TWI550734B - 單一分流反相器電路中的功率四方扁平無引腳（ｐｑｆｎ）封裝 - Google Patents

單一分流反相器電路中的功率四方扁平無引腳（ｐｑｆｎ）封裝 Download PDF

Info

Publication number
TWI550734B
TWI550734B TW103101806A TW103101806A TWI550734B TW I550734 B TWI550734 B TW I550734B TW 103101806 A TW103101806 A TW 103101806A TW 103101806 A TW103101806 A TW 103101806A TW I550734 B TWI550734 B TW I550734B
Authority
TW
Taiwan
Prior art keywords
phase
terminal
power switch
phase power
pqfn package
Prior art date
Application number
TW103101806A
Other languages
English (en)
Other versions
TW201448065A (zh
Inventor
汀 法蘭度
羅爾 巴柏沙
高橋　利夫
Original Assignee
國際整流器股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/102,275 external-priority patent/US9659845B2/en
Application filed by 國際整流器股份有限公司 filed Critical 國際整流器股份有限公司
Publication of TW201448065A publication Critical patent/TW201448065A/zh
Application granted granted Critical
Publication of TWI550734B publication Critical patent/TWI550734B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0618—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/06181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29339—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13064—High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Inverter Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

單一分流反相器電路中的功率四方扁平無引腳(PQFN)封裝
本發明係關於一種封裝技術領域，特別是一種單一分流反相器電路中的功率四方扁平無引腳(PQFN)封裝。
結合許多半導體裝置的封裝，由保持相關或相依的電路元件極度接近，可簡化電路設計、降低成本並提供更高效率且增進表現。此外，相較於使用分離封裝的元件，這些封裝可促進整合應用及有較佳的電及熱的表現。
四方扁平無引腳(QFN)封裝為用於電元件，例如功率半導體裝置，的無引腳封裝。QFN封裝可利用導線架及連接導線連接至封裝於其中的電元件。QFN封裝通常具有有限的複雜度且電迴路具有挑戰性，特別是對於較複雜的組態。因此，QFN封裝通常具有簡單的組態且封裝小量的電元件。
100‧‧‧PQFN封裝
150‧‧‧分流反相器電路
102‧‧‧驅動IC
104a‧‧‧U相功率開關
104b‧‧‧U相功率開關
106a‧‧‧V相功率開關
106b‧‧‧V相功率開關
108a‧‧‧W相功率開關
108b‧‧‧W相功率開關
110a‧‧‧U相輸出節點
110b‧‧‧V相輸出節點
110c‧‧‧W相輸出節點
112‧‧‧I/O終端
112a‧‧‧VBUS終端
112b‧‧‧VCC終端
112c‧‧‧HIN1終端
112d‧‧‧HIN2終端
112e‧‧‧HIN3終端
112f‧‧‧LIN1終端
112g‧‧‧LIN2終端
112h‧‧‧LIN3終端
112i‧‧‧EN終端
112j‧‧‧FAULT終端
112k‧‧‧RCIN終端
112l‧‧‧IM終端
112m‧‧‧VSS終端
112n‧‧‧VCOM終端
112o‧‧‧SW1終端
112p‧‧‧SW2終端
112q‧‧‧SW3終端
112r‧‧‧VB1終端
112s‧‧‧VB2終端
112t‧‧‧VB3終端
114‧‧‧匯流排電壓源
116‧‧‧供應電壓源
124‧‧‧微控制器
126‧‧‧馬達
162‧‧‧輸入邏輯
164‧‧‧位準偏移器
168‧‧‧欠壓保護電路
170‧‧‧比較器
172‧‧‧鎖存器
174a及174b‧‧‧閘極驅動
200‧‧‧PQFN封裝
202‧‧‧驅動IC
204a‧‧‧U相功率開關
204b‧‧‧U相功率開關
206a‧‧‧V相功率開關
206b‧‧‧V相功率開關
208a‧‧‧W相功率開關
208b‧‧‧W相功率開關
212‧‧‧I/O終端
212a‧‧‧VBUS終端
212b‧‧‧VCC終端
212c‧‧‧HIN1終端
212d‧‧‧HIN2終端
212e‧‧‧HIN3終端
212f‧‧‧LIN1終端
212g‧‧‧LIN2終端
212h‧‧‧LIN3終端
212i‧‧‧EN終端
212j‧‧‧FAULT終端
212k‧‧‧RCIN終端
212l‧‧‧IM終端
212m‧‧‧邏輯接地終端
212n‧‧‧功率級接地終端
212o‧‧‧SW1終端(U相輸出終端)
212p‧‧‧SW2終端(V相輸出終端)
212q‧‧‧SW3終端(W相輸出終端)
212r‧‧‧VB1終端
212s‧‧‧VB2終端
212t‧‧‧VB3終端
220‧‧‧驅動IC晶粒接墊
222a‧‧‧W相晶粒接墊
222b‧‧‧V相晶粒接墊
222c‧‧‧U相晶粒接墊
228‧‧‧共同晶粒接墊
232‧‧‧導線架條
233‧‧‧導線架島
234‧‧‧導線架島
236‧‧‧導線架島
236a至236f‧‧‧汲極
238a至238f‧‧‧源極
240a‧‧‧上側
240b‧‧‧底側
242a至242c‧‧‧邊緣
244a至244g‧‧‧連接導線
246‧‧‧連接導線
246a至246f‧‧‧連接導線
260‧‧‧導線架
252‧‧‧空間
256‧‧‧接地
圖1A顯示功率四方扁平無引腳(PQFN)封裝的範例電路的示意圖。
圖1B顯示於範例單一分流反相器電路中的PQFN封裝的示意圖。
第2A圖顯示範例PQFN封裝的導線架的上平面視圖。
第2B圖顯示有連接導線的範例PQFN封裝的上平面視圖。
第2C圖顯示範例PQFN封裝的下平面視圖。
第2D圖顯示範例PQFN封裝的一部分的截面視圖。
【發明內容與實施方式】
功率四方扁平無引腳(PQFN)封裝於單一分流反相器電路中，與圖式之至少一圖連結並實質上顯示及/或說明，並更完整的提出於申請專利範圍中。
於此所述，單詞「III-V族」表示化合物半導體，包含至少一III族元素及至少一V族元素。例如，III-V族半導體可為III-氮半導體的形式。「III-氮」或「III-N」表示化合物半導體，包含氮及至少一III族元素，例如鋁(Al)、鎵(Ga)、銦(In)及硼(B)，且包含但不限於其任意的合金，例如氮化鋁鎵(AlxGa(1- x)N)、氮化銦鎵(InyGa(1-y)N)、氮化鋁銦鎵(AlxInyGa(1-x-y)N)、氮磷砷化鎵(GaAsaPbN(1-a-b))、氮磷砷化鋁銦鎵(AlxInyGa(1-x-y)AsaPbN(1-a-b))。III-氮一般亦表示任何包含但不限於Ga極性、N極性、半極性或非極性的結晶方向。III-氮材料亦可包含纖鋅礦、閃鋅礦或混合多型的其一，且可包含單晶、單結晶、多晶或非晶結構。於此所述，氮化鎵或GaN，表示III-氮化合物半導體，其中III族元素或元素包含一些或顯著的量的鎵，但除了鎵以外，亦可包含其它III族元素。III-V族或GaN電晶體亦可表示複合高電壓增強模式電晶體，由疊階連接III-V族或GaN電晶體與較低電壓的IV族電晶體而形成。
此外，於此所述，單詞「IV族」表示半導體，至少包含一IV族元素，例如矽(Si)、鍺(Ge)及碳(C)，且亦可包含半導體化合物，例如矽鍺(SiGe)及碳化矽(SiC)。IV族亦表示半導體材料，其包含大於一層的IV族元素，或摻雜IV族元素，以產生應力IV族材料，且亦可包含IV族基複合基板，例如絕緣覆矽(SOI)、氧植入隔離(SIMOX)製程的基板及藍寶石覆矽(SOS)。
以下的說明書包含與本發明的實施方式相關的特定資訊。本發明的圖式及其伴隨的詳細說明僅表示範例實施方式。除非特別註記，否則，圖式之間相似或相應的元件可由相似或相應的參考編號表示。此外，本發明中 的圖式及圖一般不表示尺寸，且無意對應於實際的相對尺寸。
圖1A顯示功率四方扁平無引腳(PQFN)封裝100的範例電路的示意圖。圖1B顯示於單一分流反相器電路150中的PQFN封裝100的示意圖。
參照圖1A及1B，PQFN封裝100包含驅動積體電路(IC)102，U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b。驅動IC102包含輸入邏輯162，位準偏移器164，欠壓保護電路168，比較器170，鎖存器172，閘極驅動174a，閘極驅動174b，電容器CR，及啟動二極體D1、D2及D3。
於圖1B的單一分流反相器電路150中，PQFN封裝100連接至匯流排電壓源114，供應電壓源116，微控制器124，馬達126，電阻器R1，電容器C1，啟動電容器CB1、CB2、CB3，及分流器RS。任何PQFN封裝100，微控制器124，馬達126，電阻器R1，電容器C1，啟動電容器CB1、CB2、CB3及分流器RS可設置於印刷電路板(PCB)上。此外，PQFN封裝100可經由PCB上的導電引腳連接至任何匯流排電壓源114，供應電壓源116，微控制器124，馬達126，電阻器R1，電容器C1，啟動電容器CB1、CB2、CB3，及分流器RS。
PQFN封裝100亦包含：VBUS終端112a，VCC終端112b，HIN1終端112c，HIN2終端112d，HIN3終端112e，LIN1終端112f，LIN2終端112g，LIN3終端 112h，EN終端112i，FAULT終端112j，RCIN終端112k，IM終端112l，VSS終端112m，VCOM終端112n，SW1終端112o，SW2終端112p，SW3終端112q，VB1終端112r，VB2終端112s，及VB3終端112t，整體稱為I/O終端112。
於PQFN封裝100中，VBUS終端112a接收VBUS作為從匯流排電壓源114的輸入。VCC終端112b接收VCC作為從供應電壓源116至驅動IC102的輸入。HIN1終端112c、HIN2終端112d及HIN3終端112e分別接收HIN1、HIN2及HIN3作為從微控制器124至驅動IC102的輸入。LIN1終端112f、LIN2終端112g及LIN3終端112h分別接收LIN1、LIN2及LIN3作為從微控制器124至驅動IC102的輸入。EN終端112i接收EN作為從微控制器124至驅動IC102的輸入。FAULT終端112j接收FAULT作為從驅動IC102至微控制器124的輸出。RCIN終端112k接收RCIN作為從電阻器R1及電容器C1至驅動IC102的輸入。IM終端112l接收ITRIP作為從U相功率開關104b、V相功率開關106b及W相功率開關108b至驅動IC102及微控制器124的輸入。VSS終端112m接收VSS作為從邏輯接地GVSS至驅動IC102的輸入。VCOM終端112n接收VCOM作為從功率級接地GCOM至驅動IC102，U相功率開關104b、V相功率開關106b及W相功率開關108b的輸入。SW1終端112o從U相輸出節點110a接收SW1作為至馬達126的輸出。驅動 IC102亦接收SW1作為從U相輸出節點110a的輸入。SW2終端112p從V相輸出節點110b接收SW2作為至馬達126的輸出。驅動IC102亦接收SW2作為從V相輸出節點110b的輸入。SW3終端112q從W相輸出節點110c接收SW3作為至馬達126的輸出。驅動IC102亦接收SW3作為從W相輸出節點110c的輸入。VB1終端112r接收VB1作為從啟動電容器CB1至驅動IC102的輸入。VB2終端112s接收VB2作為從啟動電容器CB2至驅動IC102的輸入。VB3終端112t接收VB3作為從啟動電容器CB3至驅動IC102的輸入。
於不同實施方式中，I/O終端112的編號、數量及位置可以不同於所示。例如，於許多實施方式，可使用與驅動IC102不同的驅動IC，其可具有與驅動IC102不同的功能及/或I/O需求。這可反應於I/O終端112以及PQFN封裝100的其它連接。作為一特定的例子，於一實施方式中，驅動IC102由功能整合驅動IC102及微控制器124的功能整合IC取代。因此，為了微控制器124的功能，可需要額外的I/O終端112，而某些I/O終端112，例如FAULT終端112j，可不需要。
PQFN封裝100係用於多相功率反向器，且驅動IC102可為驅動全橋組態的U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b的高電壓IC(HVIC)。驅動IC102的例子包含International Rectifier Corporation®的「第五代」 HVIC。於本實施方式中，U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b為垂直導通功率裝置，例如，IV族半導體功率金屬氧化物半導體場效電晶體(功率MOSFETs)如快速逆向磊晶二極體場效電晶體(FREDFETs)，或IV族半導體絕緣閘極雙極電晶體(IGBTs)。於其它實施方式，III-V族半導體FETs、HEMTs(高電子移動率電晶體)及，特別是，可作為於U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b中的功率裝置的GaN FETs及/或HEMTs。如上所定義的，此處所述的氮化鎵或GaN，表示III-氮化合物半導體，其中III族元素或元素包含一些或實質量的鎵，但除了鎵之外亦可包含其它III族元素。如前所述，III-V族或GaN電晶體亦可表示由階疊連接III-V族或GaN電晶體與較低電壓IV族電晶體而形成的複合高電壓增強模式電晶體。雖然PQFN封裝100提供全橋功率裝置，不同的實施方式可提供其它封裝組態作為特定應用的需求。
於PQFN封裝100中，HIN1、HIN2及HIN3係為高側電晶體的U相功率開關104a、V相功率開關106a及W相功率開關108a的控制訊號。輸入邏輯162接收HIN1、HIN2及HIN3，其分別提供至位準偏移器164。於本實施方式中，位準偏移器164係具有可以承受例如約600伏特的終端的高電壓位準偏移器。HIN1、HIN2及HIN3的位準偏移後的版本由閘極驅動174a接收，以提供 高側閘極訊號H1、H2及H3至U相功率開關104a、V相功率開關106a及W相功率開關108a，如圖1A中所示。閘極驅動174a更從U相輸出節點110a、V相輸出節點110b及W相輸出節點110c分別接收SW1、SW2及SW3。驅動IC102由此從HIN1、HIN2及HIN3分別產生高側閘極訊號H1、H2及H3。
相似地，LIN1、LIN2及LIN3係為低側電晶體的U相功率開關104b、V相功率開關106b及W相功率開關108b的控制訊號。輸入邏輯162接收LIN1、LIN2及LIN3，其分別提供至位準偏移器166。於本實施方式中，位準偏移器166係低電壓位準偏移器，其補償邏輯接地GVSS及功率級接地GCOM之間的差異。此可為，例如，約1伏特至約2伏特。LIN1、LIN2及LIN3的位準偏移後的版本分別提供至閘極驅動174b以提供低側閘極訊號L1、L2及L3至U相功率開關104b、V相功率開關106b及W相功率開關108b，如圖1A中所示。驅動IC102由此從LIN1、LIN2及LIN3分別產生低側閘極訊號L1、L2及L3。
驅動IC102可由此使用閘極驅動174a及174b以產生馬達電流IM提供功率至馬達126，而驅動U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b的開關。於本實施方式中，閘極驅動174a及174b係分別與U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及 108b的其一或更多阻抗匹配。閘極驅動174a及174b由此可於無閘極電阻下驅動U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b，其允許PQFN封裝100較小。
VBUS係從匯流排電壓源114的匯流排電壓，其分別耦合至U相功率開關104a、V相功率開關106a及W相功率開關108a的汲極。作為一例，匯流排電壓源114可為AC至DC整流器。例如，AC可為引出端電壓，如230伏特。例如，VBUS的DC電壓可為約300伏特至約400伏特。
VCC係從供應電壓源116的驅動IC102的供應電壓，例如其可為，約15伏特。如圖1A中所示，閘極驅動174b由VCC提供功率。於一些實施方式，供應電壓源116從VBUS產生VCC。VB1、VB2及VB3係驅動IC102的啟動電壓且分別由啟動電容器CB1、CB2及CB3提供。啟動電容器CB1、CB2及CB3可被充電，例如，由VCC，分別經由啟動二極體D1、D2及D3。啟動電容器CB1耦合於VB1終端112r及SW3終端112q之間。啟動電容器CB2耦合於VB2終端112s及SW2終端112p之間。啟動電容器CB3耦合於VB3終端112t及SW1終端112o之間。
於所示的實施方式中，VCC耦合至欠壓保護電路168。欠壓保護電路168偵測當VCC降至低於臨界電壓的欠壓狀態，例如約9伏特。VCC提醒輸入邏輯162欠 壓狀態，以由此使驅動IC102的開關不動作。驅動IC102的開關亦可使用EN改變。由微控制器124，可使用EN，以使驅動IC102的開關動作。特別是，驅動IC102組態為回應EN而使H1、H2、H3、L1、L2及L3動作。
圖1A顯示馬達電流IM提供至驅動IC102作為ITRIP。驅動IC102利用ITRIP以為過電流保護。例如，圖1A顯示比較器170比較ITRIP與由電容器CR產生的參考電壓。若ITRIP超過參考電壓，比較器170觸發鎖存器172，其表示由提供FAULT至FAULT終端112j，過電流條件至微控制器124。輸入邏輯162亦接收FAULT以使驅動IC102的開關不動作。從過電流保護，驅動IC102利用RCIN自動重設鎖存器172。如圖1B中所示，電阻器R1耦合於VCC終端112b及RCIN終端112k之間以充電電容器C1。電容器C1耦合於RCIN終端112k及VSS終端112m之間。電阻器R1及電容器C1可被改變以改變過電流保護的自動重設的時間。
VSS係從邏輯接地GVSS的驅動IC102的支持邏輯電路的邏輯接地。作為一例，圖1A顯示VSS作為電容器CR的邏輯接地。VSS亦為支持邏輯電路的其它組件的邏輯接地，其包含：輸入邏輯162，位準偏移器164，欠壓保護電路168，比較器170，鎖存器172，及電容器CR，但可包含不同組件。VCOM係從功率級接地GCOM的U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b的功率級接地。圖1A顯 示VCOM連接至於封裝100中的U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b的源極。VCOM亦可用於驅動IC102。如圖1A中所示，VCOM耦合至驅動IC102的閘極驅動174b。
邏輯接地從提供的功率級接地分離，用於使用分流器RS的分流反相器電路150。分流器RS耦合跨越VSS終端112m及VCOM終端112n。分流器RS亦經由VCOM終端112n耦合至各U相功率開關104b、V相功率開關106b及W相功率開關108b的源極。因此，如圖1A中所示，從馬達126的馬達電流IM係從U相功率開關104b、V相功率開關106b及W相功率開關108b的複合相電流。馬達電流IM經由IM終端112l提供至微控制器124。微控制器124利用馬達電流IM以重建個別的相電流(U、V及W)以由控制HIN1、HIN2、HIN3、LIN1、LIN2及LIN3而控制脈衝寬度調節(PWM)。
因此，本實施方式中，PQFN封裝100具有從功率級接地分離的邏輯接地。於U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b開關時，可建立電壓跨越分流器RS。由具有從功率級接地分離的邏輯接地，用於支持邏輯電路的VCC可作為相對於接地以取代跨越分流器RS的電壓。因此，由使用分離接地，PQFN封裝100受保護而不受閂鎖效應及噪訊錯誤影響，否則可由從U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關 108a及108b的過量開關電壓造成影響。
典型的QFN封裝具有複雜度限制，而有簡單的組態及小數量的電元件。對於較複雜的組態，難以導引連接導線同時避免導線交叉及短路。此外，導線長度會對電及熱表現有負面的影響。唯，PQFN封裝，根據本發明的說明書中的不同的實施例，可實質上相較於典型QFN封裝更複雜，同時避免導線交叉及導線短路且達成高電及熱表現。此外，此PQFN封裝可達成從功率級接地中分離的邏輯接地於單一分流反相器電路中。
轉至圖2A、2B及2C，圖2A顯示圖2B及2C的PQFN封裝200的上平面視圖。圖2B顯示PQFN封裝200的上平面視圖。圖2C顯示PQFN封裝200的下平面視圖。於本實施方式中，PQFN封裝200係多晶片模組(MCM)PQFN封裝，其可具有約12mm乘12mm的佔板尺寸。於其它實施方式中，PQFN封裝200可具有大於12mm乘12mm的佔板尺寸。於再其它實施方式中，PQFN封裝200可具有小於12mm乘12mm的佔板尺寸。
PQFN封裝200對應至圖1A及1B中的PQFN封裝100。例如，PQFN封裝200包含：驅動IC202，U相功率開關204a及204b、V相功率開關206a及206b以及W相功率開關208a及208b，分別對應於圖1A中的驅動IC102，U相功率開關104a及104b、V相功率開關106a及106b以及W相功率開關108a及108b。此外，PQFN封裝200包含：VBUS終端212a，VCC終端212b，HIN1 終端212c，HIN2終端212d，HIN3終端212e，LIN1終端212f，LIN2終端212g，LIN3終端212h，EN終端212i，FAULT終端212j，RCIN終端212k，IM終端2121，VSS終端212m(亦稱為「邏輯接地終端」)，VCOM終端212n(亦稱為「功率級接地終端」)，SW1終端212o(亦稱為「U相輸出終端212o」)，SW2終端212p(亦稱為「V相輸出終端212p」)，SW3終端212q(亦稱為「W相輸出終端212q」)，VB1終端212r，VB2終端212s，及VB3終端212t(亦稱為「I/O終端212」)分別對應於PQFN封裝100中的VBUS終端112a，VCC終端112b，HIN1終端112c，HIN2終端112d，HIN3終端112e，LIN1終端112f，LIN2終端112g，LIN3終端112h，EN終端112i，FAULT終端112j，RCIN終端112k，IM終端1121，VSS終端112m，VCOM終端112n，SW1終端112o，SW2終端112p，SW3終端112q，VB1終端112r，VB2終端112s，及VB3終端112t。
圖2A顯示導線架260包含：驅動IC晶粒接墊220，W相晶粒接墊222a，V相晶粒接墊222b，U相晶粒接墊222c及共同晶粒接墊228。導線架島233電性地並機械地連接(如整合連接)至驅動IC晶粒接墊220。導線架260更包含導線架條230及232及I/O終端212。導線架島234於導線架260的導線架條230上且導線架條230電性地且機械地連接(如整合連接)至導線架260的V相晶粒接墊222b。導線架島236於導線架260的導線架 條232上且導線架條232電性地且機械地連接(如整合連接)至導線架260的U相晶粒接墊222c。如圖2B中所示，導線架條230及232可選擇性延伸至PQFN封裝200的邊緣242c。如此作，任何導線架條230及232可提供，例如，PQFN封裝200的額外的I/O終端。例如，顯示導線架條232提供額外的SW1終端212o於PQFN封裝200的邊緣242c。
導線架260可包含高導熱及導電性的材料，例如Olin Brass®的銅(Cu)合金C194。導線架260的上側240a可選擇性鍍上增強與裝置晶粒及導線的附著的材料。此鍍可包含選擇性的提供於導線架260鍍銀(Ag)，其可自如QPL Limited等公司得到。
圖2A及2B顯示導線架260係受蝕刻導線架，例如受半蝕刻導線架。導線架260的部分，可為未受蝕刻(如未受半蝕刻)使用虛線示於圖2A及2B中。導線架島233、234及236為這種未受蝕刻部分的例子。例如，圖2C顯示導線架260的底側240b(亦對應於PQFN封裝200的底側)。圖2C更顯示PQFN封裝200的模製化合物265，其覆蓋導線架260的受蝕刻部分。模製化合物265可為具有低彎曲模數的塑膠，例如Hitachi® Chemical的CEL9220ZHF10(v79)。為提供對抗封裝破裂的彈性，PQFN封裝200的高度(或厚度)定義為模製化合物265可保持薄，例如0.9mm或更少。
I/O終端212，導線架島233，導線架島234， 及導線架島236係未受蝕刻且經由模製化合物265於導線架260的底側240b(亦對應於PQFN封裝200的底側)暴露。如此，I/O終端212，導線架島233，導線架島234及導線架島236暴露於導線架260的底側240b上，而用於高導電及/或散熱。由提供(PCB)匹配區塊，可選擇性地利用此特徵。導線架260的暴露區域可鍍，如錫(Sn)。
驅動IC202，U相功率開關204a及204b、V相功率開關206a及206b以及W相功率開關208a及208b利用連接導線及導線架260互連。
圖2B顯示U相功率開關204a及204b、V相功率開關206a及206b以及W相功率開關208a及208b，以及驅動IC202電性地並機械地連接至導線架260。這可由利用銲錫或導電接合劑，例如Henkel Corporation的銀填充QMI 529HT，而完成。
如圖2B中所示，U相功率開關204b、V相功率開關206b及W相功率開關208b位於導線架260上，沿PQFN封裝200的邊緣242a。W相功率開關208b位於W相晶粒接墊222a上。特別是，W相功率開關208b的汲極236a位於W相晶粒接墊222a上。相似地，V相功率開關206b位於V相晶粒接墊222b上。特別是，V相功率開關206b的汲極236b位於V相晶粒接墊222b上。此外，U相功率開關204b位於U相晶粒接墊222c上。特別是，U相功率開關204b的汲極236c位於U相晶粒接墊222c上。因此，U相功率開關204b、V相功率開關206b及W 相功率開關208b個別耦合至導線架260的各晶粒接墊。如此，W相晶粒接墊222a可對應於PQFN封裝200的W相輸出終端212q，V相晶粒接墊222b可對應於PQFN封裝200的V相輸出終端212p，且U相晶粒接墊222c可對應於PQFN封裝200的U相輸出終端212o，如圖2B中所示。
另外，如圖2B中所示，U相功率開關204a、V相功率開關206a及W相功率開關208a位於導線架260上，沿PQFN封裝200的邊緣242b，其交叉邊緣242a。U相功率開關204a、V相功率開關206a及W相功率開關208a位於共同晶粒接墊228上。特別是，U相功率開關204a的汲極236d，V相功率開關206a的汲極236e及W相功率開關208a的汲極236f位於導線架260的共同晶粒接墊228上。因此，共同晶粒接墊228可對應於PQFN封裝200的VBUS終端212a(如匯流排電壓輸入終端)，如圖2B中所示。
此組態的例子更詳細地顯示於圖2D中。圖2D顯示PQFN封裝200的部分截面視圖。圖2D中的截面視圖對應於圖2B及2C的截面2D至2D。圖2D顯示V相功率開關206a的汲極236e經由導電黏合劑254及導線架260的鍍248a連接至共同晶粒接墊228。導電黏合劑254可包含銀填充黏合劑，例如QMI 529HT。PQFN封裝200中的其它晶粒可相似地連接至導線架260。
如圖2B中所示，驅動IC202位於導線架260 上。特別是，驅動IC202位於導線架260的驅動IC晶粒接墊220上。驅動IC晶粒接墊220大於驅動IC202且因此可適應不同的更大的驅動IC，其可具有與驅動IC202不同的特徵。
圖2B亦顯示連接導線，例如連接導線244a，電性地並機械地連接驅動IC202至VCC終端212b，HIN1終端212c，HIN2終端212d，HIN3終端212e，LIN1終端212f，LIN2終端212g，LIN3終端212h，EN終端212i，FAULT終端212j，RCIN終端212k，IM終端2121，邏輯接地終端212m，VB1終端212r，VB2終端212s，VB3終端212t，且至U相功率開關204a及204b、V相功率開關206a及206b以及W相功率開關208a及208b的各閘極。
於圖2B中的連接導線244a及相似地描繪的連接導線可包含，例如，1.3密耳直徑G1型金(Au)線。可利用較厚的導線於功率連接，例如連接導線246a、246b、246c、246d、246e及246f(亦稱為「連接導線246」)。連接導線246可為，例如，2.0密耳直徑銅(Cu)線，例如Kulicke & Soffa®的Maxsoft® LD導線。連接導線246可利用接合針腳於球(BSOB)接合。如圖2B中所示，多連接導線，例如二連接導線，可平行於連接導線246用於處理額外電流。
U相功率開關204b、V相功率開關206b及W相功率開關208b經由導線架260分別耦合至U相功率開關204a、V相功率開關206a及W相功率開關208a。
於圖2B中，連接導線246a電性地並機械地連接U相功率開關204a的源極238d至導線架260。特別是，源極238d經由連接導線246a連接至導線架條232的導線架島236。因此，圖1A的U相輸出節點110a位於導線架260的導線架條232上，其中導線架條232連接至導線架260的U相晶粒接墊222c。如此，PQFN封裝200具有配置連接導線246a及其它連接導線，例如連接導線244b，的顯著的彈性，同時避免因為導線交叉的導線短路並達成高電及熱表現。連接導線244b電性地並機械地連接驅動IC202及導線架260的導線架條232於導線架島236處以提供SW1至驅動IC202，如圖1A中所示。圖1A的U相輸出節點110a亦位於導線架260的導線架島236上。因導線架島236暴露於PQFN封裝200的底側240b上(顯示於圖2C中)，U相輸出節點110a處的熱產生可有效率地從PQFN封裝200散出。
相似地，連接導線246b電性地並機械地連接V相功率開關206a的源極238e至導線架260。圖2D顯示此連接的一例子。源極238e藉由連接導線246b經由導線架260的鍍248b連接至導線架條230的導線架島234。之後導線架條230經由V相晶粒接墊222b連接至V相功率開關206b的汲極236b。可部署相似的連接而連接源極238d至U相功率開關204b的汲極236c。連接導線246b電性地並機械地連接V相功率開關206a的源極238e至導線架條230於導線架島234處。因此，圖1A的V相 輸出節點110b位於導線架260的導線架條230上，其中導線架條230連接至導線架260的V相晶粒接墊222b。如此，PQFN封裝200具有配置連接導線246b及其它連接導線，如連接導線244c，的顯著的彈性，同時避免因為導線交叉的導線短路且達成高電及熱表現。連接導線244c電性地並機械地連接驅動IC202及導線架260的導線架條230於導線架島234處以提供SW2至驅動IC202，如圖1A中所示。圖1A的V相輸出節點110b亦位於導線架260的導線架島234上。當導線架島234暴露於PQFN封裝200的底側240b(如圖2C中所示)上，V相輸出節點110b處的熱產生可有效率地從PQFN封裝200散發。
請注意，PQFN封裝200可包含導線架島234及/或236而無導線架條230及/或232。例如，導線架島234可經由PCB上的線路連接至V相晶粒接墊222b。再者，請注意PQFN封裝200可包含導線架條230及/或232而未有導線架島234及/或236。唯，具有導線架條230及232且有導線架島234及236可提供PQFN封裝200中的連接導線的配置的顯著的彈性，同時達成高電及熱表現。
於圖2B中，連接導線246c係電性地並機械地連接W相功率開關208a的源極238f至導線架260。特別是，連接導線246b電性地並機械地連接W相功率開關208a的源極238f至W相晶粒接墊222a於導線架260上。因此，圖1A的W相輸出節點110c位於導線架260的W相晶粒接墊222a上且有W相功率開關208b。當W 相功率開關208b相鄰於W相功率開關208a，W相功率開關208a的源極238f可耦合至W相功率開關208b的汲極236a，同時簡單避免因為導線交叉的導線短路且達成高電及熱表現。此可由不使用導線架條及/或導線架島而完成。因此，可使PQFN封裝200顯著地較小，同時避免U相輸出節點110a、V相輸出節點110b及W相輸出節點110c之間的電弧效應。例如，額外的導線架條及/或導線架島可能需要較大的PQFN封裝200以維持導線架條230及232之間足夠的空間252，以避免電弧效應(如至少1mm)。此外，這種組態不顯著影響PQFN封裝200中的連接導線配置的彈性。又，當W相晶粒接墊222a暴露於PQFN封裝200的底側240b(圖2C中所示)上，W相輸出節點110c處的熱產生可有效率地從PQFN封裝200發散。連接導線244d電性地並機械地連接驅動IC202及源極238f以提供SW3至驅動IC202，如圖1A中所示。
PQFN封裝200包含導線架260的邏輯接地耦合至驅動IC202的支持邏輯電路。導線架260的邏輯接地包含邏輯接地終端212m。至少連接導線244g係電性地並機械地連接導線架260的邏輯接地終端212m至驅動IC202且特別是，係連接導線架260的邏輯接地終端212m至驅動IC202的支持邏輯。
PQFN封裝200更包含導線架260的功率級接地耦合至U相功率開關204b、V相功率開關206b及W相功率開關208b的源極238c、238b及238a。導線架260的 功率級接地包含：功率級接地終端212n，驅動IC晶粒接墊220，及導線架島233。圖2B中，至少連接導線246d係電性地並機械地連接導線架260的功率級接地的功率級接地終端212n至W相功率開關208b的源極238a。至少連接導線246e係電性地並機械地連接W相功率開關208b的源極238a至V相功率開關206b的源極238b。此外，至少連接導線246f電性地並機械地連接V相功率開關206b的源極238b至U相功率開關204b的源極238c。因此，源極238a、238b及238c於PQFN封裝200中相互電連接。
此外，於本實施方式中，導線架260的功率級接地耦合至驅動IC202的閘極驅動(如圖1中的閘極驅動174b)。連接導線244e及244f經由導線架260連接U相功率開關204b的源極238c至驅動IC202的閘極驅動。連接導線244e係電性地並機械地連接U相功率開關204b的源極238c至導線架260的導線架島233。連接導線244f係電性地並機械地連接導線架260的導線架島233至驅動IC202。經由導線架260連接U相功率開關204b的源極238c至驅動IC202，提供PQFN封裝200中的連接的彈性。唯，請注意導線架島233係選擇性的且連接導線可直接連接U相功率開關204b的源極238c至驅動IC202。此外，於某些實施方式中，驅動IC202選擇性地具有接地256，其位於導線架260的驅動IC晶粒接墊220上。接地256可為功率級接地及/或邏輯接地。於所示的 實施方式中，其中接地256係功率級接地，可不包含連接導線244f。
因此，如上所述並參照圖1A、1B及2A至2D，伴隨不同實施方式，PQFN封裝，可相較於典型的QFN封裝實質上更複雜，同時避免導線交叉及導線短路且達成高電及熱表現。如此，PQFN封裝可達成複雜的電路，如具有邏輯接地從功率級接地分離的單一分流反相器電路。
由上所述，顯然地，不同技術可使用於實施敘述於本發明中的概念而不脫離這些概念的範圍。此外，當這些概念參照特定的實施方式敘述，所屬技術領域中具有通常知識者可理解形式及細節的改變不脫離這些概念的範圍。如此，所述的實施方式可被以所有說明的角度考量而不限制。亦應理解為本發明不限於這些上述的特定的實施方式，而可有許多重置、修改及替代而不脫離本發明所揭示的範圍。
200‧‧‧PQFN封裝
202‧‧‧驅動IC
204a‧‧‧U相功率開關
204b‧‧‧U相功率開關
206a‧‧‧V相功率開關
206b‧‧‧V相功率開關
208a‧‧‧W相功率開關
208b‧‧‧W相功率開關
212a‧‧‧VBUS終端
212b‧‧‧VCC終端
212c‧‧‧HIN1終端
212d‧‧‧HIN2終端
212e‧‧‧HIN3終端
212f‧‧‧LIN1終端
212g‧‧‧LIN2終端
212h‧‧‧LIN3終端
212i‧‧‧EN終端
212j‧‧‧FAULT終端
212k‧‧‧RCIN終端
212l‧‧‧IM終端
212m‧‧‧VSS終端
212n‧‧‧VCOM終端
212o‧‧‧SW1終端
212p‧‧‧SW2終端
212q‧‧‧SW3終端
212r‧‧‧VB1終端
212s‧‧‧VB2終端
212t‧‧‧VB3終端
236a至236f‧‧‧汲極
238a至238f‧‧‧源極
242a至242c‧‧‧邊緣
244a至244g‧‧‧連接導線
246a至246f‧‧‧連接導線
252‧‧‧空間
256‧‧‧接地

Claims (20)

  1. 一種功率四方扁平無引腳(PQFN)封裝，包含：驅動積體電路(IC)位於導線架上；U相、V相及W相功率開關位於該導線架上；該導線架的邏輯接地耦合至該驅動IC的支持邏輯電路；該導線架的功率級接地耦合至該U相、該V相及該W相功率開關的源極。
  2. 如請求項第1項之PQFN封裝，其中，該功率級接地更耦合至該驅動IC的閘極驅動。
  3. 如請求項第1項之PQFN封裝，包含，至少一連接導線連接該導線架的該功率級接地至該W相功率開關的該源極。
  4. 如請求項第1項之PQFN封裝，包含，至少一連接導線連接該W相功率開關的該源極至該V相功率開關的該源極。
  5. 如請求項第1項之PQFN封裝，包含，至少一連接導線連接該V相功率開關的該源極至該U相功率開關的該源極。
  6. 如請求項第1項之PQFN封裝，包含，至少一連接導線連接該PQFN封裝的功率級接地終端至該W相功率開關的該源極。
  7. 如請求項第1項之PQFN封裝，包含，至少一連接導線連接該PQFN封裝的邏輯接地終端至該驅動IC的 該支持邏輯電路。
  8. 如請求項第1項之PQFN封裝，包含，經由該導線架，至少一連接導線連接該U相功率開關的該源極至該驅動IC的該閘極驅動。
  9. 如請求項第1項之PQFN封裝，其中，該U相、該V相及該W相功率開關位於該導線架的分別的晶粒接墊上。
  10. 如請求項第1項之PQFN封裝，其中，經由該導線架，該U相、該V相及該W相功率開關分別耦合至另一U相、另一V相及另一W相功率開關。
  11. 如請求項第1項之PQFN封裝，其中，該U相、該V相及該W相功率開關包含快速逆向磊晶二極體場效電晶體(FREDFETs)。
  12. 如請求項第1項之PQFN封裝，其中，該U相、該V相及該W相功率開關包含絕緣閘極雙極電晶體(IGBTs)。
  13. 如請求項第1項之PQFN封裝，其中，該U相、該V相及該W相功率開關包含III-V族電晶體。
  14. 如請求項第1項之PQFN封裝，其中，該PQFN封裝具有大於12mm乘12mm的佔板尺寸。
  15. 如請求項第1項之PQFN封裝，其中，該PQFN封裝具有小於12mm乘12mm的佔板尺寸。
  16. 一種功率四方扁平無引腳(PQFN)封裝，包含： 驅動積體電路(IC)位於導線架上；U相、V相及W相功率開關位於該導線架上；該導線架的邏輯接地耦合至該驅動IC的支持邏輯電路；該導線架的功率級接地耦合至該驅動IC的閘極驅動。
  17. 如請求項第16項之PQFN封裝，其中，該導線架的功率級接地更耦合至該U相、該V相及該W相功率開關的源極。
  18. 如請求項第16項之PQFN封裝，其中，該U相、該V相及該W相功率開關位於該導線架的分別的晶粒接墊上。
  19. 如請求項第16項之PQFN封裝，其中，經由至少一連接導線，該導線架的該功率級接地耦合至該驅動IC的該閘極驅動。
  20. 如請求項第16項之PQFN封裝，包含，至少一連接導線連接該U相功率開關的源極至該導線架以使耦合該功率級接地至該閘極驅動。
TW103101806A 2013-03-07 2014-01-17 單一分流反相器電路中的功率四方扁平無引腳（ｐｑｆｎ）封裝 TWI550734B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361774484P 2013-03-07 2013-03-07
US14/102,275 US9659845B2 (en) 2010-12-13 2013-12-10 Power quad flat no-lead (PQFN) package in a single shunt inverter circuit

Publications (2)

Publication Number Publication Date
TW201448065A TW201448065A (zh) 2014-12-16
TWI550734B true TWI550734B (zh) 2016-09-21

Family

ID=49885048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103101806A TWI550734B (zh) 2013-03-07 2014-01-17 單一分流反相器電路中的功率四方扁平無引腳（ｐｑｆｎ）封裝

Country Status (5)

Country Link
EP (1) EP2775518A3 (zh)
JP (1) JP6235918B2 (zh)
KR (1) KR101615512B1 (zh)
CN (2) CN104037154B (zh)
TW (1) TWI550734B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10818568B1 (en) * 2019-06-28 2020-10-27 Alpha And Omega Semiconductor (Cayman) Ltd. Super-fast transient response (STR) AC/DC converter for high power density charging application

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183463A (ja) * 2003-12-16 2005-07-07 Mitsubishi Electric Corp 半導体装置
US20080002445A1 (en) * 2006-05-24 2008-01-03 Cho Byoung-Chul 3-Phase inverter module, motor driving apparatus using the same, and inverter integrated circuit package
CN102569241A (zh) * 2010-12-13 2012-07-11 国际整流器公司 利用引线框实现电互连的多芯片模块(mcm)功率四方扁平无引线(pqfn)半导体封装
TW201240046A (en) * 2011-03-25 2012-10-01 Rda Microelectronics Beijing Co Ltd Global system for mobile communications (GSM) radio-frequency emission front-end module adopting Quad Flat No-lead package

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3394377B2 (ja) * 1996-01-09 2003-04-07 三菱電機株式会社 半導体装置および半導体モジュール
JP3674333B2 (ja) * 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
JP4018312B2 (ja) * 2000-02-21 2007-12-05 株式会社ルネサステクノロジ 無線通信装置
US6465875B2 (en) * 2000-03-27 2002-10-15 International Rectifier Corporation Semiconductor device package with plural pad lead frame
JP4450530B2 (ja) * 2001-07-03 2010-04-14 三菱電機株式会社 インバータモジュール
JP4489485B2 (ja) * 2004-03-31 2010-06-23 株式会社ルネサステクノロジ 半導体装置
JP2006223016A (ja) * 2005-02-08 2006-08-24 Renesas Technology Corp 電源システム、マルチチップモジュール、システムインパッケージ、および非絶縁型ｄｃ／ｄｃコンバータ
JP5291864B2 (ja) * 2006-02-21 2013-09-18 ルネサスエレクトロニクス株式会社 Ｄｃ／ｄｃコンバータ用半導体装置の製造方法およびｄｃ／ｄｃコンバータ用半導体装置
CN101030733B (zh) * 2007-03-21 2011-04-13 中国科学院电工研究所 一种轻型单元级联式多电平功率变换器
US20090189261A1 (en) 2008-01-25 2009-07-30 Lay Yeap Lim Ultra-Thin Semiconductor Package
US7928758B2 (en) * 2008-06-13 2011-04-19 System General Corp. Transistor gate driving circuit with power saving of power converter
CN201234208Y (zh) * 2008-07-02 2009-05-06 东南大学 链式变换器功率单元控制器用开关电源
CN102074513A (zh) * 2009-11-25 2011-05-25 国碁电子(中山)有限公司 方形扁平无引脚芯片封装结构及方法
CN102148168B (zh) * 2010-02-04 2015-04-22 飞思卡尔半导体公司 制造具有改进抬升的半导体封装的方法
CN201928197U (zh) * 2010-12-13 2011-08-10 成都成电硅海科技股份有限公司 开关电源控制系统
US20120256193A1 (en) * 2011-04-08 2012-10-11 Intersil Americas Inc. Monolithic integrated capacitors for high-efficiency power converters

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183463A (ja) * 2003-12-16 2005-07-07 Mitsubishi Electric Corp 半導体装置
US20080002445A1 (en) * 2006-05-24 2008-01-03 Cho Byoung-Chul 3-Phase inverter module, motor driving apparatus using the same, and inverter integrated circuit package
CN102569241A (zh) * 2010-12-13 2012-07-11 国际整流器公司 利用引线框实现电互连的多芯片模块(mcm)功率四方扁平无引线(pqfn)半导体封装
TW201240046A (en) * 2011-03-25 2012-10-01 Rda Microelectronics Beijing Co Ltd Global system for mobile communications (GSM) radio-frequency emission front-end module adopting Quad Flat No-lead package

Also Published As

Publication number Publication date
JP2014195045A (ja) 2014-10-09
CN107293531B (zh) 2021-03-12
EP2775518A2 (en) 2014-09-10
JP6235918B2 (ja) 2017-11-22
TW201448065A (zh) 2014-12-16
CN104037154A (zh) 2014-09-10
CN107293531A (zh) 2017-10-24
KR101615512B1 (ko) 2016-04-26
CN104037154B (zh) 2017-07-25
KR20140110724A (ko) 2014-09-17
EP2775518A3 (en) 2017-11-08

Similar Documents

Publication Publication Date Title
US10438876B2 (en) Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
EP2477222B1 (en) Stacked half-bridge package with a current carrying layer
EP2477220A2 (en) Stacked half-bridge package with a common conductive clip
US9324646B2 (en) Open source power quad flat no-lead (PQFN) package
US8581416B2 (en) Method of forming a semiconductor device and leadframe therefor
US9362215B2 (en) Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
US9443795B2 (en) Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
TWI523179B (zh) 開放源功率四方扁平無引腳（ｐｑｆｎ）導線架
KR102041939B1 (ko) 다상 파워 인버터용 리드프레임 아일랜드들을 갖는 파워 쿼드 플랫 노-리드 반도체 패키지
TWI550734B (zh) 單一分流反相器電路中的功率四方扁平無引腳（ｐｑｆｎ）封裝
TWI570878B (zh) 在共同積體電路上具有自舉二極體的功率四面扁平無引線封裝