TWI568510B - Dust-removing nozzle and dust-removing apparatus - Google Patents

Dust-removing nozzle and dust-removing apparatus Download PDF

Info

Publication number
TWI568510B
TWI568510B TW104142476A TW104142476A TWI568510B TW I568510 B TWI568510 B TW I568510B TW 104142476 A TW104142476 A TW 104142476A TW 104142476 A TW104142476 A TW 104142476A TW I568510 B TWI568510 B TW I568510B
Authority
TW
Taiwan
Prior art keywords
air
dust
small
area portion
electronic component
Prior art date
Application number
TW104142476A
Other languages
Chinese (zh)
Other versions
TW201713419A (en
Inventor
宇澤啓
久保孝夫
Original Assignee
泰政有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 泰政有限公司 filed Critical 泰政有限公司
Application granted granted Critical
Publication of TWI568510B publication Critical patent/TWI568510B/en
Publication of TW201713419A publication Critical patent/TW201713419A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278Arrangement or mounting of spray heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04Cleaning by suction, with or without auxiliary action
    • B08B5/043Cleaning travelling work

Description

除塵噴嘴及除塵裝置 Dust removal nozzle and dust removal device

本發明係關於一種除塵噴嘴及除塵裝置。 The present invention relates to a dust removing nozzle and a dust removing device.

具有例如CMOS影像感測器或CCD影像感測器等具有小面積部之(小型)電子零件,係於印刷電路板或卡式托盤排列配設為複數個列,並於生產線上移動。(小型)電子零件之該小面積部,係為被特別要求超高潔淨度之部分。以往,已知有一種除塵裝置係藉由噴出、吸取空氣以將附著於該小面積部之塵埃或微粒子等異物去除。類似於該除塵裝置的實施例請參照專利文獻1日本特開2014-100622號公報。 A (small) electronic component having a small area such as a CMOS image sensor or a CCD image sensor is arranged in a plurality of columns on a printed circuit board or a card tray, and is moved on a production line. The small-area portion of the (small) electronic component is a part that is particularly required for ultra-high cleanliness. Conventionally, there has been known a dust removing device that removes foreign matter such as dust or fine particles adhering to the small-area portion by ejecting and sucking air. For an example of the dust removing device, please refer to Japanese Laid-Open Patent Publication No. 2014-100622.

然而,以往的除塵裝置係藉由考慮到對應至印刷電路板或卡式托盤全長之長型的清潔頭(除塵頭),該小面積部以外的部分亦噴空氣以進行除塵及洗淨。於小面積部以外的部分消耗多餘的空氣導致最需要除塵之重點的小面積部的洗淨效率降低這樣的缺點係存在。又,該小面積部的周圍位置一般存在有許多直徑數十微米之極微細電路,噴出之高壓、高速空氣可能使極微細電路斷路或損傷。 However, in the conventional dust removing device, by taking into consideration the long cleaning head (dusting head) corresponding to the entire length of the printed circuit board or the card tray, the portion other than the small area portion is also sprayed with air for dust removal and washing. The disadvantage that the excess air is consumed in a portion other than the small-area portion causes a decrease in the cleaning efficiency of the small-area portion which is the most important point of dust removal. Further, there are generally many fine circuits having a diameter of several tens of micrometers around the small-area portion, and the high-pressure, high-speed air that is ejected may cause the ultrafine circuit to be broken or damaged.

在此,本發明之目的係提供一種除塵噴嘴及除塵裝置,係可將電子零件中特別要求高潔淨度之該感測器等面積小之部分,集中地且效率良好地洗淨。 Here, an object of the present invention is to provide a dust removing nozzle and a dust removing device which can clean a portion which is small in size, such as a sensor, which is particularly required to have high cleanliness in an electronic component, and which is concentrated and efficiently.

本發明之除塵噴嘴係用以以空氣洗淨具備要求超高潔淨度 的需除塵之小面積部的電子零件,該除塵噴嘴包含:一空氣噴出孔,係向該需除塵之小面積部的輪廓內噴出空氣;及一空氣吸入孔,係包圍該空氣噴出孔而配設,於該需除塵之小面積部的該輪廓周圍將噴出之空氣吸入。又,該電子零件係配設有極微細電路,該極微細電路係沿著該需除塵之小面積部的該輪廓的一部分至整個周圍,該除塵噴嘴係構成為不使空氣直接噴出至該極微細電路,而係由該空氣噴出孔瞄準該需除塵之小面積部噴出空氣。 The dust removing nozzle of the invention is used for washing with air and has the requirement of ultra-high cleanliness An electronic component for a small area of the dust to be removed, the dust removing nozzle comprising: an air ejection hole for discharging air into a contour of the small area to be dusted; and an air suction hole surrounding the air ejection hole It is assumed that the discharged air is sucked around the contour of the small area portion to be dusted. Further, the electronic component is provided with a very fine circuit which is along a part of the outline of the small area to be dusted to the entire circumference, and the dust removing nozzle is configured not to directly discharge air to the pole. The micro-circuit is directed by the air ejection hole to aim the air to be ejected in a small area to be dusted.

又,該需除塵之小面積部係為感測器。 Moreover, the small area portion to be dusted is a sensor.

又,本發明之除塵裝置包含:輸送手段,係將電子零件群排列為相互平行之複數個列,並斷續地輸送;及複數個除塵噴嘴,係排列設置於正交於該輸送手段的輸送方向之寬度方向,該電子零件群的各電子零件的一部分係具備要求超高潔淨度之需除塵之小面積部,該各除塵噴嘴具備空氣噴出孔及空氣吸入孔,該空氣噴出孔係向該需除塵之小面積部的輪廓內噴出空氣,該空氣吸入孔係包圍該空氣噴出孔而配設,於該需除塵之小面積部的該輪廓周圍將噴出之空氣吸入,進而,該複數個除塵噴嘴係對應該電子零件群的各列配設,該電子零件係配設有極微細電路,該極微細電路係沿著該需除塵之小面積部的該輪廓的一部分至整個周圍,該除塵噴嘴係構成為對於該輸送手段斷續地輸送且為停止狀態之該電子零件,不使空氣直接噴出至該極微細電路,而係向該需除塵之小面積部的輪廓內噴出空氣,且於該需除塵之小面積部的該輪廓周圍將噴出之空氣吸入。 Moreover, the dust removing device of the present invention includes: a conveying means for arranging the electronic component groups in a plurality of rows parallel to each other and intermittently conveying; and a plurality of dust removing nozzles arranged in an orthogonal manner to the conveying means In the width direction of the direction, a part of each electronic component of the electronic component group is provided with a small area portion requiring dust removal requiring ultra-high cleanliness, and each of the dust removing nozzles has an air ejection hole and an air suction hole, and the air ejection hole is directed to the Air is blown out from the outline of the small-area portion to be dusted, and the air suction hole is disposed to surround the air ejection hole, and the air to be ejected is sucked around the contour of the small-area portion to be dust-removed, and further, the plurality of dust-removing The nozzles are arranged corresponding to the respective rows of the electronic component group, and the electronic component is provided with a very fine circuit which is along a part of the contour of the small area portion to be dusted to the entire circumference, the dust removing nozzle The electronic component that is intermittently transported to the transport means and is in a stopped state does not directly discharge air to the micro-fine circuit, but is required to Discharging air in the small area contour portion of the dust, and to the peripheral contour of the small area portion of the dust discharge the required intake air.

根據本發明之除塵噴嘴,對應需除塵之小面積部的面積及形狀,於各除塵噴嘴配設空氣噴出孔及空氣吸入孔,可幾乎不發生空氣外漏,將空氣僅噴出至需要洗淨之需除塵之小面積部,可效率良好地洗淨需除塵之小面積部。又,可不消耗多餘的空氣,減少空氣消耗量。且可不使異物飛散至周圍而去除。由空氣噴出孔噴出之空氣在一瞬間達到規定之壓力及 風速,以短時間內釋出之空氣,可確實地去除需除塵之小面積部的異物,提升洗淨效率。 According to the dust removing nozzle of the present invention, in accordance with the area and shape of the small-area portion to be dust-removed, the air-discharging hole and the air-suction hole are disposed in each of the dust-removing nozzles, so that the air leakage is hardly generated, and only the air is sprayed out to be washed. The small area that needs to be dusted can clean the small area that needs to be dusted efficiently. Moreover, it is possible to reduce the amount of air consumption without consuming excess air. And it can be removed without causing foreign matter to fly around. The air ejected from the air ejection hole reaches the prescribed pressure in an instant and The wind speed, the air released in a short time, can surely remove the foreign matter in the small area where dust is to be removed, and improve the cleaning efficiency.

根據本發明之除塵裝置,將複數個除塵噴嘴對應於電子零件群的各列而配設,可效率良好地洗淨各電子零件設置之需除塵之小面積部。又,對應需除塵之小面積部的面積及形狀,於各除塵噴嘴配設空氣噴出孔及空氣吸入孔,可幾乎不發生空氣外漏,將空氣僅噴出至需要洗淨之需除塵之小面積部,可效率良好地洗淨需除塵之小面積部。又,可不消耗多餘的空氣,減少空氣消耗量。且可不使異物飛散至周圍而去除。由空氣噴出孔噴出之空氣在一瞬間達到規定之壓力及風速,以短時間內釋出之空氣,可確實地去除需除塵之小面積部的異物,提升洗淨效率。可對應同時輸送之電子零件的數量而配設除塵噴嘴,提升洗淨效率。 According to the dust removing device of the present invention, a plurality of dust removing nozzles are disposed corresponding to the respective rows of the electronic component group, and the small-area portion to be dust-removed provided for each electronic component can be efficiently cleaned. Further, in accordance with the area and shape of the small-area portion to be dust-removed, the air-discharging hole and the air-suction hole are disposed in each of the dust-removing nozzles, so that there is almost no leakage of air, and only the air is ejected to a small area to be cleaned. The department can clean the small area that needs to be dusted efficiently. Moreover, it is possible to reduce the amount of air consumption without consuming excess air. And it can be removed without causing foreign matter to fly around. The air ejected from the air ejection hole reaches a predetermined pressure and a wind speed in an instant, and the air released in a short time can surely remove foreign matter in a small area to be dusted, thereby improving the cleaning efficiency. A dust removal nozzle can be provided corresponding to the number of electronic components that are simultaneously conveyed to improve the cleaning efficiency.

1‧‧‧除塵噴嘴 1‧‧‧dust removal nozzle

11‧‧‧空氣噴出用管路 11‧‧‧Air spout pipe

12‧‧‧空氣吸入用管路 12‧‧‧Air intake pipe

13‧‧‧噴嘴本體部 13‧‧‧Nozzle body

14‧‧‧蓋部 14‧‧‧ 盖部

15‧‧‧擋塊 15‧‧ ‧stop

15A‧‧‧第一擋塊 15A‧‧‧First stop

15B‧‧‧第二擋塊 15B‧‧‧second stop

16‧‧‧擴大孔 16‧‧‧Enlarged hole

17‧‧‧縮小孔 17‧‧‧Reduced holes

1A‧‧‧相對面 1A‧‧‧ opposite

2‧‧‧需除塵之小面積部 2‧‧‧Small area requiring dust removal

3‧‧‧空氣噴出孔 3‧‧‧Air venting holes

4‧‧‧空氣吸入孔 4‧‧‧Air suction hole

6‧‧‧電子零件 6‧‧‧Electronic parts

7‧‧‧超音波產生器 7‧‧‧Supersonic generator

8‧‧‧極微細電路 8‧‧‧ extremely fine circuit

10‧‧‧電子零件群 10‧‧‧Electronic parts group

20‧‧‧輸送手段 20‧‧‧ means of transport

C‧‧‧輸送方向 C‧‧‧Transport direction

F‧‧‧氣流 F‧‧‧Airflow

L‧‧‧輪廓 L‧‧‧ contour

P‧‧‧空氣噴出區域 P‧‧‧Air blasting area

V‧‧‧空氣吸入區域 V‧‧‧Air intake area

W‧‧‧洗淨區域 W‧‧‧Clean area

第1圖:表示本發明之除塵噴嘴的一個實施形態之擴大底面圖。 Fig. 1 is an enlarged bottom plan view showing an embodiment of a dust removing nozzle of the present invention.

第2圖:係第1圖之截面圖,(A)為D-D截面圖,(B)為E-E截面圖。 Fig. 2 is a cross-sectional view of Fig. 1, (A) is a D-D cross-sectional view, and (B) is an E-E cross-sectional view.

第3圖:係擴大平面圖,(A)為表示電子零件之擴大平面圖,(B)為說明除塵噴嘴與電子零件的對應關係之擴大平面圖。 Fig. 3 is an enlarged plan view, (A) is an enlarged plan view showing an electronic component, and (B) is an enlarged plan view showing a correspondence relationship between a dust removing nozzle and an electronic component.

第4圖:表示本發明之除塵裝置的一個實施形態之局部的圖,(A)為平面圖,(B)為斜視圖。 Fig. 4 is a partial view showing an embodiment of the dust removing device of the present invention, wherein (A) is a plan view and (B) is a perspective view.

第5圖:表示除塵噴嘴的其他實施形態之底面圖,(A)為表示其中一例之底面圖,(B)為表示其他例之底面圖。 Fig. 5 is a bottom view showing another embodiment of the dust removing nozzle, wherein (A) is a bottom view showing an example thereof, and (B) is a bottom view showing another example.

第6圖:表示除塵噴嘴的其他實施形態之底面圖,(C)為表示其中一例之底面圖,(D)為表示其他例之底面圖,(E)為表示另一例之底面圖。 Fig. 6 is a bottom view showing another embodiment of the dust removing nozzle, (C) is a bottom view showing an example thereof, (D) is a bottom view showing another example, and (E) is a bottom view showing another example.

第7圖:表示除塵噴嘴的另外之實施形態之底面圖,(F)為表示其中一例之底面圖,(G)為表示其他例之底面圖,(H)為表示另一例之底面圖。 Fig. 7 is a bottom view showing another embodiment of the dust removing nozzle, wherein (F) is a bottom view showing an example thereof, (G) is a bottom view showing another example, and (H) is a bottom view showing another example.

為讓本發明之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本發明之實施例,並配合所附圖式,作詳細說明如下: The above and other objects, features and advantages of the present invention will become more <RTIgt;

第4圖表示具有本發明之除塵噴嘴之除塵裝置的一個實施形態,該裝置係對電子零件6噴出空氣以除塵及洗淨,該電子零件6的一部份具有需除塵之小面積部2。電子零件6係於例如印刷電路板或卡式托盤以格子狀或交錯狀排列配設,除塵噴嘴1係對應於電子零件6之各列而設置,對於各電子零件6上之一個需除塵之小面積部2,一個除塵噴嘴1係相對向地配設。 Fig. 4 shows an embodiment of a dust removing device having a dust removing nozzle of the present invention which ejects air to the electronic component 6 for dusting and washing, and a part of the electronic component 6 has a small area portion 2 to be dusted. The electronic components 6 are arranged in a lattice or staggered arrangement, for example, on a printed circuit board or a card tray, and the dust removing nozzles 1 are provided corresponding to the respective rows of the electronic components 6, and one of the electronic components 6 is required to be dust-removed. In the area portion 2, one dust removing nozzle 1 is disposed to face each other.

如第3圖所示,需除塵之小面積部2係由例如CMOS影像感測器或CCD影像感測器等感測器形成。電子零件6係配設有極微細電路8,該極微細電路8係沿著需除塵之小面積部2的輪廓L的一部分至整個周圍。需除塵之小面積部2於圖式中由平面看係形成為矩形狀,最小尺寸係設定為4.4mm×3.3mm,最大尺寸係設定為36mm×24mm。需除塵之小面積部2於電子零件6中係最需要除塵,且特別要求高潔淨度。具體而言,每單位面積(mm2)附著之異物係大小1μm者未滿5個。極微細電路8係以截面積為圓形而言,其直徑為10μm~20μm者。又,需除塵之小面積部2的輪廓L不限定於矩形狀,可自由變更為圓形、橢圓狀或長方形之短邊形成為圓弧狀之形狀等。又,其他需除塵之小面積部2亦可為水晶元件、MEMS(微機電系統)、半導體晶圓、光學零件等,於圖式係省略。 As shown in Fig. 3, the small area 2 to be dusted is formed by a sensor such as a CMOS image sensor or a CCD image sensor. The electronic component 6 is provided with an extremely fine circuit 8 which is along a part of the outline L of the small-area portion 2 to be dusted to the entire periphery. The small-area portion 2 to be dust-removed is formed in a rectangular shape in plan view, and the minimum size is set to 4.4 mm × 3.3 mm, and the maximum size is set to 36 mm × 24 mm. The small-area portion 2 to be dust-removed is most necessary for dust removal in the electronic component 6, and particularly requires high cleanliness. Specifically, the foreign matter attached per unit area (mm 2 ) is less than five in size 1 μm. The ultrafine circuit 8 has a diameter of 10 μm to 20 μm in terms of a circular cross section. Further, the outline L of the small-area portion 2 to be dust-removed is not limited to a rectangular shape, and can be freely changed into a circular shape, an elliptical shape, or a short side in which a rectangular shape is formed into an arc shape. Further, the other small-area portion 2 to be dust-removed may be a crystal element, a MEMS (Micro Electro Mechanical System), a semiconductor wafer, an optical component, or the like, and is omitted in the drawings.

如第1圖及第2圖所示,除塵噴嘴1係於與需除塵之小面積部2相對之面1A具備複數個噴出空氣之空氣噴出孔3及複數個吸入空氣 之空氣吸入孔4。如第3圖(B)所示,除塵噴嘴1係於與需除塵之小面積部2相對之狀態,空氣噴出孔3配設於需除塵之小面積部2的輪廓L內的區域P,由空氣噴出孔3向需除塵之小面積部2的輪廓L內噴出空氣。亦即,除塵噴嘴1係構成為不使空氣直接噴出至需除塵之小面積部2的輪廓L之周圍配設之極微細電路8,而係由空氣噴出孔3瞄準需除塵之小面積部2噴出空氣。空氣吸入孔4係配設為包圍(複數個)空氣噴出孔3,以於需除塵之小面積部2的輪廓L之周圍區域V,吸入噴出的空氣。以下,將需除塵之小面積部2的輪廓L內的區域P作為空氣噴出區域,將需除塵之小面積部2的輪廓L之周圍區域V作為空氣吸入區域。 As shown in Fig. 1 and Fig. 2, the dust removing nozzle 1 is provided with a plurality of air ejection holes 3 for ejecting air and a plurality of suction air on the surface 1A opposed to the small-area portion 2 to be dust-removed. The air is sucked into the hole 4. As shown in Fig. 3(B), the dust removing nozzle 1 is in a state opposed to the small-area portion 2 to be dust-removed, and the air ejection hole 3 is disposed in the region P in the outline L of the small-area portion 2 to be dust-removed. The air ejection hole 3 ejects air into the outline L of the small-area portion 2 to be dusted. In other words, the dust removing nozzle 1 is configured such that the air is not directly ejected to the extremely fine circuit 8 disposed around the contour L of the small-area portion 2 to be dust-removed, and the air ejection hole 3 is aimed at the small-area portion 2 to be dust-removed. Air is ejected. The air suction hole 4 is provided to surround (a plurality of) air ejection holes 3 so as to suck in the discharged air in the peripheral region V of the outline L of the small-area portion 2 to be dusted. Hereinafter, the region P in the outline L of the small-area portion 2 to be dusted is used as the air ejection region, and the peripheral region V of the outline L of the small-area portion 2 to be dusted is taken as the air suction region.

第1圖及第2圖中,除塵噴嘴1由平面看係形成為略呈矩形之短柱狀,且具有噴嘴本體部13及蓋部14,該噴嘴本體部13連結有供給、排氣用之空氣配管連接頭,該蓋部14開設有複數個空氣噴出孔3及複數個空氣吸入孔4。除塵噴嘴1內具有連通並連結至複數個空氣噴出孔3之空氣噴出用管路11及連通並連結至複數個空氣吸入孔4之空氣吸入用管路12,蓋部14內的空氣噴出用管路11配設有超音波產生器7。超音波產生器7係由空氣噴出孔3及複數個擋塊15形成,該擋塊15設有數量與空氣噴出孔3相同之貫通孔,且該擋塊15係有第一擋塊15A及第二擋塊15B兩種,該第一擋塊15A具有直徑比空氣噴出孔3大之擴大孔16,該第二擋塊15B具有直徑比擴大孔16小之縮小孔17,兩種擋塊15A、15B係交互配設。藉由空氣噴出孔3、擴大孔16及縮小孔17,形成截面積重複擴大、縮小之連續的超音波產生孔。此外,亦可於蓋部14的底部將空氣噴出孔3及連續的超音波產生孔成形為一體。 In the first and second figures, the dust removing nozzle 1 is formed in a short rectangular column shape in plan view, and has a nozzle body portion 13 and a lid portion 14, and the nozzle body portion 13 is connected to supply and exhaust. The air pipe connector has a plurality of air ejection holes 3 and a plurality of air suction holes 4. The dust removing nozzle 1 has an air blowing pipe 11 that communicates with and is connected to the plurality of air blowing holes 3, and an air suction pipe 12 that communicates with the plurality of air suction holes 4, and an air discharge pipe in the cover portion 14. The road 11 is provided with an ultrasonic generator 7. The ultrasonic generator 7 is formed by an air ejection hole 3 and a plurality of stoppers 15, which are provided with the same number of through holes as the air ejection holes 3, and the stopper 15 is provided with the first stopper 15A and the first There are two types of two stoppers 15B. The first stopper 15A has an enlarged hole 16 having a larger diameter than the air ejection hole 3, and the second stopper 15B has a reduction hole 17 having a smaller diameter than the enlarged hole 16, and two kinds of stoppers 15A, 15B is an interactive configuration. The air ejection hole 3, the enlarged hole 16 and the reduced hole 17 form a continuous ultrasonic wave generating hole whose cross-sectional area is repeatedly enlarged and reduced. Further, the air ejection hole 3 and the continuous ultrasonic wave generating hole may be integrally formed at the bottom of the lid portion 14.

如第1圖所示,空氣噴出孔3係直徑較小之圓形孔,其直徑D0較佳係設定為0.45mm~0.75mm。另一方面,空氣吸入孔4係可以為直徑較大之圓形孔,其直徑D1為空氣噴出孔3之直徑D0的3倍~5倍,具 體而言,較佳係設定為1.5mm~3.5mm。空氣噴出孔3的直徑D0若未滿上述下限值,則難以穿孔加工,若超過上述上限值,則噴出之空氣的風速降低。又,空氣吸入孔4的直徑D1若未滿上述下限值,則可能無法去除異物,若超過上述上限值,則除塵噴嘴1的大小過大。 As shown in Fig. 1, the air ejection hole 3 is a circular hole having a small diameter, and the diameter D 0 is preferably set to 0.45 mm to 0.75 mm. On the other hand, the air suction hole 4 may be a circular hole having a large diameter, and the diameter D 1 is 3 to 5 times the diameter D 0 of the air ejection hole 3, and specifically, it is preferably set to 1.5 mm. ~3.5mm. When the diameter D 0 of the air ejection hole 3 is less than the above lower limit, the piercing process is difficult, and if it exceeds the above upper limit, the air velocity of the discharged air is lowered. Further, if the diameter D 1 of the air suction hole 4 is less than the above lower limit value, foreign matter may not be removed, and if it exceeds the above upper limit value, the size of the dust removing nozzle 1 is excessively large.

接著說明本發明之除塵裝置。如第4圖所示,本發明之除塵裝置具備輸送手段20及複數個除塵噴嘴1,該輸送手段20係將電子零件群10排列為相互平行之複數個列,並斷續地輸送,該除塵噴嘴1係排列設置於正交於輸送手段20的輸送方向C之寬度方向,且複數個除塵噴嘴1係對應於電子零件群10的各列而配設。輸送手段20係可由例如使長度方向的兩端部連結之無端狀輸送帶、由輸送帶內部支持之滾筒、驅動滾筒之馬達、傳動機等構成。電子零件群10之各電子零件6的一部分係具備要求超高潔淨度之需除塵之小面積部2。需除塵之小面積部2係電子零件6中最需要除塵之部分。 Next, the dust removing device of the present invention will be described. As shown in Fig. 4, the dust removing device of the present invention includes a conveying means 20 and a plurality of dust removing nozzles 1, and the conveying means 20 arranges the electronic component groups 10 in a plurality of rows parallel to each other and intermittently conveys the dust. The nozzles 1 are arranged in the width direction orthogonal to the transport direction C of the transport means 20, and a plurality of dust removing nozzles 1 are disposed corresponding to the respective rows of the electronic component group 10. The transport means 20 can be constituted, for example, by an endless conveyor belt that connects both end portions in the longitudinal direction, a drum supported by the inside of the conveyor belt, a motor that drives the drum, a conveyor, and the like. A part of each of the electronic components 6 of the electronic component group 10 is provided with a small-area portion 2 requiring dust removal requiring ultra-high cleanliness. The portion of the 2 series electronic parts 6 that needs to be dust-removed is most in need of dust removal.

如第1圖及第4圖(B)所示,除塵噴嘴1係構成為對於輸送手段20斷續地輸送且為停止狀態之電子零件6,向需除塵之小面積部2的輪廓L內由空氣噴出孔3噴出空氣,且於需除塵之小面積部2的輪廓L周圍將噴出之空氣吸入至空氣吸入孔4。除塵噴嘴1係於橫越輸送方向C之洗淨位置W對應於同時輸送過來之電子零件6的數量,於橫向(正交於輸送方向C)排列設置相同個數,對於電子零件6上的一個需除塵之小面積部2,一個除塵噴嘴1係相對向地配設。此外,除塵噴嘴1亦可構成為排列設置成複數列,於複數個洗淨位置W同時進行洗淨,以對應更多的電子零件6。 As shown in Fig. 1 and Fig. 4(B), the dust removing nozzle 1 is configured such that the electronic component 6 that is intermittently conveyed to the transporting means 20 and is in a stopped state is placed in the outline L of the small-area portion 2 to be dust-removed. The air ejection hole 3 ejects air, and sucks the ejected air around the contour L of the small-area portion 2 to be dusted to the air suction hole 4. The dust removing nozzle 1 is disposed at a washing position W across the conveying direction C corresponding to the number of electronic parts 6 that are simultaneously conveyed, and is arranged in the lateral direction (orthogonal to the conveying direction C) by the same number, for one on the electronic part 6. A small area portion 2 for dust removal is required, and one dust removing nozzle 1 is disposed opposite to the ground. Further, the dust removing nozzles 1 may be configured to be arranged in a plurality of rows, and simultaneously washed at a plurality of cleaning positions W to correspond to more electronic components 6.

以下說明上述本發明之除塵噴嘴的使用方法(作用)。如第2圖(A)所示,由供給用之空氣配管供給規定之高壓空氣至除塵噴嘴1的空氣噴出用管路11。供給至空氣噴出用管路11之空氣係通過超音波產生 器7,成為具有20kHz~100kHz頻率之超音波的氣流(超音波空氣)F,由空氣噴出孔3噴出。空氣噴出用管路11的容積極小,空氣噴出用管路11內係於短時間內一瞬間達到規定之壓力,由空氣噴出孔3噴出高速(140m~200m/sec)之氣流F。 The method (operation) of the above-described dust removing nozzle of the present invention will be described below. As shown in FIG. 2(A), the predetermined high-pressure air is supplied to the air discharge line 11 of the dust removing nozzle 1 by the supply air pipe. The air supplied to the air discharge pipe 11 is generated by ultrasonic waves. The airflow (ultrasonic air) F having a supersonic wave having a frequency of 20 kHz to 100 kHz is ejected from the air ejection hole 3. The air ejection line 11 has a small positive volume, and the air ejection line 11 reaches a predetermined pressure in a short time, and a high-speed (140 m to 200 m/sec) air flow F is ejected from the air ejection hole 3.

第3圖(B)中,除塵噴嘴1係於需除塵之小面積部2的輪廓L內之空氣噴出區域P,由空氣噴出孔3向需除塵之小面積部2噴出空氣。除塵噴嘴1僅向需除塵之小面積部2噴出空氣,使異物由需除塵之小面積部2表面剝離。亦即,除塵噴嘴1係由空氣噴出孔3瞄準需除塵之小面積部2噴出空氣,以不使空氣直接噴出至需除塵之小面積部2的輪廓L之周圍配設之極微細電路8。除塵噴嘴1不將空氣噴出至需除塵之小面積部2的輪廓L周圍,而不會產生多餘的空氣外漏(air leak)。因此,不會消耗多餘的空氣,以較少之空氣消耗量,效率良好地洗淨需除塵之小面積部。 In Fig. 3(B), the dust removing nozzle 1 is in the air ejection region P in the outline L of the small-area portion 2 to be dust-removed, and the air ejection hole 3 ejects air to the small-area portion 2 to be dust-removed. The dust removing nozzle 1 ejects air only to the small-area portion 2 to be dust-removed, and the foreign matter is peeled off from the surface of the small-area portion 2 to be dust-removed. In other words, the dust removing nozzle 1 is directed to the small-sized circuit 8 disposed around the contour L of the small-area portion 2 to be dust-removed by the air ejection hole 3 aiming at the small-area portion 2 to be dust-removed. The dust removing nozzle 1 does not spray air around the contour L of the small-area portion 2 to be dust-removed, and does not generate an excessive air leak. Therefore, the excess air is not consumed, and the small-area portion to be dust-removed is efficiently washed with a small amount of air consumption.

由需除塵之小面積部2表面剝離之異物,於需除塵之小面積部2的輪廓L周圍的空氣吸入區域V被空氣吸入孔4吸入,異物由空氣吸入用管路12至排氣用之空氣配管而被排出。除塵噴嘴1係於包圍空氣噴出區域P之空氣吸入區域V,吸入由空氣噴出孔3噴出之空氣,使異物不會飛散於周圍而去除。 The foreign matter peeled off from the surface of the small-area portion 2 to be dust-removed is sucked into the air suction hole V around the contour L of the small-area portion 2 to be dust-removed, and the foreign matter is supplied from the air suction pipe 12 to the exhaust gas. It is discharged by air piping. The dust removing nozzle 1 is in the air suction region V surrounding the air ejection region P, and sucks the air ejected from the air ejection hole 3 so that foreign matter does not fly around and is removed.

又,本發明可變更設計,例如,除塵噴嘴1可如第5圖(A)所示,空氣吸入孔4形成為細縫狀亦可。細縫狀之空氣吸入孔4係以夾住空氣噴出區域P之方式配設於需除塵之小面積部2的輪廓L周圍的兩處。又,如第5圖(B)所示,空氣吸入孔4係形成為閉環狀,以包圍需除塵之小面積部2的輪廓L周圍之方式配設。 Further, the present invention can be modified. For example, the dust removing nozzle 1 can be formed in a slit shape as shown in Fig. 5(A). The air suction hole 4 of the slit shape is disposed at two places around the contour L of the small-area portion 2 to be dusted so as to sandwich the air ejection region P. Further, as shown in Fig. 5(B), the air suction hole 4 is formed in a closed loop shape so as to surround the contour L of the small-area portion 2 to be dust-removed.

如第6圖所示,需除塵之小面積部2為圓形狀之情況,除塵噴嘴1由平面看係較佳形成為圓形狀。第6圖(C)中,除塵噴嘴1係於 需除塵之小面積部2的輪廓L內以放射狀配設複數個空氣噴出孔3,並以包圍需除塵之小面積部2的輪廓L周圍之方式配設複數個空氣吸入孔4。第6圖(D)中,空氣吸入孔4係形成為彎曲成圓弧狀之細縫,第6圖(E)中,空氣吸入孔4係形成為圓環狀,以包圍需除塵之小面積部2的輪廓L周圍之方式配設。又,如第7圖所示,需除塵之小面積部2的面積(大小)變大之情況則增加空氣噴出孔3及空氣吸入孔4的個數,或增加空氣吸入孔4的面積。第7圖(F)中,需除塵之小面積部2的輪廓L內配設比第1圖所示之圖例更多的空氣噴出孔3,並以包圍需除塵之小面積部2的輪廓L周圍之方式配設複數個空氣吸入孔4。第7圖(G)中,空氣吸入孔4成為細縫狀,第7圖(H)中,空氣吸入孔4成為ㄇ字型,以包圍需除塵之小面積部2的輪廓L周圍之方式配設。 As shown in Fig. 6, in the case where the small-area portion 2 to be dust-removed has a circular shape, the dust-removing nozzle 1 is preferably formed in a circular shape in plan view. In Fig. 6(C), the dust removing nozzle 1 is attached to A plurality of air ejection holes 3 are radially disposed in the outline L of the small-area portion 2 to be dust-removed, and a plurality of air suction holes 4 are disposed so as to surround the contour L of the small-area portion 2 to be dust-removed. In Fig. 6(D), the air suction hole 4 is formed as a slit that is curved in an arc shape, and in Fig. 6(E), the air suction hole 4 is formed in an annular shape to surround a small area to be dusted. The contour of the portion 2 is arranged around the contour L. Further, as shown in Fig. 7, when the area (size) of the small-area portion 2 to be dusted is increased, the number of the air ejection holes 3 and the air suction holes 4 is increased, or the area of the air suction holes 4 is increased. In Fig. 7(F), more air ejection holes 3 than the illustrations shown in Fig. 1 are disposed in the outline L of the small-area portion 2 to be dust-removed, and the contour L of the small-area portion 2 to be dust-removed is surrounded. A plurality of air suction holes 4 are provided in the surrounding manner. In Fig. 7(G), the air suction hole 4 has a slit shape, and in Fig. 7(H), the air suction hole 4 has a U-shape, and surrounds the contour L of the small-area portion 2 to be dust-removed. Assume.

如上所述,本發明之除塵噴嘴係用以以空氣洗淨具備要求超高潔淨度的需除塵之小面積部2的電子零件6,該除塵噴嘴包含:空氣噴出孔3,係向該需除塵之小面積部2的輪廓L內噴出空氣;及空氣吸入孔4,係包圍該空氣噴出孔3而配設,於該需除塵之小面積部2的該輪廓L周圍將噴出之空氣吸入,故可對應於需除塵之小面積部2的面積及形狀而配置空氣噴出孔3及空氣吸入孔4,可幾乎不發生空氣外漏,將空氣僅噴出至需要洗淨之需除塵之小面積部2,可效率良好地且確實地洗淨需除塵之小面積部2。又,可不消耗多餘的空氣,減少空氣消耗量。且可不使異物飛散至周圍而去除。由空氣噴出孔3噴出之空氣在一瞬間達到規定之壓力及風速,以短時間內釋出之空氣,可確實地去除需除塵之小面積部2的異物,提升洗淨效率。 As described above, the dust removing nozzle of the present invention is for cleaning the electronic component 6 having the small-area portion 2 requiring dust removal requiring high cleanliness, and the dust removing nozzle includes the air ejection hole 3 for the dust to be removed. Air is ejected from the outline L of the small-area portion 2, and the air suction hole 4 is disposed so as to surround the air ejection hole 3, and the air to be ejected is sucked around the contour L of the small-area portion 2 to be dust-removed. The air ejection hole 3 and the air suction hole 4 can be disposed corresponding to the area and shape of the small-area portion 2 to be dust-removed, and the air leakage can be hardly generated, and the air can be ejected only to the small-area portion 2 to be cleaned. The small-area portion 2 to be dust-removed can be cleaned efficiently and surely. Moreover, it is possible to reduce the amount of air consumption without consuming excess air. And it can be removed without causing foreign matter to fly around. The air ejected from the air ejection hole 3 reaches a predetermined pressure and a wind speed in an instant, and the air released in a short time can surely remove the foreign matter of the small-area portion 2 to be dusted, thereby improving the washing efficiency.

又,該電子零件6係配設有極微細電路8,該極微細電路8係沿著該需除塵之小面積部2的該輪廓L的一部分至整個周圍,該除塵噴嘴係構成為不使空氣直接噴出至該極微細電路8,而係由該空氣噴出孔3 瞄準該需除塵之小面積部2噴出空氣,可不使極微細電路8斷路或損傷,將空氣僅噴出至需除塵之小面積部2,而效率良好且確實地洗淨需除塵之小面積部2。 Further, the electronic component 6 is provided with a micro-fine circuit 8 which is along a part of the outline L of the small-area portion 2 to be dust-removed to the entire circumference, and the dust-removing nozzle is configured not to make air. Directly ejected to the micro-fine circuit 8 by the air ejection hole 3 Aiming at the small-area portion 2 to be dust-removed, the air can be ejected only to the small-area portion 2 to be dust-removed, and the small-area portion 2 to be dust-removed is efficiently and surely cleaned. .

又,該需除塵之小面積部2係為感測器,故在電子零件6中最需要除塵,可將空氣僅集中噴出至特別要求高潔淨度之需除塵之小面積部2,而效率良好且確實地洗淨需除塵之小面積部2。 Moreover, the small-area portion 2 to be dust-removed is a sensor, so that the dust is most needed in the electronic component 6, and the air can be concentratedly discharged only to the small-area portion 2 requiring dust removal, which is particularly required for high cleanliness, and is efficient. And cleanly clean the small area portion 2 to be dusted.

又,本發明之除塵裝置包含輸送手段20及複數個除塵噴嘴1,該輸送手段20係將電子零件群10排列為相互平行之複數個列,並斷續地輸送,該除塵噴嘴1係排列設置於正交於該輸送手段20的該輸送方向之寬度方向,該電子零件群10的各電子零件6的一部分係具備要求超高潔淨度之需除塵之小面積部2,該除塵噴嘴1具備空氣噴出孔3及空氣吸入孔4,該空氣噴出孔3係向該需除塵之小面積部的輪廓L內噴出空氣,該空氣吸入孔4係包圍該空氣噴出孔3而配設,於該需除塵之小面積部2的該輪廓L周圍將噴出之空氣吸入,進而,複數個除塵噴嘴1係構成為對應於電子零件群10的各列而配設,對於輸送手段20斷續地輸送且為停止狀態之電子零件6,向需除塵之小面積部2的輪廓L內噴出空氣,且於需除塵之小面積部2的輪廓L周圍將噴出之空氣吸入,故將複數個除塵噴嘴1對應於電子零件群10的各列而配設,可效率良好地洗淨設置於各電子零件6的需除塵之小面積部2。又,對應需除塵之小面積部2的面積及形狀,於各除塵噴嘴配設空氣噴出孔3及空氣吸入孔4,可幾乎不發生空氣外漏,將空氣僅噴出至需要洗淨之需除塵之小面積部2,可效率良好地洗淨需除塵之小面積部2。又,可不消耗多餘的空氣,減少空氣消耗量。且可不使異物飛散至周圍而去除。由空氣噴出孔3噴出之空氣在一瞬間達到規定之壓力及風速,以短時間內釋出之空氣,可確實地去除需除塵之小面積部2的異物,提升洗淨效率。可對應同時輸送之電子零件6的數量而配設除塵噴 嘴1,提升洗淨效率。 Further, the dust removing device of the present invention includes a conveying means 20 and a plurality of dust removing nozzles 1 which arrange the electronic component groups 10 in a plurality of rows which are parallel to each other and are intermittently conveyed, and the dust removing nozzles 1 are arranged and arranged. A part of each of the electronic components 6 of the electronic component group 10 is provided with a small-area portion 2 requiring dust removal requiring ultra-high cleanliness, which is orthogonal to the width direction of the transporting means 20, and the dust-removing nozzle 1 is provided with air. a discharge hole 3 and an air suction hole 4 for discharging air into a contour L of the small-area portion to be dust-removed, the air suction hole 4 being disposed to surround the air ejection hole 3, and the dust is required to be removed The air to be ejected is sucked around the outline L of the small-area portion 2, and the plurality of dust-removing nozzles 1 are arranged to be arranged corresponding to the respective rows of the electronic component group 10, and the transport means 20 is intermittently transported and stopped. In the electronic component 6 of the state, air is ejected into the outline L of the small-area portion 2 to be dust-removed, and the air to be ejected is sucked around the contour L of the small-area portion 2 to be dust-removed, so that the plurality of dust-removing nozzles 1 correspond to the electrons. zero The respective rows of the group 10 are disposed, and the small-area portion 2 to be dust-removed provided in each of the electronic components 6 can be efficiently cleaned. Further, in accordance with the area and shape of the small-area portion 2 to be dust-removed, the air-discharging holes 3 and the air-suction holes 4 are disposed in the respective dust-removing nozzles, so that there is almost no leakage of air, and only air is discharged to the dust to be cleaned. The small area portion 2 can efficiently clean the small area portion 2 to be dusted. Moreover, it is possible to reduce the amount of air consumption without consuming excess air. And it can be removed without causing foreign matter to fly around. The air ejected from the air ejection hole 3 reaches a predetermined pressure and a wind speed in an instant, and the air released in a short time can surely remove the foreign matter of the small-area portion 2 to be dusted, thereby improving the washing efficiency. Dedusting spray can be provided according to the number of electronic parts 6 that are simultaneously transported Mouth 1, improve cleaning efficiency.

雖然本發明已利用上述實施例揭示,然其並非用以限定本發明,任何熟習此技藝者在不脫離本發明之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the present invention has been disclosed in the above embodiments, it is not intended to limit the scope of the present invention. The scope of protection of the invention is therefore defined by the scope of the appended claims.

1‧‧‧除塵噴嘴 1‧‧‧dust removal nozzle

1A‧‧‧相對面 1A‧‧‧ opposite

3‧‧‧空氣噴出孔 3‧‧‧Air venting holes

4‧‧‧空氣吸入孔 4‧‧‧Air suction hole

L‧‧‧輪廓 L‧‧‧ contour

P‧‧‧空氣噴出區域 P‧‧‧Air blasting area

V‧‧‧空氣吸入區域 V‧‧‧Air intake area

D0‧‧‧空氣噴出孔直徑 D 0 ‧‧‧Air ejection hole diameter

D1‧‧‧空氣吸入孔直徑 D 1 ‧‧‧Air suction hole diameter

Claims (3)

一種除塵噴嘴,係用以以空氣洗淨具備要求超高潔淨度的需除塵之小面積部的電子零件,該除塵噴嘴包含:一空氣噴出孔,係向該需除塵之小面積部的輪廓內噴出空氣;及一空氣吸入孔,係包圍該空氣噴出孔而配設,於該需除塵之小面積部的該輪廓周圍將噴出之空氣吸入,其中,該電子零件係配設有極微細電路,該極微細電路係沿著該需除塵之小面積部的該輪廓的一部分至整個周圍,該除塵噴嘴係構成為不使空氣直接噴出至該極微細電路,而係由該空氣噴出孔瞄準該需除塵之小面積部噴出空氣。 A dust removing nozzle for cleaning an electronic component having a small area requiring dust removal requiring ultra-high cleanliness, the dust removing nozzle comprising: an air ejection hole facing the outline of the small area to be dusted Ejecting air; and an air suction hole is disposed to surround the air ejection hole, and the air to be ejected is sucked around the contour of the small area portion to be dusted, wherein the electronic component is provided with a micro-fine circuit. The ultra-fine circuit is along a part of the contour of the small-area portion to be dusted to the entire circumference, and the dust-removing nozzle is configured not to directly discharge air to the micro-fine circuit, but the air ejection hole is aimed at the need The small area of the dust is sprayed with air. 如申請專利範圍第1項所述之除塵噴嘴,其中,該需除塵之小面積部係為感測器。 The dust removing nozzle according to claim 1, wherein the small area portion to be dusted is a sensor. 一種除塵裝置,包含:輸送手段,係將電子零件群排列為相互平行之複數個列,並斷續地輸送;及複數個除塵噴嘴,係排列設置於正交於該輸送手段的輸送方向之寬度方向,該電子零件群的各電子零件的一部分係具備要求超高潔淨度之需除塵之小面積部,該各除塵噴嘴具備空氣噴出孔及空氣吸入孔,該空氣噴出孔係向該需除塵之小面積部的輪廓內噴出空氣,該空氣吸入孔係包圍該空氣噴出孔而配設,於該需除塵之小面積部的該輪廓周圍將噴出之空氣吸入,進而,該複數個除塵噴嘴係對應該電子零件群的各列配設,該電子零件係配設有極微細電路,該極微細電路係沿著該需除塵之小面積部的該輪廓的一部分至整個周圍,該除塵噴嘴係構成為對於該輸送手段斷續地輸送且為停止狀態之該電子零件,不使空氣直接噴出至該極微細電路,而係向該需除塵之小面積部的輪廓內噴出空氣,且於該需除塵之小面積部的該輪廓周圍將噴出之空氣吸入。 A dust removing device comprising: a conveying means for arranging an electronic component group into a plurality of columns parallel to each other and intermittently conveying; and a plurality of dust removing nozzles arranged in a width orthogonal to a conveying direction of the conveying means In the direction, a part of each electronic component of the electronic component group is provided with a small area portion requiring dust removal requiring ultra-high cleanliness, and each of the dust removing nozzles has an air ejection hole and an air suction hole, and the air ejection hole is directed to the dust removal Air is blown out from the outline of the small-area portion, and the air suction hole is disposed to surround the air ejection hole, and the air to be ejected is sucked around the contour of the small-area portion to be dust-removed, and further, the plurality of dust-removing nozzles are paired Each of the electronic component groups is disposed, and the electronic component is provided with a very fine circuit which is formed along a part of the outline of the small area portion to be dusted to the entire circumference, and the dust removing nozzle is configured as The electronic component that is intermittently conveyed by the conveying means and is in a stopped state does not directly discharge air to the micro-fine circuit, but is directed to the dust-removing device. The small area around the contour portion of the inner contour of the area of the air ejection portion, and the need to discharge the dust of the air intake.
TW104142476A 2015-10-07 2015-12-17 Dust-removing nozzle and dust-removing apparatus TWI568510B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015199582A JP6173404B2 (en) 2015-10-07 2015-10-07 Dust removal nozzle and dust removal device

Publications (2)

Publication Number Publication Date
TWI568510B true TWI568510B (en) 2017-02-01
TW201713419A TW201713419A (en) 2017-04-16

Family

ID=58531573

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142476A TWI568510B (en) 2015-10-07 2015-12-17 Dust-removing nozzle and dust-removing apparatus

Country Status (4)

Country Link
JP (1) JP6173404B2 (en)
KR (1) KR102063172B1 (en)
CN (1) CN106563667B (en)
TW (1) TWI568510B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106937496B (en) * 2017-03-01 2019-08-06 烽火通信科技股份有限公司 Communication equipment is with from dedusting wall hanging cabinet and dust removal method
CN107666800B (en) * 2017-09-29 2019-06-25 歌尔股份有限公司 A kind of electronic equipment
CN107824554A (en) * 2017-12-11 2018-03-23 大竹县第二小学 A kind of efficiently crevice cleaning device
CN110369395A (en) * 2018-04-12 2019-10-25 宁波舜宇光电信息有限公司 Cleaner for motor lens assembly
KR102053583B1 (en) * 2019-06-10 2019-12-06 김석태 Cleaning apparatus for a camera module
CN110883015A (en) * 2019-12-09 2020-03-17 Oppo(重庆)智能科技有限公司 Dirty adsorption equipment
CN113680743B (en) * 2021-08-20 2022-05-24 张卓莹 Circuit test PCB board surface cleaning equipment for electronic information

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006110428A (en) * 2004-10-13 2006-04-27 Takuma Co Ltd Nozzle and filtration type duct collector
JP2009192200A (en) * 2008-02-18 2009-08-27 Aizakku T:Kk Dust collection nozzle and industrial dust collector using it
TWI453808B (en) * 2011-03-23 2014-09-21 Hitachi High Tech Instr Co Ltd A foreign matter removing device and a wafer bonding machine provided with the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2512350Y2 (en) * 1990-06-19 1996-10-02 株式会社伸興 Dust remover
US7767025B2 (en) * 2007-09-30 2010-08-03 Intel Corporation Nozzle array configuration to facilitate deflux process improvement in chip attach process
JP2010062455A (en) * 2008-09-05 2010-03-18 Sharp Corp Foreign matter removing device
KR101397277B1 (en) * 2012-05-16 2014-05-21 삼성전기주식회사 Apparatus for removing dust and method for removing dust by using the same
TW201420219A (en) * 2012-11-16 2014-06-01 Nitto Ind Co Ltd Dust removal device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006110428A (en) * 2004-10-13 2006-04-27 Takuma Co Ltd Nozzle and filtration type duct collector
JP2009192200A (en) * 2008-02-18 2009-08-27 Aizakku T:Kk Dust collection nozzle and industrial dust collector using it
TWI453808B (en) * 2011-03-23 2014-09-21 Hitachi High Tech Instr Co Ltd A foreign matter removing device and a wafer bonding machine provided with the same

Also Published As

Publication number Publication date
TW201713419A (en) 2017-04-16
JP2017070904A (en) 2017-04-13
KR20170041603A (en) 2017-04-17
KR102063172B1 (en) 2020-01-07
JP6173404B2 (en) 2017-08-02
CN106563667A (en) 2017-04-19
CN106563667B (en) 2019-06-14

Similar Documents

Publication Publication Date Title
TWI568510B (en) Dust-removing nozzle and dust-removing apparatus
JP6336801B2 (en) Substrate dryer
KR101548243B1 (en) Apparatus for recovering abrasives, apparatus for blasting process comprising the apparatus for recovering abrasives and method of blasting process
JP5273534B2 (en) Dry cleaning apparatus, cleaning method, and cleaned items
JP2013147352A (en) Dry ice belt washing system for laser cutting device
JP2006346515A (en) Dust collector
TW201810448A (en) Foreign matter removal device
JP6653016B2 (en) Foreign matter removal device
CN107424896B (en) Chamber cleaning system
KR20210093500A (en) Dry type ultrasonic cleaner having multi-suction port
KR20190012584A (en) Air knife and dust cleaning apparatus having the same
JP2018107466A (en) Substrate drying apparatus
JP2007059417A (en) Substrate treatment device
JP2007059416A (en) Substrate treatment device
KR102026867B1 (en) Debris removal device
JP2003282525A (en) Substrate treatment device
US20190366397A1 (en) Air rinsing apparatus and systems for rinsing containers
JP3706566B2 (en) Liquid drainer for printed wiring boards
JP2018130536A (en) Tablet printing device
JP2004074104A (en) Conveying and dust removing apparatus
JP2005169356A (en) Air knife drying device
WO2020073192A1 (en) Ultrasonic cleaning machine
JP6931987B2 (en) Flux coating device and flux coating method
JP2007152438A (en) Manufacturing apparatus and manufacturing method for semiconductor
JP2003224101A (en) Substrate cleaning equipment and cleaning method