TWI563109B - Carrier for thin glass substrates and apparatus and method using the same - Google Patents

Carrier for thin glass substrates and apparatus and method using the same

Info

Publication number
TWI563109B
TWI563109B TW101134079A TW101134079A TWI563109B TW I563109 B TWI563109 B TW I563109B TW 101134079 A TW101134079 A TW 101134079A TW 101134079 A TW101134079 A TW 101134079A TW I563109 B TWI563109 B TW I563109B
Authority
TW
Taiwan
Prior art keywords
carrier
same
glass substrates
thin glass
thin
Prior art date
Application number
TW101134079A
Other languages
English (en)
Other versions
TW201317172A (zh
Inventor
Oliver Heimel
Reiner Hinterschuster
Hans Georg Wolf
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201317172A publication Critical patent/TW201317172A/zh
Application granted granted Critical
Publication of TWI563109B publication Critical patent/TWI563109B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW101134079A 2011-09-27 2012-09-18 Carrier for thin glass substrates and apparatus and method using the same TWI563109B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/066780 WO2013044941A1 (en) 2011-09-27 2011-09-27 Carrier for thin glass substrates and use thereof

Publications (2)

Publication Number Publication Date
TW201317172A TW201317172A (zh) 2013-05-01
TWI563109B true TWI563109B (en) 2016-12-21

Family

ID=45093690

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101134079A TWI563109B (en) 2011-09-27 2012-09-18 Carrier for thin glass substrates and apparatus and method using the same

Country Status (5)

Country Link
EP (1) EP2761051B1 (zh)
JP (1) JP5963218B2 (zh)
KR (1) KR20140069277A (zh)
TW (1) TWI563109B (zh)
WO (1) WO2013044941A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US11133158B2 (en) 2013-06-10 2021-09-28 View, Inc. Glass pallet for sputtering systems
US11688589B2 (en) 2013-06-10 2023-06-27 View, Inc. Carrier with vertical grid for supporting substrates in coater
CN105452524B (zh) * 2013-08-02 2018-12-11 应用材料公司 用于基板的支承布置以及用于使用用于基板的支承布置的设备和方法
CN105452523B (zh) * 2013-08-02 2019-07-16 应用材料公司 用于基板的保持布置以及使用所述用于基板的保持布置的设备和方法
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
EP3099483B1 (en) 2014-01-27 2022-06-01 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
EP3129221A1 (en) 2014-04-09 2017-02-15 Corning Incorporated Device modified substrate article and methods for making
KR102245762B1 (ko) * 2014-04-17 2021-04-27 어플라이드 머티어리얼스, 인코포레이티드 홀더, 홀더를 갖는 캐리어, 및 기판을 고정시키기 위한 방법
WO2015180798A1 (en) * 2014-05-30 2015-12-03 Applied Materials, Inc. Carrier and method for supporting a substrate in a vacuum processing chamber
CN107873062B (zh) 2015-05-08 2020-10-30 应用材料公司 用于固持基板的方法和支撑件
JP2018524201A (ja) 2015-05-19 2018-08-30 コーニング インコーポレイテッド シートをキャリアと結合するための物品および方法
CN105083980B (zh) * 2015-06-10 2017-12-01 合肥京东方光电科技有限公司 溅射设备及其基板承载装置
KR102524620B1 (ko) 2015-06-26 2023-04-21 코닝 인코포레이티드 시트 및 캐리어를 포함하는 방법들 및 물품들
CN205470755U (zh) * 2015-07-27 2016-08-17 盟立自动化股份有限公司 用以承载平板构件的卡匣本体
TW201737398A (zh) * 2016-02-09 2017-10-16 恩特葛瑞斯股份有限公司 用於可撓性基板之微環境
KR200493207Y1 (ko) * 2016-04-07 2021-02-17 어플라이드 머티어리얼스, 인코포레이티드 기판을 지지하기 위한 캐리어 및 이를 위한 장치
TW202216444A (zh) 2016-08-30 2022-05-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
JP7431160B2 (ja) 2017-12-15 2024-02-14 コーニング インコーポレイテッド 基板を処理するための方法および結合されたシートを含む物品を製造するための方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04325699A (ja) * 1991-04-26 1992-11-16 Fuji Electric Co Ltd プリント配線板用メッキ治具
JP2000336476A (ja) * 1999-05-28 2000-12-05 Fujitsu Ltd ガラス基板のスパッタリング方法及びスパッタリング装置
DE102004027898A1 (de) * 2004-06-09 2006-01-05 Leybold Optics Gmbh Transportmodul und Transportsystem für ein flaches Substrat

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11246046A (ja) * 1998-03-02 1999-09-14 Sony Corp 基板搬送装置
KR100582345B1 (ko) * 2003-12-09 2006-05-22 삼성코닝정밀유리 주식회사 유리기판의 검사를 위한 클램핑장치
JP2006056610A (ja) * 2004-08-17 2006-03-02 Kyokuhei Glass Kako Kk ガラス基板の移送用把持具および該把持具を用いたガラス基板搬送用ボックスへの収納方法
AU2008210794A1 (en) * 2007-02-01 2008-08-07 Willard & Kelsey Solar Group, Llc System and method for glass sheet semiconductor coating
US7964434B2 (en) * 2008-09-30 2011-06-21 Stion Corporation Sodium doping method and system of CIGS based materials using large scale batch processing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04325699A (ja) * 1991-04-26 1992-11-16 Fuji Electric Co Ltd プリント配線板用メッキ治具
JP2000336476A (ja) * 1999-05-28 2000-12-05 Fujitsu Ltd ガラス基板のスパッタリング方法及びスパッタリング装置
DE102004027898A1 (de) * 2004-06-09 2006-01-05 Leybold Optics Gmbh Transportmodul und Transportsystem für ein flaches Substrat

Also Published As

Publication number Publication date
EP2761051B1 (en) 2018-11-07
KR20140069277A (ko) 2014-06-09
WO2013044941A1 (en) 2013-04-04
CN103814154A (zh) 2014-05-21
JP2014531759A (ja) 2014-11-27
JP5963218B2 (ja) 2016-08-03
TW201317172A (zh) 2013-05-01
EP2761051A1 (en) 2014-08-06

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