TWI760133B - Photomask cleaning apparatus and method - Google Patents
Photomask cleaning apparatus and method Download PDFInfo
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- TWI760133B TWI760133B TW110108171A TW110108171A TWI760133B TW I760133 B TWI760133 B TW I760133B TW 110108171 A TW110108171 A TW 110108171A TW 110108171 A TW110108171 A TW 110108171A TW I760133 B TWI760133 B TW I760133B
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- mask
- reticle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Abstract
Description
本發明是關於一種光罩清潔設備及光罩清潔方法,特別是指一種用來清除光罩護膜上的污染物之光罩清潔設備及光罩清潔方法。 The present invention relates to a photomask cleaning device and a photomask cleaning method, in particular to a photomask cleaning device and a photomask cleaning method for removing contaminants on a photomask protective film.
在半導體製程中,是包括一曝光製程,其是先將一具有圖案之光罩置於晶圓之上方,再利用一曝光光源透過光罩射於一晶圓上。之後,將該晶圓浸入一顯影液中,就可以在晶圓上看到光罩的圖案了。 In the semiconductor manufacturing process, an exposure process is included. First, a mask with a pattern is placed on the wafer, and then an exposure light source is used to emit light on a wafer through the mask. After that, the wafer is immersed in a developing solution, and the pattern of the reticle can be seen on the wafer.
該光罩上會有一層光罩護膜,該光罩護膜能避免光罩受到刮傷。此外,由於該光罩護膜會因靜電而附著污染物(汙染粒子)、化學物質等,所以需要對該光罩護膜進行清潔,才不會影響到半導體製程的良率。然而,現有的光罩護膜的除塵效果與除塵效率仍有改良必要。並且,在取出該光罩的過程中,外部的汙染粒子也容易附著於該光罩護膜上。 There is a layer of protective film on the photomask, which can prevent the photomask from being scratched. In addition, since the photomask protective film may adhere to contaminants (contamination particles), chemical substances, etc. due to static electricity, the photomask protective film needs to be cleaned so as not to affect the yield of the semiconductor process. However, it is still necessary to improve the dust removal effect and dust removal efficiency of the existing photomask protective films. In addition, in the process of taking out the photomask, the external contamination particles are also easily attached to the photomask protective film.
因此,如何改善上述的問題,便是本領域具有通常知識者值得去思量地。 Therefore, how to improve the above-mentioned problems is worth thinking about by those with ordinary knowledge in this field.
本發明之目的在於提供一光罩清潔設備,該光罩清潔設備對於光罩護膜具有極佳的除塵效果,且在取出該光罩的過程中還能避免外部的汙染粒子附著於該光罩護膜上。 The purpose of the present invention is to provide a mask cleaning device, which has an excellent dust removal effect on the mask film, and can prevent external pollution particles from adhering to the mask during the process of taking out the mask on the protective film.
本發明之光罩清潔設備應用於一光罩盒,光罩盒包括一上蓋及一底盤,底盤上供容置一光罩,光罩具有一光罩護膜,光罩清潔設備包括一主殼體、一次殼體、一光罩開蓋裝置、一運送裝置及至少一風刀裝置,次殼體是連結該主殼體。其中,光罩開蓋裝置包括一升降元件及一開蓋元件,開蓋元件是包括一後 背連結部及一罩蓋部,而升降元件是用以升降該後背連結部與罩蓋部。此外,罩蓋部是嵌入於次殼體內,罩蓋部與後背連結部形成一光罩入口,且上蓋是抵靠於罩蓋部上。另外,運送裝置包括一滑軌及一光罩盒乘載台。光罩盒乘載台是經由滑軌移動到該光罩入口,且底盤設置於光罩盒乘載台上。此外,風刀裝置是用以產生一氣流至該光罩護膜。其中,當升降元件上升開蓋元件時,該上蓋、該罩蓋部、該主殼體及該次殼體形成一密閉空間。 The mask cleaning device of the present invention is applied to a mask box. The mask box includes an upper cover and a bottom plate. A mask is accommodated on the bottom plate. The mask has a mask protective film. The mask cleaning device includes a main shell. A body, a primary casing, a mask opening device, a conveying device and at least one air knife device, and the secondary casing is connected to the main casing. Wherein, the mask opening device includes a lifting element and a cover opening element, and the cover opening element includes a rear The back connecting part and a cover part are used for lifting and lowering the back connecting part and the cover part. In addition, the cover part is embedded in the sub-casing, the cover part and the back connecting part form a mask entrance, and the upper cover is abutted on the cover part. In addition, the transporting device includes a slide rail and a photomask box mounting platform. The reticle carrier is moved to the reticle entrance via the slide rail, and the chassis is set on the reticle carrier. In addition, the air knife device is used to generate an air flow to the photomask protective film. Wherein, when the lifting element lifts up to open the cover element, the upper cover, the cover part, the main casing and the secondary casing form a closed space.
在上所述之光罩清潔設備,其中,風刀裝置包括一方位調整元件及一風刀噴嘴,風刀噴嘴是連結該方位調整元件。 In the above-mentioned mask cleaning equipment, the air knife device includes an orientation adjustment element and an air knife nozzle, and the air knife nozzle is connected to the orientation adjustment element.
在上所述之光罩清潔設備,其中,方位調整元件包括一第一軸心,該風刀噴嘴包括一第二軸心,且第一軸心垂直於第二軸心。 In the above-mentioned mask cleaning device, the azimuth adjustment element includes a first axis, the air knife nozzle includes a second axis, and the first axis is perpendicular to the second axis.
在上所述之光罩清潔設備,其中,該風刀裝置的數量為多個,且這些風刀裝置排列成ㄇ字型。 In the above-mentioned mask cleaning equipment, the number of the air knife devices is multiple, and these air knife devices are arranged in a ㄇ shape.
在上所述之光罩清潔設備,還包括一靜電中和裝置,該靜電中和裝置以多個α粒子製造出多個帶電粒子,且這些帶電粒子經由一乾淨氣體傳送至該光罩護膜。 The above-mentioned photomask cleaning equipment further includes an electrostatic neutralization device, which produces a plurality of charged particles with a plurality of alpha particles, and the charged particles are transmitted to the photomask protective film through a clean gas .
在上所述之光罩清潔設備,其中,該底盤包括一旋轉開關,該光罩盒乘載台包括一旋轉單元,該旋轉單元對應於該旋轉開關。 In the reticle cleaning apparatus described above, wherein the chassis includes a rotary switch, and the reticle pod mount includes a rotary unit corresponding to the rotary switch.
在上所述之光罩清潔設備,還包括一超音波共振裝置,該超音波共振裝置用以產生一超音波至該光罩護膜。 The above-mentioned photomask cleaning device further includes an ultrasonic resonance device for generating an ultrasonic wave to the photomask protective film.
在上所述之光罩清潔設備,還包括至少一流量控制裝置,該流量控制裝置用以控制進入該風刀噴嘴的氣流量。 The above-mentioned mask cleaning apparatus further includes at least one flow control device for controlling the flow of air entering the air knife nozzle.
在上所述之光罩清潔設備,該超音波的頻率是不小於20kHz。在上所述之光罩清潔設備,該超音波共振裝置包括一高度調整平台及一超音波震盪頭,超音波震盪頭是連結高度調整平台。 In the above-mentioned mask cleaning equipment, the frequency of the ultrasonic wave is not less than 20kHz. In the above-mentioned mask cleaning equipment, the ultrasonic resonance device includes a height adjustment platform and an ultrasonic vibration head, and the ultrasonic vibration head is connected to the height adjustment platform.
在上所述之光罩清潔設備,還包括一光罩護膜監測裝置,光罩護膜監測裝置用以監測該光罩護膜的振幅。 The above-mentioned reticle cleaning equipment further includes a reticle film monitoring device, which is used for monitoring the amplitude of the reticle film.
在上所述之光罩清潔設備,還包括至少一空氣過濾裝置,該空氣過濾裝置用以過濾該主殼體內的污染粒子。 The above-mentioned mask cleaning apparatus further includes at least one air filter device for filtering the contamination particles in the main casing.
本發明之另一目的在於提供一光罩清潔方法,光罩清潔方法對於光罩護膜具有極佳的除塵效果,且在取出該光罩的過程中還能避免外部的汙染粒子附著於光罩護膜上。 Another object of the present invention is to provide a mask cleaning method, which has an excellent dust removal effect on the mask film, and can prevent external pollution particles from adhering to the mask during the process of taking out the mask on the protective film.
本發明之光罩清潔方法是應用於上所述之光罩清潔設備,該光罩清潔方法包括下列步驟。首先,放置一光罩盒至該光罩入口,光罩盒包括一上蓋及一底盤,且底盤上供容置一光罩。之後,將上蓋與底盤分離開來,以使光罩盒乘載台只乘載底盤與光罩。之後,將底盤與光罩移動至主殼體內。之後,產生一氣流至該光罩的一光罩護膜。之後,將底盤與光罩送回該光罩入口。之後,將上蓋與底盤進行結合,以使光罩收納至該光罩盒內。 The mask cleaning method of the present invention is applied to the above-mentioned mask cleaning equipment, and the mask cleaning method includes the following steps. First, place a mask box to the mask entrance, the mask box includes an upper cover and a bottom plate, and the bottom plate is used for accommodating a mask. After that, the upper cover and the chassis are separated, so that only the chassis and the photomask are carried on the reticle pod loading platform. After that, move the chassis and photomask into the main housing. Afterwards, an airflow is generated to a reticle cover of the reticle. Afterwards, return the chassis and reticle to the reticle inlet. After that, the upper cover is combined with the chassis, so that the photomask is accommodated in the photomask box.
在上所述之光罩清潔方法,還包括一靜電中和步驟,以多個α粒子製造出多個帶電粒子,且這些帶電粒子經由一乾淨氣體傳送至該光罩護膜。 The above-mentioned photomask cleaning method further includes an electrostatic neutralization step, wherein a plurality of alpha particles are used to produce a plurality of charged particles, and the charged particles are transmitted to the photomask protective film through a clean gas.
在上所述之光罩清潔方法,還包括一超音波共振步驟,用以產生一超音波至光罩護膜。 The above-mentioned photomask cleaning method further includes an ultrasonic resonance step for generating an ultrasonic wave to the photomask protective film.
本發明具有下述優點:具有極佳的除塵效果,且在取出該光罩的過程中還能避免外部的汙染粒子附著於該光罩護膜上。 The invention has the following advantages: it has excellent dust removal effect, and can prevent external pollution particles from adhering to the protective film of the photomask during the process of taking out the photomask.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, preferred embodiments are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings.
10:光罩清潔設備 10: Reticle cleaning equipment
11:主殼體 11: Main shell
12:次殼體 12: Secondary shell
13:光罩開蓋裝置 13: Photomask opening device
131:升降元件 131: Lifting components
132:開蓋元件 132: Open cover element
132B:後背連結部 132B: Back joint
132C:罩蓋部 132C: Cover part
132E:光罩入口 132E: reticle entrance
14:運送裝置 14: Transporter
141:滑軌 141: Slide rail
142:光罩盒乘載台 142: Reticle Cassette Mounting Stage
142S:旋轉單元 142S: Rotary unit
15:風刀裝置 15: Air knife device
151:方位調整元件 151: Azimuth adjustment element
151A:第一軸心 151A: The first axis
152:風刀噴嘴 152: Air Knife Nozzle
152A:第二軸心 152A: Second axis
16:靜電中和裝置 16: Static neutralization device
161:離子噴嘴 161: Ion nozzle
162:α電離器 162: Alpha Ionizer
17:超音波共振裝置 17: Ultrasonic resonance device
171:高度調整平台 171: Height Adjustment Platform
172:超音波震盪頭 172: Ultrasonic Concussion Head
18:流量控制裝置 18: Flow control device
19:光罩護膜監測裝置 19:Reticle film monitoring device
21:空氣過濾裝置 21: Air filter device
8:光罩盒 8: Photomask box
81:上蓋 81: upper cover
81T:卡榫座 81T: Tenon seat
82:底盤 82: Chassis
82T:卡榫 82T: Tenon
82S:旋轉開關 82S: Rotary switch
83:光罩 83: Photomask
83F:光罩護膜 83F: Photomask Protector
S1~S8:步驟 S1~S8: Steps
圖1A所繪示為風刀裝置、運送裝置、超音波共振裝置、靜電中和裝置及流量控制裝置位於主殼體內的示意圖。 FIG. 1A is a schematic diagram illustrating that the air knife device, the conveying device, the ultrasonic resonance device, the electrostatic neutralization device and the flow control device are located in the main casing.
圖1B所繪示為光罩清潔設備的立體圖。 FIG. 1B is a perspective view of the mask cleaning apparatus.
圖1C所繪示為光罩盒的上蓋及底盤的立體圖。 FIG. 1C is a perspective view of the top cover and the chassis of the photomask box.
圖1D所繪示為光罩盒底面的示意圖。 FIG. 1D is a schematic view of the bottom surface of the photomask box.
圖2A所繪示為光罩開蓋裝置的示意圖。 FIG. 2A is a schematic diagram of a mask opening device.
圖2B所繪示為開蓋元件上升時的示意圖。 FIG. 2B is a schematic diagram of the cover-opening element rising.
圖3A所繪示為運送裝置的示意圖。 FIG. 3A is a schematic diagram of the transport device.
圖3B所繪示為光罩盒嵌入於光罩入口的示意圖。 FIG. 3B is a schematic view of the mask box embedded in the mask inlet.
圖3C所繪示為開蓋元件開啟上蓋的示意圖。 FIG. 3C is a schematic diagram of the cover opening element opening the upper cover.
圖3D所繪示為底盤設置於光罩盒乘載台的示意圖。 FIG. 3D is a schematic diagram illustrating that the chassis is disposed on the photomask pod loading platform.
圖4所繪示為底盤與光罩移動至主殼體內的示意圖。 FIG. 4 is a schematic diagram illustrating the movement of the chassis and the photomask into the main housing.
圖5所繪示為三組風刀裝置的示意圖。 FIG. 5 is a schematic diagram of three sets of air knife devices.
圖6所繪示為靜電中和裝置的示意圖。 FIG. 6 is a schematic diagram of an electrostatic neutralization device.
圖7所繪示為超音波共振裝置的示意圖。 FIG. 7 is a schematic diagram of an ultrasonic resonance device.
圖8所繪示為本實施例之光罩清潔方法的流程圖。 FIG. 8 is a flowchart of the mask cleaning method of the present embodiment.
圖9所繪示為另一實施例之光罩清潔方法的流程圖。 FIG. 9 is a flowchart illustrating a method for cleaning a photomask according to another embodiment.
請參閱圖1A、圖1B、圖1C及圖1D,圖1A所繪示為風刀裝置15、運送裝置14、超音波共振裝置17、靜電中和裝置16及流量控制裝置18位於主殼體11內的示意圖,圖1B所繪示為光罩清潔設備10的立體圖,圖1C所繪示為光罩盒8的上蓋81及底盤82的立體圖,圖1D所繪示為光罩盒8底面的示意圖。本實施例之光罩清潔設備10是應用於一光罩盒8,光罩盒8包括一上蓋81及一底盤82,上蓋81是包括多個卡榫座81T,底盤82的側邊是包括多個卡榫82T,相鄰的卡榫82T是對應一個卡榫座81T。並且,底盤82的底面是包括一旋轉開關82S。其中,當上蓋81結
合於底盤82時,底盤82是被上蓋81所覆蓋住,且卡榫82T是嵌入於所對應的卡榫座81T內。此外,底盤82的上方是供容置一光罩83,光罩83上具有一光罩護膜83F。
Please refer to FIGS. 1A , 1B, 1C and 1D. FIG. 1A shows that the
本實施例之光罩清潔設備10包括一主殼體11、一次殼體12、一光罩開蓋裝置13、一運送裝置14、三組風刀裝置15、一靜電中和裝置16、一超音波共振裝置17、多個流量控制裝置18、一光罩護膜監測裝置19及多個空氣過濾裝置21,次殼體12是連結主殼體11,且次殼體12與主殼體11相互導通。其中,風刀裝置15、靜電中和裝置16、超音波共振裝置17、流量控制裝置18及光罩護膜監測裝置19是設置於主殼體11內,運送裝置14所設置位置則是橫跨了主殼體11及次殼體12。
The
請再次參閱圖1B及同時請參閱圖2A及圖2B,圖2A所繪示為光罩開蓋裝置13的示意圖,圖2B所繪示為開蓋元件132上升時的示意圖。光罩開蓋裝置13包括一升降元件131及一開蓋元件132,開蓋元件132是包括一後背連結部132B及一罩蓋部132C,後背連結部132B是連結罩蓋部132C,且罩蓋部132C的外觀呈ㄇ字型隔板的態樣。值得注意的是,升降元件131是用以上升或下降後背連結部132B與罩蓋部132C。此外,光罩開蓋裝置13的罩蓋部132C是嵌入於次殼體12內,罩蓋部132C與後背連結部132B會形成一光罩入口132E,光罩入口132E便是光罩盒8所擺放的位置區域。
Please refer to FIG. 1B and FIGS. 2A and 2B again. FIG. 2A is a schematic diagram of the
請參閱圖3A及圖3B,圖3A所繪示為運送裝置14的示意圖,圖3B所繪示為光罩盒8嵌入於光罩入口132E的示意圖。運送裝置14包括一滑軌141及一光罩盒乘載台142,滑軌141的其中一端在主殼體11內,滑軌141的另一端在次殼體12內,而光罩盒乘載台142是包括一旋轉單元142S,旋轉單元142S是對應於底盤82的旋轉開關82S。詳細來說,當旋轉單元142S轉開旋轉開關82S時,卡榫82T是縮入於底盤82內,其沒有嵌入於所對應的卡榫座81T內。這樣一來,才能將光罩盒8的上蓋81及底盤82分隔開來。
Please refer to FIGS. 3A and 3B , FIG. 3A is a schematic diagram of the
此外,光罩盒乘載台142是以可移動的方式連結滑軌141,所以光罩盒乘載台142能透過滑軌141移動到光罩入口132E處。具體來說,當光罩盒乘載台142經由滑軌141移動到次殼體12內時,光罩盒乘載台142會顯露於光罩入口132E(請再次參閱圖1B)。這樣一來,光罩盒8便能設置於光罩盒乘載台142上(光罩盒8是透過底盤82設置於光罩盒乘載台142上)。
In addition, since the pod mounting table 142 is movably connected to the
請參閱圖3C,圖3C所繪示為開蓋元件132開啟上蓋81的示意圖,當光罩盒8設置於光罩盒乘載台142上時,光罩盒8的上蓋81是抵靠於罩蓋部132C上。因此,光罩清潔設備10要從光罩盒8露出光罩83時,旋轉單元142S會轉開旋轉開關82S且升降元件131也會立即上升後背連結部132B,上蓋81便會隨著罩蓋部132C往上升起。之後,上蓋81會與底盤82分離開來,此刻的光罩盒乘載台142只乘載底盤82與底盤82上方的光罩83(請參閱圖3D)。
Please refer to FIG. 3C . FIG. 3C is a schematic diagram of the
請再次參閱圖3C及同時參閱圖4,圖4所繪示為底盤82與光罩83移動至主殼體11內的示意圖。值得注意的是,當升降元件131上升後背連結部132B後,運送裝置14也會經由光罩盒乘載台142將底盤82與光罩83移動至主殼體11內,也就是將光罩83移動到風刀裝置15、靜電中和裝置16及超音波共振裝置17的下方處。並且,當光罩盒8的上蓋81與罩蓋部132C往上升起,上蓋81、罩蓋部132C、主殼體11及次殼體12會形成一密閉空間。這樣一來,光罩清潔設備10在取出光罩83的過程中便能避免外部的汙染粒子附著於光罩護膜83F上。此外,在清潔光罩護膜83F時,也能確保光罩護膜83F在該密閉空間內。
Please refer to FIG. 3C and FIG. 4 again. FIG. 4 is a schematic diagram illustrating the movement of the
請再次參閱圖4及同時參閱圖5,圖5所繪示為三組風刀裝置15的示意圖。風刀裝置15包括一方位調整元件151及一風刀噴嘴152,風刀噴嘴152是連結方位調整元件151。其中,方位調整元件151包括一第一軸心151A,而風刀噴嘴152包括一第二軸心152A,第一軸心151A是垂直於第二軸心152A。因此,經由第一軸心
151A及第二軸心152A可將風刀噴嘴152進行上下移動、左右移動及旋轉變化,以達成風刀裝置15調整高低或左右位置及旋轉角度。
Please refer to FIG. 4 and FIG. 5 again. FIG. 5 is a schematic diagram of three sets of
此外,風刀裝置15是用以產生一氣流至光罩護膜83F,以藉由該氣流將汙染粒子吹離光罩護膜83F。具體來說,該氣流是從風刀噴嘴152所噴射而出,且風刀噴嘴152能經由方位調整元件151改變該氣流的噴射角度。因此,風刀裝置15可依據不同光罩83的厚度(即光罩護膜83F的位置)進行調整,以達到最佳除塵效果。
In addition, the
另外,本實施例之光罩清潔設備10是具有三組風刀裝置15,此三組風刀裝置15被排列成ㄇ字型。如此一來,兩組側向的風刀裝置15對於側向立面之物體會具有極佳的除塵效果。
In addition, the
此外,每一個流量控制裝置18是對應一個風刀噴嘴152,流量控制裝置18是用以控制進入風刀噴嘴152的氣流量。這樣一來,有利於風刀噴嘴152使用最佳的氣流量進行除塵,達到最好的除塵效果。
In addition, each
請再次參閱圖4及同時參閱圖6,圖6所繪示為靜電中和裝置16的示意圖。靜電中和裝置16是包括一α電離器162及多個離子噴嘴161,α電離器162是用以產生多個α粒子。之後,靜電中和裝置16經由這些α粒子製造出多個帶電粒子,且這些帶電粒子再經由離子噴嘴161傳送至光罩護膜83F,使得汙染粒子容易與光罩護膜83F分離開來。其中,靜電中和裝置16是利用風力(乾淨氣體)將帶電粒子快速到達光罩護膜83F表面,所以相較於傳統的靜電中和裝置更能有效除靜電。
Please refer to FIG. 4 and FIG. 6 again. FIG. 6 is a schematic diagram of the
請再次參閱圖4及同時參閱圖7,圖7所繪示為超音波共振裝置17的示意圖。超音波共振裝置17是包括一高度調整平台171及一超音波震盪頭172,超音波震盪頭172是連結高度調整平台171,而高度調整平台171是用以調整超音波震盪頭172的高度位置。在本實施例中,超音波共振裝置17是經由超音波震盪頭172產生一超音波至光罩護膜83F,以使光罩護膜83F及依附在光罩護膜83F上的汙染粒
子產生共振。如此一來,汙染粒子容易從光罩護膜83F掉落到外部。上述中,該超音波的頻率是不小於20kHz,且該超音波的最佳的頻率約為35kHz。
Please refer to FIG. 4 and FIG. 7 again. FIG. 7 is a schematic diagram of the
此外,風刀裝置15、靜電中和裝置16及超音波共振裝置17皆是位於光罩盒乘載台142上方,所以風刀裝置15、靜電中和裝置16及超音波共振裝置17能同時對光罩護膜83F進行除塵。並且,透過光罩盒乘載台142在滑軌141上來回移動,更能增加清潔光罩護膜83F的功效。
In addition, the
另外,光罩護膜監測裝置19是設置在超音波共振裝置17的旁側。值得注意的是,光罩護膜監測裝置19是用以監測光罩護膜83F的振幅。這樣一來,防止因超音波振動造成光罩護膜83F的振動過大,導致光罩護膜83F損壞。
In addition, the
此外,空氣過濾裝置21是設置流量控制裝置18旁側,空氣過濾裝置21是用以過濾該污染粒子,以減少光罩清潔設備10內的汙染物。
In addition, the
在本實施例中,當光罩護膜83F完成清潔程序時,運送裝置14還會將底盤82連同光罩83送回光罩入口132E,也就是光罩盒8的開蓋處。接著,光罩開蓋裝置13再將上蓋81與底盤82結合,且旋轉單元142S會鎖固旋轉開關82S,以使光罩83再度收納於光罩盒8內。
In this embodiment, when the reticle
綜上所述,光罩清潔設備10經由風刀裝置15、靜電中和裝置16及超音波共振裝置17對於光罩護膜83F具有極佳的除塵效果,且在取出光罩83與收納光罩83的過程中還能避免外部的汙染粒子附著於光罩護膜83F上。
In conclusion, the
請參閱圖8,圖8所繪示為本實施例之光罩清潔方法的流程圖。本實施例之光罩清潔方法是應用於光罩清潔設備10,光罩清潔方法包括下列步驟。首先,請參閱圖1C、圖3B及步驟S1,放置一光罩盒8至光罩入口132E,光罩盒8包括一上蓋81及一底盤82,且底盤82上供容置一光罩83。
Please refer to FIG. 8 . FIG. 8 is a flowchart of the mask cleaning method of the present embodiment. The mask cleaning method of this embodiment is applied to the
之後,請參閱圖3C、圖3D及步驟S2,將上蓋81與底盤82分離開來,以使光罩盒乘載台142只乘載底盤82與光罩83。詳細來說,上蓋81與底盤82是經由開蓋元件132開啟分離。
Then, referring to FIGS. 3C , 3D and step S2 , the
之後,請參閱圖4及步驟S3,經由運送裝置14將底盤82與光罩83移動至主殼體11內。
After that, referring to FIG. 4 and step S3 , the
之後,請參閱圖6及步驟S4,步驟S4是相當於一靜電中和步驟,經由靜電中和裝置16以多個α粒子製造出多個帶電粒子,且這些帶電粒子經由一乾淨氣體傳送至光罩83的一光罩護膜83F,以使汙染粒子容易與光罩護膜83F分離開來。
After that, please refer to FIG. 6 and step S4. Step S4 is equivalent to an electrostatic neutralization step. A plurality of charged particles are produced by a plurality of α particles through the
之後,請參閱圖7及步驟S5,步驟5是相當於一超音波共振步驟,經由超音波共振裝置17產生一超音波至光罩護膜83F,以使光罩護膜83F及依附在光罩護膜83F上的汙染粒子產生共振。因此,汙染粒子容易從光罩護膜83F掉落到外部。
After that, please refer to FIG. 7 and step S5, step 5 is equivalent to an ultrasonic resonance step, and an ultrasonic wave is generated to the photomask
之後,請參閱圖5及步驟S6,經由多個風刀裝置15產生一氣流至光罩護膜83F,以使汙染粒子吹離光罩護膜83F。
Afterwards, referring to FIG. 5 and step S6 , a plurality of
之後,請參閱步驟S7,經由運送裝置14將底盤82與光罩83送回光罩入口132E處。
After that, referring to step S7 , the
之後,請參閱步驟S8,經由開蓋元件132將上蓋81與底盤82進行結合,以使光罩83收納至光罩盒8內。
After that, referring to step S8 , the
在上述的光罩清潔方法中,是依序進行步驟S4、步驟S5及步驟S6。然而,在其他的實施例中,也能同時執行步驟S4、步驟S5及步驟S6(請參閱圖9)。具體來說,風刀裝置15、靜電中和裝置16及超音波共振裝置17能同時對光罩護膜83F進行除塵,不需要依序分別執行。並且,在其他的實施例中,還能將光罩盒乘載台142於主殼體11內來回移動數次。如此一來,相當於上述的步驟S4、步驟S5及步驟S6都被重複執行多次,更有利於清潔光罩護膜83F。
In the above-mentioned mask cleaning method, step S4, step S5 and step S6 are performed in sequence. However, in other embodiments, step S4 , step S5 and step S6 can also be performed simultaneously (please refer to FIG. 9 ). Specifically, the
綜上所述,本實施例之光罩清潔方法藉由光罩清潔設備10的風刀裝置15、靜電中和裝置16及超音波共振裝置17對於光罩護膜83F具有極佳的除塵效果,且本方法還會將清潔後的光罩83收納回原本的光罩盒8內。
To sum up, the mask cleaning method of this embodiment has an excellent dust removal effect on the mask
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.
10:光罩清潔設備 10: Reticle cleaning equipment
11:主殼體 11: Main shell
12:次殼體 12: Secondary shell
132:開蓋元件 132: Open cover element
132B:後背連結部 132B: Back joint
132C:罩蓋部 132C: Cover part
14:運送裝置 14: Transporter
142:光罩盒乘載台 142: Reticle Cassette Mounting Stage
15:風刀裝置 15: Air knife device
16:靜電中和裝置 16: Static neutralization device
17:超音波共振裝置 17: Ultrasonic resonance device
18:流量控制裝置 18: Flow control device
19:光罩護膜監測裝置 19:Reticle film monitoring device
81:上蓋 81: upper cover
82:底盤 82: Chassis
83:光罩 83: Photomask
Claims (15)
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TW201011458A (en) * | 2008-09-09 | 2010-03-16 | Gudeng Prec Industral Co Ltd | A reticle clean device |
TW201624107A (en) * | 2014-12-25 | 2016-07-01 | 台灣積體電路製造股份有限公司 | Photomask cleaning apparatus and method |
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