TWI574115B - 用於投射微影之照射光學單元 - Google Patents

用於投射微影之照射光學單元 Download PDF

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Publication number
TWI574115B
TWI574115B TW101124746A TW101124746A TWI574115B TW I574115 B TWI574115 B TW I574115B TW 101124746 A TW101124746 A TW 101124746A TW 101124746 A TW101124746 A TW 101124746A TW I574115 B TWI574115 B TW I574115B
Authority
TW
Taiwan
Prior art keywords
mirror
illumination
optical unit
conical
mirror device
Prior art date
Application number
TW101124746A
Other languages
English (en)
Chinese (zh)
Other versions
TW201321902A (zh
Inventor
克理斯多弗 漢納克斯
印哥 翔杰
約格 季摩曼
喬哈尼斯 勞夫
馬丁 米耶禾
法蘭克 斯克勒山納
Original Assignee
卡爾蔡司Ｓｍｔ有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 卡爾蔡司Ｓｍｔ有限公司 filed Critical 卡爾蔡司Ｓｍｔ有限公司
Publication of TW201321902A publication Critical patent/TW201321902A/zh
Application granted granted Critical
Publication of TWI574115B publication Critical patent/TWI574115B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70108—Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/02—Catoptric systems, e.g. image erecting and reversing system
    • G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW101124746A 2011-07-11 2012-07-10 用於投射微影之照射光學單元 TWI574115B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011078928A DE102011078928A1 (de) 2011-07-11 2011-07-11 Beleuchtungsoptik für die Projektionslithografie

Publications (2)

Publication Number Publication Date
TW201321902A TW201321902A (zh) 2013-06-01
TWI574115B true TWI574115B (zh) 2017-03-11

Family

ID=47425403

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101124746A TWI574115B (zh) 2011-07-11 2012-07-10 用於投射微影之照射光學單元

Country Status (5)

Country Link
US (1) US9507269B2 (OSRAM)
JP (1) JP2014523136A (OSRAM)
DE (1) DE102011078928A1 (OSRAM)
TW (1) TWI574115B (OSRAM)
WO (1) WO2013007731A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012206153A1 (de) 2012-04-16 2013-10-17 Carl Zeiss Smt Gmbh Optisches System einer mikrolithographischen Projektionsbelichtungsanlage
DE102013200394A1 (de) 2013-01-14 2014-07-17 Carl Zeiss Smt Gmbh Polarisationsmessvorrichtung, Lithographieanlage, Messanordnung, und Verfahren zur Polarisationsmessung
DE102014204818A1 (de) 2014-03-14 2015-09-17 Carl Zeiss Smt Gmbh Optisches Bauelement
US20190017878A1 (en) * 2017-07-12 2019-01-17 Radiant Innovation Inc. Non-contact temperature measuring device
DE102019200193B3 (de) 2019-01-09 2020-02-06 Carl Zeiss Smt Gmbh Optisches System für eine Projektionsbelichtungsanlage
US12399431B2 (en) * 2021-11-15 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
CN117471633B (zh) * 2023-10-17 2025-09-30 中国科学院合肥物质科学研究院 一种红外激光光学镜的调节机构

Citations (1)

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Publication number Priority date Publication date Assignee Title
EP1376185A2 (en) * 2002-06-20 2004-01-02 Nikon Corporation Minimizing thermal distortion effects on EUV mirror

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NL194929C (nl) * 1992-10-20 2003-07-04 Samsung Electronics Co Ltd Projectiebelichtingssysteem.
JP2866267B2 (ja) * 1992-12-11 1999-03-08 三菱電機株式会社 光描画装置およびウェハ基板の光描画方法
DE69418131D1 (de) * 1993-03-01 1999-06-02 Gen Signal Corp Vorrichtung zur erzeugung einer einstellbaren ringförmigen beleuchtung für einen photolithograpischen projektionsapparat
US6573978B1 (en) * 1999-01-26 2003-06-03 Mcguire, Jr. James P. EUV condenser with non-imaging optics
JP2005303084A (ja) * 2004-04-13 2005-10-27 Nikon Corp 露光装置、露光装置の製造方法、露光装置の調整方法及びマイクロデバイスの製造方法
WO2005109104A2 (en) 2004-05-06 2005-11-17 Carl Zeiss Laser Optics Gmbh Optical component having an improved thermal behavior
JP5053543B2 (ja) 2005-02-02 2012-10-17 東ソー株式会社 タンタル化合物、その製造方法、タンタル含有薄膜、及びその形成方法
EP1811547A4 (en) * 2005-02-03 2010-06-02 Nikon Corp OPTICAL INTEGRATOR, OPTICAL LIGHTING DEVICE, EXPOSURE DEVICE AND EXPOSURE METHOD
JP5436853B2 (ja) * 2005-04-20 2014-03-05 カール・ツァイス・エスエムティー・ゲーエムベーハー 投影露光系及び偏光光学素子
TWI451125B (zh) 2005-09-13 2014-09-01 Zeiss Carl Smt Gmbh 顯微蝕刻投影光學系統、包含此一光學系統之顯微蝕刻工具、使用此一顯微蝕刻工具於顯微蝕刻生產微結構元件之方法、藉此一方法所生產之微結構元件以及於此一光學系統中設計一光學表面的方法
US7591561B2 (en) * 2005-10-13 2009-09-22 Nikon Corporation Liquid cooled mirror for use in extreme ultraviolet lithography
DE102006039655A1 (de) * 2006-08-24 2008-03-20 Carl Zeiss Smt Ag Beleuchtungssystem für eine Mikrolithographie-Projektionsbelichtungsanlage, Projektionsbelichtungsanlage mit einem derartigen Beleuchtungssystem, Verfahren zur Herstellung eines mikrostruktuierten Bauelements mit einer derartigen Projektionsbelichtungsanlage sowie durch dieses Verfahren hergestelltes mikrostrukturiertes Bauelement
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JP5487118B2 (ja) * 2008-02-15 2014-05-07 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィのための投影露光装置に使用するファセットミラー
DE102009029103A1 (de) 2008-11-20 2010-05-27 Carl Zeiss Smt Ag Beleuchtungseinrichtung für eine Mikrolithographische Projektionsbelichtungsanlage
DE102012203950A1 (de) * 2012-03-14 2013-09-19 Carl Zeiss Smt Gmbh Beleuchtungsoptik für eine Projektionsbelichtungsanlage
DE102012209132A1 (de) * 2012-05-31 2013-12-05 Carl Zeiss Smt Gmbh Beleuchtungsoptik für die Projektionslithographie

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1376185A2 (en) * 2002-06-20 2004-01-02 Nikon Corporation Minimizing thermal distortion effects on EUV mirror

Also Published As

Publication number Publication date
US20140111785A1 (en) 2014-04-24
TW201321902A (zh) 2013-06-01
DE102011078928A1 (de) 2013-01-17
WO2013007731A1 (en) 2013-01-17
JP2014523136A (ja) 2014-09-08
US9507269B2 (en) 2016-11-29

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