JP2013237147A - アルカリ土類金属酸化物ポリマー研磨パッド - Google Patents
アルカリ土類金属酸化物ポリマー研磨パッド Download PDFInfo
- Publication number
- JP2013237147A JP2013237147A JP2013099414A JP2013099414A JP2013237147A JP 2013237147 A JP2013237147 A JP 2013237147A JP 2013099414 A JP2013099414 A JP 2013099414A JP 2013099414 A JP2013099414 A JP 2013099414A JP 2013237147 A JP2013237147 A JP 2013237147A
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- Prior art keywords
- polymer
- earth metal
- alkaline earth
- metal oxide
- microelements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 86
- 229910052784 alkaline earth metal Inorganic materials 0.000 title claims description 7
- 150000001342 alkaline earth metals Chemical class 0.000 title claims description 6
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 claims abstract description 58
- 239000011159 matrix material Substances 0.000 claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 239000012530 fluid Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims description 127
- 239000002245 particle Substances 0.000 claims description 67
- 239000000203 mixture Substances 0.000 claims description 32
- 239000000395 magnesium oxide Substances 0.000 claims description 22
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 22
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 22
- -1 alkaline earth metal Metal oxide Chemical class 0.000 claims description 20
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical group [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000292 calcium oxide Substances 0.000 claims description 7
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
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- 229910052791 calcium Inorganic materials 0.000 description 16
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- AXKZIDYFAMKWSA-UHFFFAOYSA-N 1,6-dioxacyclododecane-7,12-dione Chemical class O=C1CCCCC(=O)OCCCCO1 AXKZIDYFAMKWSA-UHFFFAOYSA-N 0.000 description 1
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- 125000003821 2-(trimethylsilyl)ethoxymethyl group Chemical group [H]C([H])([H])[Si](C([H])([H])[H])(C([H])([H])[H])C([H])([H])C(OC([H])([H])[*])([H])[H] 0.000 description 1
- BSYVFGQQLJNJJG-UHFFFAOYSA-N 2-[2-(2-aminophenyl)sulfanylethylsulfanyl]aniline Chemical compound NC1=CC=CC=C1SCCSC1=CC=CC=C1N BSYVFGQQLJNJJG-UHFFFAOYSA-N 0.000 description 1
- WABOBVQONKAELR-UHFFFAOYSA-N 2-methyl-4-(2-methylbutan-2-yl)benzene-1,3-diamine Chemical compound CCC(C)(C)C1=CC=C(N)C(C)=C1N WABOBVQONKAELR-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
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- YNLKXLJDIRXVAM-UHFFFAOYSA-N CCC(C)C.C(C(=C)C)#N Chemical compound CCC(C)C.C(C(=C)C)#N YNLKXLJDIRXVAM-UHFFFAOYSA-N 0.000 description 1
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- 239000005977 Ethylene Substances 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
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- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 239000004615 ingredient Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
【解決手段】研磨パッドはポリマーマトリックスを含み、ポリマーマトリックスは研磨面を有する。加えて、ポリマー微小要素がポリマーマトリックスの中及びポリマーマトリックスの研磨面に分散している。ポリマー微小要素は、外面を有し、研磨面にテキスチャを形成するために流体が充填されている。そして、アルカリ土類金属酸化物含有領域が、ポリマー微小要素それぞれの中に分散し、ポリマー微小要素の外面の50%未満をコートするように離散している。
【選択図】なし
Description
本発明は、半導体基材を研磨するのに有用な複合アルカリ土類金属酸化物含有研磨パッドを提供する。研磨パッドは、ポリマーマトリックス、中空のポリマー微小要素及びポリマー微小要素に埋め込まれたアルカリ土類金属酸化物含有粒子を含む。アルカリ土類要素は、好ましくは、酸化カルシウム、酸化マグネシウム又は酸化マグネシウムと酸化カルシウムとの混合物である。驚くことに、アルカリ土類金属酸化物含有粒子は、ポリマー微小要素と会合した特定の構造へと分級されると、先進のCMP用途の場合に過度なスクラッチング又はガウジングを生じさせない傾向にある。ポリマーマトリックスがアルカリ土類金属酸化物含有粒子をその研磨面に有するにもかかわらず、このガウジング及びスクラッチングの抑制が得られる。
マツボー社のエルボージェット空気分級機(モデルEJ1S-3S)により、40ミクロンの平均直径及び30g/リットルの密度を有するポリアクリロニトリル及びメタクリロニトリルのイソペンタン充填コポリマーの試料の分離を実施した。これらの中空微小球は、コポリマー中に埋め込まれた酸化マグネシウム・カルシウム含有粒子を含有するものであった。酸化マグネシウム・カルシウム含有粒子は微小球の外側表面積の約5〜15%を被覆していた。加えて、試料は、5μmよりも大きい粒径を有する酸化マグネシウム・カルシウム粒子と会合したコポリマー微小球、ii)ポリマー微小要素の外面の50%超を被覆する酸化マグネシウム・カルシウム含有領域、及びiii)酸化マグネシウム・カルシウム含有粒子と凝集して、120μmよりも大きい平均クラスタサイズになったポリマー微小要素、を含むものであった。エルボージェット空気分級機は、コアンダブロックならびに図1A及び1Bの構造を含むものであった。図2は、微粒子の存在下における所望の酸化マグネシウム・カルシウム含有微小球を示す。所望の微小球の場合、白い領域は、ポリマーシェルに埋め込まれた酸化マグネシウム・酸化カルシウムミネラル粒子を表す。望ましくない粒子の場合、白い領域が粒子の半分超又は粒子全体を被覆する。選択した設定でポリマー微小球を振動フィーダに通してガスジェットに送り込むと、表1の結果が得られた。
表2は、研磨パッドを作るために使用されるポリウレタンケーキを流込み成形するための微小球配合を提供する。
違いは、図9及び10に示すようなスカイビングされた面の場合により顕著である。スカイビング作業は、より大きな機械的応力を加え、特にシェル壁の延性がより低く、シェル壁がより脆性である場合、微小球を破壊する可能性がより高い。
次の実施例は、直径40ミクロンのポリ(二塩化ビニリデン)/ポリアクリロニトリル又はポリアクリロニトリル/メタクリロニトリル微小球のいずれかをずっと軟らかなマトリックスに添加する効果を示す。配合及び加工条件を表4にまとめる。
Claims (8)
- 半導体、磁性及び光学基材の少なくとも一つを研磨するのに有用な研磨パッドであって、
研磨面を有するポリマーマトリックス、
前記ポリマーマトリックスの中及び前記ポリマーマトリックスの前記研磨面に分散したポリマー微小要素であって、外面を有し、前記研磨面にテキスチャを形成するために流体が充填されているポリマー微小要素、及び
前記ポリマー微小要素それぞれの中に分散したアルカリ土類金属酸化物含有領域
を含み、前記アルカリ土類金属酸化物含有領域が、前記ポリマー微小要素の前記外面の50%未満をコートするように離散しており、前記ポリマー微小要素の合計で0.1重量%未満が、i)5μmよりも大きい粒径を有するアルカリ土類金属酸化物含有粒子、ii)前記ポリマー微小要素の前記外面の50%超を被覆するアルカリ土類金属酸化物含有領域、及びiii)アルカリ土類金属酸化物含有粒子と凝集して、120μmよりも大きい平均クラスタサイズになったポリマー微小要素、と関連している、研磨パッド。 - 前記ポリマー微小要素と関連した前記アルカリ土類金属含有領域が0.01〜3μmの平均サイズを有する、請求項1記載の研磨パッド。
- 前記ポリマー微小要素が5〜200ミクロンの平均サイズを有する、請求項1記載の研磨パッド。
- 前記アルカリ土類金属含有領域が前記ポリマー微小要素の前記外面の1〜40%を被覆する、請求項1記載の研磨パッド。
- 半導体、磁性及び光学基材の少なくとも一つを研磨するのに有用な研磨パッドであって、
研磨面を有するポリマーマトリックス、
前記ポリマーマトリックスの中及び前記ポリマーマトリックスの前記研磨面に分散したポリマー微小要素であって、外面を有し、前記研磨面にテキスチャを形成するために流体が充填されているポリマー微小要素、及び
前記ポリマー微小要素それぞれの中に分散したアルカリ土類金属酸化物含有領域
を含み、前記アルカリ土類金属酸化物が、酸化カルシウム、酸化マグネシウム又は酸化カルシウムと酸化マグネシウムとの混合物であり、前記アルカリ土類金属酸化物含有領域が、前記ポリマー微小要素の前記外面の1〜40%をコートするように離散しており、前記ポリマー微小要素の合計で0.05重量%未満が、i)5μmよりも大きい粒径を有するアルカリ土類金属酸化物含有粒子、ii)前記ポリマー微小要素の前記外面の50%超を被覆するアルカリ土類金属酸化物含有領域、及びiii)アルカリ土類金属酸化物含有粒子と凝集して、120μmよりも大きい平均クラスタサイズになったポリマー微小要素、と関連している研磨パッド。 - 前記ポリマー微小要素上に分散した前記アルカリ土類金属含有領域が0.01〜2ミクロンの平均粒径を有する、請求項5記載の研磨パッド。
- 前記ポリマー微小要素が10〜100ミクロンの平均サイズを有する、請求項5記載の研磨パッド。
- 前記アルカリ土類金属含有領域が前記ポリマー微小要素の前記外面の2〜30%を被覆する、請求項5記載の研磨パッド。
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US13/469,527 US9073172B2 (en) | 2012-05-11 | 2012-05-11 | Alkaline-earth metal oxide-polymeric polishing pad |
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FR2990439A1 (fr) | 2013-11-15 |
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