TWI560255B - Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device - Google Patents

Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device

Info

Publication number
TWI560255B
TWI560255B TW101105237A TW101105237A TWI560255B TW I560255 B TWI560255 B TW I560255B TW 101105237 A TW101105237 A TW 101105237A TW 101105237 A TW101105237 A TW 101105237A TW I560255 B TWI560255 B TW I560255B
Authority
TW
Taiwan
Prior art keywords
sensitive adhesive
pressure sensitive
electronic device
adhesive sheet
sheet
Prior art date
Application number
TW101105237A
Other languages
Chinese (zh)
Other versions
TW201237135A (en
Inventor
Katsunori Fukuta
Takayuki Kobayashi
Noboru Kojima
Etsuko Yoshinari
Chiyo Ishizu
Original Assignee
Toyo Ink Sc Holdings Co Ltd
Toyochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink Sc Holdings Co Ltd, Toyochem Co Ltd filed Critical Toyo Ink Sc Holdings Co Ltd
Publication of TW201237135A publication Critical patent/TW201237135A/en
Application granted granted Critical
Publication of TWI560255B publication Critical patent/TWI560255B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Position Input By Displaying (AREA)
TW101105237A 2011-03-15 2012-02-17 Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device TWI560255B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011056983A JP5712706B2 (en) 2011-03-15 2011-03-15 Adhesive, adhesive sheet and display

Publications (2)

Publication Number Publication Date
TW201237135A TW201237135A (en) 2012-09-16
TWI560255B true TWI560255B (en) 2016-12-01

Family

ID=46808661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101105237A TWI560255B (en) 2011-03-15 2012-02-17 Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device

Country Status (4)

Country Link
JP (1) JP5712706B2 (en)
KR (1) KR101890713B1 (en)
CN (1) CN102676092B (en)
TW (1) TWI560255B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5790089B2 (en) * 2011-03-31 2015-10-07 Dic株式会社 Double-sided adhesive tape
JP6057693B2 (en) * 2012-12-17 2017-01-11 藤森工業株式会社 Adhesive layer and adhesive film
CN103087503B (en) * 2013-01-14 2015-04-01 徐广敏 Electronic pouring sealant and preparation method thereof
JP6130246B2 (en) * 2013-06-28 2017-05-17 リンテック株式会社 Adhesive composition, adhesive and adhesive sheet
JP6325778B2 (en) * 2013-06-28 2018-05-16 リンテック株式会社 Adhesive sheet and laminate
JP6442879B2 (en) * 2013-06-28 2018-12-26 三菱ケミカル株式会社 Laminated moisture barrier film
JP6130245B2 (en) * 2013-06-28 2017-05-17 リンテック株式会社 Adhesive composition, adhesive and adhesive sheet
JP2015193706A (en) * 2014-03-31 2015-11-05 リンテック株式会社 Method for producing surface protective film for conductive substrate
CN104175697B (en) * 2014-07-04 2016-01-27 京东方科技集团股份有限公司 The attaching method of polaroid, polaroid unit and display unit
WO2016111526A1 (en) 2015-01-06 2016-07-14 엘지전자 주식회사 Broadcast signal transmission device, broadcast signal reception device, broadcast signal transmission method, and broadcast signal reception method
KR101785198B1 (en) * 2015-03-31 2017-10-12 스미또모 가가꾸 가부시키가이샤 Optical laminate and liquid crystal display device
JP5956044B1 (en) * 2015-10-07 2016-07-20 住友化学株式会社 Optical laminate and liquid crystal display device
JP7112227B2 (en) * 2017-03-31 2022-08-03 積水化学工業株式会社 Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200600558A (en) * 2004-04-30 2006-01-01 Sumitomo Chemical Co Acrylic resin composition
TW200842171A (en) * 2006-12-06 2008-11-01 Nitto Denko Corp Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet
TW201006905A (en) * 2008-07-31 2010-02-16 Lintec Corp Adhesive sheet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788937B2 (en) 2001-05-07 2011-10-05 綜研化学株式会社 Adhesive composition and display adhesive sheet using the composition
JP4534431B2 (en) * 2003-04-30 2010-09-01 東洋インキ製造株式会社 Adhesive and optical member using the same
JP5299804B2 (en) 2004-08-03 2013-09-25 綜研化学株式会社 Adhesive sheet for attaching metal
JP2007297452A (en) * 2006-04-28 2007-11-15 Daio Paper Corp Adhesive sheet
JP4931197B2 (en) * 2006-08-24 2012-05-16 リケンテクノス株式会社 Adhesive composition and adhesive sheet member using the same
JP4531099B2 (en) 2007-09-06 2010-08-25 日東電工株式会社 Adhesive composition, and adhesive product and display using the same
JPWO2011024925A1 (en) 2009-08-28 2013-01-31 日東電工株式会社 Adhesive tape or sheet substrate, and adhesive tape or sheet
WO2011027707A1 (en) 2009-09-01 2011-03-10 綜研化学株式会社 Radiation-curable pressure-sensitive adhesive composition for optical members, and pressure-sensitive adhesion type optical members

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200600558A (en) * 2004-04-30 2006-01-01 Sumitomo Chemical Co Acrylic resin composition
TW200842171A (en) * 2006-12-06 2008-11-01 Nitto Denko Corp Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet
TW201006905A (en) * 2008-07-31 2010-02-16 Lintec Corp Adhesive sheet

Also Published As

Publication number Publication date
TW201237135A (en) 2012-09-16
CN102676092B (en) 2016-03-16
KR20120105361A (en) 2012-09-25
CN102676092A (en) 2012-09-19
JP5712706B2 (en) 2015-05-07
JP2012193248A (en) 2012-10-11
KR101890713B1 (en) 2018-08-22

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