TWI557202B - And a temporary fixing agent composition - Google Patents

And a temporary fixing agent composition Download PDF

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Publication number
TWI557202B
TWI557202B TW101128012A TW101128012A TWI557202B TW I557202 B TWI557202 B TW I557202B TW 101128012 A TW101128012 A TW 101128012A TW 101128012 A TW101128012 A TW 101128012A TW I557202 B TWI557202 B TW I557202B
Authority
TW
Taiwan
Prior art keywords
component
temporary fixing
adhesive composition
meth
fixing adhesive
Prior art date
Application number
TW101128012A
Other languages
English (en)
Chinese (zh)
Other versions
TW201313861A (zh
Inventor
Gosuke Nakajima
Tomoyuki Kanai
Kimihiko Yoda
Kazuhiro Oshima
Original Assignee
Denka Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Company Ltd filed Critical Denka Company Ltd
Publication of TW201313861A publication Critical patent/TW201313861A/zh
Application granted granted Critical
Publication of TWI557202B publication Critical patent/TWI557202B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW101128012A 2011-08-05 2012-08-03 And a temporary fixing agent composition TWI557202B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011171629 2011-08-05

Publications (2)

Publication Number Publication Date
TW201313861A TW201313861A (zh) 2013-04-01
TWI557202B true TWI557202B (zh) 2016-11-11

Family

ID=47668453

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128012A TWI557202B (zh) 2011-08-05 2012-08-03 And a temporary fixing agent composition

Country Status (3)

Country Link
JP (1) JP6016793B2 (ja)
TW (1) TWI557202B (ja)
WO (1) WO2013021945A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104530991B (zh) * 2014-12-24 2016-08-24 湖北固润科技股份有限公司 一种水性光固化粘合剂及其在玻璃切割加工中的应用
JP6742139B2 (ja) * 2015-04-22 2020-08-19 デンカ株式会社 組成物
KR102604119B1 (ko) * 2015-07-30 2023-11-20 덴카 주식회사 조성물
JP6694057B2 (ja) * 2016-03-31 2020-05-13 デンカ株式会社 組成物
CN114364763B (zh) * 2019-09-17 2024-02-20 汉高股份有限及两合公司 丙烯酸酯粘合剂组合物
KR102334413B1 (ko) * 2019-12-18 2021-12-03 (주)이녹스첨단소재 광경화성 접착제 조성물 및 이를 이용하는 부재의 가고정 방법
KR102339285B1 (ko) * 2019-12-18 2021-12-15 삼성디스플레이 주식회사 광경화성 접착제 조성물 및 이를 이용하는 부재의 가고정 방법
KR102334412B1 (ko) * 2019-12-18 2021-12-03 (주)이녹스첨단소재 광경화성 접착제 조성물 및 이를 이용하는 부재의 가고정 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200927767A (en) * 2007-10-19 2009-07-01 Jsr Corp Curable composition, liquid crystal sealing agent and liquid crystal display element
JP2011089055A (ja) * 2009-10-23 2011-05-06 Denki Kagaku Kogyo Kk 仮固定用接着剤組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000355647A (ja) * 1999-06-15 2000-12-26 Denki Kagaku Kogyo Kk 硬化性樹脂組成物及び接着剤組成物
JP2001139637A (ja) * 1999-11-10 2001-05-22 Denki Kagaku Kogyo Kk 硬化性樹脂組成物
JP5164316B2 (ja) * 2005-08-02 2013-03-21 電気化学工業株式会社 接着剤及びそれを用いる部材の仮固定方法
JP5344880B2 (ja) * 2008-10-01 2013-11-20 三井化学株式会社 接着樹脂組成物、およびそれを含む積層体
JP5599575B2 (ja) * 2009-04-16 2014-10-01 電気化学工業株式会社 仮固定用接着剤組成物
TW201043674A (en) * 2009-04-17 2010-12-16 Furukawa Electric Co Ltd Adhesive thin film and wafer processing tape
JP5513866B2 (ja) * 2009-12-11 2014-06-04 リンテック株式会社 電子部品加工用粘着シート
JP2011142253A (ja) * 2010-01-08 2011-07-21 Hitachi Chem Co Ltd 半導体用途接着フィルム及びその製造方法並びに半導体装置の製造方法及び半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200927767A (en) * 2007-10-19 2009-07-01 Jsr Corp Curable composition, liquid crystal sealing agent and liquid crystal display element
JP2011089055A (ja) * 2009-10-23 2011-05-06 Denki Kagaku Kogyo Kk 仮固定用接着剤組成物

Also Published As

Publication number Publication date
WO2013021945A1 (ja) 2013-02-14
TW201313861A (zh) 2013-04-01
JP6016793B2 (ja) 2016-10-26
JPWO2013021945A1 (ja) 2015-03-05

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