TWI568804B - 製備金屬奈米顆粒之方法及使用其之墨水 - Google Patents
製備金屬奈米顆粒之方法及使用其之墨水 Download PDFInfo
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- TWI568804B TWI568804B TW102123166A TW102123166A TWI568804B TW I568804 B TWI568804 B TW I568804B TW 102123166 A TW102123166 A TW 102123166A TW 102123166 A TW102123166 A TW 102123166A TW I568804 B TWI568804 B TW I568804B
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- Prior art keywords
- metal
- group
- organic solvent
- metal precursor
- solution
- Prior art date
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- 239000002082 metal nanoparticle Substances 0.000 title claims description 47
- 238000000034 method Methods 0.000 title claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 60
- 239000002243 precursor Substances 0.000 claims description 41
- 239000000243 solution Substances 0.000 claims description 38
- 239000003960 organic solvent Substances 0.000 claims description 29
- 239000000976 ink Substances 0.000 claims description 26
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 24
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 24
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 24
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 23
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 21
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
- 125000001424 substituent group Chemical group 0.000 claims description 18
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 17
- 239000011259 mixed solution Substances 0.000 claims description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000000654 additive Substances 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 10
- 238000013019 agitation Methods 0.000 claims description 10
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 9
- 230000000704 physical effect Effects 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 8
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical class CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 6
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 6
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000008096 xylene Substances 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 5
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 4
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 4
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 claims description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 3
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 150000001555 benzenes Chemical class 0.000 claims description 3
- 239000001273 butane Substances 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 claims description 3
- 150000002170 ethers Chemical class 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052762 osmium Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 description 26
- 235000014113 dietary fatty acids Nutrition 0.000 description 21
- 239000000194 fatty acid Substances 0.000 description 21
- 229930195729 fatty acid Natural products 0.000 description 21
- 150000004665 fatty acids Chemical class 0.000 description 21
- 239000002105 nanoparticle Substances 0.000 description 20
- 239000002904 solvent Substances 0.000 description 14
- 239000002244 precipitate Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 10
- 239000006185 dispersion Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000012266 salt solution Substances 0.000 description 7
- NKBWMBRPILTCRD-UHFFFAOYSA-N 2-Methylheptanoic acid Chemical compound CCCCCC(C)C(O)=O NKBWMBRPILTCRD-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 4
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 4
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 101710134784 Agnoprotein Proteins 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 3
- 238000005119 centrifugation Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 239000013557 residual solvent Substances 0.000 description 3
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 2
- IOOUWNQSMXVTRP-UHFFFAOYSA-N 2,2-dimethoxypropan-1-ol Chemical compound COC(C)(CO)OC IOOUWNQSMXVTRP-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- VUAXHMVRKOTJKP-UHFFFAOYSA-N 2,2-dimethylbutyric acid Chemical compound CCC(C)(C)C(O)=O VUAXHMVRKOTJKP-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- CVKMFSAVYPAZTQ-UHFFFAOYSA-N 2-methylhexanoic acid Chemical compound CCCCC(C)C(O)=O CVKMFSAVYPAZTQ-UHFFFAOYSA-N 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- -1 oxides Chemical class 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G5/00—Compounds of silver
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/005—Compounds containing elements of Groups 1 or 11 of the Periodic Table without C-Metal linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
- C09D139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C09D139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2202/00—Treatment under specific physical conditions
- B22F2202/11—Use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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Description
本發明主張韓國專利申請號第2012-0092260號,申請日為2012年8月23日之優先權,且該優先權案全文揭示內容以參考方式併入本文中。
本發明係關於一種使用一金屬前驅物以製備金屬奈米顆粒之方法,該金屬前驅物係透過使用一α位上具有取代基之脂肪酸製備而得,以及一種使用其以製備金屬奈米顆粒墨水之方法。更具體而言,本發明係關於一種可輕易分散於不同溶劑、控制顆粒尺寸及顆粒分佈、展現優異分散穩定度之金屬奈米顆粒,以及當其塗佈膜後該形成之塗佈膜具增進的物理特性,以及一種由該金屬奈米顆粒製備金屬奈米顆粒墨水之方法。
金屬墨水已被用於各種產品,如導電性墨水、電磁波屏蔽劑、反射膜形成材料、抗菌劑等,特別是,由於現行法規的指令,而使導電性墨水用於電/電子電路、用於使低電阻率的金屬相互連結、印刷電路板(PCBs)、軟性印刷電路板(FPCBs)、無線射頻識別(RFID)標籤和電磁波屏蔽材料之天線,且對於需要金屬圖案或簡易形成的電極於該領域的新應用是有用的,如電漿顯示面板(PDPs)、液晶顯示器(TFT-LCDs)、有機發光二極體(OLEDs)、軟性顯示器及有機薄膜電晶體(OTFTs),從而使導電墨水越發受到重視。隨著高功能性及極薄電子產品的趨勢,使用在電子產品中的金屬顆粒大小逐漸變微小。
在一般的情況下,可透過製備金屬前驅物或金屬奈米顆粒以製備金屬墨水。
於此,已有使用熱分解法或使用還原劑之還原方法來製備金屬奈米顆粒,在這種情況下,因為使用了聚合物型式之極性封端劑,造成這些金屬顆粒存有其無法輕易地混合於不同之溶劑的問題。
因此,本案的發明人已進行了大量的研究,以期找出一種解決金屬奈米顆粒的問題,發明人發現,當使用α位上具有取代基之脂肪酸製備金屬前驅物並用其合成金屬奈米顆粒時,該用於金屬墨水之金屬奈米顆粒可輕易地混合於不同溶劑中,且可依據合成條件來控制顆粒粒徑/分佈,並於形成塗佈膜時增進分散穩定度及物理特性之塗佈膜可製備而得。因此,基於這些事實本發明得以完成。
本發明係關於一種製備能夠控制顆粒粒徑與分佈之不同奈米顆粒的金屬奈米顆粒之方法。
此外,本發明關於一種製備金屬奈米墨水之方法,其係可輕易地分散於不同溶劑中,且增進一塗佈膜的分散穩定性及物理特性,該金屬奈米墨水係使用上述方法製備之金屬奈米顆粒。
根據本發明之一方面,係提供了一種用於金屬墨水之金屬奈米顆粒之製備方法,於此,該方法包含將一α位上具有取代基之金屬前驅物溶解於一有機溶劑中,且對該金屬前驅物溶液施加一能量源或一機械力。
根據本發明之製備金屬奈米顆粒之方法,其中該α位上具有取代基之金屬前驅物具有如下式1表示之結構:
於式1中,X代表具有1至6個碳原子之烷基或鹵素,M為選自由Ag、Pd、Rh、Cu、Pt、Ni、Fe、Ru、Os、Mn、Cr、Mo、Au、W、Co、Ir、Zn及Cd所組成之群組,且n為由0至23範圍內之整數。
此外,該有機溶劑為至少一種選自由THF、二甲苯、甲苯、
二氯甲烷、CH3OH、CH3CH2OH、CH3CH2CH2OH、乙二醇、二乙二醇、三甘醇、丙二醇、丁二醇、二乙二醇單甲基醚、二乙二醇單丁基醚、丙二醇單甲基醚所組成之群組,以及DMSO。另外,可進一步添加至少一種選自由KOH、NaOH、NH3、NH2CH3、NH4OH、NH(CH3)2、N(CH3)3、NH2Et、NH(Et)2、NEt3及Ca(OH)2所組成之群組之鹼,以增進該金屬前驅物於該有機溶劑中之溶解度。
該施加於金屬前驅物溶液之能量源可為熱、微波或紫外線(UV),且該施加於金屬前驅物溶液之機械力可為攪拌或超音波。
該金屬前驅物與該有機溶劑可呈現質量比為1:2至1:5,以控制該奈米顆粒之粒徑為20至200nm,且亦可呈現質量比為1:5至1:20,以控制該奈米顆粒之粒徑為1至20nm。
根據本發明之另一方面,係提供了一種製備金屬墨水之方法。於此,該方法包含將一α位上具有取代基之金屬前驅物溶解於一有機溶劑中以合成金屬奈米顆粒,並施加一能量源或一機械力於該金屬前驅物溶液,混合並分散一添加劑於該合成之金屬奈米顆粒以調整該金屬奈米顆粒之分散性及物理性能,並將該混合溶液均質化。
該用於分散金屬奈米顆粒之有機溶劑可為至少一種選自由醚類(THF、乙醚、丙醚或MEK)、苯類(二甲苯、甲苯、乙苯或苯)、醇類(甲醇、乙醇、丁醇、丙醇、乙二醇或丙二醇)、氯化物(二氯甲烷或三氯甲烷)、硫化物(DMSO)、氮化物(DMF、DEF、乙胺、氨、乙醇胺、二乙醇胺、三乙醇胺或三乙胺)及烷類(己烷、戊烷或丁烷)所組成之群組,以及一分散穩定劑、一黏合劑,及其他已知可用於製備包含金屬奈米顆粒之金屬墨水之添加劑。
可應用超音波攪拌、渦流攪拌、機械攪拌、球磨機或滾軋機使該混合溶液均質。
圖1為根據本發明之一實施例,顯示一α位上具有取代基之金屬前驅物之合成流程示意圖。
圖2為一示意圖,顯示根據本發明之一實施例製備金屬奈米顆粒時於控制合成條件下改變顆粒粒徑。
圖3至圖5為根據本發明之一實施例所製備之金屬奈米顆粒之尺寸控制實驗所得到的結果圖像。
本發明的上述目的、特徵和優點,經由本技術領域之通常知識者透過下列的實施方式並配合附圖,而顯而易見。當本發明經由下方的實施方式所詳述,對技藝人士而言,可在不偏離本發明之範圍下,做明顯的修飾而仍包含於本發明之範疇。
根據本發明之奈米金屬顆粒,係透過一方法其包含將一α位上具有取代基之金屬前驅物溶解於一有機溶劑中,並對該金屬前驅物溶液施加一能量源或一機械力製備而得。
如圖1所示,該α位上具有取代基之金屬前驅物之合成,是透過將一金屬鹽與溶解於有機溶液中之一α位上具有取代基之脂肪酸反應,以合成一α位上具有取代基之金屬前驅物。
更進一步而言,形成該金屬前驅物,包括將一α位上具有取代基之脂肪酸溶解於一有機溶劑中以製備一脂肪酸溶液;將一金屬鹽溶液滴入該脂肪酸溶液使該金屬鹽溶液與該脂肪酸溶液反應;於該混合溶液中形成一金屬前驅物沉澱物,並分離該沉澱物。
於透過溶解該α位上具有取代基之脂肪酸於該有機溶劑中以製備該脂肪酸溶液時,該α位上具有取代基之脂肪酸具有如下式2表示之結構:
於上式2中,X代表具有1至6個碳原子之烷基或鹵素,且n為由0至23範圍內之整數。
該較佳的脂肪酸可為2-甲基庚酸、2-甲基己酸、2,2-二甲基丁酸、2-乙基己酸、己酸、丙烯酸或異丁酸。
此外,該溶劑為至少一種有機溶劑,其係選自由H2O、CH2CN、CH3OH、CH3CH2OH、THF、DMSO、DMF、1-甲氧基-2-丙醇、2,2-二甲氧基丙醇(2,2-dimethoxypropanol)、4-甲基-2-戊酮、戊醇、己醇、壬烷、辛烷、庚烷、己烷、丙酮、甲乙酮、甲基異丁酮、2-甲氧乙醇(methyl cellosolve)、乙二醇乙醚(ethyl cellosolve)、乙二醇、二乙二醇、三甘醇、丙二醇、丁二醇、二乙二醇單甲基醚、二乙二醇單丁基醚、丙二醇單甲基醚及二丁醚所組成之群組。
該脂肪酸溶液可進一步包含至少一種選自由KOH、NaOH、NH3、NH2CH3、NH4OH、NH(CH3)2、N(CH3)3、NH2Et、NH(Et)2、NEt3及Ca(OH)2所組成之群組之鹼。
於將金屬鹽溶液滴入該脂肪酸溶液,使該金屬鹽溶液與該脂肪酸溶液反應。首先,該金屬鹽溶液係透過將一金屬鹽溶解於一有機溶劑或一水溶液中而製備。於此,一用於脂肪酸溶液之有機溶劑可為該有機溶劑,且該用於脂肪酸溶液之有機溶劑與該用於金屬溶液之有機溶劑可為相同或不同。
接著,該金屬鹽溶液係滴入該脂肪酸溶液中,使其與脂肪酸溶液反應。在這種情況下,於滴下的同時可伴隨強力的攪拌。金屬鹽的金屬離子可選自由Ag、Pd、Rh、Cu、Pt、Ni、Fe、Ru、Os、Mn、Cr、Mo、Au、W、Co、Ir、Zn及Cd所組成之群組,且優選為Ag。所有的氮化物、氧化物、硫化物及鹵化物可用於做為金屬鹽的陰離子材料,其中,優選者為氮化物的形式做為金屬鹽的陰離子材料。
該脂肪酸溶液與該金屬溶液可以體積比為1:1至10:1或1:10混合,在這種情況下,體積比較佳之範圍為1:1至1:10或10:1,此外,該反應可在室溫下進行。
為了由該混合溶液中形成該金屬前驅物沉澱物,完成滴加入金屬鹽溶液之混合溶液可進一步攪拌1至30分鐘,以形成沉澱物。
於分離沉澱物時,該沉澱物可運用相關技術中已知的常規分離方式來移除,更具體地,於本文中可使用的方法,如過濾或再結晶。
接著,將分離出的沉澱物以下列至少一種用於合成該沉澱物時所用之有機溶劑,其係選自由例如CH2CN、CH3OH、CH3CH2OH、THF、DMSO、DMF、1-甲氧基-2-丙醇、2,2-二甲氧基丙醇、4-甲基-2-戊酮、戊醇、己醇、壬烷、辛烷、庚烷、己烷、丙酮、甲乙酮、甲基異丁酮、2-甲氧乙醇、乙二醇乙醚、乙二醇、二乙二醇、三甘醇、丙二醇、丁二醇、二乙二醇單甲基醚、二乙二醇單丁基醚、丙二醇單甲基醚及二丁醚所組成之群組,以及水,清洗數次,然後乾燥以形成最終金屬前驅物。
於一有機溶劑中,溶解以上述方法所製備之該α位上具有取代基之金屬前驅物,該有機溶劑可為選自由THF、二甲苯、甲苯、二氯甲烷、CH3OH、CH3CH2OH、CH3CH2CH2OH、己烷、乙二醇、二乙二醇、三甘醇、丙二醇、丁二醇、二乙二醇單甲基醚、二乙二醇單丁基醚、丙二醇單甲基醚所組成之群組,以及DMSO。此外,可添加鹼以增進溶解度,且於此所使用之鹼為至少一種選自由KOH、NaOH、NH3、NH2CH3、NH4OH、NH(CH3)2、N(CH3)3、NH2Et、NH(Et)2、NEt3及Ca(OH)2所組成之群組。
此外,在控制反應條件(濃度、溫度等)下,可以調整金屬奈米顆粒之顆粒粒徑。例如,當控制該金屬前驅物與該溶劑呈現質量比為1:5時,或者該金屬前驅物與該溶劑呈現高濃度質量比高於1:5時,例如為高濃度質量比1:2至1:5時,該金屬奈米顆粒之平均粒徑可被控制在20至200nm之範圍;且當該金屬前驅物係呈現於低濃度1:5之質量比,也就是說,例如在低濃度質量比1:5至1:20時,該金屬奈米顆粒之平均粒徑可被控制在20nm或更小之範圍。當鹼包含於溶液中時,需使用溶劑與鹼質量的總重而非僅使用溶劑之質量。
無論是在高或低濃度條件下,溫度要保持在60℃或更低,這是因為當溫度高於60℃時,所用的溶劑揮發而造成溶液中的組合物可能會改變。
顆粒粒徑可使用時間參數來調整,而非溫度參數。例如,在
高濃度狀態下,當反應時間為一小時,可獲得平均顆粒粒徑為50nm之金屬奈米顆粒;然而,當反應時間增加至兩小時,該金屬奈米顆粒之平均顆粒粒徑增加至約100nm;然而,當於60℃時施加超音波,即使反應時間延長至2小時,該金屬奈米顆粒為20至50nm;當所用之溶劑具有低極性及沸點時,分離/純化該金屬奈米顆粒的程序可容易地進行,而簡化步驟並增加產率。
接著,透過使用不同的能量源或施加一機械力,該金屬前驅物溶液可形成金屬奈米顆粒。於此,可使用的各種能量源可包含於室溫至60℃下加熱、3至10kw之微波或紫外線(UV),而施加該機械力則可透過渦流攪拌,使用設備為可實現於500至1,000rpm下穩定攪拌,或可實現驅動功率為20至30kHz之設備者。
如圖2所示,當該金屬前驅物以高濃度存在時,具有平均粒徑50至200nm之奈米顆粒可於加熱至60℃並對該混合溶液攪拌而合成。另外,具有平均粒徑50至20nm之奈米顆粒亦可透過於加熱至60℃並對該混合溶液施加超音波而合成。另一方面,當該金屬前驅物以低濃度存在時,具有平均粒徑3至10nm之奈米顆粒可於加熱至60℃並對該混合溶液施加UV照射、微波、攪拌或超音波而合成。
此外,本發明提供了一種製備金屬奈米墨水之方法,其包含將上述方法所製備之金屬奈米顆粒分散於一有機溶劑中以製備一金屬奈米顆粒分散液,混合添加劑以調整物理特性,並使該混合溶液均質。
該用於分散該金屬奈米顆粒之有機溶劑可為至少一種選自由醚類(THF、乙醚、丙醚或MEK)、苯類(二甲苯、甲苯、乙苯或苯)、醇類(甲醇、乙醇、丁醇、丙醇、乙二醇或丙二醇)、氯化物(二氯甲烷或三氯甲烷)、硫化物(DMSO)、氮化物(DMF、DEF、乙胺、氨、乙醇胺、二乙醇胺、三乙醇胺或三乙胺)及烷類(己烷、戊烷或丁烷)所組成之群組,以及一分散穩定劑、一黏合劑及其他已知可用於製備包含金屬奈米顆粒之金屬墨水之添加劑。
於透過混合該添加物以調整物理特性時,透過添加添加劑而
得到塗佈或印刷過程中所需的最終墨水,其物理性質可被調整。相關技術領域中所習知的一般添加劑,可廣泛地用於一般含量的範圍。於此所用的添加劑,例如,胺,特別是NH3、NH(CH3)2、N(CH3)3、NH2Et、NH(Et)2或NEt3,可加入的含量為10至50重量%,以及表面活性劑,如聚乙烯吡咯烷酮(PVP)、聚丙烯酸(PAA)、十二烷基硫酸鈉(SDS),或添加做為分散穩定劑之Tween 20TM或DowFaxTM,含量約為0.05至5重量%,以最終墨水的總重量計算。另外,也可添加以最終墨水的總重量計之含量為0.1至5重量%的增黏劑。
於使該混合溶液均質,該金屬墨水可進行超音波攪拌、渦流攪拌、機械攪拌或球磨機處理。例如,可進行約30分鐘至2小時,5至50Hz之超音波攪拌,可進行約2至4小時,200至550rpm之渦流攪拌,及透過引入球以及重量比為1:1的溶液,並攪拌該溶液約8至12小時。此外,於溶劑及添加劑以不同比例混合後,可進行1至9次的滾軋機處理。
於此,本發明將以下方實施例進一步說明,然而,需理解於此之實施例並非用以限制本發明之範圍。
實施例1:製備具有平均粒徑3至10nm之金屬奈米顆粒
[合成Ag前驅物]
將1.7g之2-甲基庚酸置入250ml燒瓶中,並將其溶解於84ml之極性有機溶劑THF中,並添加2.7g之NEt3做為鹼。之後,將1.4g之AgNO3置於另一250ml燒瓶中,並將其溶解於84ml之THF中。將該AgNO3溶液以800ml/hr的速率緩慢地滴加於2-甲基庚酸溶液中,同時伴隨劇烈攪拌。完成加入AgNO3溶液之混合溶液,攪拌20分鐘,並分離沉澱物,將該沉澱物以有機溶劑清洗(THF)兩次,接著乾燥以形成約2.0g之Ag前驅物(Ag-2-甲基庚酸酯)。
[製備Ag奈米顆粒]
將0.6g之Ag-2-甲基庚酸酯溶解於5.2g之THF,接著,加入0.6g之NEt3做為鹼,並攪拌以增加溶解度。將所得的反應溶液施加超音波一個小時,同時加熱至60℃以製備具有平均顆粒粒徑為5nm之Ag奈
米顆粒。該反應溶液接著以離心分離,去除殘留的溶劑,以製備出0.2g之Ag奈米顆粒。
實施例2:製備具有平均粒徑20至50nm之金屬奈米顆粒
[合成Ag前驅物]
以實施例1的相同方式合成Ag前驅物。
[製備Ag奈米顆粒]
將0.6g之Ag-2-甲基庚酸酯溶解於2.2g之THF及0.6g之NEt3中,將所得的反應溶液施加超音波一個小時,同時加熱至60℃以製備具有平均顆粒粒徑為30nm之Ag奈米顆粒。該反應溶液接著以離心分離,去除殘留的溶劑,以製備出0.2g之Ag奈米顆粒。
實施例3:製備具有平均粒徑50至200nm之金屬奈米顆粒
[合成Ag前驅物]
以實施例1的相同方式合成Ag前驅物。
[製備Ag奈米顆粒]
將0.6g之Ag-2-甲基庚酸酯溶解於2.2g之THF及0.6g之NEt3中,將所得的反應溶液於60℃下攪拌1至2個小時以製備具有平均顆粒粒徑為100nm之Ag奈米顆粒。該反應溶液接著以離心分離,去除殘留的溶劑,以製備出0.2g之Ag奈米顆粒。
由實施例1至3中所製備之Ag奈米顆粒以掃描型電子顯微鏡(SEM)拍攝,並從計算500顆能確定其粒徑者之奈米顆粒中,獲得平均粒徑。
實施例4
[製備Ag奈米顆粒墨水]
從實施例1至3中所製備的Ag奈米顆粒取0.6g,分別分散於4.0ml之有機溶劑(THF)中,接著,將胺(NH3)做為添加劑,以及聚乙烯吡咯烷酮(PVP)做為分散穩定劑,分別以基於混合溶液總重之2%(重量)及0.5%(重量)加入上述溶液,以機械攪拌均勻混合以製備一Ag墨水。
實驗實施例1
由實施例1至3所製備之Ag奈米顆粒,於穿透式電子顯微鏡(TEM)下拍攝,結果分別顯示於圖3至圖5。
實驗實施例2
將實施例4製備的Ag墨水塗佈或印刷,並在250℃下燒結20分鐘。之後,使用一四點探針測定該塗佈的塗覆膜之表面電阻率,其結果為該塗覆膜具有7mW.cm之特異性電阻率。
根據本發明可獲得具有下列效果。
第一,根據本發明之實施例,該金屬奈米顆粒可使用α位上具有取代基之脂肪酸合成之金屬前驅物而合成,因此,因為該α位上具有取代基之脂肪酸做為封端劑而使金屬奈米顆粒可輕易地與不同極性之溶劑混合。
第二,金屬奈米顆粒之粒徑及粒徑分佈可於控制合成條件下(如濃度和溫度)而調整,並使用不同能量源或機械力來合成金屬奈米顆粒。
第三,根據本發明所製備之金屬奈米顆粒,可透過與其使當的比例來添加溶劑以及添加劑,而獲得具有增進的分散穩定性以及墨水物理特性金屬奈米顆粒墨水。
雖然本文中揭示了實施例,但應理解其包含其他變化的可能性,這些變化並不視為背離本發明之實施例的精神及範圍,且對技藝人士而言,所有這些明顯的修飾仍視為下方申請專利範圍之範疇內。
Claims (10)
- 一種製備用於金屬墨水之金屬奈米顆粒之方法,包含:將一α位上具有取代基之金屬前驅物溶解於一有機溶劑中,且對該金屬前驅物溶液施加一能量源或一機械力。
- 如請求項1之方法,其中該α位上具有取代基之金屬前驅物具有如下式1表示之結構:
- 如請求項1之方法,其中該有機溶劑為至少一種選自由THF、二甲苯、甲苯、二氯甲烷、CH3OH、CH3CH2OH、CH3CH2CH2OH、己烷、乙二醇、二乙二醇、三甘醇、丙二醇、丁二醇、二乙二醇單甲基醚、二乙二醇單丁基醚、丙二醇單甲基醚所組成之群組,以及DMSO。
- 如請求項1之方法,其進一步包含添加至少一種選自由KOH、NaOH、NH3、NH2CH3、NH4OH、NH(CH3)2、N(CH3)3、NH2Et、NH(Et)2、NEt3及Ca(OH)2所組成之群組之鹼,以增進該金屬前驅物於該有機溶劑中之溶解度。
- 如請求項1之方法,其中該能量源為熱、微波或紫外線(UV),且該機械力為攪拌或超音波。
- 如請求項1之方法,其中該金屬前驅物與該有機溶劑之質量比為1:2至 1:5。
- 如請求項1之方法,其中該金屬前驅物與該有機溶劑之質量比為1:5至1:20。
- 一種製備金屬奈米顆粒墨水之方法,包含:將根據請求項1至7任一項之方法製備而得之金屬奈米顆粒分散於一有機溶劑中,以製備一金屬奈米顆粒墨水;混合一添加劑以調整其物理特性;以及使該混合溶液均質。
- 如請求項8之方法,其中該有機溶劑為至少一種選自由醚類(THF、乙醚、丙醚或MEK)、苯類(二甲苯、甲苯、乙苯或苯)、醇類(甲醇、乙醇、丁醇、丙醇、乙二醇或丙二醇)、氯化物(二氯甲烷或三氯甲烷)、硫化物(DMSO)、氮化物(DMF、DEF、乙胺、氨、乙醇胺、二乙醇胺、三乙醇胺或三乙胺)及烷類(己烷、戊烷或丁烷)所組成之群組。
- 如請求項8之方法,其中使該混合溶液均質係透過運用超音波攪拌、渦流攪拌、機械攪拌、球磨機或滾軋機。
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