TWI572644B - 鹼土金屬氧化物－聚合質硏磨墊 - Google Patents

鹼土金屬氧化物－聚合質硏磨墊 Download PDF

Info

Publication number
TWI572644B
TWI572644B TW102115666A TW102115666A TWI572644B TW I572644 B TWI572644 B TW I572644B TW 102115666 A TW102115666 A TW 102115666A TW 102115666 A TW102115666 A TW 102115666A TW I572644 B TWI572644 B TW I572644B
Authority
TW
Taiwan
Prior art keywords
polymeric
alkaline earth
earth metal
metal oxide
microcomponent
Prior art date
Application number
TW102115666A
Other languages
English (en)
Chinese (zh)
Other versions
TW201402660A (zh
Inventor
大衛Ｂ 詹姆斯
唐娜Ｍ 艾登
安德魯Ｒ 溫克
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201402660A publication Critical patent/TW201402660A/zh
Application granted granted Critical
Publication of TWI572644B publication Critical patent/TWI572644B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW102115666A 2012-05-11 2013-05-02 鹼土金屬氧化物－聚合質硏磨墊 TWI572644B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/469,527 US9073172B2 (en) 2012-05-11 2012-05-11 Alkaline-earth metal oxide-polymeric polishing pad

Publications (2)

Publication Number Publication Date
TW201402660A TW201402660A (zh) 2014-01-16
TWI572644B true TWI572644B (zh) 2017-03-01

Family

ID=49475631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102115666A TWI572644B (zh) 2012-05-11 2013-05-02 鹼土金屬氧化物－聚合質硏磨墊

Country Status (8)

Country Link
US (1) US9073172B2 (enExample)
JP (1) JP6093236B2 (enExample)
KR (1) KR102016175B1 (enExample)
CN (1) CN103386653B (enExample)
DE (1) DE102013008061A1 (enExample)
FR (1) FR2990439B1 (enExample)
SG (1) SG195465A1 (enExample)
TW (1) TWI572644B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
US11524390B2 (en) 2017-05-01 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of making chemical mechanical polishing layers having improved uniformity
US11638978B2 (en) * 2019-06-10 2023-05-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-debris fluopolymer composite CMP polishing pad
WO2021011260A1 (en) * 2019-07-12 2021-01-21 Cabot Microelectronics Corporation Polishing pad employing polyamine and cyclohexanedimethanol curatives
US12138738B2 (en) * 2020-06-19 2024-11-12 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
CN114310656B (zh) * 2020-09-29 2024-03-08 Sk恩普士有限公司 抛光垫、抛光垫的制造方法及半导体器件的制造方法
KR102502516B1 (ko) * 2021-03-12 2023-02-23 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
US20230015668A1 (en) * 2021-07-01 2023-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad
CN116262329B (zh) * 2021-12-13 2025-07-29 湖北鼎汇微电子材料有限公司 一种抛光垫

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040029511A1 (en) * 2001-03-20 2004-02-12 Kincaid Don H. Abrasive articles having a polymeric material
CN1935461A (zh) * 2005-09-19 2007-03-28 罗门哈斯电子材料Cmp控股股份有限公司 具有改进的粘着性的水基抛光垫及其制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
JP2004087912A (ja) * 2002-08-28 2004-03-18 Okamoto Machine Tool Works Ltd 基板の乾式化学機械研磨方法およびそれに用いる装置
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
JP2009184858A (ja) * 2008-02-04 2009-08-20 Nippon Chem Ind Co Ltd ヒドラジンが固定化されたシリカ粒子よりなるコロイダルシリカ
JP5327425B2 (ja) * 2008-04-28 2013-10-30 Ｊｓｒ株式会社 化学機械研磨パッドおよび化学機械研磨方法
JP5222626B2 (ja) * 2008-05-20 2013-06-26 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
TW201016391A (en) * 2008-10-20 2010-05-01 Bestac Advanced Material Co Ltd Polishing pad having abrasive grains and method for making the same
US8257152B2 (en) 2010-11-12 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Silicate composite polishing pad
US8357446B2 (en) 2010-11-12 2013-01-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-silicate composite
US8202334B2 (en) 2010-11-12 2012-06-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming silicate polishing pad
US8894732B2 (en) * 2012-05-11 2014-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-alkaline earth metal oxide composite

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040029511A1 (en) * 2001-03-20 2004-02-12 Kincaid Don H. Abrasive articles having a polymeric material
CN1935461A (zh) * 2005-09-19 2007-03-28 罗门哈斯电子材料Cmp控股股份有限公司 具有改进的粘着性的水基抛光垫及其制造方法

Also Published As

Publication number Publication date
CN103386653B (zh) 2016-12-28
US9073172B2 (en) 2015-07-07
FR2990439A1 (fr) 2013-11-15
KR102016175B1 (ko) 2019-08-29
JP2013237147A (ja) 2013-11-28
CN103386653A (zh) 2013-11-13
DE102013008061A1 (de) 2013-11-14
SG195465A1 (en) 2013-12-30
TW201402660A (zh) 2014-01-16
JP6093236B2 (ja) 2017-03-08
US20130303061A1 (en) 2013-11-14
FR2990439B1 (fr) 2016-07-15
KR20130126521A (ko) 2013-11-20

Similar Documents

Publication Publication Date Title
TWI585128B (zh) 中空聚合質－鹼土金屬氧化物複合物
TWI572644B (zh) 鹼土金屬氧化物－聚合質硏磨墊
TWI515082B (zh) 矽酸鹽複合物研磨墊
TWI591167B (zh) 形成鹼土金屬氧化物硏磨墊
JP5845832B2 (ja) シリケート研磨パッドを形成する方法
JP2012101353A5 (enExample)
TWI525138B (zh) 中空聚合物－矽酸鹽複合物