TWI564539B - 光學系統、用於其中之照射控制之方法及非暫時性電腦可讀媒體 - Google Patents
光學系統、用於其中之照射控制之方法及非暫時性電腦可讀媒體 Download PDFInfo
- Publication number
- TWI564539B TWI564539B TW101120937A TW101120937A TWI564539B TW I564539 B TWI564539 B TW I564539B TW 101120937 A TW101120937 A TW 101120937A TW 101120937 A TW101120937 A TW 101120937A TW I564539 B TWI564539 B TW I564539B
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- TW
- Taiwan
- Prior art keywords
- illumination
- optical
- array
- dynamic
- pupil
- Prior art date
Links
- 238000005286 illumination Methods 0.000 title claims description 198
- 230000003287 optical effect Effects 0.000 title claims description 174
- 238000000034 method Methods 0.000 title claims description 41
- 210000001747 pupil Anatomy 0.000 claims description 106
- 230000004075 alteration Effects 0.000 claims description 44
- 238000009826 distribution Methods 0.000 claims description 36
- 230000010287 polarization Effects 0.000 claims description 26
- 230000005855 radiation Effects 0.000 claims description 11
- 230000003595 spectral effect Effects 0.000 claims description 8
- 230000007547 defect Effects 0.000 claims description 5
- 230000005670 electromagnetic radiation Effects 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 238000001228 spectrum Methods 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 238000003491 array Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000004458 analytical method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 8
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- 230000001427 coherent effect Effects 0.000 description 6
- 238000012937 correction Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- 238000005457 optimization Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 5
- 230000021615 conjugation Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
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- 238000010894 electron beam technology Methods 0.000 description 2
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/06—Means for illuminating specimens
- G02B21/08—Condensers
- G02B21/082—Condensers for incident illumination only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
- G02B21/365—Control or image processing arrangements for digital or video microscopes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/18—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical projection, e.g. combination of mirror and condenser and objective
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Multimedia (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microscoopes, Condenser (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/170,025 US8681413B2 (en) | 2011-06-27 | 2011-06-27 | Illumination control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201303258A TW201303258A (zh) | 2013-01-16 |
| TWI564539B true TWI564539B (zh) | 2017-01-01 |
Family
ID=47361608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101120937A TWI564539B (zh) | 2011-06-27 | 2012-06-11 | 光學系統、用於其中之照射控制之方法及非暫時性電腦可讀媒體 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8681413B2 (enExample) |
| EP (1) | EP2724361B1 (enExample) |
| JP (1) | JP6132838B2 (enExample) |
| KR (1) | KR101982363B1 (enExample) |
| TW (1) | TWI564539B (enExample) |
| WO (1) | WO2013002988A2 (enExample) |
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| US9164397B2 (en) * | 2010-08-03 | 2015-10-20 | Kla-Tencor Corporation | Optics symmetrization for metrology |
| US9228943B2 (en) * | 2011-10-27 | 2016-01-05 | Kla-Tencor Corporation | Dynamically adjustable semiconductor metrology system |
| EP2823360B1 (de) * | 2012-03-09 | 2022-06-22 | Carl Zeiss SMT GmbH | Beleuchtungsoptik für die euv-projektionslithografie sowie optisches system mit einer derartigen beleuchtungsoptik |
| KR102330743B1 (ko) * | 2012-06-26 | 2021-11-23 | 케이엘에이 코포레이션 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
| US20150268418A1 (en) * | 2012-09-27 | 2015-09-24 | Applied Micro Circuits Corporation | Expanded beam interconnector |
| US9188839B2 (en) * | 2012-10-04 | 2015-11-17 | Cognex Corporation | Component attachment devices and related systems and methods for machine vision systems |
| NL2011477A (en) * | 2012-10-10 | 2014-04-14 | Asml Netherlands Bv | Mark position measuring apparatus and method, lithographic apparatus and device manufacturing method. |
| US20150157199A1 (en) * | 2012-12-06 | 2015-06-11 | Noam Sapiens | Method and apparatus for scatterometric measurement of human tissue |
| WO2014102792A1 (en) * | 2012-12-27 | 2014-07-03 | Nova Measuring Instruments Ltd. | Optical method and system for critical dimensions and thickness characterization |
| US9123649B1 (en) | 2013-01-21 | 2015-09-01 | Kla-Tencor Corporation | Fit-to-pitch overlay measurement targets |
| US9476837B2 (en) * | 2013-04-21 | 2016-10-25 | Nova Measuring Instruments Ltd. | Method and system for improving optical measurements on small targets |
| CN105408721B (zh) * | 2013-06-27 | 2020-01-10 | 科磊股份有限公司 | 计量学目标的极化测量及对应的目标设计 |
| CN106104202B (zh) * | 2014-03-20 | 2019-08-02 | 科磊股份有限公司 | 计量光学量测方法及系统 |
| JP6578118B2 (ja) * | 2014-04-04 | 2019-09-18 | 株式会社ニューフレアテクノロジー | 撮像装置、検査装置および検査方法 |
| TWI557406B (zh) * | 2014-04-04 | 2016-11-11 | Nuflare Technology Inc | An imaging device, a defect inspection device, and a defect inspection method |
| WO2016015987A1 (en) | 2014-07-28 | 2016-02-04 | Asml Netherlands B.V. | Illumination system, inspection apparatus including such an illumination system, inspection method and manufacturing method |
| US9793178B2 (en) * | 2014-08-28 | 2017-10-17 | University Of Rochester | Focused beam scatterometry apparatus and method |
| CN107078074B (zh) | 2014-11-25 | 2021-05-25 | 科磊股份有限公司 | 分析及利用景观 |
| DE102015214302B4 (de) * | 2015-04-28 | 2021-02-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur Erzeugung zweidimensionaler Beleuchtungsmuster und Vorrichtung zur optischen Bestimmung von Geschwindigkeitsfeldern in Fluidströmungen |
| NL2017766A (en) | 2015-12-09 | 2017-06-14 | Asml Holding Nv | A flexible illuminator |
| WO2017102327A1 (en) | 2015-12-17 | 2017-06-22 | Asml Netherlands B.V. | Polarization tuning in scatterometry |
| WO2017102304A1 (en) | 2015-12-17 | 2017-06-22 | Asml Netherlands B.V. | Adjustment of a metrology apparatus or a measurement thereby based on a characteristic of a target measured |
| CN106933049B (zh) * | 2015-12-30 | 2020-06-16 | 上海微电子装备（集团）股份有限公司 | 一种用于半导体光刻的曝光系统与曝光方法 |
| US9846128B2 (en) * | 2016-01-19 | 2017-12-19 | Applied Materials Israel Ltd. | Inspection system and a method for evaluating an exit pupil of an inspection system |
| WO2017153130A1 (en) | 2016-03-07 | 2017-09-14 | Asml Netherlands B.V. | Illumination system and metrology system |
| US10438339B1 (en) | 2016-09-12 | 2019-10-08 | Apple Inc. | Optical verification system and methods of verifying micro device transfer |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| CN111316172A (zh) * | 2017-11-07 | 2020-06-19 | Asml荷兰有限公司 | 量测设备和确定感兴趣的特性的方法 |
| CN108279553B (zh) * | 2018-01-30 | 2019-06-21 | 中国科学院上海光学精密机械研究所 | 一种光刻机照明控制测试系统及方法 |
| EP3528047A1 (en) * | 2018-02-14 | 2019-08-21 | ASML Netherlands B.V. | Method and apparatus for measuring a parameter of interest using image plane detection techniques |
| US10761031B1 (en) * | 2018-03-20 | 2020-09-01 | Kla-Tencor Corporation | Arbitrary wavefront compensator for deep ultraviolet (DUV) optical imaging system |
| US12130246B2 (en) | 2018-12-31 | 2024-10-29 | Asml Netherlands B.V. | Method for overlay metrology and apparatus thereof |
| US11359916B2 (en) * | 2019-09-09 | 2022-06-14 | Kla Corporation | Darkfield imaging of grating target structures for overlay measurement |
| CN113048895B (zh) * | 2021-03-04 | 2022-08-16 | 上海精测半导体技术有限公司 | 探测反射光变化的装置、方法及膜厚测量装置 |
| JP7589188B2 (ja) | 2022-02-28 | 2024-11-25 | キヤノン株式会社 | 計測装置、計測方法、リソグラフィ装置及び物品の製造方法 |
| JP2025530963A (ja) * | 2022-09-26 | 2025-09-19 | エーエスエムエル ネザーランズ ビー．ブイ． | チューナブル光学系 |
| KR102519813B1 (ko) | 2022-10-17 | 2023-04-11 | (주)오로스테크놀로지 | 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램 |
| KR102546552B1 (ko) | 2022-11-14 | 2023-06-22 | (주)오로스테크놀로지 | 오버레이 계측 장치의 동작을 제어하는 데이터를 저장하기 위한 데이터 구조를 기록한 컴퓨터 판독 가능 저장 매체 및 이를 위한 오버레이 계측 장치 |
| US20240312847A1 (en) * | 2023-03-15 | 2024-09-19 | Auros Technology, Inc. | Optimization method of overlay measurement device and overlay measurement device performing the same |
| CN119986931A (zh) * | 2023-11-10 | 2025-05-13 | 致茂电子(苏州)有限公司 | 科勒照明系统的最佳化扩散片位置调校方法 |
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| US6844927B2 (en) * | 2002-11-27 | 2005-01-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for removing optical abberations during an optical inspection |
| US7009704B1 (en) * | 2000-10-26 | 2006-03-07 | Kla-Tencor Technologies Corporation | Overlay error detection |
| TWI294518B (en) * | 2004-08-16 | 2008-03-11 | Asml Netherlands Bv | Scattermeter and method for measuring a property of a substrate |
| US20080239428A1 (en) * | 2007-04-02 | 2008-10-02 | Inphase Technologies, Inc. | Non-ft plane angular filters |
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| JP5721042B2 (ja) * | 2010-10-20 | 2015-05-20 | 株式会社ニコン | 顕微鏡システム |
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-
2011
- 2011-06-27 US US13/170,025 patent/US8681413B2/en active Active
-
2012
- 2012-06-07 WO PCT/US2012/041273 patent/WO2013002988A2/en not_active Ceased
- 2012-06-07 KR KR1020147002337A patent/KR101982363B1/ko active Active
- 2012-06-07 EP EP12803940.1A patent/EP2724361B1/en active Active
- 2012-06-07 JP JP2014518591A patent/JP6132838B2/ja active Active
- 2012-06-11 TW TW101120937A patent/TWI564539B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7009704B1 (en) * | 2000-10-26 | 2006-03-07 | Kla-Tencor Technologies Corporation | Overlay error detection |
| US6844927B2 (en) * | 2002-11-27 | 2005-01-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for removing optical abberations during an optical inspection |
| TWI294518B (en) * | 2004-08-16 | 2008-03-11 | Asml Netherlands Bv | Scattermeter and method for measuring a property of a substrate |
| US20080239428A1 (en) * | 2007-04-02 | 2008-10-02 | Inphase Technologies, Inc. | Non-ft plane angular filters |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2724361A2 (en) | 2014-04-30 |
| KR20140053141A (ko) | 2014-05-07 |
| JP2014521116A (ja) | 2014-08-25 |
| US8681413B2 (en) | 2014-03-25 |
| JP6132838B2 (ja) | 2017-05-24 |
| US20120327503A1 (en) | 2012-12-27 |
| TW201303258A (zh) | 2013-01-16 |
| EP2724361A4 (en) | 2015-03-18 |
| EP2724361B1 (en) | 2023-12-27 |
| WO2013002988A2 (en) | 2013-01-03 |
| KR101982363B1 (ko) | 2019-05-27 |
| WO2013002988A3 (en) | 2013-07-11 |
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