TWI563602B - Method of fabricating a package substrate - Google Patents

Method of fabricating a package substrate

Info

Publication number
TWI563602B
TWI563602B TW105111841A TW105111841A TWI563602B TW I563602 B TWI563602 B TW I563602B TW 105111841 A TW105111841 A TW 105111841A TW 105111841 A TW105111841 A TW 105111841A TW I563602 B TWI563602 B TW I563602B
Authority
TW
Taiwan
Prior art keywords
fabricating
package substrate
package
substrate
Prior art date
Application number
TW105111841A
Other languages
English (en)
Other versions
TW201737415A (zh
Inventor
Chu Chin Hu
Shih Ping Hsu
Che Wei Hsu
Chin Ming Liu
Chih Kuai Yang
Original Assignee
Phoenix Pioneer Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Pioneer Technology Co Ltd filed Critical Phoenix Pioneer Technology Co Ltd
Priority to TW105111841A priority Critical patent/TWI563602B/zh
Priority to CN201610683394.4A priority patent/CN107301954A/zh
Application granted granted Critical
Publication of TWI563602B publication Critical patent/TWI563602B/zh
Priority to US15/465,775 priority patent/US9831217B2/en
Publication of TW201737415A publication Critical patent/TW201737415A/zh

Links

Classifications

    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4828—Etching
    • H01L21/4832—Etching a temporary substrate after encapsulation process to form leads
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    • H01L21/4857—Multilayer substrates
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L2924/1434—Memory

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW105111841A 2016-04-15 2016-04-15 Method of fabricating a package substrate TWI563602B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105111841A TWI563602B (en) 2016-04-15 2016-04-15 Method of fabricating a package substrate
CN201610683394.4A CN107301954A (zh) 2016-04-15 2016-08-18 封装基板的制作方法
US15/465,775 US9831217B2 (en) 2016-04-15 2017-03-22 Method of fabricating package substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105111841A TWI563602B (en) 2016-04-15 2016-04-15 Method of fabricating a package substrate

Publications (2)

Publication Number Publication Date
TWI563602B true TWI563602B (en) 2016-12-21
TW201737415A TW201737415A (zh) 2017-10-16

Family

ID=58227500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105111841A TWI563602B (en) 2016-04-15 2016-04-15 Method of fabricating a package substrate

Country Status (3)

Country Link
US (1) US9831217B2 (zh)
CN (1) CN107301954A (zh)
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