TWI563342B - Photosensitive resin compound, photosensitive element, method for forming resist pattern, method for producing print wiring board, and print wiring board - Google Patents

Photosensitive resin compound, photosensitive element, method for forming resist pattern, method for producing print wiring board, and print wiring board

Info

Publication number
TWI563342B
TWI563342B TW100125622A TW100125622A TWI563342B TW I563342 B TWI563342 B TW I563342B TW 100125622 A TW100125622 A TW 100125622A TW 100125622 A TW100125622 A TW 100125622A TW I563342 B TWI563342 B TW I563342B
Authority
TW
Taiwan
Prior art keywords
wiring board
print wiring
resist pattern
resin compound
forming resist
Prior art date
Application number
TW100125622A
Other languages
English (en)
Chinese (zh)
Other versions
TW201214041A (en
Inventor
Junichi Iso
Yoshiki Ajioka
Mitsuru Ishi
Manami Usuba
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201214041A publication Critical patent/TW201214041A/zh
Application granted granted Critical
Publication of TWI563342B publication Critical patent/TWI563342B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/0285—Silver salts, e.g. a latent silver salt image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/0325—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polysaccharides, e.g. cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW100125622A 2010-07-30 2011-07-20 Photosensitive resin compound, photosensitive element, method for forming resist pattern, method for producing print wiring board, and print wiring board TWI563342B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010173082 2010-07-30
JP2011136640A JP6022749B2 (ja) 2010-07-30 2011-06-20 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、リードフレームの製造方法及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
TW201214041A TW201214041A (en) 2012-04-01
TWI563342B true TWI563342B (en) 2016-12-21

Family

ID=45903090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100125622A TWI563342B (en) 2010-07-30 2011-07-20 Photosensitive resin compound, photosensitive element, method for forming resist pattern, method for producing print wiring board, and print wiring board

Country Status (3)

Country Link
JP (1) JP6022749B2 (ko)
KR (1) KR101885928B1 (ko)
TW (1) TWI563342B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5948539B2 (ja) * 2012-01-27 2016-07-06 旭化成株式会社 感光性樹脂組成物
JP5993582B2 (ja) 2012-02-28 2016-09-14 第一工業製薬株式会社 アルキレンオキサイド変性ジペンタエリスリトールアクリレートを含有してなる反応性組成物
CN104781730B (zh) * 2012-11-20 2020-03-06 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法
JP6120560B2 (ja) * 2012-12-26 2017-04-26 第一工業製薬株式会社 カラーフィルター、ブラックマトリックス、又は回路形成用の硬化性樹脂組成物
TWI649619B (zh) * 2013-07-23 2019-02-01 日商日立化成股份有限公司 投影曝光用感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法、印刷配線板的製造方法及引線框架的製造方法
CN111694218B (zh) * 2014-05-21 2023-09-08 旭化成株式会社 感光性树脂组合物以及电路图案的形成方法
TWI620017B (zh) 2015-04-08 2018-04-01 Asahi Chemical Ind Photosensitive resin composition
WO2017130427A1 (ja) * 2016-01-28 2017-08-03 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116751A (ja) * 2006-11-06 2008-05-22 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
TW200910008A (en) * 2007-05-11 2009-03-01 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4651534B2 (ja) * 2005-07-14 2011-03-16 富士フイルム株式会社 パターン形成材料、並びにパターン形成装置及び永久パターン形成方法
JP2007178459A (ja) * 2005-12-26 2007-07-12 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007197390A (ja) * 2006-01-27 2007-08-09 Fujifilm Corp オキシム誘導体、感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
TW200745749A (en) * 2006-02-21 2007-12-16 Hitachi Chemical Co Ltd Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel
KR101289569B1 (ko) * 2006-12-19 2013-07-24 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP5252963B2 (ja) * 2007-04-17 2013-07-31 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体
JP2010122381A (ja) * 2008-11-18 2010-06-03 Hitachi Chem Co Ltd 黒色感光性樹脂組成物、ブラックマトリクスの製造方法、カラーフィルタの製造方法及びカラーフィルタ
JP2010152345A (ja) * 2008-11-25 2010-07-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物、及びその用途

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116751A (ja) * 2006-11-06 2008-05-22 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
TW200910008A (en) * 2007-05-11 2009-03-01 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

Also Published As

Publication number Publication date
JP2012048202A (ja) 2012-03-08
KR20120022586A (ko) 2012-03-12
KR101885928B1 (ko) 2018-08-06
TW201214041A (en) 2012-04-01
JP6022749B2 (ja) 2016-11-09

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