JP5864733B2 - 接合のための圧力分布を決定する方法および装置 - Google Patents
接合のための圧力分布を決定する方法および装置 Download PDFInfo
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- JP5864733B2 JP5864733B2 JP2014513918A JP2014513918A JP5864733B2 JP 5864733 B2 JP5864733 B2 JP 5864733B2 JP 2014513918 A JP2014513918 A JP 2014513918A JP 2014513918 A JP2014513918 A JP 2014513918A JP 5864733 B2 JP5864733 B2 JP 5864733B2
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- 238000000034 method Methods 0.000 title claims description 54
- 238000009826 distribution Methods 0.000 title claims description 39
- 238000005259 measurement Methods 0.000 claims description 73
- 235000012431 wafers Nutrition 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 69
- 230000003746 surface roughness Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
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- 239000000374 eutectic mixture Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
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- 229910018173 Al—Al Inorganic materials 0.000 description 1
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- 229910003298 Ni-Ni Inorganic materials 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0061—Force sensors associated with industrial machines or actuators
- G01L5/0076—Force sensors associated with manufacturing machines
- G01L5/008—Force sensors integrated in an article or a dummy workpiece
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0061—Force sensors associated with industrial machines or actuators
- G01L5/0076—Force sensors associated with manufacturing machines
- G01L5/0085—Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Fluid Pressure (AREA)
Description
1o ツール表面
2 ウェーハ
3 スペーサ
4 ウェーハ
5 ツール
5o ツール表面
6 板材
6' 板材
7 測定層
7' 測定層
7" 測定層
8 ディスペンサ
9 接着低減層
10 加熱装置
11 測定手段
Claims (9)
- 第1の基板を第2の基板にウェーハ接合するための圧力分布を、以下のステップによって、特に以下の手順で、決定する方法であって、
前記第1の基板を保持する第1のツール(1)と、前記第1の基板および前記第2の基板を接合するために前記第1のツール(1)と位置合わせされた向かい合う第2のツール(5)との間に、流体から成る測定層(7、7'、7'')を配置するステップと、
前記第1のツール(1)および前記第2のツール(5)を互いに近づけることで、前記測定層(7、7'、7'')を変形するステップと、
前記測定層(7、7'、7'')の前記変形を測定するステップと、
前記変形の前記測定に基づいて前記圧力分布を算出するステップと
を含む方法。 - 前記測定層(7、7'、7'')と前記第1のツール(1)との間、および/または、前記測定層(7、7'、7'')と前記第2のツール(5)との間に、互いに位置合わせされたウェーハ(2、4)が導入される、請求項1に記載の方法。
- 前記測定層(7、7'、7'')の形状が、前記測定層(7、7'、7'')が導入された後に、変形の前に測定される、請求項1または2に記載の方法。
- 前記測定層(7、7'、7'')は、硬化後に塑性変形させることができる硬化性の材料から成る、請求項1から3のいずれか一項に記載の方法。
- 前記第1のツール(1)と前記第2のツール(5)との間の前記測定層(7、7'、7'')の定められた分布のためのディスペンサ(8)がある、請求項1から4のいずれか一項に記載の方法。
- 前記変形は、前記測定層(7、7'、7'')に沿った複数の位置において、光学的に測定される、請求項1から5のいずれか一項に記載の方法。
- 前記測定層(7、7'、7'')は、前記ウェーハ(2) 上に、液滴を適用することで生成される、請求項1から6のいずれか一項に記載の方法。
- 接着低減層(9)が、前記測定層(7、7'、7'')と、前記ウェーハ(2、4)のうちの少なくとも一方との間に導入される、請求項2に記載の方法。
- 第1の基板を第2の基板にウェーハ接合するための圧力分布を決定する装置であって、
第1のツール(1)と、前記第1のツール(1)と位置合わせされた向かい合う第2のツール(5)との間に、流体から成る測定層(7、7'、7'')を導入または適用する導入手段(8)と、
前記第1のツール(1)および前記第2のツール(5)を互いに向けて動かすことで、前記測定層(7、7'、7'')を変形する変形手段(1、5)と、
前記測定層(7、7'、7'')の前記変形を測定する測定手段と、
前記変形の前記測定に基づいて前記圧力分布を算出する算出手段と、
を備える装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2011/059308 WO2012167814A1 (de) | 2011-06-06 | 2011-06-06 | Verfahren und vorrichtung zur ermittlung der druckverteilung zum bonden |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014516160A JP2014516160A (ja) | 2014-07-07 |
JP5864733B2 true JP5864733B2 (ja) | 2016-02-17 |
Family
ID=44627444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014513918A Active JP5864733B2 (ja) | 2011-06-06 | 2011-06-06 | 接合のための圧力分布を決定する方法および装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9500541B2 (ja) |
EP (1) | EP2718094B9 (ja) |
JP (1) | JP5864733B2 (ja) |
KR (1) | KR101830471B1 (ja) |
CN (1) | CN103561944B (ja) |
SG (1) | SG194935A1 (ja) |
TW (1) | TWI561136B (ja) |
WO (1) | WO2012167814A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014194944A1 (de) | 2013-06-05 | 2014-12-11 | Ev Group E. Thallner Gmbh | Messeinrichtung und verfahren zur ermittlung einer druckkarte |
US10526124B2 (en) * | 2016-05-25 | 2020-01-07 | International Business Machines Corporation | Surface distortion detector for packaging |
EP3379222B1 (en) | 2017-03-22 | 2020-12-30 | Methode Electronics Malta Ltd. | Magnetoelastic based sensor assembly |
CN110462558A (zh) * | 2017-07-19 | 2019-11-15 | 深圳纽迪瑞科技开发有限公司 | 一种压力感应装置及压力感应设备 |
US11084342B2 (en) | 2018-02-27 | 2021-08-10 | Methode Electronics, Inc. | Towing systems and methods using magnetic field sensing |
EP3758959A4 (en) | 2018-02-27 | 2022-03-09 | Methode Electronics, Inc. | TOWING SYSTEMS AND METHODS USING MAGNETIC SENSING |
US11221262B2 (en) | 2018-02-27 | 2022-01-11 | Methode Electronics, Inc. | Towing systems and methods using magnetic field sensing |
US11135882B2 (en) | 2018-02-27 | 2021-10-05 | Methode Electronics, Inc. | Towing systems and methods using magnetic field sensing |
US11491832B2 (en) | 2018-02-27 | 2022-11-08 | Methode Electronics, Inc. | Towing systems and methods using magnetic field sensing |
DE102020206978A1 (de) | 2020-06-04 | 2021-12-09 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Überprüfung einer Verbindung, Prüfeinrichtung, Computerprogrammprodukt und Fertigungseinrichtung |
US11829077B2 (en) | 2020-12-11 | 2023-11-28 | Kla Corporation | System and method for determining post bonding overlay |
US11782411B2 (en) | 2021-07-28 | 2023-10-10 | Kla Corporation | System and method for mitigating overlay distortion patterns caused by a wafer bonding tool |
CN117810109B (zh) * | 2024-02-29 | 2024-05-14 | 华南理工大学 | 晶圆键合保持方法 |
Family Cites Families (16)
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JPH0658272B2 (ja) * | 1988-05-24 | 1994-08-03 | 工業技術院長 | 触圧覚センサ |
DE4104975C2 (de) * | 1991-02-19 | 1994-02-24 | Ferrozell Gmbh | Verfahren zum Prüfen der Flächenpressung von Pressen für Laminate sowie die Verwendung eines dafür geeigneten Laminates |
JPH05172666A (ja) * | 1991-12-26 | 1993-07-09 | Toppan Printing Co Ltd | 簡易接触圧力測定シート |
JPH10311764A (ja) * | 1997-05-13 | 1998-11-24 | Super Silicon Kenkyusho:Kk | 圧力分布測定用ウェーハ |
US6033987A (en) | 1999-01-15 | 2000-03-07 | Winbond Electronics Corp. | Method for mapping and adjusting pressure distribution of CMP processes |
TW418476B (en) * | 1999-03-02 | 2001-01-11 | Winbond Electronics Corp | Apparatus and method for measuring the pressure distribution on the wafer surface |
US6508896B1 (en) | 2000-08-09 | 2003-01-21 | The Goodyear Tire & Rubber Company | Method and apparatus for calibrating and optimizing equipment for product fabrication |
CN1383198A (zh) * | 2001-04-24 | 2002-12-04 | 华邦电子股份有限公司 | 作用于晶片表面压力零件的压力分布测量与回馈方法 |
GB0313794D0 (en) * | 2003-06-14 | 2003-07-23 | Univ Dundee | Tactile sensor assembly |
JP4951930B2 (ja) * | 2005-10-21 | 2012-06-13 | 株式会社ニコン | 半導体集積センサ |
US7635014B2 (en) * | 2005-11-11 | 2009-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for pressure bonding and method for manufacturing semiconductor device |
US7698952B2 (en) | 2006-10-03 | 2010-04-20 | Kla-Tencor Corporation | Pressure sensing device |
JP5020037B2 (ja) | 2007-11-26 | 2012-09-05 | 富士フイルム株式会社 | 圧力分布測定方法 |
DE202009018064U1 (de) | 2008-01-24 | 2010-12-02 | Brewer Science, Inc. | Gegenstände beim reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat |
DE102008025287A1 (de) * | 2008-05-27 | 2009-12-03 | SID Sächsisches Institut für die Druckindustrie GmbH Institut des Vereins POLYGRAPH Leipzig e.V. | Vorrichtung zur Messung von Pressungskenngrößen im Spalt zwischen zylindrischen Körpern |
WO2011013111A2 (en) | 2009-07-31 | 2011-02-03 | Schlumberger Canada Limited | Pressure measurement of a reservoir fluid in a microfluidic device |
-
2011
- 2011-06-06 JP JP2014513918A patent/JP5864733B2/ja active Active
- 2011-06-06 SG SG2013084025A patent/SG194935A1/en unknown
- 2011-06-06 CN CN201180071430.7A patent/CN103561944B/zh active Active
- 2011-06-06 KR KR1020137032047A patent/KR101830471B1/ko active IP Right Grant
- 2011-06-06 EP EP11727413.4A patent/EP2718094B9/de active Active
- 2011-06-06 WO PCT/EP2011/059308 patent/WO2012167814A1/de active Application Filing
- 2011-06-06 US US14/119,023 patent/US9500541B2/en active Active
-
2012
- 2012-06-06 TW TW101120357A patent/TWI561136B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN103561944B (zh) | 2016-09-28 |
KR101830471B1 (ko) | 2018-02-20 |
US20140102221A1 (en) | 2014-04-17 |
TWI561136B (en) | 2016-12-01 |
WO2012167814A1 (de) | 2012-12-13 |
EP2718094B1 (de) | 2018-01-10 |
JP2014516160A (ja) | 2014-07-07 |
US9500541B2 (en) | 2016-11-22 |
KR20140031290A (ko) | 2014-03-12 |
CN103561944A (zh) | 2014-02-05 |
EP2718094B9 (de) | 2018-04-25 |
TW201309144A (zh) | 2013-02-16 |
EP2718094A1 (de) | 2014-04-16 |
SG194935A1 (en) | 2013-12-30 |
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