TWI574785B - 內扣環及外扣環 - Google Patents
內扣環及外扣環 Download PDFInfo
- Publication number
- TWI574785B TWI574785B TW102108272A TW102108272A TWI574785B TW I574785 B TWI574785 B TW I574785B TW 102108272 A TW102108272 A TW 102108272A TW 102108272 A TW102108272 A TW 102108272A TW I574785 B TWI574785 B TW I574785B
- Authority
- TW
- Taiwan
- Prior art keywords
- region
- ring
- inner ring
- annular
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 152
- 238000005498 polishing Methods 0.000 claims description 53
- 238000000227 grinding Methods 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 description 34
- 239000010408 film Substances 0.000 description 15
- 239000002002 slurry Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 230000007717 exclusion Effects 0.000 description 7
- 239000000945 filler Substances 0.000 description 5
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37164410P | 2010-08-06 | 2010-08-06 | |
| US201161479271P | 2011-04-26 | 2011-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201323153A TW201323153A (zh) | 2013-06-16 |
| TWI574785B true TWI574785B (zh) | 2017-03-21 |
Family
ID=45556486
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100127991A TWI540021B (zh) | 2010-08-06 | 2011-08-05 | 以扣環調校基板邊緣 |
| TW102108272A TWI574785B (zh) | 2010-08-06 | 2011-08-05 | 內扣環及外扣環 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100127991A TWI540021B (zh) | 2010-08-06 | 2011-08-05 | 以扣環調校基板邊緣 |
Country Status (8)
| Country | Link |
|---|---|
| US (5) | US20120034848A1 (enExample) |
| EP (2) | EP3406402B1 (enExample) |
| JP (2) | JP6073222B2 (enExample) |
| KR (3) | KR101701870B1 (enExample) |
| CN (2) | CN103252715B (enExample) |
| SG (2) | SG10201506082UA (enExample) |
| TW (2) | TWI540021B (enExample) |
| WO (1) | WO2012019144A2 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6073222B2 (ja) | 2010-08-06 | 2017-02-01 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 保定リングを用いた基板縁部調整 |
| US20130102152A1 (en) * | 2011-10-20 | 2013-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
| JP5976522B2 (ja) | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| US10702972B2 (en) | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
| US10532441B2 (en) * | 2012-11-30 | 2020-01-14 | Applied Materials, Inc. | Three-zone carrier head and flexible membrane |
| US9381613B2 (en) * | 2013-03-13 | 2016-07-05 | Applied Materials, Inc. | Reinforcement ring for carrier head |
| JP6403981B2 (ja) * | 2013-11-13 | 2018-10-10 | 株式会社荏原製作所 | 基板保持装置、研磨装置、研磨方法、およびリテーナリング |
| KR102173323B1 (ko) * | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
| JP2016155188A (ja) * | 2015-02-24 | 2016-09-01 | 株式会社荏原製作所 | リテーナリング、基板保持装置、研磨装置およびリテーナリングのメンテナンス方法 |
| US9488218B2 (en) | 2015-03-30 | 2016-11-08 | Honeywell International Inc. | Pilot ring with controlled axial roll |
| JP6392193B2 (ja) * | 2015-10-14 | 2018-09-19 | 株式会社荏原製作所 | 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法 |
| US10029346B2 (en) * | 2015-10-16 | 2018-07-24 | Applied Materials, Inc. | External clamp ring for a chemical mechanical polishing carrier head |
| US10160091B2 (en) * | 2015-11-16 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMP polishing head design for improving removal rate uniformity |
| JP7250311B2 (ja) * | 2016-04-01 | 2023-04-03 | モ カン，ジューン | 基板収容部材を備える化学機械的な研磨装置用のキャリアヘッド |
| JP7021863B2 (ja) * | 2017-03-30 | 2022-02-17 | 富士紡ホールディングス株式会社 | 保持具 |
| CN109551365B (zh) * | 2019-01-15 | 2023-12-08 | 合肥哈工普利世智能装备有限公司 | 等离子抛光夹持组件、等离子抛光机及其抛光方法 |
| US11344991B2 (en) | 2019-02-28 | 2022-05-31 | Applied Materials, Inc. | Retainer for chemical mechanical polishing carrier head |
| US11325223B2 (en) | 2019-08-23 | 2022-05-10 | Applied Materials, Inc. | Carrier head with segmented substrate chuck |
| US11511390B2 (en) | 2019-08-30 | 2022-11-29 | Applied Materials, Inc. | Pivotable substrate retaining ring |
| KR102735236B1 (ko) | 2020-06-29 | 2024-11-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 다수의 각도적 가압 가능한 구역들을 갖는 연마 캐리어 헤드 |
| WO2022040459A1 (en) * | 2020-08-21 | 2022-02-24 | Applied Materials, Inc. | Improved retaining ring design |
| US11440159B2 (en) * | 2020-09-28 | 2022-09-13 | Applied Materials, Inc. | Edge load ring |
| US11623321B2 (en) * | 2020-10-14 | 2023-04-11 | Applied Materials, Inc. | Polishing head retaining ring tilting moment control |
| JP7536601B2 (ja) * | 2020-11-04 | 2024-08-20 | 株式会社荏原製作所 | 研磨ヘッドおよび研磨装置 |
| US11660721B2 (en) * | 2021-02-18 | 2023-05-30 | Applied Materials, Inc. | Dual loading retaining ring |
| KR102556166B1 (ko) | 2022-01-28 | 2023-07-19 | 지앤에스건설 주식회사 | 플로팅 인테리어 계단 시공방법 및 그 방법으로 시공된 플로팅 인테리어 계단 |
| US20230356354A1 (en) * | 2022-05-03 | 2023-11-09 | Applied Materials, Inc. | Compliant inner ring for a chemical mechanical polishing system |
| US20230356355A1 (en) * | 2022-05-03 | 2023-11-09 | Applied Materials, Inc. | Polishing head with local inner ring downforce control |
| US20230381915A1 (en) * | 2022-05-27 | 2023-11-30 | Applied Materials, Inc. | Operation of clamping retainer for chemical mechanical polishing |
| KR102630907B1 (ko) | 2022-08-24 | 2024-01-30 | 임형남 | 이중나선계단 다가구주택 |
| US20250100105A1 (en) * | 2023-09-27 | 2025-03-27 | Applied Materials, Inc. | Cmp inner ring in smart head |
| CN117484382A (zh) * | 2023-11-14 | 2024-02-02 | 北京子牛亦东科技有限公司 | 一种用于化学机械研磨设备的研磨头的隔膜 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201000257A (en) * | 2006-11-22 | 2010-01-01 | Applied Materials Inc | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW400567B (en) * | 1995-04-10 | 2000-08-01 | Matsushita Electric Industrial Co Ltd | The polishing device and its polishing method for the substrate |
| US5795215A (en) * | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
| US5643061A (en) * | 1995-07-20 | 1997-07-01 | Integrated Process Equipment Corporation | Pneumatic polishing head for CMP apparatus |
| US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
| JPH09321002A (ja) * | 1996-05-31 | 1997-12-12 | Komatsu Electron Metals Co Ltd | 半導体ウェハの研磨方法およびその研磨用テンプレー ト |
| US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
| US6110025A (en) * | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
| DE69813374T2 (de) * | 1997-05-28 | 2003-10-23 | Tokyo Seimitsu Co. Ltd., Mitaka | Halbleiterscheibe Poliervorrichtung mit Halterring |
| US6116992A (en) * | 1997-12-30 | 2000-09-12 | Applied Materials, Inc. | Substrate retaining ring |
| KR100550034B1 (ko) * | 1998-04-06 | 2006-02-08 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
| US6143127A (en) * | 1998-05-14 | 2000-11-07 | Applied Materials, Inc. | Carrier head with a retaining ring for a chemical mechanical polishing system |
| US6436228B1 (en) | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
| US20020173242A1 (en) * | 1999-04-19 | 2002-11-21 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| TW467795B (en) * | 1999-03-15 | 2001-12-11 | Mitsubishi Materials Corp | Wafer transporting device, wafer polishing device and method for making wafers |
| US6527624B1 (en) * | 1999-03-26 | 2003-03-04 | Applied Materials, Inc. | Carrier head for providing a polishing slurry |
| KR100546288B1 (ko) * | 1999-04-10 | 2006-01-26 | 삼성전자주식회사 | 화학 기계적 폴리싱 장치 |
| JP3873557B2 (ja) * | 2000-01-07 | 2007-01-24 | 株式会社日立製作所 | 半導体装置の製造方法 |
| US6517422B2 (en) * | 2000-03-07 | 2003-02-11 | Toshiba Ceramics Co., Ltd. | Polishing apparatus and method thereof |
| US6375549B1 (en) * | 2000-03-17 | 2002-04-23 | Motorola, Inc. | Polishing head for wafer, and method for polishing |
| US6558232B1 (en) * | 2000-05-12 | 2003-05-06 | Multi-Planar Technologies, Inc. | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
| US6602114B1 (en) * | 2000-05-19 | 2003-08-05 | Applied Materials Inc. | Multilayer retaining ring for chemical mechanical polishing |
| JP2002018709A (ja) | 2000-07-05 | 2002-01-22 | Tokyo Seimitsu Co Ltd | ウェーハ研磨装置 |
| US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
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| KR20070118277A (ko) * | 2005-04-12 | 2007-12-14 | 니혼 세이미츠 덴시 가부시키가이샤 | Ｃｍｐ 장치용 리테이너링과 그 제조방법 및 ｃｍｐ 장치 |
| US7186171B2 (en) * | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
| KR200395968Y1 (ko) * | 2005-06-16 | 2005-09-15 | 주식회사 윌비에스엔티 | 화학적기계 연마장치의 리테이너 링 |
| US7198548B1 (en) * | 2005-09-30 | 2007-04-03 | Applied Materials, Inc. | Polishing apparatus and method with direct load platen |
| US7727055B2 (en) * | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
| US7699688B2 (en) * | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
| US7654888B2 (en) | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
| JP2008302464A (ja) * | 2007-06-07 | 2008-12-18 | Renesas Technology Corp | 研磨装置およびそれを用いた半導体装置の製造方法 |
| JP2008307674A (ja) | 2007-06-18 | 2008-12-25 | Tokyo Seimitsu Co Ltd | 分割加圧型リテーナリング |
| JP5199691B2 (ja) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置 |
| US7749052B2 (en) * | 2008-09-08 | 2010-07-06 | Applied Materials, Inc. | Carrier head using flexure restraints for retaining ring alignment |
| JP6073222B2 (ja) | 2010-08-06 | 2017-02-01 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 保定リングを用いた基板縁部調整 |
| US20130102152A1 (en) * | 2011-10-20 | 2013-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
-
2011
- 2011-08-05 JP JP2013523375A patent/JP6073222B2/ja active Active
- 2011-08-05 WO PCT/US2011/046828 patent/WO2012019144A2/en not_active Ceased
- 2011-08-05 US US13/204,541 patent/US20120034848A1/en not_active Abandoned
- 2011-08-05 CN CN201310170453.4A patent/CN103252715B/zh active Active
- 2011-08-05 CN CN201180044017.1A patent/CN103098182B/zh active Active
- 2011-08-05 KR KR1020137005683A patent/KR101701870B1/ko active Active
- 2011-08-05 KR KR1020137006070A patent/KR101814185B1/ko active Active
- 2011-08-05 SG SG10201506082UA patent/SG10201506082UA/en unknown
- 2011-08-05 EP EP18181304.9A patent/EP3406402B1/en active Active
- 2011-08-05 EP EP11815393.1A patent/EP2601677B1/en active Active
- 2011-08-05 US US13/204,571 patent/US8721391B2/en active Active
- 2011-08-05 SG SG2013009766A patent/SG187782A1/en unknown
- 2011-08-05 KR KR1020177037347A patent/KR101882708B1/ko active Active
- 2011-08-05 TW TW100127991A patent/TWI540021B/zh active
- 2011-08-05 TW TW102108272A patent/TWI574785B/zh active
-
2013
- 2013-02-08 US US13/762,963 patent/US8840446B2/en active Active
- 2013-06-26 JP JP2013134227A patent/JP5924739B2/ja active Active
-
2015
- 2015-12-03 US US14/958,814 patent/US10022837B2/en active Active
-
2018
- 2018-06-25 US US16/017,689 patent/US11173579B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201000257A (en) * | 2006-11-22 | 2010-01-01 | Applied Materials Inc | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
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