TW I576657 B TWI576657 B TW I576657B TW 103145403 A TW103145403 A TW 103145403A TW 103145403 A TW103145403 A TW 103145403A TW I576657 B TWI576657 B TW I576657B
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TW
Taiwan
Prior art keywords
protective film
reticle
substrate
contaminant
embodiments
Prior art date
Application number
TW103145403A
Other languages
Chinese (zh)
Other versions
TW201624107A (en
Inventor
陳煜仁
曾信富
徐享乾
Original Assignee
台灣積體電路製造股份有限公司
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Priority to TW103145403A priority Critical patent/TWI576657B/en
Publication of TW201624107A publication Critical patent/TW201624107A/en
Application granted granted Critical
Publication of TWI576657B publication Critical patent/TWI576657B/en

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Description

Mask cleaning device and mask cleaning method

The disclosure relates primarily to a cleaning device, and more particularly to a reticle cleaning device.

Semiconductor devices are used in a variety of electronic applications, such as, for example, personal computers, cell phones, digital cameras, and other electronic devices. The semiconductor device is usually fabricated by depositing an insulating layer or a dielectric layer material, a conductive layer material, and a semiconductor layer material on a semiconductor substrate, and patterning various material layers by using a lithography process, whereby the semiconductor substrate is formed thereon. Circuit parts and components are formed on top. A number of integrated circuits are typically fabricated on a single semiconductor wafer, and individual dies on the wafer are singulated by cutting between the integrated circuits along the dicing lines. For example, individual dies are then packaged separately in a multi-wafer module or other type of package structure.

In the above lithography process, a mask is generally used to pattern the material layer. However, if contaminants are attached to the mask, an incorrect pattern is formed on the material layer, which affects the yield of the semiconductor device.

However, there are still many challenges regarding how to remove contaminants from the reticle.

The present disclosure provides a reticle cleaning apparatus for cleaning a reticle, the reticle including a substrate and a protection from the substrate membrane. The reticle cleaning apparatus includes an ultrasonic device for generating an ultrasonic wave to the protective film, whereby contaminants adhering to one of the inner surfaces of the protective film are dropped onto the substrate.

The present disclosure provides a reticle cleaning method including placing a reticle to a reticle cleaning apparatus. The reticle cleaning method also includes generating a supersonic wave to a protective film of the reticle to vibrate the protective film and dropping a contaminant on one of the inner surfaces of the protective film to the reticle On a substrate. The inner surface faces the substrate and is spaced apart from the substrate. The reticle cleaning method further includes removing the protective film and removing the internal contaminants.

The present disclosure provides a reticle cleaning method including placing a reticle to a reticle cleaning apparatus. The reticle cleaning method also includes generating a supersonic wave to a protective film of the reticle to drop contaminants on one of the inner surfaces of the protective film onto one of the reticle substrates, and vibrating the protection An external contaminant on one of the outer surfaces of the membrane. The inner surface faces the substrate and is spaced apart from the substrate. The reticle cleaning method further includes reducing static electricity between the inner and outer contaminants and the protective film via a static elimination controller, and generating a gas flow to the protective film to blow off the outer pollutant on the outer surface .

1‧‧‧Photomask cleaning equipment

10‧‧‧Base

20‧‧‧Transportation device

21‧‧‧ drive mechanism

22‧‧‧Mobile agencies

23‧‧‧Clamping mechanism

30‧‧‧Ultrasonic device

31‧‧‧Power Module

32‧‧‧ oscillating components

40‧‧‧Static Elimination Controller

41‧‧‧Electrostatic controller

42‧‧‧Ion generating components

50‧‧‧jet device

51‧‧‧ gas valve parts

52‧‧‧Connecting tube

53‧‧‧ gas nozzle

60‧‧‧Liquid cleaning device

61‧‧‧Flow controller

62‧‧‧Connecting tube

63‧‧‧Dropper nozzle

70‧‧‧ suction device

71‧‧‧vacuum pump

72‧‧‧Connecting tube

73‧‧‧Sucking head

A1‧‧‧ acute angle

Contaminants in C1‧‧

C2‧‧‧External pollutants

D1‧‧‧ moving direction

D2‧‧‧ extending direction

D3‧‧‧Adjustment direction

L1‧‧‧ droplet

M1‧‧‧Photo Mask

M11‧‧‧ substrate

M12‧‧‧ pattern layer

M13‧‧‧ surface

M14‧‧‧Frame

M15‧‧‧ protective film

Sides of M151, M152, M153, M154‧‧

M16‧‧‧ inner surface

M17‧‧‧ outer surface

P1‧‧‧ water level

1 is a perspective view of a reticle cleaning apparatus in accordance with some embodiments.

2 is a cross-sectional view of a reticle in accordance with some embodiments.

Figure 3 is a flow diagram of a reticle cleaning method in accordance with some embodiments.

4A, 4B, and 4C are schematic views of the reticle cleaning method in an intermediate stage in accordance with some embodiments.

The making and using of various embodiments of the present invention are described in detail below. However, it should be understood that the embodiments of the present invention are intended to provide a number of concepts that are applicable to the present invention and can be embodied in a particular context. The specific embodiments discussed herein are for illustrative purposes only and are not intended to limit the scope of the invention.

It should be understood that the following description provides many different embodiments or examples for implementing the various features of the disclosure. Specific embodiments of the components and arrangements are described below to simplify the disclosure. Of course, these specific embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the specification mentions that implementing the first process before the second process is performed may include the second process performing the second process immediately after the first process, or may include other processes between the first process and the second process. An embodiment. In order to make the description simpler and clearer, various feature structures can be drawn at any scale. Furthermore, reference to the formation of the first feature structure over the second feature structure may include embodiments in which the first feature structure is in direct or indirect contact with the second feature structure.

Various variations of the embodiments are described below. Similar elements are labeled to identify similar elements by the various views and the disclosed embodiments. It will be appreciated that additional operational steps may be performed before, during or after the method, and that in other embodiments of the method, portions of the operational steps may be substituted or omitted.

The present disclosure provides various embodiments of a reticle cleaning apparatus and a reticle cleaning method. Figure 1 is a perspective view of a reticle cleaning apparatus 1 in accordance with some embodiments. The mask cleaning device 1 is used to clean a mask M1. The reticle cleaning device 1 includes a base 10, a transmission device 20, an ultrasonic device 30, and a static elimination controller 40. A jet device 50, a liquid cleaning device 60, and a suction device 70.

The transport device 20 is disposed on the base 10 for moving, rotating, and clamping the reticle M1. In some embodiments, the transport device 20 includes two drive mechanisms 21, a moving mechanism 22, and a clamping mechanism 23. The driving mechanism 21 is disposed on the base 10 for rotating the moving mechanism 22. In some embodiments, the moving mechanism 22 rotates about a moving direction D1.

Both ends of the moving mechanism 22 are respectively connected to the driving mechanism 21. The moving mechanism 22 is for moving the clamping mechanism 23 in the moving direction D1. In some embodiments, the moving mechanism 22 extends in the direction of movement D1. The clamping mechanism 23 is disposed on the moving mechanism 22 for clamping the reticle M1.

In some embodiments, the drive mechanism 21 drives the moving mechanism 22 to move the clamping mechanism 23 to move the reticle M1 in the moving direction D1. Further, the drive mechanism 21 rotates the moving mechanism 22 such that the reticle M1 is positioned at a horizontal position parallel to a horizontal plane or the reticle M1 is inclined with respect to the horizontal plane.

Figure 2 is a cross-sectional view of a reticle M1 in accordance with some embodiments. The mask M1 includes a substrate M11, a frame M14, and a protective film M15. The substrate M11 may be made of a light transmissive material such as quartz or glass. The substrate M11 has a pattern layer M12 on one surface M13 of the substrate M11.

The frame M14 is disposed on the surface M13 of the substrate M11 and surrounds the pattern layer M12. The frame M14 is for fixing the protective film M15, and the protective film M15 and the substrate M11 are spaced apart from each other. In some embodiments, the frame M14 is a square structure, and the frame M14 extends perpendicular to the surface M13 of the substrate M11.

The protective film M15 is disposed on the frame M14 and spaced apart from the substrate M11. In some embodiments, the protective film M15 and the substrate M11 are parallel to each other. protection The film M15, the frame M14 and the substrate M11 form a sealed space. One inner surface M16 of the protective film M15 faces the pattern layer M12, and one outer surface M17 of the protective film M15 is opposite to the inner surface M16. In some embodiments, the protective film M15 is made of a light transmissive material.

In some cases, the protective film M15 may adhere to some contaminants (C1 and/or C2), which may affect the pattern formed by exposure using the mask M1. Since the thickness of the protective film M15 is very thin, it is difficult to distinguish whether the contaminant is located on the inner surface M16 or the outer surface M17 of the protective film M15 under inspection by a visual inspection or a detecting instrument (not shown).

For example, the contaminants mentioned above may be dust or chemicals. As shown in Figures 1 and 2, the internal contaminant C1 may adhere to the inner surface M16, and the outer contaminant C2 may adhere to the outer surface M17. Therefore, if general cleaning is performed only on the outer surface M17 of the protective film M15, the internal contaminant C1 cannot be removed.

As shown in FIG. 1, the ultrasonic device 30 is disposed above the base 10. The ultrasonic device 30 is for generating an ultrasonic wave to the protective film M15, thereby causing the protective film M15, the internal contaminant C1, and the external contaminant C2 to vibrate. In some embodiments, the frequency of the ultrasonic waves is between about 18 kHz and 2 MHz.

When the inner contaminant C1 and the protective film M15 vibrate, the inner contaminant C1 is dropped to the pattern layer M12 on the substrate M11. Thereafter, by visual inspection or inspection of the pattern layer M12 of the substrate M11 via a detecting instrument, it is judged whether or not the inside of the mask M1 has the internal contaminant C1 to be removed.

The ultrasonic device 30 includes a power module 31 and an oscillating member 32. The oscillating component 32 is coupled to the power module 31. When the power module 31 supplies power to the oscillating member 32, the oscillating member 32 is caused to vibrate. Oscillating element 32 can be along An extension direction D2 extends and rotates around D2. In some embodiments, the extension direction D2 is perpendicular to the movement direction D1. The width of the oscillating member 32 is approximately the width of the protective film M15. In some embodiments, the oscillating member 32 is located above the moving mechanism 22. In some embodiments, the oscillating member 32 is movable in an adjustment direction D3 to adjust the distance between the oscillating member 32 and the reticle M1. Further, the oscillating member 32 is rotatable in the extending direction D2 to adjust the angle of the oscillating member 32 toward the reticle M1.

Since the ultrasonic wave device 30 generates ultrasonic waves to the protective film M15, static electricity may be generated between the protective film M15 and the contaminant, so that the contaminant is adsorbed to the protective film M15 via the electrostatic force. Therefore, the static electricity eliminating controller 40 can be used to reduce static electricity between the contaminant and the protective film M15, so that the contaminants are more easily separated from the protective film M15 layer.

The static elimination controller 40 can include an electrostatic controller 41 and an ion generating component 42. The ion generating component 42 is coupled to the electrostatic controller 41. When the electrostatic controller 41 supplies power to the ion generating element 42, it causes the ion generating element 42 to generate ions, which in some embodiments are negative ions. The ion generating element 42 is used to generate ions to the protective film M15.

In some embodiments, the ion generating element 42 can extend along the direction of extension D2. The width of the ion generating element 42 is approximately the width of the protective film M15. In some embodiments, the ion generating element 42 is located above the moving mechanism 22. In some embodiments, the ion generating element 42 is movable in the adjustment direction D3 to adjust the distance between the ion generating element 42 and the reticle M1. Further, the ion generating element 42 is rotatable in the extending direction D2 to adjust the angle of the ion generating element 42 toward the mask M1.

The jet device 50 is used to generate a gas flow to the protective film M15. When the ultrasonic wave generated by the ultrasonic device 30 causes the external contaminant C2 to vibrate with respect to the protective film M15, the external contaminant C2 can be blown away from the protective film M15 by the above-described air current.

The jet device 50 can include a gas valve member 51, a connecting tube 52, and a gas jet head 53. The gas valve member 51 is used to control gas release. In some embodiments, the gas can be a nitrogen gas. The connecting pipe 52 is for connecting the gas valve member 51 and the gas jet head 53. The gas pressurized by the gas valve member 51 is ejected through the connecting pipe 52 to the gas jet head 53. The gas jet head 53 is for discharging a gas flow to the protective film M15.

In some embodiments, the gas showerhead 53 can extend along the direction of extension D2. The width of the gas jet head 53 is approximately the width of the protective film M15. In some embodiments, the gas showerhead 53 is located above the moving mechanism 22. In some embodiments, the gas jet head 53 is movable in the adjustment direction D3 to adjust the distance between the gas jet head 53 and the reticle M1. Further, the gas jet head 53 is rotatable in the extending direction D2 to adjust the angle of the gas jet head 53 toward the mask M1.

The liquid cleaning device 60 is for dropping the droplet L1 (as shown in FIG. 4C) onto the outer surface M17 of the protective film M15. When the external contaminant C2 sticks to the outer surface M17, the outer contaminant C2 can be separated from the outer surface M17 when flowing through the outer contaminant C2 via the droplet L1.

The liquid cleaning device 60 can include a flow controller 61, a connecting tube 62, and a droplet discharge head 63. The flow controller 61 is configured to output a cleaning liquid and to control the flow rate of the cleaning liquid. The connecting pipe 62 is used to connect the flow controller 61 and the droplet discharge head 63. The cleaning liquid outputted from the flow controller 61 passes through the connection pipe 62 to the droplet discharge head 63. Outputted intermittently or continuously by the flow controller 61 The liquid is cleaned so that the droplet discharge head 63 produces the droplet L1. In some embodiments, the cleaning liquid and the droplet L1 may be a solvent. In some embodiments, the droplet discharge head 63 is movable in the adjustment direction D3 to adjust the distance between the droplet discharge head 63 and the mask M1. Further, the droplet discharge head 63 is rotatable in the extending direction D2 to adjust the angle of the droplet discharge head 63 toward the mask M1.

The suction device 70 is for sucking the liquid droplet L1 on the outer surface M17. The suction device 70 can include a vacuum pump 71, a connecting tube 72, and a suction head 73. The vacuum pump 71 is used to provide a negative pressure. The connecting pipe 72 is used to connect the vacuum pump 71 and the suction head 73. The suction head 73 sucks the liquid droplet L1 by the negative pressure generated by the vacuum pump 71.

In some embodiments, as shown in FIG. 4C, the reticle M1 is tilted relative to the horizontal plane by the driving mechanism 21, so that the droplet L1 flows on the outer surface M17 and is exposed to the external pollution on the moving path of the droplet L1. C2. When the droplet L1 flows to the edge of the outer surface M17, the suction head 73 sucks the droplet L1 to prevent the droplet L1 from falling onto the base 10.

Figure 3 is a flow diagram of a reticle cleaning method in accordance with some embodiments. 4A, 4B, and 4C are schematic views of the reticle cleaning method in an intermediate stage in accordance with some embodiments. In step S101, when the mask M1 is detected by visual inspection or a detecting instrument, it is found that the protective film M15 has contaminants. The reticle M1 can be placed to the reticle cleaning apparatus 1 for cleaning.

In step S103, a mask cleaning process is performed. First, the ultrasonic device 30 can be activated to cause the oscillating member 32 to generate ultrasonic waves; the static electricity eliminating controller 40 is activated to cause the ion generating member 42 to generate negative ions; and the air jet device 50 is activated to cause the gas jet head 53 to generate an air flow. After that, make the mask M1 and shock The swash element 32, the ion generating element 42, and the gas jet head 53 are relatively moved.

In some embodiments, the moving mechanism 22 moves the clamping mechanism 23 to move the reticle M1 in the moving direction D1. At this time, as shown in FIGS. 4A and 4B, the oscillation element 32, the ion generating element 42, and the gas jet head 53 sequentially pass over the side M151 of one side of the protective film M15 to the upper side of the other opposite side M152.

When the oscillating member 32 passes over the protective film M15, the oscillating member 32 vibrates the protective film M15 from the side M151 to the side M152 by ultrasonic waves so that the inner surface M16 of the protective film M15 (as shown in FIG. 2) The internal contaminant C1 is dropped onto the pattern layer M12 of the substrate M11, and the external contaminant C2 is also vibrated relative to the protective film M15 and is dispersed into the environment.

When the ion generating element 42 passes over the protective film M15, the ion generating element 42 reduces the static electricity between the contaminant and the protective film M15 by the negative ions from the side M151 to the side M152 of the protective film M15, so that the contaminant is easier and protected. The membrane M15 layer was separated.

When the gas jet head 53 passes over the protective film M15, the gas jet head 53 ejects a gas stream from the side M151 to the side edge M152 of the protective film M15 for blowing off the outer surface M17 of the protective film M15 (as shown in FIG. 2). Contaminant C2 outside.

Since the external contaminant C2 vibrates with respect to the protective film M15 by the ultrasonic waves generated by the ultrasonic device 30, the external contaminant C2 can be easily blown off by the air current generated by the gas jet head 53. In addition, in some embodiments, the wind pressure of the airflow may be between about 1 Kg/cm 2 and 10 Kg/cm 2 , which may be lower than the air pressure of the airflow when the ultrasonic device 30 is not used, thereby preventing the airflow from being blown. Protective film M15.

In step S105, since the internal pollutant C1 has been shocked by ultrasonic waves Since the protective film M15 is removed, it is possible to check whether there is an internal contaminant C1 on the pattern layer M12 of the substrate M11 by visual inspection or a detecting instrument, and thus it can be easily discriminated that the internal contaminant C1 is located inside the photomask. When the mask M1 does not have the internal contaminant C1, step S109 can be performed. If there is an internal contaminant C1, in step S107, the protective film M15 can be removed and the contaminant C1 on the pattern layer M12 can be removed. After the internal contaminant C1 is removed, the protective film M15 can be mounted on the substrate M11. In some embodiments, another protective film can be mounted onto the substrate M11.

In some embodiments, after the process of step S107 is performed, the detection may be performed again for the protective film M15. If the protective film M15 detects the contaminant, step S101 may be re-executed to perform the mask cleaning process.

In step S109, the mask M1 having no internal contaminant C1 in step S105 or the mask M1 having the inner contaminant C1 removed in step S107 is again subjected to detection of the protective film M15 for inspecting the protective film M15. Whether there is residual C2 residue.

When there is no external contaminant C2, step S111 may be performed to transfer the mask M1 to a semiconductor device (not shown). In some embodiments, the semiconductor device is a lithography process device or a reticle storage device.

In step S109, when the outer film C2 remains on the protective film M15, step S113 may be performed to perform a liquid cleaning process. Since most of the contaminants have been removed at this time, only the external contaminant C2 remaining on the outer surface M17 of the protective film M15 is cleaned by the liquid cleaning device, and the use of the cleaning liquid can be reduced.

First, when the mask M1 has been removed from the mask cleaning apparatus 1, the mask M1 is again clamped to the chucking mechanism 23. As shown in Figure 4C, the moving mechanism 22 will clamp The holding mechanism 23 and the mask M1 are moved between the droplet discharge head 63 and the suction head 73. Thereafter, the drive mechanism 21 rotates the moving mechanism 22 to incline the mask M1 with respect to a horizontal plane P1. In some embodiments, the mask M1 has an acute angle A1 with the horizontal plane P1. The acute angle A1 is between about 1 degree and 85 degrees.

The start flow controller 61 drops the droplet L1 to the side M153 of one of the outer surfaces M17 (shown in FIG. 2) of the protective film M15 via the droplet discharge head 63. Due to the inclination of the mask M1, the above-mentioned droplet L1 flows to the side M154 of one of the outer surfaces M17 via the side M153. When the droplet L1 flows to the side edge M154, it is sucked through the suction head 73 to prevent the droplet L1 from dripping to the base 10.

In some embodiments, the detection instrument analyzes the coordinates of the contaminant on the protective film M15. The moving mechanism 22 moves the reticle M1 according to the coordinates of the outer pollutant C2, so that the path of the droplet L1 moving on the protective film M15 passes through the external pollutant C2, as shown in FIG. 4C, to reduce the contact of the droplet L1 with the protective surface. area.

Through the liquid cleaning procedure of step S113, the contaminant C2 adhering to the protective film M15 should be removed via the droplet L1. The photomask M1 can then be transferred to the semiconductor device (step S111). In some embodiments, the protective film M15 of the mask M1 can be detected again by visual inspection or by a detecting instrument. If there is a contaminant on the protective film M15, the reticle cleaning procedure of step S103 or the liquid cleaning procedure of step S113 may be performed again.

The present disclosure provides embodiments of a reticle cleaning apparatus and a reticle cleaning method. By the ultrasonic device 30, the contaminant C1 on the protective film M15 is shaken away from the protective film M15, and it can be distinguished that the internal contaminant C1 is originally attached to the inner surface M16 of the protective film M15 to avoid cleaning the protective film M15. The outer surface M17 cleans the internal contaminant C1. In addition, the outer surface of the protective film M15 is also made by the ultrasonic device 30. The external contaminant C2 on M17 vibrates relative to the protective film M15, and can blow the outer contaminant C2 away from the protective film M15 with a flow of a lower wind pressure to prevent the protective film M15 from being blown by the air flow.

In some embodiments, the present disclosure provides a reticle cleaning apparatus for cleaning a reticle, the reticle including a substrate and a protective film spaced apart from the substrate. The reticle cleaning apparatus includes an ultrasonic device for generating an ultrasonic wave to the protective film, whereby contaminants adhering to one of the inner surfaces of the protective film are dropped onto the substrate.

In some embodiments, the present disclosure provides a reticle cleaning method including placing a reticle to a reticle cleaning apparatus. The reticle cleaning method also includes generating a supersonic wave to a protective film of the reticle to vibrate the protective film and dropping a contaminant on one of the inner surfaces of the protective film to the reticle On a substrate. The inner surface faces the substrate and is spaced apart from the substrate. The reticle cleaning method further includes removing the protective film and removing the internal contaminants.

In some embodiments, the present disclosure provides a reticle cleaning method including placing a reticle to a reticle cleaning apparatus. The reticle cleaning method also includes generating a supersonic wave to a protective film of the reticle to drop contaminants on one of the inner surfaces of the protective film onto one of the reticle substrates, and vibrating the protection An external contaminant on one of the outer surfaces of the membrane. The inner surface faces the substrate and is spaced apart from the substrate. The reticle cleaning method further includes reducing static electricity between the inner and outer contaminants and the protective film via a static elimination controller, and generating a gas flow to the protective film M15 to blow off the external pollution on the outer surface. Things.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims. For example, it will be understood by those of ordinary skill in the art that the various features, functions, processes, and materials described herein can be modified and modified in any manner without departing from the spirit and scope of the invention.

Further, the scope of the present invention is not limited to the processes, machines, manufacture, compositions, means, methods and steps in the specific embodiments described in the specification. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; It is possible to perform substantially the same functions as the corresponding embodiments described in this specification or to produce substantially the same results. Accordingly, the scope of the invention is to be construed as being limited to the modifications and variations thereof in the process, the machine, the manufacture, the composition of matter, the means, the method, or the steps. In addition, each application scope constitutes a separate embodiment, and combinations of different application scopes and embodiments are also within the scope of the invention.

1‧‧‧Photomask cleaning equipment

10‧‧‧Base

20‧‧‧Transportation device

21‧‧‧ drive mechanism

22‧‧‧Mobile agencies

23‧‧‧Clamping mechanism

30‧‧‧Ultrasonic device

31‧‧‧Power Module

32‧‧‧ oscillating components

40‧‧‧Static Elimination Controller

41‧‧‧Electrostatic controller

42‧‧‧Ion generating components

50‧‧‧jet device

51‧‧‧ gas valve parts

52‧‧‧Connecting tube

53‧‧‧ gas nozzle

60‧‧‧Liquid cleaning device

61‧‧‧Flow controller

62‧‧‧Connecting tube

63‧‧‧Dropper nozzle

70‧‧‧ suction device

71‧‧‧vacuum pump

72‧‧‧Connecting tube

73‧‧‧Sucking head

Contaminants in C1‧‧

C2‧‧‧External pollutants

D1‧‧‧ moving direction

D2‧‧‧ extending direction

D3‧‧‧Adjustment direction

M1‧‧‧Photo Mask

M11‧‧‧ substrate

M12‧‧‧ pattern layer

M13‧‧‧ surface

M14‧‧‧Frame

M15‧‧‧ protective film

Sides of M151, M152, M153, M154‧‧

Claims (8)

  1. A reticle cleaning device for cleaning a reticle, the reticle comprising a substrate and a protective film spaced apart from the substrate, and the reticle cleaning device comprises: an ultrasonic device for generating an ultrasonic wave And the protective film, wherein the contaminant adhering to one of the inner surfaces of the protective film is dropped onto the substrate, wherein the substrate has a pattern layer, the inner surface faces the pattern layer, and the inner contaminant is removed Fall to the above pattern layer.
  2. The reticle cleaning device of claim 1, further comprising a static elimination controller for reducing static electricity between the internal pollutant and the protective film.
  3. The reticle cleaning apparatus of claim 1, further comprising a jet device for generating a gas flow to the protective film, wherein the outer surface of one of the protective films is contaminated by the ultrasonic wave The object generates vibration on the outer surface, and the outer contaminant is blown away from the protective film by the air flow.
  4. The reticle cleaning device of claim 1, further comprising a liquid cleaning device for dropping a droplet onto the outer surface.
  5. A reticle cleaning method comprising: placing a reticle to a reticle cleaning device; generating an ultrasonic wave to a protective film of the reticle to vibrate the protective film and making an inner surface of one of the protective films One of the contaminants is dropped onto one of the substrates of the reticle, wherein the inner surface faces the substrate and Intersecting from the substrate; and removing the protective film and removing the internal contaminants.
  6. The reticle cleaning method of claim 5, further comprising reducing static electricity between the inner contaminant and the protective film via a static elimination controller.
  7. The reticle cleaning method of claim 5, further comprising installing the protective film onto the substrate.
  8. A reticle cleaning method comprising: placing a reticle to a reticle cleaning device; generating an ultrasonic wave to a protective film of the reticle to drop contaminants in one of the inner surfaces of the protective film to And shielding one of the outer surfaces of the protective film on the substrate, wherein the inner surface faces the substrate and is spaced apart from the substrate; and the inner and outer pollution is reduced through a static elimination controller Static electricity between the object and the protective film; generating a gas flow to the protective film to blow off the outer contaminant on the outer surface; tilting the photomask; and dropping a droplet onto the outer surface a side edge, wherein the liquid droplet flows to the second side of one of the outer surfaces via the first side edge.
TW103145403A 2014-12-25 2014-12-25 Photomask cleaning apparatus and method TWI576657B (en)

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TW103145403A TWI576657B (en) 2014-12-25 2014-12-25 Photomask cleaning apparatus and method

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TWI576657B true TWI576657B (en) 2017-04-01

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Publication number Priority date Publication date Assignee Title
TWI626506B (en) * 2016-07-28 2018-06-11 Non-contact reticle/wafer cleaning device
TWI673566B (en) * 2018-02-13 2019-10-01 特銓股份有限公司 Photomask cleaning device and reticle cleaning method

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