JP3706566B2 - Liquid drainer for printed wiring boards - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a liquid draining and drying apparatus for removing liquid adhering to a printed wiring board in a manufacturing process of the printed wiring board.
[0002]
[Prior art]
A printed wiring board is manufactured through various scientific or physical processing steps. During this manufacturing process, the printed wiring board is immersed in liquid or sprayed with liquid, such as plating or cleaning. There is usually a process. Further, when the liquid adheres to the printed circuit board in the process as described above, a process of removing the adhering liquid before moving to the subsequent process is usually required.
[0003]
In order to remove the liquid adhering to the printed wiring board, a method in which compressed air is blown onto the surface of the printed wiring board to blow off the adhering liquid is widely used. A typical example of this method will be described with reference to FIG. In FIG. 5, 101 is a printed wiring board, 102 is a conveyance roller, 103 is an ejector, 104 is a compressed air introduction path, and 105 is an adhesion liquid.
[0004]
The printed wiring board 101 is transported in the direction of the arrow D by the transport roller 102 with the adhesion liquid 105. Here, compressed air generated by a compressor or blower (not shown) is sent from the compressed air introduction path 104 to the ejector 103, and is formed at the tip of the ejector 103 so as to be long in the width direction of the printed wiring board conveyance path. To the surface of the printed wiring board 101.
[0005]
As a result, the adhesion liquid 105 is blown off by the compressed air and scattered from the surface of the printed wiring board 101 like 105A. However, most of the scattered liquid 105 </ b> A again falls on the printed wiring board 101 and becomes the adherent liquid 105 again. That is, the drainage state is poor, and eventually, a part of the adhering liquid 105 passes through the compressed air blown from the slit nozzle 103A and remains.
[0006]
Therefore, as disclosed in a recently published technique, for example, Japanese Patent Laid-Open No. 6-338676 “Draining and drying method and apparatus for printed circuit board”, a method for eliminating the above-described poor drainage is considered. . This method will be described with reference to FIGS. In FIG. 6, 201 is an ejector, 202 is a compressed air introduction path, and 203 is an ejection nozzle. Unlike the slit nozzle 103A shown in FIG. 5, the ejection nozzle 203 has a substantially circular shape aligned in a straight line. It is formed with a hole.
[0007]
The said ejector 201 is fixed to a printed wiring board conveyance path, as shown in FIG. FIG. 7 is a view of the printed wiring board conveyance path as viewed from the front or the rear. Here, the ejector 201 is disposed at an angle β with the surface of the printed wiring board 101 in a direction perpendicular to the transport direction of the printed wiring board 101. That is, the compressed air blown from the jet nozzle 203 is blown obliquely at an angle α to the surface of the printed wiring board 101.
[0008]
The adhering liquid 105 is driven away in the direction intersecting the transport direction of the printed wiring board 101 by the compressed air blown obliquely, and is eventually blown into the lateral space of the printed wiring board 101 like 105A. As a result, the poor drainage as described with reference to FIG. Furthermore, in this document, as shown in FIG. 8, the adhering liquid 105 is effectively discharged by blowing compressed air obliquely in the direction opposite to the conveying direction of the printed wiring board 101, that is, by making γ an acute angle. You can do that.
[0009]
[Problems to be solved by the invention]
However, as can be seen from FIG. 7, since the ejector 201 is inclined with respect to the printed wiring board 101, the position of the ejection nozzle 203 moves away from the surface of the printed wiring board 101 as it moves away from the fulcrum of the angle β, and the attached liquid The end portion on the side from which 105 is discharged is far away from the printed wiring board 101 compared to the end portion on the opposite side. When the inclination angle of the ejector 201 is constant, the difference in the distance from the printed wiring board 101 due to the position of the ejection nozzle 203 increases as the width of the printed wiring board 101 increases.
[0010]
Therefore, in the width direction of the printed wiring board 101, on the side where the adhesion liquid 105 is discharged, the distance from the ejection nozzle 203 is large, so that there is a problem that the wind pressure is significantly reduced compared to the opposite side. As a result, in an area where the wind pressure is weak, there is a high possibility that a part of the adhesion liquid 105 remains without being blown off.
Further, the above-described area where the wind pressure is weak is an area where the adhesion liquid 105 of all the width direction areas of the printed wiring board 101 is collected, which increases the possibility of remaining.
[0011]
The present invention has been made to solve the above-described problems, and has a function of discharging the adhering liquid in a direction intersecting the transport direction of the printed wiring board, and the compressed air ejection nozzle is in the width direction of the printed wiring board. An apparatus for draining and drying a printed wiring board, characterized in that the direction in which the entire area is approached at an equal distance, and in addition, the direction in which the attached liquid is discharged, is distributed to the left and right starting from the approximate center in the width direction of the printed wiring board. The purpose is to provide.
[0012]
[Means for Solving the Problems]
The present invention relates to a liquid draining and drying apparatus that removes liquid adhering to a printed wiring board in a manufacturing process of the printed wiring board, and a nozzle that ejects a plurality of holes formed in a spiral shape on a side surface that forms a curved surface. A cylindrical ejector, and the ejector extending in a direction perpendicular to the transport direction of the printed wiring board transport path and parallel to the surface of the printed wiring board, and driving the ejector The compressed air supplied from the compressed nozzle is supplied to the rotating jetting device from the compressed air supply means which is rotated around the axis by the air joint connected to one end of the jetting device by a rotatable air joint. A liquid draining and drying device for a printed wiring board, characterized by a spiral air curtain rotating and discharging the liquid adhering to the printed wiring board in a direction intersecting the transport direction of the printed wiring board Subjected to.
[0013]
In addition, by forming a spiral shape formed by a row of ejection nozzles drilled in the ejector, starting from a position corresponding to the approximate center in the width direction of the printed wiring board to be transported, it is formed in a spiral shape that is reversed left and right, Discharge of adherent liquid more efficiently.
[0014]
Further, in the state where the ejector is rotated, the ejecting device captures and includes the compressed air immediately after the ejection for all the ejecting nozzles other than the ejecting nozzle that ejects the compressed air toward the surface of the printed wiring board. A rectifying hood that ejects the compressed air contained in the slit nozzle arranged so as to jet compressed air to the printed wiring board in parallel with the printed wiring board is provided, and the liquid draining and drying function of the printed wiring board is more reliable. To do.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1, 2, 3, and 4. FIG. 1 is a perspective view showing an embodiment of the present invention. In FIG. 1A, 101 is a printed wiring board conveyed in the direction of arrow A, 102 is a conveyance roller, 3 is an ejector, and 4 is a rotatable air joint. Moreover, FIG.1 (b) equips the ejector 3 with the commutation hood 5 in the structure shown to Fig.1 (a).
[0016]
As shown in FIG. 1A, the ejector 3 is a cylinder disposed so that its axis is perpendicular to the transport direction of the printed wiring board 101 and the axis is parallel to the surface of the printed wiring board 1. Is an element of shape. One end 3A of the ejector 3 is sealed, and the other end is connected to a compressed air supply means (not shown) comprising a compressor or a blower via a rotatable air joint 4. Further, the ejector 3 is rotatably fixed by a support mechanism (not shown), and is rotated in the direction of arrow A by a drive means (not shown).
[0017]
The compressed air supplied to the inside of the ejector 3 is ejected from an ejection nozzle 6 that is formed in a spiral arrangement on a curved side surface 3B as shown in FIG. Since the ejection nozzles 6 are formed adjacent to each other, the compressed air after ejection forms a spiral air curtain 7. Further, as shown in FIG. 3, the ejection nozzles 6 are arranged so as to draw a spiral in the opposite direction from the position 8 on both sides starting from a position 8 corresponding to the approximate center in the width direction of the printed wiring board 101.
[0018]
As a result, the spiral blown air rotating in the direction of arrow A discharges the adhering liquid 105 on the printed wiring board 101 moving in the direction of arrow A in the direction intersecting the direction of arrow A (the direction of arrow C). To do. Here, since the spiral direction of the jet air is opposite from the substantially central portion of the printed wiring board 101 in the width direction, the adhesion liquid 105 is distributed to both sides of the printed wiring board 101 and discharged. Further, in the present embodiment, the arrangement of the spiral ejection nozzles is one row, but the same effect can be obtained even if this is a plurality of rows.
[0019]
When the direction of the jet nozzle 6 is directed to the surface of the printed wiring board 101, the rotating spiral jet air as described above has an effect of discharging the adhering liquid 105, but jets in the other direction. Compressed air cannot be expected to have any effect. Therefore, the compressed air ejected in this direction is included in the flow straightening hood 5 as shown in FIG. 4 and blown onto the surface of the printed wiring board 101 from the slit nozzle 5A provided in the flow straightening hood 5.
[0020]
Since the surface of the printed wiring board 101 passing under the slit nozzle 5A has been subjected to the discharge action of the adhering liquid 105 by the ejector 3, the adhering liquid 105 does not exist in a large mass, but is as small as a mist. The possibility of remaining as the adhering liquid 105B cannot be ignored. Therefore, the compressed air ejected from the slit nozzle 5A completely removes such mist-like residual adhering liquid 105B, and dries the surface of the printed wiring board 101.
[0021]
【The invention's effect】
According to the present invention, the adhering liquid 105 on the surface of the printed wiring board 101 is discharged in a direction intersecting the transport direction of the printed wiring board 101 by blowing out the rotating spiral compressed air, which is shown in FIG. In such an action of the conventional slit nozzle 103A, the poor drainage caused by the adhered liquid 105A blown off again adheres to the printed wiring board 101 is eliminated. As a result, the adhesion liquid that cannot be completely discharged from the printed wiring board 101 can be drastically reduced.
[0022]
Further, in the conventional method of discharging the adhering liquid in the direction intersecting the transport direction of the printed wiring board 101 as shown in FIG. 7, the distance between the ejection nozzle 203 and the surface of the printed wiring board 101 is different in the width direction. As a result, a large difference has also occurred in the wind pressure of the compressed air. According to the present invention, the distance between the ejection nozzle 6 and the surface of the printed wiring board 101 is uniformly arranged, and the entire surface of the printed wiring board 101 is disposed. , Compressed air can be blown with an appropriate wind pressure.
[0023]
Further, in the conventional method shown in FIG. 7, the method of discharging the adhering liquid 105 scattered over the entire surface of the printed wiring board to one side is taken, but according to the present invention, it is distributed from the approximate center in the width direction to both sides. The attached liquid can be discharged. This makes it possible to discharge the attached liquid more efficiently.
[0024]
Moreover, according to this invention, since the ejector 3 is cylindrical and rotates, the angle by which compressed air is sprayed with respect to the printed wiring board 101 changes. As a result, as described with reference to FIG. 8 in the prior art, a state in which compressed air is blown obliquely with respect to the conveyance direction of the printed wiring board 101 is also obtained, and the discharge efficiency of the adhesion liquid 105 is further increased.
[0025]
In addition, the compressed air ejected from the ejection nozzle 6 at an angle not sprayed on the surface of the printed wiring board 101 is collected, and the compressed air is supplied by disposing the rectifying hood 5 that sprays the compressed air from the slit nozzle 5A to the printed wiring board 101. It is possible to eliminate the waste of compressed air and to completely blow off the mist-like adhering liquid 105B that could not be discharged by the previous ejector 3, and finish the printed wiring board 101 in a dry state.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of the present invention. FIG. 2 is a perspective view of an ejector according to the present invention. FIG. 3 is a top view illustrating the operation of the present invention. Fig. 5 is a side view showing a conventional technique. Fig. 6 is a perspective view of an ejector showing a conventional technique. Fig. 7 is a front view showing a conventional technique. Fig. 8 is a side view showing a conventional technique. Explanation of]
DESCRIPTION OF SYMBOLS 3 Spout 4 Rotatable air joint 5 Rectification hood 6 Jet nozzle 7 Air curtain 101 Printed wiring board 102 Conveying roller 105 Adhering liquid

Claims (3)

In the liquid draining and drying device for removing the liquid adhering to the printed wiring board in the manufacturing process of the printed wiring board,
A cylindrical ejector having a plurality of holes drilled in a spiral manner on a side surface forming a curved surface as an ejection nozzle;
Extending the ejector in a direction perpendicular to the transport direction of the printed wiring board transport path and parallel to the surface of the printed wiring board;
The ejector is rotated around the axis by driving means,
Compressed air is supplied to the rotating ejector from compressed air supply means connected to one end of the ejector by a rotatable air joint,
The compressed air ejected from the ejection nozzle becomes a rotating spiral air curtain, and the liquid adhering to the printed wiring board is discharged in a direction intersecting the transport direction of the printed wiring board. Drying equipment. A spiral shape formed by a row of ejection nozzles drilled in the ejector forms a spiral shape that is reverse to the left and right starting from a position corresponding to the approximate center in the width direction of the printed wiring board to be conveyed. The liquid draining and drying device for a printed wiring board according to claim 1. In the state in which the ejector rotates, all the ejecting nozzles other than the ejecting nozzle that ejects compressed air toward the surface of the printed wiring board capture and contain the compressed air immediately after the ejection, and are parallel to the ejector. The printed wiring board according to claim 1 or 2, further comprising a rectifying hood for ejecting the contained compressed air from a slit nozzle arranged so as to eject compressed air to the printed wiring board. Liquid drainer.

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