TWI564539B - 光學系統、用於其中之照射控制之方法及非暫時性電腦可讀媒體 - Google Patents
光學系統、用於其中之照射控制之方法及非暫時性電腦可讀媒體 Download PDFInfo
- Publication number
- TWI564539B TWI564539B TW101120937A TW101120937A TWI564539B TW I564539 B TWI564539 B TW I564539B TW 101120937 A TW101120937 A TW 101120937A TW 101120937 A TW101120937 A TW 101120937A TW I564539 B TWI564539 B TW I564539B
- Authority
- TW
- Taiwan
- Prior art keywords
- illumination
- optical
- array
- dynamic
- pupil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/06—Means for illuminating specimens
- G02B21/08—Condensers
- G02B21/082—Condensers for incident illumination only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
- G02B21/365—Control or image processing arrangements for digital or video microscopes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/18—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical projection, e.g. combination of mirror and condenser and objective
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Microscoopes, Condenser (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/170,025 US8681413B2 (en) | 2011-06-27 | 2011-06-27 | Illumination control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201303258A TW201303258A (zh) | 2013-01-16 |
| TWI564539B true TWI564539B (zh) | 2017-01-01 |
Family
ID=47361608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101120937A TWI564539B (zh) | 2011-06-27 | 2012-06-11 | 光學系統、用於其中之照射控制之方法及非暫時性電腦可讀媒體 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8681413B2 (enExample) |
| EP (1) | EP2724361B1 (enExample) |
| JP (1) | JP6132838B2 (enExample) |
| KR (1) | KR101982363B1 (enExample) |
| TW (1) | TWI564539B (enExample) |
| WO (1) | WO2013002988A2 (enExample) |
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| US9164397B2 (en) * | 2010-08-03 | 2015-10-20 | Kla-Tencor Corporation | Optics symmetrization for metrology |
| US9228943B2 (en) * | 2011-10-27 | 2016-01-05 | Kla-Tencor Corporation | Dynamically adjustable semiconductor metrology system |
| EP2823360B1 (de) * | 2012-03-09 | 2022-06-22 | Carl Zeiss SMT GmbH | Beleuchtungsoptik für die euv-projektionslithografie sowie optisches system mit einer derartigen beleuchtungsoptik |
| KR102231730B1 (ko) * | 2012-06-26 | 2021-03-24 | 케이엘에이 코포레이션 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
| US20150268418A1 (en) * | 2012-09-27 | 2015-09-24 | Applied Micro Circuits Corporation | Expanded beam interconnector |
| US9188839B2 (en) * | 2012-10-04 | 2015-11-17 | Cognex Corporation | Component attachment devices and related systems and methods for machine vision systems |
| NL2011477A (en) * | 2012-10-10 | 2014-04-14 | Asml Netherlands Bv | Mark position measuring apparatus and method, lithographic apparatus and device manufacturing method. |
| US20150157199A1 (en) * | 2012-12-06 | 2015-06-11 | Noam Sapiens | Method and apparatus for scatterometric measurement of human tissue |
| WO2014102792A1 (en) * | 2012-12-27 | 2014-07-03 | Nova Measuring Instruments Ltd. | Optical method and system for critical dimensions and thickness characterization |
| US9123649B1 (en) | 2013-01-21 | 2015-09-01 | Kla-Tencor Corporation | Fit-to-pitch overlay measurement targets |
| US9476837B2 (en) * | 2013-04-21 | 2016-10-25 | Nova Measuring Instruments Ltd. | Method and system for improving optical measurements on small targets |
| CN105408721B (zh) * | 2013-06-27 | 2020-01-10 | 科磊股份有限公司 | 计量学目标的极化测量及对应的目标设计 |
| CN106104202B (zh) * | 2014-03-20 | 2019-08-02 | 科磊股份有限公司 | 计量光学量测方法及系统 |
| JP6578118B2 (ja) * | 2014-04-04 | 2019-09-18 | 株式会社ニューフレアテクノロジー | 撮像装置、検査装置および検査方法 |
| TWI557406B (zh) * | 2014-04-04 | 2016-11-11 | Nuflare Technology Inc | An imaging device, a defect inspection device, and a defect inspection method |
| WO2016015987A1 (en) | 2014-07-28 | 2016-02-04 | Asml Netherlands B.V. | Illumination system, inspection apparatus including such an illumination system, inspection method and manufacturing method |
| US9793178B2 (en) * | 2014-08-28 | 2017-10-17 | University Of Rochester | Focused beam scatterometry apparatus and method |
| CN107078074B (zh) | 2014-11-25 | 2021-05-25 | 科磊股份有限公司 | 分析及利用景观 |
| DE102015214302B4 (de) * | 2015-04-28 | 2021-02-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur Erzeugung zweidimensionaler Beleuchtungsmuster und Vorrichtung zur optischen Bestimmung von Geschwindigkeitsfeldern in Fluidströmungen |
| KR102128488B1 (ko) | 2015-12-09 | 2020-07-01 | 에이에스엠엘 홀딩 엔.브이. | 플렉시블 일루미네이터 |
| CN109073980B (zh) | 2015-12-17 | 2021-06-18 | Asml荷兰有限公司 | 量测设备的调节或基于已测量目标的特性而由量测设备进行的测量 |
| KR20180095605A (ko) | 2015-12-17 | 2018-08-27 | 에이에스엠엘 네델란즈 비.브이. | 스캐터로메트리에서의 편광 튜닝 |
| CN106933049B (zh) * | 2015-12-30 | 2020-06-16 | 上海微电子装备(集团)股份有限公司 | 一种用于半导体光刻的曝光系统与曝光方法 |
| US9846128B2 (en) * | 2016-01-19 | 2017-12-19 | Applied Materials Israel Ltd. | Inspection system and a method for evaluating an exit pupil of an inspection system |
| JP6731490B2 (ja) | 2016-03-07 | 2020-07-29 | エーエスエムエル ネザーランズ ビー.ブイ. | 照明システムおよびメトロロジシステム |
| US10438339B1 (en) * | 2016-09-12 | 2019-10-08 | Apple Inc. | Optical verification system and methods of verifying micro device transfer |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| KR102695660B1 (ko) | 2017-11-07 | 2024-08-14 | 에이에스엠엘 네델란즈 비.브이. | 관심 특성을 결정하는 계측 장치 및 방법 |
| CN108279553B (zh) * | 2018-01-30 | 2019-06-21 | 中国科学院上海光学精密机械研究所 | 一种光刻机照明控制测试系统及方法 |
| EP3528047A1 (en) * | 2018-02-14 | 2019-08-21 | ASML Netherlands B.V. | Method and apparatus for measuring a parameter of interest using image plane detection techniques |
| US10761031B1 (en) * | 2018-03-20 | 2020-09-01 | Kla-Tencor Corporation | Arbitrary wavefront compensator for deep ultraviolet (DUV) optical imaging system |
| US12130246B2 (en) | 2018-12-31 | 2024-10-29 | Asml Netherlands B.V. | Method for overlay metrology and apparatus thereof |
| US11359916B2 (en) * | 2019-09-09 | 2022-06-14 | Kla Corporation | Darkfield imaging of grating target structures for overlay measurement |
| CN113048895B (zh) * | 2021-03-04 | 2022-08-16 | 上海精测半导体技术有限公司 | 探测反射光变化的装置、方法及膜厚测量装置 |
| JP7589188B2 (ja) * | 2022-02-28 | 2024-11-25 | キヤノン株式会社 | 計測装置、計測方法、リソグラフィ装置及び物品の製造方法 |
| WO2024068297A1 (en) * | 2022-09-26 | 2024-04-04 | Asml Netherlands B.V. | Tunable optical system |
| KR102519813B1 (ko) | 2022-10-17 | 2023-04-11 | (주)오로스테크놀로지 | 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램 |
| KR102546552B1 (ko) | 2022-11-14 | 2023-06-22 | (주)오로스테크놀로지 | 오버레이 계측 장치의 동작을 제어하는 데이터를 저장하기 위한 데이터 구조를 기록한 컴퓨터 판독 가능 저장 매체 및 이를 위한 오버레이 계측 장치 |
| KR102898111B1 (ko) * | 2023-03-15 | 2025-12-09 | (주) 오로스테크놀로지 | 오버레이 측정 장치의 최적화 방법 및 이를 수행하는 오버레이 측정 장치 |
| WO2025243284A1 (en) * | 2024-05-20 | 2025-11-27 | Tondo Smart Ltd. | Systems and methods for improving illumination efficiency in an area of interest |
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| US6844927B2 (en) * | 2002-11-27 | 2005-01-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for removing optical abberations during an optical inspection |
| US7009704B1 (en) * | 2000-10-26 | 2006-03-07 | Kla-Tencor Technologies Corporation | Overlay error detection |
| TWI294518B (en) * | 2004-08-16 | 2008-03-11 | Asml Netherlands Bv | Scattermeter and method for measuring a property of a substrate |
| US20080239428A1 (en) * | 2007-04-02 | 2008-10-02 | Inphase Technologies, Inc. | Non-ft plane angular filters |
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2011
- 2011-06-27 US US13/170,025 patent/US8681413B2/en active Active
-
2012
- 2012-06-07 EP EP12803940.1A patent/EP2724361B1/en active Active
- 2012-06-07 WO PCT/US2012/041273 patent/WO2013002988A2/en not_active Ceased
- 2012-06-07 KR KR1020147002337A patent/KR101982363B1/ko active Active
- 2012-06-07 JP JP2014518591A patent/JP6132838B2/ja active Active
- 2012-06-11 TW TW101120937A patent/TWI564539B/zh active
Patent Citations (4)
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| US7009704B1 (en) * | 2000-10-26 | 2006-03-07 | Kla-Tencor Technologies Corporation | Overlay error detection |
| US6844927B2 (en) * | 2002-11-27 | 2005-01-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for removing optical abberations during an optical inspection |
| TWI294518B (en) * | 2004-08-16 | 2008-03-11 | Asml Netherlands Bv | Scattermeter and method for measuring a property of a substrate |
| US20080239428A1 (en) * | 2007-04-02 | 2008-10-02 | Inphase Technologies, Inc. | Non-ft plane angular filters |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120327503A1 (en) | 2012-12-27 |
| WO2013002988A3 (en) | 2013-07-11 |
| WO2013002988A2 (en) | 2013-01-03 |
| US8681413B2 (en) | 2014-03-25 |
| TW201303258A (zh) | 2013-01-16 |
| EP2724361A4 (en) | 2015-03-18 |
| JP6132838B2 (ja) | 2017-05-24 |
| KR101982363B1 (ko) | 2019-05-27 |
| KR20140053141A (ko) | 2014-05-07 |
| EP2724361A2 (en) | 2014-04-30 |
| EP2724361B1 (en) | 2023-12-27 |
| JP2014521116A (ja) | 2014-08-25 |
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