TWI563048B - Polymer for pressure sensitive adhesive, pressure sensitive adhesive composition and heat-peelable pressure sensitive adhesive sheet - Google Patents

Polymer for pressure sensitive adhesive, pressure sensitive adhesive composition and heat-peelable pressure sensitive adhesive sheet

Info

Publication number
TWI563048B
TWI563048B TW102101867A TW102101867A TWI563048B TW I563048 B TWI563048 B TW I563048B TW 102101867 A TW102101867 A TW 102101867A TW 102101867 A TW102101867 A TW 102101867A TW I563048 B TWI563048 B TW I563048B
Authority
TW
Taiwan
Prior art keywords
sensitive adhesive
pressure sensitive
polymer
heat
peelable
Prior art date
Application number
TW102101867A
Other languages
English (en)
Other versions
TW201335309A (zh
Inventor
Yukio Arimitsu
Daisuke Shimokawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201335309A publication Critical patent/TW201335309A/zh
Application granted granted Critical
Publication of TWI563048B publication Critical patent/TWI563048B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24—Homopolymers or copolymers of amides or imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
TW102101867A 2012-01-17 2013-01-17 Polymer for pressure sensitive adhesive, pressure sensitive adhesive composition and heat-peelable pressure sensitive adhesive sheet TWI563048B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012007495A JP2013147541A (ja) 2012-01-17 2012-01-17 粘着剤用ポリマー、粘着剤組成物及び熱剥離性粘着シート

Publications (2)

Publication Number Publication Date
TW201335309A TW201335309A (zh) 2013-09-01
TWI563048B true TWI563048B (en) 2016-12-21

Family

ID=47559310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102101867A TWI563048B (en) 2012-01-17 2013-01-17 Polymer for pressure sensitive adhesive, pressure sensitive adhesive composition and heat-peelable pressure sensitive adhesive sheet

Country Status (6)

Country Link
US (1) US20130186565A1 (zh)
EP (1) EP2617787A1 (zh)
JP (1) JP2013147541A (zh)
KR (1) KR102011148B1 (zh)
CN (1) CN103205225B (zh)
TW (1) TWI563048B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6129668B2 (ja) 2012-09-26 2017-05-17 株式会社マキタ 電動工具
JP6054208B2 (ja) * 2013-03-04 2016-12-27 日東電工株式会社 熱剥離型粘着シート
JP2015076276A (ja) * 2013-10-09 2015-04-20 日東電工株式会社 電解質膜搬送用粘着シートおよび該粘着シートを用いた燃料電池用膜／電極複合体の製造方法
JP6228809B2 (ja) * 2013-10-31 2017-11-08 株式会社日本触媒 新規重合体及び粘度指数向上剤、並びに潤滑油組成物
JP6378501B2 (ja) * 2014-03-05 2018-08-22 日東電工株式会社 粘着シート
JP6624825B2 (ja) * 2014-09-25 2019-12-25 日東電工株式会社 熱剥離型粘着シート
CN107201186A (zh) * 2016-03-16 2017-09-26 利昌电气工业有限公司 加热可降低黏着力的黏着胶带
CN106675433B (zh) * 2017-01-12 2019-09-13 深圳市美信电子有限公司 一种防爆易拆解安全的胶带及其制备方法
JP7029226B2 (ja) * 2017-02-14 2022-03-03 味の素株式会社 回路基板
CN108929403B (zh) * 2017-05-25 2022-05-27 日油株式会社 粘结剂树脂、导电膏组合物、陶瓷用粘结剂树脂及陶瓷组合物
JP6768038B2 (ja) * 2018-07-26 2020-10-14 日東電工株式会社 粘着シート
CN109233676A (zh) * 2018-08-31 2019-01-18 苏州义铠轩电子科技有限公司 垂直导电热解粘胶带
CN109266236B (zh) * 2018-09-18 2021-09-17 烟台德邦科技股份有限公司 一种高温减粘胶带及其制备方法
CN110204647B (zh) * 2019-05-24 2021-08-31 广东锐涂精细化工有限公司 一种可撕膜热塑性丙烯酸树脂及其制备方法
CN110713811B (zh) * 2019-10-30 2021-04-13 浙江龙游道明光学有限公司 一种反光膜用高弹性压敏胶的制造方法
KR20210061717A (ko) * 2019-11-20 2021-05-28 엘지디스플레이 주식회사 표시 장치
CN110938394B (zh) * 2019-12-17 2021-08-10 苏州赛伍应用技术股份有限公司 一种胶黏剂及其制备方法、由其制得的胶黏剂层以及热减粘胶带
JP7155210B2 (ja) * 2020-09-18 2022-10-18 日東電工株式会社 粘着シート
JP2021006634A (ja) * 2020-09-18 2021-01-21 日東電工株式会社 粘着シート
CN113025259A (zh) * 2020-12-16 2021-06-25 江苏中科聚合新材料产业技术研究院有限公司 一种可拆卸双组分聚氨酯胶粘剂及其制备方法、可拆卸结构件
DE102022110643A1 (de) * 2022-05-02 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Thermisch aktivierbares Expansionselement, Verwendung desselben sowie Fügeteil und Verbundbauteil umfassend das thermisch aktivierbare Expansionselement

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101824283A (zh) * 2009-03-04 2010-09-08 日东电工株式会社 热剥离型压敏粘合片及其用于切断加工层压陶瓷片的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3594853B2 (ja) * 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP5097336B2 (ja) 2005-03-07 2012-12-12 ニッタ株式会社 積層セラミック電子部品の製造方法
JP2006332419A (ja) * 2005-05-27 2006-12-07 Nitto Denko Corp 固体撮像デバイス保護用粘着テープおよびそれを用いた映像センサの実装方法
JP5283838B2 (ja) * 2006-11-04 2013-09-04 日東電工株式会社 熱剥離性粘着シート及び被着体回収方法
JP5150118B2 (ja) 2007-03-26 2013-02-20 ソマール株式会社 粘着シート
JP2010129700A (ja) * 2008-11-26 2010-06-10 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP5525782B2 (ja) * 2009-01-13 2014-06-18 東京応化工業株式会社 接着剤組成物および接着フィルム
JP2012117041A (ja) * 2010-11-12 2012-06-21 Nitto Denko Corp 粘着剤組成物、粘着剤層、及び、粘着テープ又はシート
JP2012117040A (ja) * 2010-11-12 2012-06-21 Nitto Denko Corp 粘着テープ又はシート

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101824283A (zh) * 2009-03-04 2010-09-08 日东电工株式会社 热剥离型压敏粘合片及其用于切断加工层压陶瓷片的方法

Also Published As

Publication number Publication date
KR20130084629A (ko) 2013-07-25
TW201335309A (zh) 2013-09-01
JP2013147541A (ja) 2013-08-01
US20130186565A1 (en) 2013-07-25
EP2617787A1 (en) 2013-07-24
CN103205225A (zh) 2013-07-17
KR102011148B1 (ko) 2019-08-14
CN103205225B (zh) 2017-03-01

Similar Documents

Publication Publication Date Title
TWI563048B (en) Polymer for pressure sensitive adhesive, pressure sensitive adhesive composition and heat-peelable pressure sensitive adhesive sheet
EP2871219A4 (en) ADHESIVE LAYER AND ADHESIVE SHEET
PL2679332T3 (pl) Folia samoprzylepna
EP2927296A4 (en) ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND ELECTRONIC DEVICE
EP2871220A4 (en) PRESSURE-SENSITIVE ADHESIVE SHEET
EP2987840A4 (en) ADHESIVE COMPOSITION, ADHESIVE LAYER, AND ADHESIVE SHEET
EP2913372A4 (en) ADHESIVE AGENT COMPOSITION AND ADHESIVE SHEET
EP2762544A4 (en) LUBRICANT, HAFTSCHICHT AND HAFTFOLIE
EP2706102A4 (en) ADHESIVE, ADHESIVE LAYER, AND ADHESIVE SHEET
SG11201405484UA (en) Ultra-thin polymer film, and porous ultra-thin polymer film
EP2886624A4 (en) ADHESIVE COMPOSITION FOR TOUCH SCREEN, ADHESIVE FILM, AND TOUCH SCREEN
PL2878299T3 (pl) Plaster adhezyjny
EP2927297A4 (en) ADHESIVE COMPOSITION, ADHESIVE AND ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
EP2730630A4 (en) ADHESIVE ADHESIVE COMPOSITION IN THE FORM OF AQUEOUS DISPERSION, ADHESIVE ADHESIVE AND ADHESIVE FILM
SG11201500419WA (en) Block copolymer composition for adhesives, and adhesive composition
TWI560255B (en) Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device
EP2826833A4 (en) LIQUID COMPOSITION AND ADHESIVE
SG11201400480SA (en) Polymer and composition including same, and adhesive composition
EP2927295A4 (en) ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND ELECTRONIC DEVICE
EP2927298A4 (en) ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND ELECTRONIC DEVICE
TWI563049B (en) Adhesive composition and adhesive sheet
EP2799506A4 (en) BONDING FILM
TWI563060B (en) Adhesive composition, adhesive film, and surface-protective adhesive film
EP2722171A4 (en) FILM FOR ADHESIVE TAPE AND ADHESIVE TAPE
EP2941465A4 (en) Pressure sensitive adhesive compositions