TWI560233B - - Google Patents

Info

Publication number
TWI560233B
TWI560233B TW104104052A TW104104052A TWI560233B TW I560233 B TWI560233 B TW I560233B TW 104104052 A TW104104052 A TW 104104052A TW 104104052 A TW104104052 A TW 104104052A TW I560233 B TWI560233 B TW I560233B
Authority
TW
Taiwan
Application number
TW104104052A
Other languages
Chinese (zh)
Other versions
TW201542659A (zh
Inventor
Yoshikazu Daigo
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014022860A external-priority patent/JP6129092B2/ja
Priority claimed from JP2014022859A external-priority patent/JP6192556B2/ja
Priority claimed from JP2014022858A external-priority patent/JP2015147908A/ja
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201542659A publication Critical patent/TW201542659A/zh
Application granted granted Critical
Publication of TWI560233B publication Critical patent/TWI560233B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06—Copolymers with vinyl aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW104104052A 2014-02-07 2015-02-06 硬化性樹脂組成物、其硬化皮膜、及具備此的裝飾玻璃板 TW201542659A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014022860A JP6129092B2 (ja) 2014-02-07 2014-02-07 硬化性樹脂組成物、その硬化皮膜、およびこれを備えた加飾ガラス板
JP2014022859A JP6192556B2 (ja) 2014-02-07 2014-02-07 硬化性樹脂組成物、その硬化皮膜、およびこれを備えた加飾ガラス板
JP2014022858A JP2015147908A (ja) 2014-02-07 2014-02-07 硬化性樹脂組成物、その硬化皮膜、およびこれを備えた加飾ガラス板

Publications (2)

Publication Number Publication Date
TW201542659A TW201542659A (zh) 2015-11-16
TWI560233B true TWI560233B (ko) 2016-12-01

Family

ID=53812152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104104052A TW201542659A (zh) 2014-02-07 2015-02-06 硬化性樹脂組成物、其硬化皮膜、及具備此的裝飾玻璃板

Country Status (3)

Country Link
KR (1) KR20150093595A (ko)
CN (1) CN104834180A (ko)
TW (1) TW201542659A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017138379A1 (ja) * 2016-02-09 2017-08-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
CN109705532B (zh) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201105742A (en) * 2009-03-23 2011-02-16 Taiyo Ink Mfg Co Ltd Curable resin composition, dry film and printed circuit board using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5298428B2 (ja) * 2006-12-26 2013-09-25 Ｊｎｃ株式会社 熱硬化性樹脂組成物及び硬化膜
US8042976B2 (en) * 2007-11-30 2011-10-25 Taiyo Holdings Co., Ltd. White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
JP2009238771A (ja) * 2008-03-25 2009-10-15 Taiyo Ink Mfg Ltd 白色硬化性樹脂組成物及びその硬化物からなる絶縁層を有するプリント配線板
WO2012141124A1 (ja) * 2011-04-13 2012-10-18 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物及びそれらを用いたプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201105742A (en) * 2009-03-23 2011-02-16 Taiyo Ink Mfg Co Ltd Curable resin composition, dry film and printed circuit board using the same

Also Published As

Publication number Publication date
KR20150093595A (ko) 2015-08-18
TW201542659A (zh) 2015-11-16
CN104834180A (zh) 2015-08-12

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