Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B30—PRESSES
  • B30B—PRESSES IN GENERAL
  • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
  • B30B15/06—Platens or press rams
  • B30B15/062—Press plates
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L1/00—Measuring force or stress, in general
  • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
  • G01L5/0061—Force sensors associated with industrial machines or actuators
  • G01L5/0076—Force sensors associated with manufacturing machines
  • G01L5/008—Force sensors integrated in an article or a dummy workpiece
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
  • G01L5/0061—Force sensors associated with industrial machines or actuators
  • G01L5/0076—Force sensors associated with manufacturing machines
  • G01L5/0085—Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/185—Joining of semiconductor bodies for junction formation
  • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/10—Measuring as part of the manufacturing process
  • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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• Chemical & Material Sciences (AREA)
• Analytical Chemistry (AREA)
• Engineering & Computer Science (AREA)
• General Physics & Mathematics (AREA)
• Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Mechanical Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Force Measurement Appropriate To Specific Purposes (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)
• Measuring Fluid Pressure (AREA)

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Publications (2)

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Citations (2)

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• 2011
  • 2011-06-06 JP JP2014513918A patent/JP5864733B2/ja active Active
  • 2011-06-06 SG SG2013084025A patent/SG194935A1/en unknown
  • 2011-06-06 CN CN201180071430.7A patent/CN103561944B/zh active Active
  • 2011-06-06 KR KR1020137032047A patent/KR101830471B1/ko active IP Right Grant
  • 2011-06-06 EP EP11727413.4A patent/EP2718094B9/de active Active
  • 2011-06-06 WO PCT/EP2011/059308 patent/WO2012167814A1/de active Application Filing
  • 2011-06-06 US US14/119,023 patent/US9500541B2/en active Active
• 2012
  • 2012-06-06 TW TW101120357A patent/TWI561136B/zh active

Patent Citations (2)

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