TWI562192B - Substrate liquid processing device and flow abnormality detection method - Google Patents

Substrate liquid processing device and flow abnormality detection method

Info

Publication number
TWI562192B
TWI562192B TW103107703A TW103107703A TWI562192B TW I562192 B TWI562192 B TW I562192B TW 103107703 A TW103107703 A TW 103107703A TW 103107703 A TW103107703 A TW 103107703A TW I562192 B TWI562192 B TW I562192B
Authority
TW
Taiwan
Prior art keywords
processing device
detection method
abnormality detection
liquid processing
substrate liquid
Prior art date
Application number
TW103107703A
Other languages
English (en)
Chinese (zh)
Other versions
TW201447972A (zh
Inventor
Norihiro Ito
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201447972A publication Critical patent/TW201447972A/zh
Application granted granted Critical
Publication of TWI562192B publication Critical patent/TWI562192B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
TW103107703A 2013-03-12 2014-03-06 Substrate liquid processing device and flow abnormality detection method TWI562192B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013048919A JP5833046B2 (ja) 2013-03-12 2013-03-12 基板液処理装置および気流異常検出方法

Publications (2)

Publication Number Publication Date
TW201447972A TW201447972A (zh) 2014-12-16
TWI562192B true TWI562192B (en) 2016-12-11

Family

ID=51521618

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103107703A TWI562192B (en) 2013-03-12 2014-03-06 Substrate liquid processing device and flow abnormality detection method

Country Status (4)

Country Link
US (1) US9478445B2 (https=)
JP (1) JP5833046B2 (https=)
KR (1) KR102159839B1 (https=)
TW (1) TWI562192B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6461617B2 (ja) 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6691836B2 (ja) * 2016-06-20 2020-05-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101853373B1 (ko) * 2016-08-01 2018-06-20 세메스 주식회사 기판 처리 장치
US10824175B2 (en) * 2017-07-28 2020-11-03 Stmicroelectronics, Inc. Air flow measurement using pressure sensors
JP6981092B2 (ja) * 2017-08-10 2021-12-15 東京エレクトロン株式会社 液処理装置
CN110021535A (zh) * 2018-01-10 2019-07-16 弘塑科技股份有限公司 基板处理装置及其旋转台
KR102121240B1 (ko) * 2018-05-03 2020-06-18 세메스 주식회사 기판 처리 장치 및 방법
JP2020035794A (ja) * 2018-08-27 2020-03-05 キオクシア株式会社 基板処理装置および半導体装置の製造方法
JP7027284B2 (ja) * 2018-09-07 2022-03-01 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP7130524B2 (ja) * 2018-10-26 2022-09-05 東京エレクトロン株式会社 基板処理装置の制御装置および基板処理装置の制御方法
KR102790512B1 (ko) 2020-01-09 2025-04-08 주식회사 모원 진단 장치
CN111842021B (zh) * 2020-07-11 2021-05-25 吉林北方捷凯传动轴有限公司 传动轴移动端节护盖装配用自动涂胶及检测设备
JP7471171B2 (ja) 2020-08-17 2024-04-19 東京エレクトロン株式会社 基板処理装置
TWI770753B (zh) * 2021-01-04 2022-07-11 南亞科技股份有限公司 清洗裝置及清洗方法
KR20220131680A (ko) 2021-03-22 2022-09-29 세메스 주식회사 기판 처리 장치
JP2025028579A (ja) * 2023-08-18 2025-03-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040118676A1 (en) * 2002-12-19 2004-06-24 Dainippon Screen Mfg. Co., Ltd. Plating apparatus and plating method
JP2009059795A (ja) * 2007-08-30 2009-03-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

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JPS62102854A (ja) * 1985-10-29 1987-05-13 Dainippon Screen Mfg Co Ltd 回転処理装置
US5254367A (en) * 1989-07-06 1993-10-19 Tokyo Electron Limited Coating method and apparatus
JP2982439B2 (ja) * 1991-10-29 1999-11-22 東京エレクトロン株式会社 処理液塗布装置及び処理液塗布方法
JPH05136041A (ja) * 1991-11-14 1993-06-01 Nec Corp 薬液塗布装置
US5358740A (en) * 1992-06-24 1994-10-25 Massachusetts Institute Of Technology Method for low pressure spin coating and low pressure spin coating apparatus
JPH0878385A (ja) * 1994-09-06 1996-03-22 Hitachi Ltd 乾燥方法および乾燥装置
JPH09148231A (ja) 1995-11-16 1997-06-06 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
US7694650B2 (en) * 2002-09-04 2010-04-13 Taiwan Semiconductor Manufacturing Co. Exhaust monitoring cup
KR100632945B1 (ko) * 2004-07-01 2006-10-12 삼성전자주식회사 상승기류를 억제할 수 있는 스핀 공정 설비 및 스핀 공정설비의 배기량 제어 방법
US7322225B2 (en) * 2004-11-08 2008-01-29 Nec Electronics America, Inc. Adhesion promotion vacuum monitoring system for photo resist coaters
JP2006332085A (ja) * 2005-05-23 2006-12-07 Mitsubishi Electric Corp スピン乾燥装置
JP4912008B2 (ja) * 2006-03-29 2012-04-04 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040118676A1 (en) * 2002-12-19 2004-06-24 Dainippon Screen Mfg. Co., Ltd. Plating apparatus and plating method
JP2009059795A (ja) * 2007-08-30 2009-03-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2014175581A (ja) 2014-09-22
KR20140111953A (ko) 2014-09-22
US20140261172A1 (en) 2014-09-18
TW201447972A (zh) 2014-12-16
KR102159839B1 (ko) 2020-09-24
US9478445B2 (en) 2016-10-25
JP5833046B2 (ja) 2015-12-16

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