FR2990439B1 - Tampon de polissage a base de polymere et d'oxyde de metal alcalino-terreux - Google Patents

Tampon de polissage a base de polymere et d'oxyde de metal alcalino-terreux

Info

Publication number
FR2990439B1
FR2990439B1 FR1354235A FR1354235A FR2990439B1 FR 2990439 B1 FR2990439 B1 FR 2990439B1 FR 1354235 A FR1354235 A FR 1354235A FR 1354235 A FR1354235 A FR 1354235A FR 2990439 B1 FR2990439 B1 FR 2990439B1
Authority
FR
France
Prior art keywords
alkaline
polymer
metal oxide
earth metal
buffer based
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1354235A
Other languages
English (en)
French (fr)
Other versions
FR2990439A1 (fr
Inventor
David B James
Donna M Alden
Andrew R Wank
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2990439A1 publication Critical patent/FR2990439A1/fr
Application granted granted Critical
Publication of FR2990439B1 publication Critical patent/FR2990439B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
FR1354235A 2012-05-11 2013-05-10 Tampon de polissage a base de polymere et d'oxyde de metal alcalino-terreux Active FR2990439B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/469,527 US9073172B2 (en) 2012-05-11 2012-05-11 Alkaline-earth metal oxide-polymeric polishing pad

Publications (2)

Publication Number Publication Date
FR2990439A1 FR2990439A1 (fr) 2013-11-15
FR2990439B1 true FR2990439B1 (fr) 2016-07-15

Family

ID=49475631

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1354235A Active FR2990439B1 (fr) 2012-05-11 2013-05-10 Tampon de polissage a base de polymere et d'oxyde de metal alcalino-terreux

Country Status (8)

Country Link
US (1) US9073172B2 (enExample)
JP (1) JP6093236B2 (enExample)
KR (1) KR102016175B1 (enExample)
CN (1) CN103386653B (enExample)
DE (1) DE102013008061A1 (enExample)
FR (1) FR2990439B1 (enExample)
SG (1) SG195465A1 (enExample)
TW (1) TWI572644B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
US11524390B2 (en) 2017-05-01 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of making chemical mechanical polishing layers having improved uniformity
US11638978B2 (en) * 2019-06-10 2023-05-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-debris fluopolymer composite CMP polishing pad
KR102743611B1 (ko) * 2019-07-12 2024-12-17 씨엠씨 머티리얼즈 엘엘씨 폴리아민 및 시클로헥산디메탄올 경화제를 사용한 폴리싱 패드
US12138738B2 (en) * 2020-06-19 2024-11-12 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
CN114310656B (zh) * 2020-09-29 2024-03-08 Sk恩普士有限公司 抛光垫、抛光垫的制造方法及半导体器件的制造方法
KR102502516B1 (ko) * 2021-03-12 2023-02-23 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
US20230015668A1 (en) * 2021-07-01 2023-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad
CN116262329B (zh) * 2021-12-13 2025-07-29 湖北鼎汇微电子材料有限公司 一种抛光垫

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US20040029511A1 (en) * 2001-03-20 2004-02-12 Kincaid Don H. Abrasive articles having a polymeric material
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
JP2004087912A (ja) * 2002-08-28 2004-03-18 Okamoto Machine Tool Works Ltd 基板の乾式化学機械研磨方法およびそれに用いる装置
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
JP2009184858A (ja) * 2008-02-04 2009-08-20 Nippon Chem Ind Co Ltd ヒドラジンが固定化されたシリカ粒子よりなるコロイダルシリカ
JP5327425B2 (ja) * 2008-04-28 2013-10-30 Ｊｓｒ株式会社 化学機械研磨パッドおよび化学機械研磨方法
JP5222626B2 (ja) * 2008-05-20 2013-06-26 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
TW201016391A (en) * 2008-10-20 2010-05-01 Bestac Advanced Material Co Ltd Polishing pad having abrasive grains and method for making the same
US8357446B2 (en) 2010-11-12 2013-01-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-silicate composite
US8202334B2 (en) 2010-11-12 2012-06-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming silicate polishing pad
US8257152B2 (en) * 2010-11-12 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Silicate composite polishing pad
US8894732B2 (en) * 2012-05-11 2014-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-alkaline earth metal oxide composite

Also Published As

Publication number Publication date
DE102013008061A1 (de) 2013-11-14
KR20130126521A (ko) 2013-11-20
US20130303061A1 (en) 2013-11-14
US9073172B2 (en) 2015-07-07
TWI572644B (zh) 2017-03-01
FR2990439A1 (fr) 2013-11-15
TW201402660A (zh) 2014-01-16
KR102016175B1 (ko) 2019-08-29
JP2013237147A (ja) 2013-11-28
SG195465A1 (en) 2013-12-30
CN103386653A (zh) 2013-11-13
CN103386653B (zh) 2016-12-28
JP6093236B2 (ja) 2017-03-08

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